JPWO2022138681A1 - - Google Patents

Info

Publication number
JPWO2022138681A1
JPWO2022138681A1 JP2022571525A JP2022571525A JPWO2022138681A1 JP WO2022138681 A1 JPWO2022138681 A1 JP WO2022138681A1 JP 2022571525 A JP2022571525 A JP 2022571525A JP 2022571525 A JP2022571525 A JP 2022571525A JP WO2022138681 A1 JPWO2022138681 A1 JP WO2022138681A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022571525A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022138681A1 publication Critical patent/JPWO2022138681A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022571525A 2020-12-25 2021-12-21 Pending JPWO2022138681A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020218001 2020-12-25
PCT/JP2021/047438 WO2022138681A1 (ja) 2020-12-25 2021-12-21 金属部材

Publications (1)

Publication Number Publication Date
JPWO2022138681A1 true JPWO2022138681A1 (https=) 2022-06-30

Family

ID=82159783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022571525A Pending JPWO2022138681A1 (https=) 2020-12-25 2021-12-21

Country Status (4)

Country Link
JP (1) JPWO2022138681A1 (https=)
KR (1) KR20230124543A (https=)
TW (1) TW202316919A (https=)
WO (1) WO2022138681A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108274A (en) * 1978-02-15 1979-08-24 Shindo Denshi Kougiyou Kk Method of producing printed circuit board
JPS6435985A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Manufacture of printed board
JP2015060947A (ja) * 2013-09-19 2015-03-30 イビデン株式会社 金属ポストを有するプリント配線板及び金属ポストを有するプリント配線板の製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
JP2016122796A (ja) * 2014-12-25 2016-07-07 新光電気工業株式会社 配線基板及び配線基板の製造方法
WO2018116692A1 (ja) * 2016-12-19 2018-06-28 タツタ電線株式会社 パッケージ基板及びパッケージ基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108274A (en) * 1978-02-15 1979-08-24 Shindo Denshi Kougiyou Kk Method of producing printed circuit board
JPS6435985A (en) * 1987-07-30 1989-02-07 Mitsubishi Electric Corp Manufacture of printed board
JP2015060947A (ja) * 2013-09-19 2015-03-30 イビデン株式会社 金属ポストを有するプリント配線板及び金属ポストを有するプリント配線板の製造方法
JP2016066705A (ja) * 2014-09-25 2016-04-28 イビデン株式会社 プリント配線板およびその製造方法
JP2016122796A (ja) * 2014-12-25 2016-07-07 新光電気工業株式会社 配線基板及び配線基板の製造方法
WO2018116692A1 (ja) * 2016-12-19 2018-06-28 タツタ電線株式会社 パッケージ基板及びパッケージ基板の製造方法

Also Published As

Publication number Publication date
KR20230124543A (ko) 2023-08-25
WO2022138681A1 (ja) 2022-06-30
TW202316919A (zh) 2023-04-16

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