KR20230113611A - 말레이미드 수지, 비대칭 비스말레이미드 화합물, 경화성조성물, 경화물, 반도체 봉지 재료, 반도체 봉지 장치, 프리프레그, 회로 기판, 및 빌드업 필름 - Google Patents

말레이미드 수지, 비대칭 비스말레이미드 화합물, 경화성조성물, 경화물, 반도체 봉지 재료, 반도체 봉지 장치, 프리프레그, 회로 기판, 및 빌드업 필름 Download PDF

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Publication number
KR20230113611A
KR20230113611A KR1020237022081A KR20237022081A KR20230113611A KR 20230113611 A KR20230113611 A KR 20230113611A KR 1020237022081 A KR1020237022081 A KR 1020237022081A KR 20237022081 A KR20237022081 A KR 20237022081A KR 20230113611 A KR20230113611 A KR 20230113611A
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South Korea
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group
compound
maleimide
aromatic
curable composition
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English (en)
Korean (ko)
Inventor
도모히로 시모노
히토미 하야시바라
츠네유키 오타구로
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디아이씨 가부시끼가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G12/00—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08G12/02—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
    • C08G12/04—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08G12/06—Amines
    • C08G12/08—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H01L23/29—
    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020237022081A 2020-12-22 2021-11-18 말레이미드 수지, 비대칭 비스말레이미드 화합물, 경화성조성물, 경화물, 반도체 봉지 재료, 반도체 봉지 장치, 프리프레그, 회로 기판, 및 빌드업 필름 Ceased KR20230113611A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-212256 2020-12-22
JP2020212256 2020-12-22
PCT/JP2021/042356 WO2022137913A1 (ja) 2020-12-22 2021-11-18 マレイミド樹脂、非対称ビスマレイミド化合物、硬化性組成物、硬化物、半導体封止材料、半導体封止装置、プリプレグ、回路基板、及びビルドアップフィルム

Publications (1)

Publication Number Publication Date
KR20230113611A true KR20230113611A (ko) 2023-07-31

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Family Applications (1)

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KR1020237022081A Ceased KR20230113611A (ko) 2020-12-22 2021-11-18 말레이미드 수지, 비대칭 비스말레이미드 화합물, 경화성조성물, 경화물, 반도체 봉지 재료, 반도체 봉지 장치, 프리프레그, 회로 기판, 및 빌드업 필름

Country Status (5)

Country Link
JP (1) JP7140307B1 (https=)
KR (1) KR20230113611A (https=)
CN (1) CN116888098A (https=)
TW (1) TWI906409B (https=)
WO (1) WO2022137913A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7838366B2 (ja) * 2022-03-29 2026-04-01 Dic株式会社 樹脂組成物、硬化物、絶縁材料、及びレジスト部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02269716A (ja) 1989-02-28 1990-11-05 Ciba Geigy Ag 芳香族ビスマレイミドに基づいた硬化性組成物
JPH06128225A (ja) 1992-10-19 1994-05-10 Mitsubishi Petrochem Co Ltd 非晶性ビスマレイミドの製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE7506026L (sv) * 1974-07-02 1976-01-05 Ciba Geigy Ag Lagerstabila, vermeherdbara blandningar.
CH597184A5 (https=) * 1976-04-09 1978-03-31 Ciba Geigy Ag
JPH02300223A (ja) * 1989-05-16 1990-12-12 Mitsubishi Petrochem Co Ltd ポリイミド
JPH0431464A (ja) * 1990-05-25 1992-02-03 Mitsubishi Petrochem Co Ltd 回路用の硬化性樹脂組成物及び金属箔積層樹脂基板
JPH072767A (ja) * 1993-06-16 1995-01-06 Mitsubishi Chem Corp マレイミドの製造方法
JP4694734B2 (ja) * 2001-08-21 2011-06-08 三井化学株式会社 マレイミド類の製造方法
KR101680274B1 (ko) * 2013-06-27 2016-11-29 제일모직 주식회사 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
CN109280169A (zh) * 2018-10-31 2019-01-29 陕西硕博电子材料有限公司 双马来酰亚胺低共融混合物及其制备方法、双马来酰亚胺树脂预聚物
WO2020217679A1 (ja) * 2019-04-26 2020-10-29 Dic株式会社 マレイミド、硬化性樹脂組成物、及び、硬化物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02269716A (ja) 1989-02-28 1990-11-05 Ciba Geigy Ag 芳香族ビスマレイミドに基づいた硬化性組成物
JPH06128225A (ja) 1992-10-19 1994-05-10 Mitsubishi Petrochem Co Ltd 非晶性ビスマレイミドの製造方法

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TWI906409B (zh) 2025-12-01
TW202231691A (zh) 2022-08-16
JP7140307B1 (ja) 2022-09-21
CN116888098A (zh) 2023-10-13
JPWO2022137913A1 (https=) 2022-06-30
WO2022137913A1 (ja) 2022-06-30

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