JP7140307B1 - マレイミド樹脂、非対称ビスマレイミド化合物、硬化性組成物、硬化物、半導体封止材料、半導体封止装置、プリプレグ、回路基板、及びビルドアップフィルム - Google Patents

マレイミド樹脂、非対称ビスマレイミド化合物、硬化性組成物、硬化物、半導体封止材料、半導体封止装置、プリプレグ、回路基板、及びビルドアップフィルム Download PDF

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JP7140307B1
JP7140307B1 JP2022536593A JP2022536593A JP7140307B1 JP 7140307 B1 JP7140307 B1 JP 7140307B1 JP 2022536593 A JP2022536593 A JP 2022536593A JP 2022536593 A JP2022536593 A JP 2022536593A JP 7140307 B1 JP7140307 B1 JP 7140307B1
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group
compound
aromatic
aliphatic hydrocarbon
curable composition
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JPWO2022137913A5 (https=
JPWO2022137913A1 (https=
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智弘 下野
瞳 林原
庸行 太田黒
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DIC Corp
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DIC Corp
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    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D207/00—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom
    • C07D207/02—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom
    • C07D207/44—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members
    • C07D207/444—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5
    • C07D207/448—Heterocyclic compounds containing five-membered rings not condensed with other rings, with one nitrogen atom as the only ring hetero atom with only hydrogen or carbon atoms directly attached to the ring nitrogen atom having three double bonds between ring members or between ring members and non-ring members having two doubly-bound oxygen atoms directly attached in positions 2 and 5 with only hydrogen atoms or radicals containing only hydrogen and carbon atoms directly attached to other ring carbon atoms, e.g. maleimide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • C08F22/36—Amides or imides
    • C08F22/40—Imides, e.g. cyclic imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G12/00—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C08G12/02—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes
    • C08G12/04—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen of aldehydes with acyclic or carbocyclic compounds
    • C08G12/06—Amines
    • C08G12/08—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Reinforced Plastic Materials (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2022536593A 2020-12-22 2021-11-18 マレイミド樹脂、非対称ビスマレイミド化合物、硬化性組成物、硬化物、半導体封止材料、半導体封止装置、プリプレグ、回路基板、及びビルドアップフィルム Active JP7140307B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020212256 2020-12-22
JP2020212256 2020-12-22
PCT/JP2021/042356 WO2022137913A1 (ja) 2020-12-22 2021-11-18 マレイミド樹脂、非対称ビスマレイミド化合物、硬化性組成物、硬化物、半導体封止材料、半導体封止装置、プリプレグ、回路基板、及びビルドアップフィルム

Publications (3)

Publication Number Publication Date
JPWO2022137913A1 JPWO2022137913A1 (https=) 2022-06-30
JP7140307B1 true JP7140307B1 (ja) 2022-09-21
JPWO2022137913A5 JPWO2022137913A5 (https=) 2022-12-05

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JP2022536593A Active JP7140307B1 (ja) 2020-12-22 2021-11-18 マレイミド樹脂、非対称ビスマレイミド化合物、硬化性組成物、硬化物、半導体封止材料、半導体封止装置、プリプレグ、回路基板、及びビルドアップフィルム

Country Status (5)

Country Link
JP (1) JP7140307B1 (https=)
KR (1) KR20230113611A (https=)
CN (1) CN116888098A (https=)
TW (1) TWI906409B (https=)
WO (1) WO2022137913A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7838366B2 (ja) * 2022-03-29 2026-04-01 Dic株式会社 樹脂組成物、硬化物、絶縁材料、及びレジスト部材

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130290A (https=) * 1974-07-02 1976-03-15 Ciba Geigy
JPS52125161A (en) * 1976-04-09 1977-10-20 Ciba Geigy Ag Preparation of maleimide
JPH02300223A (ja) * 1989-05-16 1990-12-12 Mitsubishi Petrochem Co Ltd ポリイミド
JPH0431464A (ja) * 1990-05-25 1992-02-03 Mitsubishi Petrochem Co Ltd 回路用の硬化性樹脂組成物及び金属箔積層樹脂基板
KR20150002953A (ko) * 2013-06-27 2015-01-08 제일모직주식회사 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
WO2020217679A1 (ja) * 2019-04-26 2020-10-29 Dic株式会社 マレイミド、硬化性樹脂組成物、及び、硬化物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5138000A (en) 1989-02-28 1992-08-11 Ciba-Geigy Corporation Curable compositions based on aromatic bismaleimides
JPH06128225A (ja) 1992-10-19 1994-05-10 Mitsubishi Petrochem Co Ltd 非晶性ビスマレイミドの製造方法
JPH072767A (ja) * 1993-06-16 1995-01-06 Mitsubishi Chem Corp マレイミドの製造方法
JP4694734B2 (ja) * 2001-08-21 2011-06-08 三井化学株式会社 マレイミド類の製造方法
CN109280169A (zh) * 2018-10-31 2019-01-29 陕西硕博电子材料有限公司 双马来酰亚胺低共融混合物及其制备方法、双马来酰亚胺树脂预聚物

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5130290A (https=) * 1974-07-02 1976-03-15 Ciba Geigy
JPS52125161A (en) * 1976-04-09 1977-10-20 Ciba Geigy Ag Preparation of maleimide
JPH02300223A (ja) * 1989-05-16 1990-12-12 Mitsubishi Petrochem Co Ltd ポリイミド
JPH0431464A (ja) * 1990-05-25 1992-02-03 Mitsubishi Petrochem Co Ltd 回路用の硬化性樹脂組成物及び金属箔積層樹脂基板
KR20150002953A (ko) * 2013-06-27 2015-01-08 제일모직주식회사 하드마스크 조성물, 이를 사용한 패턴 형성 방법 및 상기 패턴을 포함하는 반도체 집적회로 디바이스
WO2020217679A1 (ja) * 2019-04-26 2020-10-29 Dic株式会社 マレイミド、硬化性樹脂組成物、及び、硬化物

Also Published As

Publication number Publication date
TWI906409B (zh) 2025-12-01
TW202231691A (zh) 2022-08-16
CN116888098A (zh) 2023-10-13
JPWO2022137913A1 (https=) 2022-06-30
KR20230113611A (ko) 2023-07-31
WO2022137913A1 (ja) 2022-06-30

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