KR20230107347A - LED bracket, light emitting unit and light emitting assembly - Google Patents

Abstract

The present application relates to an LED bracket, a light emitting unit and a light emitting assembly, wherein a substrate of the LED bracket includes a substrate body and a support portion extending from the substrate body into a sidewall of a bowl of the LED bracket, the support portion extending from the sidewall of the bowl to a conductive surface of the LED bracket. An insulating region extending from one of the regions to the other conductive region and insulating and isolating at least the two conductive regions extends to a sidewall region corresponding to the sidewall.

Description

LED bracket, light emitting unit and light emitting assembly

The present application relates to the field of LED (Light Emitting Diode, LED chip), and in particular, to an LED bracket, a light emitting unit, and a light emitting assembly.

Surface-mounted LEDs are widely used in fields such as lighting, decoration, backlight and display. The surface mount type LED includes an LED bracket and an LED chip installed on the LED bracket. An LED bracket of a surface mount type LED typically includes a substrate and a package body having a bowl for accommodating an LED chip installed on the substrate. However, the bowl of the conventional LED bracket does not have high side wall strength, and is easily damaged under the influence of external forces such as plate deformation.

Therefore, how to improve the intensity of the LED bracket is currently a technical problem that needs to be addressed urgently.

In view of the defects of the prior art described above, an object of the present application is to provide an LED bracket, a light emitting unit, and a light emitting assembly to solve the problem that the strength of the LED bracket is not high and is easily damaged by external force in the related art.

The LED bracket includes a package body and a substrate partially covered by the package body, wherein a bowl is formed on the package body, and a portion of the substrate is positioned in the bowl as a lower portion of the bowl; The substrate includes two conductive regions located in the bowl, and an insulating region is provided between the two conductive regions to insulate and isolate the two;

The substrate includes a substrate body and a support extending from the substrate body into a sidewall of the bowl, the support extending from one of the conductive regions to another of the conductive regions within the sidewall, the support extending from at least the insulative region to the sidewall. It extends to the sidewall area corresponding to .

Based on the same inventive idea, the present application further provides a light emitting unit comprising an LED chip and an LED bracket as described above. The LED chip is installed under the bowl, and the anode and cathode of the LED chip are electrically connected to the two conductive regions, respectively;

The light emitting unit further comprises an encapsulation layer installed in the bowl.

Based on the same inventive concept, the present application further provides a light emitting assembly including a circuit board and a light emitting unit as described above installed on the circuit board and electrically connected to the circuit board.

The present application provides an LED bracket, a light emitting unit and a light emitting assembly, wherein a substrate of the LED bracket includes a substrate body and a support portion extending from the substrate body into a sidewall of a bowl of the LED bracket, through the support portion, a sidewall of the bowl. increasing the overall intensity of the LED bracket by enhancing the intensity; In addition, the support portion extends from one of the conductive regions of the LED bracket to the other conductive region within the sidewall of the bowl, and at least the insulating region insulated and separated from these two conductive regions extends to the sidewall region corresponding to the sidewall, that is, the support portion It extends from the two conductive areas to the area between the two areas projected on the sidewall of the bowl, but the support part extends to this area as much as the area of this part has the weakest LED bracket strength, further increasing the strength of the LED bracket, especially the LED bracket. By forming strong reinforcement at the part with the lowest bracket strength, it is possible to prevent the LED bracket from being damaged by external force as much as possible. Since the light emitting unit and the light emitting assembly provided by the present application adopt an LED bracket having higher strength, overall strength and reliability of the light emitting unit and the light emitting assembly can be improved.

1 is a top view 1 of an LED bracket provided in Example 1 of the present application.
Figure 2 is a top view 2 of the LED bracket provided in Example 1 of the present application.
Figure 3 is a top view 3 of the LED bracket provided in Example 1 of the present application.
Figure 4 is a top view 4 of the LED bracket provided in Example 1 of the present application.
5 is an AA cross-sectional view of the LED bracket of FIG. 4 .
6 is a top view 5 of the LED bracket provided in Example 1 of the present application.
Figure 7 is a structural explanatory diagram 1 of the LED bracket provided in Example 2 of the present application.
Figure 8 is a structural explanatory diagram 2 of the LED bracket provided in Example 2 of the present application.
Figure 9 is a structural explanatory diagram 3 of the LED bracket provided in Example 2 of the present application.
10 is a schematic diagram 1 of the structure of a first groove provided in Example 2 of the present application.
FIG. 11 is a structural explanatory diagram 2 of a first groove provided in Example 2 of the present application.
FIG. 12 is a structural explanatory diagram 3 of a first groove provided in Example 2 of the present application.
Figure 13 is a structural explanatory diagram 4 of the LED bracket provided in Example 2 of the present application.
Figure 14 is a structural explanatory diagram 5 of the LED bracket provided in Example 2 of the present application.
15 is a structural explanatory diagram of a light emitting assembly provided in Example 2 of the present application.
Figure 16 is a schematic diagram 1 of the structure of the LED bracket provided in Example 3 of the present application.
Figure 17 is a schematic diagram 2 of the structure of the LED bracket provided in Example 3 of the present application.
Figure 18 is a structural explanatory diagram 3 of the LED bracket provided in Example 3 of the present application.
Figure 19 is a structural explanatory diagram 4 of the LED bracket provided in Example 3 of the present application.
20 is a schematic diagram 5 of the LED bracket provided in Example 3 of the present application.
21 is a structural explanatory diagram of a light emitting unit provided in Example 3 of the present application.
Figure 22 is a schematic diagram 1 of the structure of the LED bracket substrate provided in Example 4 of the present application.
Figure 23 is a schematic diagram 2 of the structure of the LED bracket substrate provided in Example 4 of the present application.
Figure 24 is a structural explanatory diagram 3 of the LED bracket substrate provided in Example 4 of the present application.
25 is a structural explanatory diagram of a light emitting unit provided in Example 4 of the present application.
Figure 26 is a schematic diagram 1 of the structure of the LED bracket provided in Example 5 of the present application.
Figure 27 is a schematic diagram 2 of the structure of the LED bracket provided in Example 5 of the present application.
Figure 28 is a structural explanatory diagram 3 of the LED bracket provided in Example 5 of the present application.
29 is a top view 1 of the LED bracket provided in Example 5 of the present application.
30 is a top view 2 of the LED bracket provided in Example 5 of the present application.
31 is a top view 3 of the LED bracket provided in Example 5 of the present application.
Figure 32 is a structural explanatory diagram 4 of the LED bracket provided in Example 5 of the present application.
33 is a structural explanatory diagram of a light emitting unit provided in Example 5 of the present application.
34 is a normalized spectrum explanatory diagram 1 provided in Example 6 of the present application.
35 is a normalized spectrum explanatory diagram 2 provided in Example 6 of the present application.
FIG. 36 is structural explanatory diagram 1 of a light emitting unit provided in Example 6 of the present application.
37 is a top view of the light emitting unit of FIG. 36;
38 is a normalized spectrum explanatory diagram 1 after improvement provided in Example 6 of the present application.
FIG. 39 is structural diagram 2 of a light emitting unit provided in Example 6 of the present application.
40 is a top view of the light emitting unit of FIG. 39;
41 is a normalized spectrum explanatory diagram 2 after improvement provided in Example 6 of the present application.
42 is structural explanatory diagram 1 of a light emitting unit provided in Example 7 of the present application.
FIG. 43 is structural diagram 2 of a light emitting unit provided in Example 7 of the present application.
44 is a structure explanatory diagram 3 of a light emitting unit provided in Example 7 of the present application.
45 is a structural diagram 4 of a light emitting unit provided in Example 7 of the present application.
46 is a structure explanatory diagram 5 of a light emitting unit provided in Example 7 of the present application.
47 is an explanatory view of the sawtooth structure of the upper surface of the LED bracket provided in Example 7 of the present application.
48 is a structure explanatory diagram 6 of a light emitting unit provided in Example 7 of the present application.
49 is structural explanatory diagram 1 of a circuit board provided in Embodiment 8 of the present application.
50 is a top view of a circuit board provided in Example 8 of the present application.
51 is a structural explanatory diagram of a light emitting assembly provided in Example 8 of the present application.
52 is an explanatory diagram of a bending state of an electronic device provided in Example 8 of the present application.
53 is a structural explanatory diagram of an electronic device provided in Example 8 of the present application.
54 is a structural explanatory diagram of a circuit board provided in Embodiment 9 of the present application.
55 is a structural explanatory diagram 1 of a light emitting assembly provided in Example 9 of the present application.
56 is a structure explanatory diagram 2 of a light emitting assembly provided in Example 9 of the present application.
57 is a structural diagram 3 of a light emitting assembly provided in Example 9 of the present application.
58 is a structural diagram 4 of a light emitting assembly provided in Example 9 of the present application.
59 is a structural diagram 5 of a light emitting assembly provided in Example 9 of the present application.
60 is a structural explanatory diagram of a heat dissipation fin provided in Example 9 of the present application.

To facilitate understanding of the present application, the present application will be more fully described below with reference to the related drawings. Preferred embodiments of the present application are shown in the drawings. However, this application may be embodied in various forms and is not limited to the embodiments described herein. Rather, these embodiments are provided for the purpose of providing a more complete and thorough understanding of the disclosure of this application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which they pertain. Terms used herein in the specification of the present application are used only for the purpose of describing specific embodiments and are not intended to limit the present application.

It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the drawings are used to distinguish similar objects, and are not used to describe a specific order or sequential order. do. It should be understood that the data so used are interchangeable where appropriate for convenience of the embodiments of the present application described herein. Further, the terms "comprising" and "comprising" and any variations thereof encompass a non-exclusive inclusion, e.g., a process, method, system, product or device comprising a series of steps or units is explicitly stated It is intended that the method not be limited to only those steps or units listed, but may include other steps or units not expressly listed or inherent to such process, method, product or device.

In this application, orientations or positional relationships indicated by the terms "upper", "lower", "inside", "middle", "outside", "front", and "backward" are based on the orientations or positional relationships shown in the drawings. . These terms are primarily intended to better describe the present application and its embodiments, and are not intended to limit that an indicated device, element or component must necessarily have a specific orientation, or be configured and operated in a specific orientation. In addition, some of the above terms may be used to indicate other meanings in addition to indicating a direction or positional relationship, and for example, the term "above" may be used to indicate a certain attachment or connection relationship depending on the case. there is. For those skilled in the art, specific meanings of these terms in this application can be understood according to specific circumstances. Also, the terms "installation", "connection" and "fixation" should be understood in a broad sense. For example, “connection” may be a fixed connection, a detachable connection, or an integral structure; It can be a mechanical connection or an electrical connection; It can be a direct connection, or an indirect connection through an intermediate medium, or an internal connection between two devices, elements or components. For those skilled in the art, specific meanings of the above-mentioned terms in this application can be understood according to specific circumstances.

It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other as long as there is no conflict. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present application will be described in detail below with reference to the drawings and in combination with examples.

Example 1

This embodiment provides an LED bracket having a simple structure, low cost, high yield and excellent overall strength, and the LED bracket may be used in fields such as lighting, decoration, backlight, and display, but is not limited thereto. The LED bracket includes a package body and a substrate partially covered by the package body, a bowl is formed on the package body, and a portion of the substrate is positioned in the bowl as a lower portion of the bowl; The substrate includes two conductive regions located in the bowl, and an insulating region is provided between the two conductive regions to insulate and isolate the two; The substrate includes a substrate body and a support portion extending from the substrate body into the sidewall of the bowl, through which the strength of the sidewall of the bowl is enhanced, thereby increasing the overall strength of the LED bracket; In this embodiment, the supporting portion extends from one of the conductive regions to the other of the conductive regions in the sidewall, and at least the insulating region extends to the sidewall region corresponding to the sidewall; The sidewall area of this part is usually the area where the strength of the LED bracket is the lowest, and the support extends to this area to form strong reinforcement in the area where the strength of the LED bracket is the weakest, thereby minimizing the situation where the LED bracket is damaged by external force. can be prevented by

In one example, the package body may be formed on a substrate with various materials, including but not limited to resin, including, but not limited to, injection molding, casting, compression molding, and the like. A bowl used to accommodate the LED chip is formed on the package body. In this example, the cross-sectional shape of the bowl is installed in a regular shape such as a rectangle, a circle, a track type, an ellipse, a ladder shape, etc., but can be flexibly installed in a shape that is not limited thereto, and can also be installed in an irregular shape according to demand. can be installed, which is not further described here.

In one example, the material of the substrate body may be an insulating material such as resin or ceramic, but is not limited thereto, and the substrate may include only one, and in this example, two conductive regions may be installed on the same substrate body. there is; The substrate of this example may include two sub-substrates, wherein the two conductive regions may be respectively provided on the substrate body of the two sub-substrates; In the conductive region of this example, the conductive region may be formed by providing a corresponding conductive layer on the substrate body, and the conductive layer may be insulated and separated by the insulating region, but is not limited thereto.

In another example, the material of the substrate body may be a conductive material such as a conductive metal, and the substrate may include two sub-substrates, in which the two sub-substrates are insulated and separated by an insulating region, and the two sub-substrates are insulated from each other. Substrates are positioned in regions within the bowl, each making up two conductive regions. Of course, in some application scenarios, the substrate may include two sub-substrates, one of which is a conductive material, and the other sub-substrate is an insulating material.

In this example, the insulating region may include a gap installed between the two conductive regions to insulate and isolate the two conductive regions, and also include an insulating material such as various insulating pastes or insulating resins installed between the two conductive regions. You can, but are not limited to this. Also in this example, one side of the insulating region close to the bowl opening is higher than one side of the at least one conductive region closer to the bowl opening, or lower than one side of the at least one conductive region closer to the bowl opening, or at least one side closer to the bowl opening. It can be installed at the same height as one side of one conductive area, and specifically, it can be flexibly installed according to various needs to improve its versatility.

In this example, an integral structure may be installed between the support part and the substrate body, thereby simplifying the structure of the LED bracket and improving integration and strength. Of course, the two may be installed in a non-integral structure. In addition, the number and specific location of the installed supports can be flexibly set according to application needs. For ease of understanding, below, in this embodiment, the substrate is insulated and separated by an insulating region and located in an area within the bowl, respectively. The description proceeds with an example of including two sub-substrates constituting two conductive regions.

In this example, the support part extends from the substrate body of one of the sub-substrates to the inside of the sidewall of the bowl, or extends from opposite sides of the substrate body of one of the sub-substrates to the inside of two opposite sidewalls of the bowl. two supporting parts, or two supporting parts extending from opposite sides of the substrate body of the two sub-substrates to the inside of the two opposite sidewalls of the bowl, respectively. In this example, the two substrates are respectively referred to as a first sub-substrate and a second sub-substrate, and the two conductive regions are respectively referred to as a first conductive region and a second conductive region.

For an application example, refer to the top view of the LED bracket shown in FIG. 1 . In order to better realize the structure of the LED bracket of the present invention, the package body is perspective-treated in the drawing, and the shaded part in the drawing shown in the top view is the upper part of the side wall; Here, the area of the first sub-substrate 11 is relatively large, the area of the second sub-substrate 12 is relatively small, and is separated from the first sub-substrate 11 by an insulating region 13, Both the sub substrate 11 and the second sub substrate 12 are partially covered by the package body 10 . In the bowl formed on the package body, portions of the first sub-substrate 11 and the second sub-substrate 12 are exposed as the first conductive region D1 and the second conductive region D2, respectively. The LED chip may be installed in the first conductive region D1, or may be installed across the first conductive region D1 and the second conductive region D2. In this embodiment, the first sub-substrate 11 includes a support portion 14 extending from its substrate body. The support part 14 extends from the substrate body of the first sub-substrate 11 to the inside of the sidewall of the bowl, and the second conductive area 14 from the second area T2 of the sidewall corresponding to the first conductive area D1 on the sidewall. extends to the third region T3 of the sidewall corresponding to the region D2, and at least the insulating region 13 extends to the sidewall region corresponding to the sidewall, that is, the first region T1 in FIG. 1; This forms strong reinforcement for the weakest part of the LED bracket, maximally preventing the LED bracket from being damaged by an external force. In this example, the support portion 14 may extend through the first region T1 into the second region T2, for example as shown in FIG. 4, the support portion 14 may also be shown in FIGS. It may not extend into the second area T2 like the support part 14 shown in FIG. 3 . In this example, it should be understood that the support portion 14 may be entirely covered by the package body 10, that is, the entirety extends into the sidewall, and may also be partially covered by the package body 10 (e.g. see Figure 2).

In this example, one side of the support portion 14 close to the bowl opening may be flush with one side of the substrate body close to the bowl opening, that is, the two may be located in the same plane; Alternatively, one surface of the support part 14 close to the opening may not be positioned on the same plane as one surface of the substrate body close to the opening. For example, one side of the support part 14 close to the opening may be installed higher than the other side of the substrate body close to the opening, that is, the support part 14 protrudes in the height direction of the substrate body (ie, the direction close to the bowl opening). In other words, the support part 14 extends from the side wall to the bowl opening of the bowl, thereby further increasing the overall strength of the side wall, especially when the LED bracket receives an upward external force due to plate deformation, for example, the side wall The possibility of breakage can be further reduced. In this example, it should be noted that the first region T1 in which the insulating region 13 corresponds to the sidewall means a region in which this partial region where the insulating region 13 contacts the sidewall corresponds to the sidewall. In other words, when viewed from above, there is a portion where the extension direction of the insulating region 13 intersects the support portion 14, and the support portion 14 of the portion is not located on the same plane as the substrate body, ensuring the strength of the sidewall. to form a three-dimensional reinforcing structure. In some application scenarios, the plate of the insulating region 13 is more easily deformed, and the supporting portion 14 enters the first region T1 to better reinforce the relatively weak portion of the LED bracket. However, in some specific application scenarios, the support portion 14 may include a portion extending in a direction away from the second conductive region D2 to reinforce other portions of the sidewall as well.

In this example, the support portion 14 may directly extend upward from the side edge of the substrate body, or may extend upward again after extending a certain distance horizontally from the side edge of the substrate body. When extending upward, the support portion 14 may include a vertical upward protrusion or may include an oblique direction protrusion. For example, referring to the example shown in FIG. 2 , the side edge of the substrate body close to the top directly extends so that the cross section of the support portion 14 is rectangular, and the thickness of the support portion 14 is less than that of the substrate body. It may be set small, and the support part 14 extends along the substrate body of the first sub-substrate 11 in the direction of the second sub-substrate 12 and enters the first region T1. In this example, the shape of the support part 14 can be installed according to demand, for example, a half-C shape (see FIG. 3), an inverted L-shape, or other shapes or combinations of shapes, for example, in FIG. Including, but not limited to, combinations of half-track shapes and rectangles shown.

In the examples shown in FIGS. 1 to 3 , all of the sub-substrates extend from one side of the substrate main body and are formed as support portions. In this embodiment, the LED bracket also includes two support parts extending from opposite sides of the substrate body of one of the sub-boards into the two opposite side walls of the bowl, respectively, or on both opposite sides of the substrate body and the package body. It should be understood that it may include three supports each extending into the bowl sidewall from different areas of the substrate body covered by the substrate body, thereby improving the overall strength of the bracket. For example, in one example, in the LED bracket shown in FIGS. 4 and 5, in view of the examples of FIGS. 1 to 3, the opposite sides of the substrate body of the first sub-board 11 are two opposite sides of the bowl. It has two supports 14 extending into the side walls of the dog. As a result, the strength of the first region T1 corresponding to the sidewall in the longitudinal direction of the insulating region 3 of the LED bracket is all improved, that is, the overall intensity is doubled compared to the LED bracket shown in FIGS. 1 to 3 can

In this embodiment, the LED bracket may also include two support portions each extending into the side wall of the bowl from one side of the substrate body of each of the two sub substrates. For example, referring to the LED bracket shown in FIG. 6 , in light of the examples shown in FIGS. 1 to 3 , the support part 14 extending into one of the side walls of the bowl on one side of the first sub-board 11 and a support part 14 extending into the other side wall of the bowl on one side of the substrate body of the second sub-board 12, and the two support parts 14 are located in two opposite sides of the bowl. do. In light of the LED brackets shown in Figs. 1 to 3, the overall intensity can also be doubled. As can be seen from the above example, in this embodiment, the number and position of the supporters 14 can be installed flexibly and variably, and the structure is simple, so that the demands of various application scenarios can be satisfied.

In some examples of this embodiment, referring to the bar shown in FIG. 4 , the first support 141 connected to the substrate body and extending from the first support 141 extend a predetermined distance to the second sub-substrate to correspond to the insulating region. The support part 14 including the second support body 142 entering the first region T1 may be installed. In some application examples, the first support 141 and the second support 142 may be integrally molded. The first support 141 may extend in a horizontal direction only in a direction perpendicular to or not perpendicular to the side edge of the substrate body, and the second support 142 extends from the first support 141 and then extends in the height direction. may protrude and extend to the second sub substrate; In addition, the first support body 141 protrudes to a certain height, and the second support body 142 extends from the first support body 141 and then horizontally extends toward the second sub-substrate; Alternatively, both the first supporter 141 and the second supporter 142 may protrude in the height direction so that at least a portion of the second supporter 142 in the first region T1 is higher than the substrate body. Through the support structure having two sections, the first support body 141 and the second support body 142, the strength of the side wall is reinforced and the coupling force between the bracket and the package body is ensured. In one application example, the first support body 141 ) The inclination of the protrusion may be set more gently than the inclination of the second support 142, and by strengthening the bonding force between the bracket and the package body through the gentle first support 141, the coupling between the bracket and the package body is more It is stable and not easily separated by external force.

It will be appreciated that any extension of the support portion 14 into the sidewall can increase the strength of the sidewall to some extent. In some embodiments, referring to FIG. 5 , FIG. 5 is an explanatory view of a cross section along line A-A of the LED bracket shown in FIG. 4 . The first support 141 of the support 14 further includes an arc-shaped connecting region, that is, the portion of the support 14 close to the substrate body may be the arc-shaped portion 143; In this example, the arc-shaped portion 143 refers to a corner portion in which an arc shape exists when the support portion 14 protrudes in the height direction, and the arc portion 143 enables a smooth transition between the support portion 14 and the substrate body. And, by further increasing the contact surface with the package body, it is advantageous to improve airtightness, and also reduces the risk of moisture inside the LED bracket by inducing the introduced water vapor to spread in the direction of the support.

In some examples, referring to FIG. 5 , in a cross section perpendicular to the side edge on which the support 14 is installed, the support 14 extends in a horizontal direction away from the substrate body, and the end of the support 14 The included angle θ between the extension direction of and the substrate body is 90° or more and less than 180°, that is, the extension direction of the upper end of the support portion 14 in the side wall has an included angle 90° or more and less than 180° with the substrate body, whereby , reducing the molding difficulty of the LED bracket. However, it can be understood that in order to increase the strength of the sidewall, it is appropriate to surround all of the support 14 with the sidewall of the package body regardless of the included angle between the support 14 and the substrate body. When the LED bracket includes two or more support parts 14, the intensity of both sides of the LED bracket may be more consistent by setting the same included angle between the upper end extension direction of the two support parts 14 and the substrate body.

In this embodiment, the support portion 14 may select a material having a hardness higher than that of the package body, and in one example, the package body may be a material such as plastic, and the hardness of the support portion is higher than that of the plastic used. Higher. The support portion 14 may be a metal material, a ceramic material, or a high-strength resin material or other material, and in some embodiments, the first sub-substrate 11 is a conductive substrate, and the substrate body and support portion 14 are a conductive metal material. For example, the first sub-substrate may include, but is not limited to, a copper substrate, an aluminum substrate, an iron substrate, a silver substrate, and the like, and the support portion is made of the same material as the substrate body, such as a metal material, and the first sub-substrate The substrate is integrally molded to ensure the integrity of the structure. In the process of forming the support portion 14, the support portion 14 may be an extended area on the first sub substrate formed into a desired shape through a process such as stamping or etching. After the supporting portion 14 is molded, it is packaged to form a package body structure such as a side wall using a material such as plastic.

In the LED bracket provided in each of the above examples of this embodiment, at least one support part 14 extending into the sidewall of the bowl is formed on at least one of the first sub-board 11 and the second sub-board 12, and the support part ( 14) extends from the substrate body and protrudes upward from the height direction of the substrate body, and the support portion 14 extends in a direction close to the second sub substrate 12 and corresponds to the first region T1 corresponding to the insulating region 3. ) to enter The LED bracket of this embodiment reinforces the strength of the sidewall through the support part 14, and in particular, the strength of the first region T1 corresponding to the insulating region 3 is remarkably improved, for example, to withstand external forces such as plate deformation. By reducing the situation in which the sidewall is damaged by, the quality of the LED bracket and the LED light emitting device manufactured using the same is guaranteed. Overall strength and reliability of the light emitting unit manufactured using the LED bracket provided in this embodiment and the light emitting assembly manufactured using the light emitting unit are expected to be higher.

Example 2

In conventional LED device packaging, an LED chip is installed in a conductive region of an LED bracket to perform packaging protection for the LED chip through an encapsulating adhesive to obtain a light emitting unit called an LED device. Since the LED device may work in a high temperature, high humidity, or salt spray environment, protection of the LED device may fail in situations where the sealing adhesive and the substrate are easily loosened or easily detached.

In order to solve the above problems, the present embodiment has a larger contact area with the encapsulating adhesive and a stronger bonding strength, so that a situation such as easy loosening or even falling off between the encapsulating adhesive and the substrate can be prevented as much as possible. .

It should be understood that the LED bracket in this embodiment can adopt not only the LED bracket shown in the above embodiment, but also an LED bracket with a different coupling structure, and the present embodiment is not limited thereto. In this embodiment, the LED bracket includes a substrate, and referring to FIG. 7 , the substrate includes a substrate body 21, and a first conductive layer 22 installed on a first surface of the substrate body 21, and A second conductive layer 23 is included, and two conductive regions separated by an insulating region are formed between the first conductive layer 22 and the second conductive layer 23 . In this embodiment, the LED bracket may include a package body installed on the substrate body 21, and the package body may adopt various sealing adhesives, but is not limited thereto.

In this embodiment, a plurality of first grooves 25 are installed at the edge of at least one of the first conductive layer 22 and the second conductive layer 23, so that the conductive layer on the substrate body in contact with the sealing adhesive is further It has a large side surface area, and also has a plurality of first grooves 25 installed on the edge of the conductive layer (ie, the side wall), so that the substrate body can have a larger bonding area with the encapsulating adhesive, that is, the encapsulating adhesive is It can have better adhesion in the example substrate body, improving the bonding strength and reducing the occurrence of loose or falling-off situations between the encapsulating adhesive and the substrate body.

Referring to FIG. 7 , in this example, a plurality of first grooves 25 are provided at the edges of the first conductive layer 22 and the second conductive layer 23, and the first conductive layer 22 ) And the first groove 25 is installed on one of the edges (ie, one side) of the second conductive layer 23, and the first groove 25 may be installed on each of the plurality of edges, so that this and the sealing It should be understood that the bonding area and bonding strength of the adhesive can be further improved.

In this example, at least two conductive through holes 24 are installed in the substrate body 21, and the first conductive layer 22 and the second conductive layer 23 are electrically connected to different conductive through holes 24, respectively. connected; Referring to FIG. 9 , in this example, the substrate further includes a third conductive layer 26 and a fourth conductive layer 27 covering the second surface of the substrate body, and the third conductive layer 26 It is electrically connected to the first conductive layer 22 through a corresponding conductive through hole 24, and the fourth conductive layer 27 is electrically connected to the second conductive layer 23 through another corresponding conductive through hole 24. electrically connected; In this example, the first surface and the second surface of the substrate body may be, but are not limited to, the front and rear surfaces of the substrate body, and are two opposite surfaces.

Here, the thickness of the plurality of first grooves 25 at the edges of the first conductive layer 22 and/or the second conductive layer 23 in the height direction of the conductive layer may coincide with the height of the conductive layer, and the conductive layer may be conductive. It may be lower than the height of the floor. For example, as in the situation illustrated in FIG. 7 , the thickness of the first groove 25 in the height direction of the conductive layer coincides with the height of the conductive layer. Referring to FIG. 8 as another example, the thickness of the first groove 25 in the height direction of the conductive layer is lower than the height of the conductive layer.

A plurality of first grooves are additionally formed at the edges of the first conductive layer 22 and/or the second conductive layer 23, and have a larger side surface area than conventional rectangular or other shaped conductive layers, and Since the roughness of the sidewall of the first conductive layer 22 and/or the second conductive layer 23 is usually relatively high, the sealing adhesive is installed on one side where the first conductive layer 22 and the second conductive layer 23 are installed. It can be understood that it is more strongly bonded with the encapsulation adhesive when performed. In addition, in some implementations, the airtightness of the finally formed LED light emitting device can also be improved. Each conductive layer in this embodiment includes, but is not limited to, pads and pins. For example, in some embodiments, the first conductive layer 22 and the second conductive layer 23 are pads for setting LED chips. , and the third conductive layer 26 and the fourth conductive layer 27 may be used as fins. In some conventional substrates, for example, a first groove or similar shape may be formed in the conductive layer as an anode or cathode pad, but in practice, such installation is used to easily distinguish the anode and cathode of the pad, and the adhesive strength of the sealing adhesive It should be noted that a distinction is made between positive and negative electrodes based on printed marks on some substrates. In the substrate of this embodiment, a plurality of first grooves 25 are provided in the first conductive layer 22 and/or the second conductive layer 23, and the positions of the first grooves 25 are located along the edge of the conductive layer. It may be continuously and regularly arranged at a constant period according to the substrate, and may be installed according to the actual shape of the substrate and/or the arrangement of the electronic device such as the subsequently mounted LED chip.

As shown in Fig. 9, the conductive through-holes 24 in this embodiment penetrate from the first surface to the second surface of the substrate body 21, and the positions and numbers of the conductive through-holes 24 to be installed are different from the actual situation. The first conductive layer 22 corresponding to the conductive through hole 24 and the conductive through hole 24 corresponding to the second conductive layer 23 are separated by a predetermined distance, so that the first conductive layer 22 corresponds to the conductive through hole 24. The layer 22 and the second conductive layer 23 are prevented from coming too close. Optionally, a conductive metal layer is provided through the conductive through hole 24 to realize the connection between the two surfaces of the substrate body, and the conductive metal layer contacts the conductive layers corresponding to the first and second surfaces of the substrate body to provide corresponding conductivity. Forms electrical connections between layers. The conductive metal layer material can be any conductive metal, including but not limited to gold, silver, copper, platinum, and the like. The conductive metal layer may be provided in the conductive through-hole through a film formation process such as vacuum sputtering, or may be fabricated through another film formation process. In this example, the conductive metal layer may not fill the conductive through hole 24, and exemplarily, the conductive through hole 24 may have a diameter of 50 to 200 um, and a conductive metal layer is formed on an inner wall of the conductive through hole. and its thickness can be set to 15um or less. In some other examples, the conductive through hole 24 may also be filled with a conductive metal material or a conductive metal bar, and similarly, an effect of electrically connecting the corresponding conductive layers on both sides of the substrate may be realized.

In some examples, the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 include a copper layer, and the formation method is a conductive through hole ( 24), but may be formed in a manner similar to the manner of forming the conductive metal layer in, but not limited thereto, which is not further described herein. In this example, the thickness of the copper layer may be set according to demand such as the size or specifications of the actual device, and as an example, the thickness of the copper layer is about 20 to 100 um, and the first conductive layer 22, the second conductive layer The layer 23, the third conductive layer 26, and the fourth conductive layer 27 may be identical or not identical to each other; In addition, although the first conductive layer 22 may be set to the same thickness as the second conductive layer 23 and the third conductive layer 26 may be set to the same thickness as the fourth conductive layer 27, the first conductive layer ( 22) and the third conductive layer 26 may have different thicknesses.

In some examples, at least one of the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27 further includes a metal plating layer, wherein the metal plating layer It should be noted that it may include any conductive metal that is more chemically stable than copper, such as gold plating, silver plating, platinum plating, or some alloys. The metal plating layer allows the conductive layer to have some corresponding metal surface properties, and is more stable than using bare copper as the conductive layer.

The first groove 25 on the substrate of this embodiment includes, but is not limited to, those made by etching, cutting, or the like. Illustratively, the entire copper layer is formed on the substrate body 21 through a method such as vacuum sputtering, and then the copper layer is fabricated into a required shape through methods such as etching and cutting. In this process, the first groove 25 are also produced The formation of the metal plating layer may be performed after the first groove 25 is completed, and as a result, necessary metal may be plated on both sidewalls of the first conductive layer 22 and/or the second conductive layer 23. . In the process of fabricating the substrate of this embodiment, the surface of the conductive layer may be polished and polished before plating metal on the conductive layer to make it flat.

The substrate body of this embodiment may include a ceramic plate, that is, the substrate of this embodiment may be a ceramic substrate such as ALN, AL2O3, or the like. In other embodiments the substrate body may also be other insulative materials.

In this embodiment, the first groove 25 of the first conductive layer 22 and the second conductive layer 23 on the substrate body may have various shapes, and in some embodiments, the shape of the first groove 25 is It should be understood that it may include at least one of an arc shape, a sawtooth shape, and a rectangle. For example, as shown in FIG. 7 , rectangular first grooves 25 are periodically formed at the edges of the first conductive layer 22 and the second conductive layer 23 (that is, between the first grooves 25). spacing is fixed) arranged; At the edge of the conductive layer shown in FIG. 10, arc-shaped first grooves 25 are periodically arranged; Saw-toothed first grooves 25 are periodically arranged at the edge of the conductive layer shown in FIG. 11; 12 shows another type of serrated first groove 25 . The shape of the first groove may be different, and if it is ensured that a plurality of first grooves are formed, that is, by increasing the lateral area of the first conductive layer and the second conductive layer in contact with the encapsulating adhesive, the adhesive strength of the encapsulating adhesive is increased. It can be understood that its size and arrangement are all configurable, as long as it is guaranteed to reach a heightened effect.

In some implementations, one or more LED chips may be installed in regions corresponding to the first conductive layer 22, the second conductive layer 23, the third conductive layer 26, and the fourth conductive layer 27. have to understand Also, the substrate may be installed to include one or more of these areas.

In the substrate of this embodiment, a plurality of first grooves are formed on the edge of the first conductive layer and/or the second conductive layer, thereby increasing the surface area of the relatively rough side of the first conductive layer and/or the second conductive layer. After performing the packaging of the adhesive, the encapsulation adhesive can contact the sidewall of the first conductive layer and/or the second conductive layer with a larger area, so that the substrate can be more strongly bonded with the encapsulation adhesive, and finally manufactured It reduces the situation in which the encapsulating adhesive on the LED light emitting device comes off, and finally reaches the effect of improving the quality of the manufactured LED light emitting device.

This embodiment further provides a light emitting unit, also referred to as an LED light emitting device, and referring to FIG. 13 , it includes a substrate body 21, an LED chip 28 and an encapsulation layer 29. The LED chip 28 is installed on the first surface of the substrate body 21, the anode of the LED chip 28 is welded to the first conductive layer 22, and the cathode of the LED chip 28 is welded to the second conductive layer. welded with (23); The encapsulation layer 29 is provided on the first surface of the substrate body 21, covers the first conductive layer 22, the second conductive layer 23 and the LED chip 28, and the encapsulation layer 29 is It enters the first groove 25 at the edge of the first conductive layer 22 and/or the second conductive layer 23.

In the light emitting unit, the encapsulation layer 29 may be an encapsulation adhesive layer, but may not be limited thereto, and the encapsulation layer 29 is at the edge of the first conductive layer 22 and/or the second conductive layer 23. Entering the first groove 25, the contact area with the sidewall of the relatively rough first conductive layer 22 and/or the second conductive layer 23 on the substrate is increased, which effectively improves the bonding strength with the substrate. let it

In one example of this embodiment, the light emitting unit may further include a zener diode according to demand, and the zener diode is installed on the first surface of the substrate body 21, that is, the same side of the LED chip 28, The anode of the diode is welded to the second conductive layer 23 and the cathode is welded to the first conductive layer 22, and the zener diode is also covered by an encapsulation layer. A zener diode connected in reverse direction can protect the LED chip. By installing it on the same side of the LED chip, the zener diode can also be protected by being covered by the sealing adhesive. It is to be understood that the LED light emitting device may further include other components, and as far as the circuit structure permits, they may be installed on the same side of the LED chip as well.

In one example of this embodiment, the plurality of first grooves 25 at the edges of the first conductive layer 22 and the second conductive layer 23 are located outside the area covered by the LED chip 28. . The light emitting unit further includes a Zener diode, and the plurality of first grooves 25 are also located outside the area covered by the Zener diode. After the component is mounted on the board, a part of the area may contact the first conductive layer 22 or the second conductive layer 23, and the first conductive layer 22 or the second conductive layer (which has a relatively large area) 23), it is possible to implement heat conduction, the first groove 25 is prevented from being installed at the location of the part, and the first conductive layer 22 or the second conductive layer 23 prevents heat conduction from the part. guarantee

As shown in FIG. 14, in the substrate adopted for the light emitting unit shown in FIG. 13, the first grooves 25 of the first conductive layer 22 and the second conductive layer 23 are each a first conductive layer ( 22) and the second conductive layer 23, the first groove 25 is provided on one side far from the center of the substrate in the longitudinal direction of the first conductive layer 22 and the second conductive layer 23. relatively many, in fact, the first groove 25 of this part can be arranged periodically; First grooves 25 may also be formed at various corners of the first conductive layer 22 and the second conductive layer 23; A small amount of first grooves 25 are also provided on one side close to the center of the substrate in the longitudinal direction of the first conductive layer or the second conductive layer. As can be seen from this example, the first grooves on the first conductive layer 22 and the second conductive layer 23 are not installed at positions where the LED chip 28 and the Zener diode are covered, and the first conductive layer ( 22) and the second conductive layer 23 are provided with relatively as many first grooves 25 as possible in all positions covered by the component, so that the substrate can have relatively good adhesion with the encapsulating adhesive layer (not shown). let it be From this, it can be seen that in practical application, the first groove 25 of the substrate can be selected according to the final layout of the component, avoiding the area covered by the component, and the first conductive layer 22 and the second conductive layer. 23 has a certain surface area, and at the same time, the first groove 25 is formed along the edges of the first conductive layer 22 and the second conductive layer 23 as much as possible, so that the substrate and the sealing adhesive layer are bonded. The strength is increased and, in some implementations, the airtightness can also be improved thereby, which is advantageous for ensuring the final quality of the LED light emitting device.

In this embodiment, the manufacturing process of the substrate and the LED light emitting chip of this embodiment is also described, and the manufacturing process includes the following.

S101: Selecting a board body suitable for drilling a hole, for example, drilling a hole in the lower left and upper right regions of the board body 21, exemplarily, the diameter of the hole may be 50 to 200 um there is. The hole drilled in the above step is a hole to be subsequently formed as a conductive through hole.

S102: Sputtering a metal layer on the front and rear surfaces of the substrate body and in the holes, for example, sputtering a relatively thin metal layer on the substrate body 21, the thickness may be less than 15um. The metal layer may be a conductive metal layer such as copper;

S103: pad-printing a circuit on the surface of the substrate body and electroplating a thick copper layer on the metal layer;

S104: After the thick copper layer is fabricated into the required conductive layer shape, etched or cut, an exemplary substrate outline as shown in FIG. 14 can be obtained;

S105: Grinding and polishing the conductive layer to flatten its surface;

S106: electroplating the surface of the conductive layer to obtain a finished substrate; For example, a metal plating layer is formed on the surface of the copper layer by electroplating.

S107: A step of installing components on a board and performing packaging through encapsulation adhesive.

Illustratively, the parts are installed on the board by a method including, but not limited to, process welding, the parts include a Zener diode and an LED chip, and after fixing these parts to the board, a method such as compression molding is performed. Through this, an encapsulation adhesive layer can be produced. In some specific examples, the thickness of the encapsulation adhesive layer may be 200 to 400 um, and the encapsulation adhesive layer may be an insulating adhesive material such as silica gel. It is appreciated that in some instances the encapsulation adhesive layer is higher than the highest surface of the components on the substrate so as to cover and protect each and all components. When the compression molding of the sealing adhesive layer is completed, it is baked and cured by putting it in an oven, and exemplarily, the silica gel packaging layer may be baked and cured at a temperature of 120 to 170 ° C. It should be understood that a single LED light emitting device can be obtained by cutting the cured LED light emitting device when one or more areas where LED chips are installed on the substrate are included.

This embodiment further provides a light emitting assembly, as shown in FIG. 15 , including a circuit board 210 and a light emitting unit, wherein the light emitting unit is the LED light emitting device presented in each of the above examples of this embodiment, and the circuit board Reference numeral 210 includes a circuit layer 211 , and the third conductive layer 26 and the fourth conductive layer 27 are welded to the circuit layer 211 . It can be understood that a corresponding circuit pattern and a component for emitting light by driving the LED light emitting device may be further disposed on the circuit board 210 of the light emitting assembly. In the light emitting device of this embodiment, the sealing adhesive layer of the LED light emitting device has a stronger bonding force with the substrate, so that it is not easily detached from the substrate, and the quality of the light emitting device is high.

Example 3

In the conventional LED package structure, the coupling between the package body and the substrate is relatively poor, resulting in deterioration in airtightness and problems such as light attenuation. For the above problem, this embodiment provides a new type of LED bracket. A second groove is added to the area where the substrate of the LED bracket contacts the package body, that is, the area covered by the substrate package body, the package body forms a stepped structure in the second groove, and the package body on the substrate The part is covered and filled in the second groove, and further, the contact area of the package body with the substrate is increased through the second groove, and the bonding strength and airtightness of the substrate and the package body are increased; In addition, when the light emitting unit is obtained by applying the bracket to the LED package body, the inner wall of the package body can be allowed to have an increased degree of inclination compared to the conventional method due to the installation of the second groove, and the required bonding strength is still required. It is possible to improve the light output angle of the light emitting unit by ensuring. It should be understood that the LED bracket of this embodiment may adopt the LED bracket as shown in the above embodiment (eg, Embodiment 1), and may also adopt LED brackets of other structures, is not limited to this.

For convenience of understanding, it will be described in combination with several examples as shown in the drawings below.

As shown in FIG. 16, in the LED bracket, the bracket includes a substrate 3 and a package body 32 installed on the substrate 3, and one side of the substrate 3 connecting the package body 32. A second groove 31 is installed in the second groove 31 , and the package body 32 covers a part of the surface of the substrate 3 and fills the second groove 31 . In some examples of this embodiment, the substrate 3 may be used as a conductive thermal conduction layer, and materials include, but are not limited to, copper alloy, aluminum, gold, silver, copper, and the like. The package body 32 may be a thermosetting resin or a thermoplastic resin, but is not limited thereto.

In one example of this embodiment, the depth of the second groove 31 opened in the LED bracket may be 0.05mm ~ 0.3mm, but is not limited thereto, and the width may be 0.05 ~ 0.5mm, but is not limited thereto. As a result, the particle diameter as the filling material of the package body 32 should be considered, and the width and depth should generally be at least twice the maximum particle diameter to prevent non-filling.

In some examples of this embodiment, the substrate 3 has two conductive regions separated by an insulating region 34, in this example the insulating region 34 is a strip-shaped via slot structure, and the insulating region ( 34), electrical insulation between the two conductive regions can be implemented by filling an insulating material filler inside.

In one example of this embodiment, as shown in FIG. 16 , the inner wall of the package body 32 is funnel-shaped and the size of the opening gradually increases in the direction away from the substrate 3, that is, the package body 32 is surrounded by The size of the opening of the formed bowl gradually increases in a direction away from the substrate 3 from the bottom of the bowl. The inner wall of the package body 32 is connected to one side of the notch of the second groove 31 close to the center of the bowl (ie, one side of the notch of the second groove 31 far from the edge of the substrate 3), and the substrate 3 In the cross section of ), the projected shape of the inner wall of the package body 32 is a straight line L1, that is, the shape of the inner wall of the package body 32 is the side surface of a truncated cone or prismatic structure, of which the substrate 3 of this example is The cross section is perpendicular to the surface of the substrate 3 . In the above structure, the second groove 31 is provided at the place where the substrate 3 and the package body 32 are joined, so that the inside of the package body 32 can be more inclined, and still ensure the necessary bonding strength. And, when applied to the structure of the LED package body, since the light emission angle becomes larger, the light emission angle θ1 of the LED package body can be increased.

In some embodiments, as shown in FIG. 17 , the inner wall of the package body 32 is funnel-shaped and the size of the opening gradually increases in a direction away from the substrate 3, and the inner wall of the package body 32 is the center of the bowl. It is connected to one side of the notch of the second groove 31 close to, and the shape of the inner wall of the package body 32 in the cross section of the substrate 3 is a curve L2, and the specific shape of the curve is a circular arc, an elliptical arc and a parabola. including but not limited to Similarly, in the above structure, the second groove 31 is installed where the substrate 3 and the inner wall of the package body 32 are joined, so that the inside of the package body 32 can be more inclined, while still ensuring the necessary bonding strength. When this is applied to the LED package body structure, the angle of light emitted from the central axis of the LED becomes larger, so the angle of light emitted from the LED package body can be increased.

In some embodiments, as shown in FIG. 18 , the inner wall of the package body 32 is funnel-shaped and the size of the opening gradually increases in a direction away from the substrate 3, and the package body 32 has a second groove 31 ) covers the surface of the substrate 3 on both sides. In the cross-section of the substrate 3, the shape of the inner wall of the package body 32 is a first section 35 vertically connected to the surface of the substrate 3 and a second section 36 installed inclined with respect to the surface of the substrate 3 includes The package body 32 covers the surface of the substrate 3 on both sides of the second groove 31 so that the package body 32 forms a stepped structure on both sides of the second groove 31, so that the substrate 3 and The bonding strength between the package bodies 32 is further increased and additionally, airtightness is provided. The first section 35 of the inner wall of the package body 32 is used to ensure the thickness of the package body 32, and the second section 36 forms an open and gradually expanding opening to increase the light emitting angle. used for

In some embodiments, as shown in FIGS. 16 to 18, a second groove 31 is installed on one side of the substrate 3 for fixing a chip (including but not limited to an LED chip). Three grooves 33 are further opened, and the third groove 33 may be opened in any one conductive region of the substrate 3 . In one example, the third groove 33 is present in the form of a counter bore on the surface of the substrate 3, the depth is 0.05 mm to 0.3 mm, but is not limited thereto, and the width may be longer than the edge length of the chip to be fixed. There is, so that the chip can be placed inside the third groove (33). The third groove 33 can cause the action of deepening the depth of the package body 32, and those skilled in the art can ensure the airtightness of the product after packaging and prevent the chip from being affected by the external environment and easily affecting its reliability. To do this, in the LED package body, it is known that the encapsulation layer on the chip has a certain thickness. In this embodiment, even if the height of the LED package body is insufficient, the thickness of the package body can be guaranteed through the depth of the third groove 33, and the height of the encapsulation layer is satisfied. Under the premise of making the size of the LED package body as small as possible. The structure may prevent the bonding wire 310 between the chip and the substrate 3 from being easily exposed to the adhesive surface and reduce the possibility of light attenuation and dead lamp occurrence.

As a point to be explained, other configurations and manipulations of the bracket of the LED package body provided by this embodiment are known to those skilled in the art, and all of them can refer to the structure of related devices in the prior art, and here in more detail don't explain

This embodiment further provides a light emitting unit, which includes the LED bracket provided by this embodiment, and as shown in FIGS. 19 to 21, the light emitting unit of this embodiment includes an LED chip 38, The LED chip 38 is fixed to the surface of the substrate 3 inside the package body 32 (that is, in the bowl) through the die bonding adhesive 37, and the LED chip 38 is bonded to the substrate through the bonding wire 310. 3), but is not limited thereto, the encapsulation layer 39 is installed in the bowl formed on the package body 32 and used to seal the LED chip 38. When the third groove 33 is opened on the substrate 3, the third groove 33 is a die bonding area of the LED package body, and the third groove 33 is located inside the bowl-shaped package body 32 , The LED chip 38 is fixed inside the third groove 33 through the die bonding adhesive 37, and the electrical connection between the LED chip 38 and the substrate 3 is implemented through the bonding wire 310. .

For convenience of understanding, the present embodiment will be described below as an example of the manufacturing process of the LED bracket, including but not limited to the following.

Substrate 3 fabrication: a third groove 33 is opened at the center of the substrate 3, and a second groove 31 is installed around the third groove 33, where the second groove 31 The depth of is 0.05mm ~ 0.3mm, the width is 0.05 ~ 0.5mm, the depth of the third groove 33 is 0.05 ~ 0.3mm, the width should be longer than the length of the LED chip (38).

Bracket formation: the package body 32 formed by the filling material under the action of the second groove 31 and the mold extends into the second groove 31, and the substrate 3 and the package body 32 form a bracket structure. do.

After disposing the die-bonding adhesive 37 in the die-bonding area in the third groove 33 using the die-bonding device and fixing mechanism, the LED chip ( 38) is disposed and hardened to fix the LED chip 38 in the third groove 33.

Wire bonding is performed on the material after die bonding is baked using a wire bonding device and a fixing mechanism so that the LED chip 38 is electrically connected to the substrate 3 through the bonding wire 310 . The bonding wire 310 employed includes, but is not limited to, gold wire, silver wire, or alloy wire.

A fluorescent adhesive or encapsulation adhesive is soldered to the material after wire bonding using an adhesive device, and then the material to which the fluorescent adhesive or encapsulation adhesive is soldered is baked and cured to form the encapsulation layer 39 . The finally obtained light emitting unit product has excellent airtightness, high product reliability, a large light emission angle and high luminance, so it can be applied to indoor and outdoor products with high reliability requirements. It should be understood that the LED chips in this example are face-up chip LEDs and can be replaced with flip-chip LEDs or vertical chip LEDs depending on demand.

Since the light emitting unit disclosed in this embodiment includes the bracket provided in the above embodiment, the light emitting unit of the bracket also has all the technical effects described above, which are not further described here. Other configurations and manipulations of the light emitting unit are known to those skilled in the art and are not described in further detail here. Partial embodiments in this specification are described in a gradual or parallel manner, each embodiment focuses on different points from other embodiments, and the same and similar parts between each embodiment may refer to each other, where no further explanation

Example 4

In an existing LED bracket, in order to improve the overall performance of the LED bracket, a copper plating layer and a silver plating layer are sequentially installed on the surface of the substrate body. However, when the LED chip is connected to the substrate surface by soldering, a large number of copper ions in the copper plating layer migrate to the silver plating layer, combine with tin on the surface of the silver plating layer to form a tin-copper compound, and holes are formed, resulting in high production yield. cause a lowering

Regarding the above problem, this embodiment provides a new type of LED bracket comprising a substrate, wherein the substrate includes a substrate body (i.e., a substrate body), and a first surface of the substrate body has a conductive layer separated by two insulating regions. regions are provided, at least one conductive region of which includes a first copper plating layer, a nickel plating layer, a second copper plating layer, and a silver plating layer sequentially laminated on the first surface of the substrate body, and the thickness of the installed first copper plating layer is Thicker than the thickness of the second copper plating layer, the nickel plating layer is used to block copper ions of the first copper plating layer from transferring to the second copper plating layer. By sequentially stacking and installing the first copper plating layer, the nickel plating layer, the second copper plating layer and the silver plating layer on the surface of the substrate body, the overall performance of the LED bracket is effectively improved; Here, the thickness of the second copper plating layer is relatively thin, and only a small amount of copper ions in the second copper plating layer are transferred to the silver plating layer, so that the copper ions form a soldering material and a large amount of tin-copper compound on the surface of the silver plating layer to generate holes can be effectively prevented from causing the copper ions in the first copper plating layer to be transferred to the second copper plating layer due to the presence of the nickel plating layer, effectively preventing an increase in the content of copper ions transferred in the second copper plating layer. By preventing tin-copper compounds from being formed in large amounts, the production yield is improved. It should be understood that other structures of the LED bracket of this embodiment may adopt the structure of the LED bracket shown in each of the above embodiments, and may also adopt other structures applicable to the LED bracket of this embodiment, This embodiment is not limited in this regard. For better understanding, this embodiment will be described in combination with examples shown in the drawings below.

As shown in FIG. 22, the substrate of the LED bracket includes a substrate body 40 and a first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and and a nickel plating layer 44, wherein the substrate body 40 has a certain structural strength that can serve as a support. In addition, since the substrate body 40 is made of a material having high thermal conductivity, when the LED chip generates heat during operation, the generated heat is conducted through the LED bracket, so that effective heat dissipation can be implemented. In a specific embodiment, the material used to fabricate the substrate body 40 may be a conductive material such as a metal material. It should be understood that the material of the substrate body 40 includes, but is not limited to, a conductive material, and may also be made of any other high thermal conductivity material having a certain structural strength, and the substrate body 40 The material is not specifically limited here.

In one example of this embodiment, the substrate body 40 includes a first surface 401 and a second surface 402 that are opposed to each other, and both the first surface 401 and the second surface 402 have a second surface. A first copper plating layer 41, a nickel plating layer 42, a second copper plating layer 43, and a silver plating layer 44 are stacked and installed. Here, the metal plating layer of the first surface 401 is used to connect with the LED chip, and the metal plating layer of the second surface 402 is used to electrically connect with the circuit board. As a point to be understood, the metal plating layer may be formed on the surface of the substrate body 40 by selecting an electroplating method, but is not limited thereto, and in the electroplating process, the metal plating layer is formed on only one surface of the substrate body 40. Forming is relatively difficult and the operation is more complicated, so the metal plating layer can be formed on the first surface 401 and the second surface 402 together, reducing the difficulty of the process and improving the processing efficiency. . As a point to be explained, the method of processing and forming the first copper plating layer 41, the nickel plating layer 42, the second copper plating layer 43, and the silver plating layer 44 on the surface of the substrate body 40 includes electroplating. It is not limited to one, and may be processed by adopting metal deposition, chemical plating, or any other method that satisfies the corresponding functional requirements, and the method of processing and forming the metal plating layer is not specifically limited.

The first copper plating layer 41 is provided on the surface of the substrate body 40 . It should be understood that in a general manufacturing process, the surface of the substrate body 40 usually has a problem of relatively low flatness, and when the substrate body 40 is directly mounted on the circuit board, the substrate body 40 and Gaps or holes may exist between the circuit boards, resulting in reduced production yield. Likewise, if the LED chip is directly mounted on the uneven surface of the substrate body 40, it may have a certain influence on the working effect of the LED chip. By installing the first copper plating layer 41 on the first surface 401 and the second surface 402 of the substrate body 40, the surface flatness of the LED bracket is improved, and it exists between the LED bracket and the circuit board. When the LED chip is mounted on the relatively flat first copper plating layer 41, the working effect can be effectively improved.

In one example of this embodiment, the thickness of the first copper plating layer 41 is in the range of 0.5 μm to 5 μm. It should be understood that, when the thickness of the first copper plating layer 41 is less than 0.5 μm, the thickness of the first copper plating layer 41 is too thin to compensate for the depressions on the surface of the substrate body 40, so that a flattening effect cannot be achieved. No, there is still a gap or hole between the corresponding LED bracket and the circuit board, and the LED chip is mounted on the corresponding LED bracket, and its working effect is still affected; When the thickness of the first copper plating layer 41 is 5 μm or more, the manufacturing cost increases to some extent because the thickness of the first copper plating layer 41 is relatively thick. Based on this, when the thickness of the first copper plating layer 41 is 0.5 μm or more and 5 μm or less, surface flatness of the LED bracket can be ensured and manufacturing cost can be effectively reduced.

The nickel plating layer 42 is provided between the first copper plating layer 41 and the second copper plating layer 43 . It should be understood that in the general process, between the LED bracket and the circuit board and between the LED chip and the LED bracket are usually fixed by soldering, and a tin solder layer is present on the surface of the silver plating layer 44, and a certain amount of work After that, the copper ions in the first copper plating layer 41 are easily transferred to the second copper plating layer 43, the copper ions in the second copper plating layer 43 increase, and a large amount of copper ions are transferred to the second copper plating layer (43). 43) to the silver plating layer 44, combine with tin on the surface of the silver plating layer 44 to form a tin-copper compound, and a large amount of tin-copper compound is formed between the LED bracket and the circuit board and the LED A hole is formed between the bracket and the LED chip, which lowers the production yield. The existence of the nickel plating layer 42 can effectively block copper ions in the first copper plating layer 41 from transferring to the second copper plating layer 43, and furthermore, a large amount of copper ions are transferred to the silver plating layer 44 to form silver. Formation of a relatively large amount of tin-copper compound with the solder material on the surface of the plating layer can be effectively prevented.

As should be further understood, the silver plating layer 44 connected to the LED chip may reflect the light emitted from the LED chip to enhance brightness. The existence of the nickel plating layer 42 effectively prevents a large amount of copper ions from transferring to the silver plating layer 44 to lower the reflectance of the silver plating layer 44, and furthermore, the corresponding reflection function of the silver plating layer 44 is normal. guarantee that

In one example of this embodiment, the thickness of the nickel plating layer 42 is in the range of 0.125 μm to 2.5 μm. It should be understood that, when the thickness of the nickel plating layer 42 is less than 0.125 μm, the thickness of the nickel plating layer 42 is too thin and the nickel plating layer 42 does not effectively block the transition of copper ions, resulting in a large amount of tin-copper compound. generation of can not be prevented, and the reflectance of the silver plated layer 44 cannot be guaranteed to satisfy the corresponding requirements; When the thickness of the nickel plating layer 42 is 2.5 μm or more, the thickness of the nickel plating layer 42 becomes relatively thick, and manufacturing cost increases to a certain extent. Based on this, when the thickness of the nickel plating layer 42 is greater than or equal to 0.125 μm and less than 2.5 μm, the transition of copper ions can be prevented and manufacturing cost can be effectively reduced.

The second copper plating layer 43 is provided between the nickel plating layer 42 and the silver plating layer 44, and the thickness of the second copper plating layer 43 is smaller than that of the first copper plating layer 41. It should be understood that, when the silver plating layer 44 is directly provided on the surface of the nickel plating layer 42, the bonding between the silver plating layer 44 and the nickel plating layer 42 is relatively low, so that the silver plating layer 44 is nickel-plated. It is easily detached from the surface of the plating layer 42, reducing the stability of the LED bracket, and by installing the second copper plating layer 43 and the second copper plating layer 43 between the nickel plating layer 42 and the silver plating layer 44 Since the coupling between the second copper plating layer 43 and the silver plating layer 44 is good, structural stability of the LED bracket can be effectively improved. To be further understood, when the thickness of the second copper plating layer 43 is smaller than the thickness of the first copper plating layer 41, that is, the thickness of the second copper plating layer 43 is relatively thin, so that the second copper plating layer 43 ) is relatively small, effectively preventing a large amount of copper ions from transferring from the second copper plating layer 43 to the silver plating layer 44, reducing the number of holes formed by the tin-copper compound to some extent, While effectively improving the production yield, it ensures that the reflectance of the silver plated layer 44 meets the corresponding requirements.

In one example of this embodiment, the thickness of the second copper plating layer 43 is in the range of 0.0625 μm to 1 μm. It should be understood that, when the thickness of the second copper plating layer 43 is less than 0.0625 μm, the thickness of the second copper plating layer 43 becomes too thin, so that the second copper plating layer 43 cannot cause bonding action, and silver There is a problem that the plating layer 44 is still removed, so that the structural stability of the LED bracket cannot be effectively guaranteed. When the thickness of the second copper plating layer 43 is 1 μm or more, the thickness of the second copper plating layer 43 becomes too thick and contains more copper ions in the second copper plating layer 43, so that the copper ions are reduced to the second copper plating layer 43. A large amount is easily transferred from the plating layer 43 to the silver plating layer 44 connected to the circuit board, and furthermore, a hole is formed by forming a large amount of tin-copper compound with tin on the surface of the silver plating layer 44, resulting in a decrease in production yield do. At the same time, a large amount of copper ions are easily transferred to the silver plated layer 44 connected to the LED chip, and the reflectance of the silver plated layer 44 is lowered, so that corresponding functional requirements cannot be satisfied. Based on this, when the thickness of the second copper plating layer 43 is 0.0625 μm or more and less than 1 μm, it can effectively bind to the silver plating layer 44 and prevent a large amount of copper ions from transferring to the silver plating layer 44. can

The silver plating layer 44 is provided on one side of the second copper plating layer 43 away from the nickel plating layer 42 . It should be understood that, on one side of the substrate body 40 close to the first surface 401, the LED chip is installed on the surface of the silver plating layer 44, and the reflectance of the silver plating layer 44 is relatively high, so that the LED chip The emitting light beam can be reflected by the silver plating layer 44, effectively enhancing its brightness; On one side close to the second surface 402 of the board body 40, a circuit board is connected to the surface of the silver plating layer 44, and in general, the circuit board and the LED bracket are fixedly connected by soldering, The bonding between the silver plating layer 44 and the solder material is superior to that between the nickel plating layer 42 and the solder layer, and the existence of the silver plating layer 44 effectively fixes the circuit board and the LED bracket so that they do not easily fall off. As a result, structural stability is improved. It should be noted that the connection method between the LED bracket and the circuit board includes, but is not limited to, a soldering method connection, and any other method that satisfies the corresponding functional requirements may be adopted, wherein the LED bracket The connection method between the circuit board and the circuit board is not specifically limited.

In one example of this embodiment, the thickness of the silver plating layer 44 is in the range of 0.25 μm to 5 μm. It should be understood that when the thickness of the silver plating layer 44 is less than 0.25, the thickness of the silver plating layer 44 becomes too thin, and the silver plating layer 44 close to the first surface 401 of the substrate body 40 does not emit light rays. , and the silver plating layer 44 close to the second surface 402 of the substrate body 40 is difficult to cause the action of bonding with the solder layer; When the thickness of the silver plating layer 44 is 5 μm or more, the thickness of the silver plating layer 44 is too thick, and since the price of silver is high, the manufacturing cost is greatly increased. Based on this, when the thickness of the silver plating layer 44 is greater than or equal to 0.25 μm and less than 5 μm, reflection of light rays and coupling with the solder layer can be simultaneously satisfied, and manufacturing cost can be effectively reduced.

In the LED bracket provided in this embodiment, the first copper plating layer 41, the nickel plating layer 42, the second copper plating layer 43, and the silver plating layer 44 are sequentially stacked and installed on the surface of the substrate body 40. effectively improve the overall performance of the second copper plating layer 43, where the thickness of the second copper plating layer 43 is relatively thin, and only a small amount of copper ions in the second copper plating layer 43 transfer to the silver plating layer 44, so that the copper ions (44) Formation of a large amount of tin-copper compound with the tin solder material on the surface can effectively prevent the occurrence of holes, and the presence of the nickel plating layer 42 prevents copper ions in the first copper plating layer 41 from forming. It can block the transition to the second copper plating layer 43, effectively preventing an increase in the content of copper ions in the second copper plating layer 43, so that a large amount of tin-copper compound cannot be formed, and the production yield is improved. let it

Referring to FIGS. 23 and 24 together, FIG. 23 is an explanatory diagram of a structure of an LED bracket in another example of this embodiment; Figure 24 is an explanatory view of the structure of the LED bracket in another example of this embodiment. In one example of this embodiment, the LED bracket further includes a palladium plating layer 45, the palladium plating layer 45 is installed on one side of the silver plating layer 44 away from the second copper plating layer 43, the palladium plating layer (45) is used to protect the plating layer (44). The structure of the palladium plating layer 45 is relatively stable, the palladium plating layer 45 covers the surface of the silver plating layer 44, and improves the anti-oxidation, anti-sulfuration and corrosion resistance of the silver plating layer 44, LED It should be understood that it improves the performance of the bracket to some extent. In this example, the thickness of the palladium plating layer 45 is in the range of 0.0025 μm to 0.25 μm. When the thickness of the palladium plating layer 45 is less than 0.0025 μm, the thickness of the palladium plating layer 45 becomes too thin, and the palladium plating layer 45 cannot exert a protective effect on the plating layer 44, so that the silver plating layer 44 is easily damaged. oxidized, yellowed and even corroded; It should be understood that when the thickness of the palladium plating layer 45 is 0.25 μm or more, the thickness of the palladium plating layer 45 becomes too thick, and the price of palladium is high, resulting in a significant increase in manufacturing cost. Based on this, when the thickness of the palladium plating layer 45 is greater than or equal to 0.0025 μm and less than 0.25 μm, the silver plating layer 44 can be effectively protected and manufacturing cost can be reduced.

In one example of this embodiment, after forming a metal plating layer on the surface of the substrate body 40, it is immersed in an antioxidant, washed and air-dried, thereby further improving the antioxidant ability of the LED bracket.

As shown in FIG. 24 , in another example of this embodiment, in order to further reduce manufacturing cost, the palladium plating layer 45 may be provided only on the surface of the silver plating layer 44 connected to the LED chip. It should be noted that the silver plating layer 44 connected to the circuit board is usually covered by a tin solder layer, and the tin solder layer can provide some protection to the silver plating layer 44 . However, since most of the silver plating layer 44 connected to the LED chip is exposed to the air, the palladium plating layer 45 may be provided only on the surface of the silver plating layer 44 connected to the LED chip to protect the silver plating layer 44.

Reference is made to the explanatory diagram of the structure of the light emitting unit (ie LED module) shown in FIG. 25 . The light emitting unit includes an LED chip 404, an encapsulation layer 405, and an LED bracket provided in this embodiment, and both the encapsulation layer 405 and the LED chip 404 are installed on the surface of the substrate 403, , the LED chip 404 is located at the bottom of the bowl. As a point to be understood, a tin solder layer may be further installed between the LED bracket and the encapsulation layer 405, that is, the LED bracket and the encapsulation layer 405 are fixed through a soldering method, and of course, through a conductive adhesive. It could be. The light emitting unit provided in this embodiment can ensure excellent overall performance of the light emitting unit by mounting the LED bracket provided in any one embodiment of the present application, and at the same time, it is possible to effectively improve the production yield of the light emitting unit. . This embodiment further provides an LED packaging device, wherein the LED packaging device includes a package body and the light emitting unit to realize package protection, and the package body accommodates the light emitting unit. By mounting the light emitting unit provided in the present embodiment, the LED package device provided in this embodiment can ensure excellent performance of the LED package device as a whole and can effectively improve the production yield of the display device.

This embodiment further provides a light emitting assembly including a light emitting unit or an LED package device provided in this embodiment. By mounting the light emitting unit or LED package device provided in this embodiment to the light emitting assembly provided in this embodiment, overall excellent performance of the light emitting assembly can be ensured, and at the same time, the production yield of the display device can be effectively improved. .

Example 5

As device technology applications evolve, industrial device indicators such as instrument panels, switches, symbols, telephones and faxes, etc., backlights, small devices, smart wearable device backlight indicators, and size-limited nixie tube backlight indicators are becoming increasingly popular for ultra-thin LED packages, small size The demand is getting higher and higher. Products such as nixie tubes and smart wearable devices are all in the trend of lightening and thinning.

A conventional LED chip package usually adopts an insulating adhesive to fix the face-up chip to the substrate, then uses a bonding wire material to connect the anode and cathode of the chip to the anode and cathode of the substrate, and finally presses the fluorescent adhesive cake. It is molded and injected into a substrate. This structure makes it difficult to reduce the thickness of the product and cannot satisfy the application requirements of ultra-thin LED products.

Regarding the above problem, this embodiment provides a fourth groove concave from the first surface to the second surface and not penetrating the second surface in a region where the substrate body is located in the bowl, wherein the second surface is away from the bowl. located remotely; The substrate includes a first pad and a second pad installed in the fourth groove and insulated from each other by an insulating region, both the first pad and the second pad extending from the bottom wall of the fourth groove to the second surface of the substrate body; , portions of the first pad and the second pad located in the fourth groove constitute the two conductive regions, respectively. Through a structure in which a groove is opened on the board and at least a part of the chip is accommodated and placed in the groove for packaging, the height of the chip protrudes from the first surface is reduced, thereby reducing the thickness of the LED product as a whole to meet the application requirements of ultra-thin LED products. satisfy For better understanding, this embodiment will be described in combination with examples shown in the drawings below.

26 to 28, this embodiment provides an LED bracket that can not only adopt the LED brackets shown in each of the above embodiments, but also adopt LED brackets of other structures, and this embodiment is not limited to this. The LED bracket provided in this embodiment includes a substrate, a first pad 51, a second pad 52 and an LED chip 53. The substrate 1 includes a substrate body 5, the substrate body 5 includes a first surface 501 and a second surface 502 opposed to each other, the substrate body 5 has a first surface ( A fourth groove 54 is established at 501 , and the fourth groove 54 does not penetrate the second surface 502 . The first pad 51 and the second pad 52 are installed at intervals on the substrate body 5 so as to be separated by an insulating region, and both the first pad 51 and the second pad 52 are fourth grooves. 54 extends from the bottom wall to the second surface 502 . At least a part of the LED chip 53 is accommodated in the fourth groove 54, the first electrode of the LED chip 53 and the first pad 51 are connected, and the second electrode of the LED chip 53 and A second pad 52 is connected.

In this embodiment, the substrate body 5 may be, but is not limited to, a PCB board, and a fourth groove 54 is provided on the PCB board, and the fourth groove 54 extends from the first surface 501 to the second surface. Concave towards 502 and not penetrating the second surface 502, the fourth groove 54 is used to receive the LED chip 53, and the bottom wall of the fourth groove 54 has the LED chip 53 ) and a matching circuit is printed. The number of LED chips 53 may be installed one or more according to actual demand, and the mounting position thereof is determined according to actual demand, and this embodiment is not overly limited. The fourth groove ( 54) is smaller than the thickness of the LED chip 53, and a part of the LED chip 53 is housed in the fourth groove 54; 27 and 28, when the thickness of the substrate body 5 is greater than the thickness of the LED chip 53 and the LED chip 53 does not need to protrude from the first surface 501, the fourth When the depth of the groove 54 is equal to or greater than the thickness of the LED chip 53, and the LED chip 53 is completely accommodated in the fourth groove 54, this structure can better protect the LED chip 53. In addition, it is exposed to the outside of the fourth groove 54 and can prevent damage such as collision. Optionally, to make the structure of the LED module more compact, the LED chip 53 adopts a flip LED chip. In another embodiment, structures such as a face-up LED chip and a vertical LED chip may also be selected and used.

The first pad 51 and the second pad 52 are made of a metal material having a conductive function or a conductive metal is installed on the outer surface, and a separation distance is provided between the first pad 51 and the second pad 52. has been Optionally, the first pad 51 includes a first end 511 and a second end 512, the first pad 51 extending from the first end 511 to the second end 512. . Here, the first end 511 is accommodated in the fourth groove 54 and the second end 512 is connected to the second surface 502 of the substrate body 5 . Similarly, the second pad 52 includes a third end 521 and a fourth end 522, the second pad 52 extending from the third end 521 to the fourth end 522, , the third end 521 is disposed to be received in the fourth groove 54 and the fourth end 522 is connected to the second surface 502 . The anode of the LED chip 53 is connected to the first end 511 of the first pad 51 , and the cathode of the LED chip 53 is connected to the third end 521 of the second pad 52 . As should be understood, the positions of the first pad 51 and the second pad 52 may be interchanged, that is, if one of them is the first pad 51, the other pad is the second pad. (52).

Through a structure in which a fourth groove 54 is opened in the substrate body 5 and at least a part of the LED chip 53 is housed and disposed in the fourth groove 54 and packaged, the LED chip 53 is formed in the first By reducing the height protruding from the surface 501, the thickness of the LED product as a whole is reduced to satisfy the application requirements of ultra-thin LED products.

In one embodiment, referring to FIGS. 29 to 31 , the shape of the fourth groove 54 corresponds to the shape of the LED chip 53 . Optionally, as shown in FIG. 29, when the number of LED chips 53 is 1 and is rectangular, a rectangular fourth groove 54 may be opened, and as shown in FIG. 30, the LED chip ( When the quantity of 53) is 1 and is elliptical, an elliptical fourth groove 54 may be opened; As shown in FIG. 31 , when the number of LED chips 53 is plural and irregularly arranged, the shape of the fourth groove 54 may be correspondingly irregular. It should be understood that, in order for the fourth groove 54 to accommodate the LED chip 53, the bottom wall area of the fourth groove 54 is always at the first surface 501 of the LED chip 53. It is larger than the orthogonal projected area. By installing the shape of the fourth groove 54 to correspond to the LED chip 53, the shape and size of the fourth groove 54 can be flexibly adjusted, which is advantageous in processing the fourth groove 54. In addition, the shape and size of the fourth groove 54 can be adjusted in real time according to the area of the substrate body 5 and the shape and layout of the LED chip 53, and can be adapted to various needs.

In one embodiment, as shown in FIGS. 26, 29 and 31, the number of fourth grooves 54 is one or more, and the number of LED chips 53 in each fourth groove 54 is one or more. am. Optionally, as shown in Fig. 29, the substrate main body 5 is provided with a fourth groove 54, and the number of LED chips 53 in the fourth groove 54 is one; As shown in FIG. 31 , one fourth groove 54 is installed in the substrate body 5, and a plurality of LED chips 53 are installed in the fourth groove 54. By flexibly adjusting the number of the fourth grooves 54, a plurality of LED chips 53 can be installed in one groove as needed, avoiding multiple processing of the fourth grooves 54; In addition, by increasing the number of the fourth grooves 54, the cutting area of the substrate body 5 can be reduced, and structural strength can be improved.

In one embodiment, referring to FIG. 26 , the substrate body 5 includes a first side surface 55 and a second side surface 56 opposed to each other, and the first end 511 of the first pad 51 extends from the bottom wall of the fourth groove 54 through the first surface 501 and the first side surface 55 to the second surface 502 to form the second end 512, and the second pad 52 The third end 521 extends from the bottom wall of the fourth groove 54 through the first surface 501 and the second side surface 56 to the second surface 502 to form a fourth end 522, , The first end 511 of the first pad 51 and the third end 521 of the second pad 52 form a vertical bisector B of the bottom wall of the fourth groove 54 in the fourth groove 54. It is installed symmetrically based on , and the first end 511 is installed at a distance from the third end 521 . Optionally, an insulating material may be installed between the first end 511 and the third end 521, the insulating material contacts the first end 511 and the third end 521, respectively, and the insulating material While electrically isolating the first pad 51 and the second pad 52, it is more convenient to conduct heat uniformly by contacting the first pad 51 and the second pad 52 with an insulating material.

In one embodiment, referring to FIGS. 26 and 27 , the LED chip package structure further includes a reinforcing member 57 . For example, as shown in FIG. 27 , on the bottom wall of the fourth groove 54, there is a first gap L1 between the first pad 51 and the second pad 52, and the first gap ( L1) is used to form anode and cathode pads by separating the first pad 51 and the second pad 52, and the size of the first gap L1 is the pitch between the anode and cathode of the LED chip 53 installed according to, when the distance between the anode and the cathode of the LED chip 53 is relatively large, the first gap L1 is relatively large, and when the distance between the anode and the cathode of the LED chip 53 is relatively small, the first gap (L1) is relatively small. The reinforcing member 57 is installed on the second surface 502, and the orthogonal projection of the reinforcing member 57 on the second surface 502 is completely the orthogonal projection of the first gap L1 on the second surface 502. cover By installing a reinforcing member 57, the thickness of the board body 5 is too thin between the first pad 51 and the second pad 52 to compensate for the defect that is easy to curve, and LED package in the first gap L1 The thickness of the structure is increased to improve the structural strength.

In one embodiment, referring to FIGS. 26 and 27 , there is a second gap L2 between the first pad 51 and the second pad 52 on the second surface 502 . Optionally, a second gap L2 is provided between the second end 512 of the first pad 51 and the fourth end 522 of the second pad 52, so that the first pad 51 and the first By separating the two pads 52 and electrically isolating the first pad 51 and the second pad 52, positive and negative pads are formed on the first pad 51 and the second pad 52, respectively. Optionally, an insulating material is installed between the second gaps L2 to electrically separate the first pad 51 and the second pad 52 through the insulating material, while also using the insulating material. Since the first pad 51 and the second pad 52 can be integrally connected, it is convenient to conduct heat uniformly.

In one embodiment, referring to FIGS. 26 to 28 , the reinforcing member 57 has a first pad 51 or second pad 52 and an integral structure. Optionally, as shown in FIG. 27 , the reinforcing member 57 and the first pad 51 are integrally structured, and the reinforcing member 57 is held together by the second end 512 of the first pad 51. It extends from one side where the first side surface 55 is located to one side where the second side surface 56 is located, and an orthogonal projection of the reinforcing member 57 on the second surface 502 is a first gap L1 on the second surface 502. ) completely covering the orthogonal projection of; As shown in FIG. 28, the reinforcing member 57 and the second pad 52 have an integral structure, and the reinforcing member 57 is connected to the second pad 52 by the fourth end 522 of the second pad 52. It extends from the side where the side surface 56 is located to the side where the first side surface 55 is located, and the area of the orthogonal projection of the reinforcing member 57 on the second surface 502 is the first gap ( It is larger than the orthogonal projected area of L1). Through designing the reinforcing member 57 and the first pad 51 or the second pad 52 as an integral structure, the strength of the structural LED package structure is improved and the first pad 51 or the second pad 52 ) and the substrate body 5 to widen the contact area so that heat dissipation is convenient and mounting and fixing is easy.

In one embodiment, referring to FIG. 32, the reinforcing member 57 is installed in the second gap L2, and the width of the reinforcing member 57 is narrower than the second gap L2, so that the first pad 51 and A separation distance is formed with all of the second pads 52 . The reinforcing member 57 is bonded to the second surface 502, and its orthogonal projected area on the second surface 502 is larger than the orthogonal projected area of the first gap L1 on the first surface 501. The reinforcing member 57 is a metal or a non-metal material having a certain structural strength, and may be made of a metal material such as copper or a non-metal material such as ceramic. Optionally, reinforcing member 57 is detachably connected to second surface 502 . By installing the reinforcing member 57 in the second gap L2, it is possible to prevent the substrate body 5 from being easily bent and damaged because the thickness of the substrate body 5 is too thin in the first gap L1, and the reinforcing member ( 57) is independent of the first pad 51 and the second pad 52, and can be flexibly mounted according to demand.

In one embodiment, referring to FIG. 26 , a solder resist layer 58 is provided on the surface of the substrate body 5 and the reinforcing member 57 facing each other. The reinforcing member 58 and the first pad 51 or the second pad 52 have an integral structure, and a conductive metal material is provided on the surface of the reinforcing member 57 facing away from the substrate body 5, The solder resist layer 58 is made of a material having acid resistance, solubility resistance, and insulation performance similar to that of the ink layer. Therefore, a solder resist layer 58 is coated on the surface of the reinforcing member 57 facing the substrate body 5 to form a protective layer, preventing corrosion of the reinforcing member 57 due to factors such as external moisture, , its high insulation performance can prevent short circuit problems caused by tilting components from the theoretical position during surface mounting.

This embodiment provides a light emitting assembly including a light emitting unit obtained by manufacturing the LED bracket described in any one of the above embodiments. The light emitting assembly may be a general lighting device such as an LED light emitting diode or a high-power ceramic LED light source, and may be used in a high-end market such as road lighting, architectural lighting, landscape lighting, or indoor lighting. In addition, it can be a backlight source for display devices such as LED-backlit LCD TVs and smart wearable devices. Through adopting the LED chip package structure provided in this embodiment, the thickness of the light source is reduced, thereby reducing the thickness of the display device and satisfying the application requirements of the ultra-thin display device.

This embodiment also provides an LED chip packaging method for manufacturing the package structure of the LED chip described in the above embodiment and packaging by adopting the package structure of the LED chip, including but not limited to:

A step in which the fourth groove 54 is opened in the substrate body 5. Optionally, the substrate body 5 includes a first surface 501 and a second surface 502 opposed to each other. Optionally, a fourth groove 54 is formed in the first surface 501 of the substrate body 5 by laser cutting, and the fourth groove 54 extends from the first surface 501 to the second surface. Concave toward 502 but not penetrating second surface 502, fourth groove 54 divides substrate body 5 into two regions, anode and cathode. Optionally, the fourth groove 54 may be machined in the substrate body 5 by adopting methods such as depth-controlled jing processing, double-sided core panel lamination, and the like.

The first pad 51 and the second pad 52 are spaced apart from each other in the substrate body 5 . Optionally, the first pad 51 and the second pad 52 are made of a metal material having a conductive function, or a metal plating layer having a conductive function is coated on their outer surfaces. The first pad 51 includes a first end 511 and a second end 512, and the first end 511 is accommodated in the fourth groove 54 and is placed on the bottom wall of the fourth groove 54. connected, the second end 512 is connected to the second surface 502 of the substrate body 5 , and the first pad 51 extends from the first end 511 to the second end 512 . Similarly, the second pad 52 includes a third end 521 and a fourth end 522, the third end 521 being received and disposed in the fourth groove 54, and the fourth end 522 ) is connected to the second surface 502 , and the second pad 52 extends from the third end 521 toward the fourth end 522 . A separation distance is provided between the first end 511 and the third end 521 and between the second end 512 and the fourth end 522 .

The LED chip 53 is connected to the first pad 51 and the second pad 52 . Optionally, a solder material 59 may be printed into the fourth groove 54 of the substrate body 5 through the 3D steel mesh, commercially available solder materials 59 including adhesives, solder pastes, and soldering fluxes. After the opening pattern of the 3D steel mesh is designed according to the electrode of the LED chip 53, the LED chip 53 is placed on the solder material 59. When the solder material 59 is silver adhesive, a baking operation is performed, the condition being generally 170° C. constant temperature, and the time being 1 hour. When the selected solder material 59 is solder paste or soldering flux, the reflow soldering operation is performed under the following conditions. Generally, the maximum furnace temperature is 290°C, the time is 30s, and it must be carried out in a nitrogen environment to prevent the metal particles of the solder material 59 from being oxidized, and this step is carried out through the solder material 59 to the LED chip. It is used to connect the first electrode of (53) to the first pad (51) and to connect the second electrode of the LED chip (53) to the second pad (52).

Through the opening of the fourth groove 54 in the substrate body 5 by adopting the laser cutting method, the processing accuracy and processing efficiency are further increased, and the yield of the finished product is improved. By placing the ends of the first pad 51 and the second pad 52 on the bottom wall of the fourth groove 54, the first electrode and the second electrode of the LED chip 53 are formed in the fourth groove 54. It is connected to the first pad 51 and the second pad 52, respectively, and by reducing the height of the LED chip protruding from the substrate body 5, the thickness of the LED product is reduced.

Additionally, referring to FIGS. 32 and 33, the first pad 51 and the second pad 52 are installed at intervals on the substrate body 5, specifically including:

Installing the first pad 51 and the second pad 52 symmetrically with respect to the vertical bisector line B of the bottom wall of the fourth groove 54. Optionally, the first end 511 of the first pad 51 and the third end 521 of the second pad 52 are respectively provided on both sides of the vertical bisector B in the fourth groove 54, The first end 511 and the third end 521 are located at the same distance from the vertical bisector B to achieve structural symmetry and prevent bending breakage due to non-uniform thickness of the LED package structure.

A reinforcing member 57 is installed on the second surface 502 . Optionally, two independent metal blocks or metal plates are adopted as the first pad 51 and the second pad 52, and ends of the first pad 51 and the second pad 52 are fourth grooves 54. ), and there is a first gap L1 between the first pad 51 and the second pad 52, and the other ends of the first pad 51 and the second pad 52 are both 2 extends to surface 502 . The reinforcing member 57 is likewise of a metallic structure and is mounted on the second surface 502, the orthogonal projection of which on the second surface 502 is completely the orthogonal projection of the first gap L1 on the second surface 502. cover By installing a reinforcing member 57, the thickness of the board body 5 is too thin between the first pad 51 and the second pad 52 to compensate for the defect that is easily damaged due to bending, and in the first gap L1 The thickness of the LED package structure is increased to improve the structural strength.

Additionally, referring to FIGS. 26 to 28, a reinforcing member 57 is installed on the second surface 502, and the reinforcing member 57 and the first pad 51 or the second pad 52 are integrally formed. including installing Optionally, the substrate body 5 includes a first side surface 55 and a second side surface 56 facing each other, and when the reinforcing member 57 has an integrated structure with the first pad 51, the reinforcing member ( 57) the second end of the first pad 51 until the distance from the second end 512 to the first side surface 55 is greater than the distance from the third end 521 to the first side surface 55 512 to the fourth end 522 of the second pad 52 . When the reinforcing member 57 has a structure integral with the second pad 52, the reinforcing member 57 has a distance from the fourth end 522 to the second side surface 56 from the first end 511 to the second It extends from the fourth end 522 of the second pad 52 to the second end 512 of the first pad 51 until it is greater than the distance to the side surface 56 .

Optionally, in another embodiment, the reinforcing member 57 is a single metal block or other structure made of a material having a certain structural strength, the reinforcing member 57 being the first pad 51 or the second pad 52 ) is bonded or welded to.

Optionally, the reinforcing member 57 is installed at a distance from both the first pad 51 or the second pad 52, and the orthogonal projection of the reinforcing member 57 on the second surface 502 is the second surface ( In 502), the orthogonal projection of the first gap L1 is completely covered.

By installing the reinforcing member 57 on the second surface 502 , it is possible to prevent the substrate body 5 from being easily damaged due to the thin thickness of the substrate body 5 in the first gap L1 .

In one example, referring to FIGS. 26 and 33 , after the reinforcing member 57 is installed on the second surface 502, a solder resist is applied to the surface of the reinforcing member 57 opposite to the substrate body 5. A layer 58 may further comprise being installed. Optionally, when the reinforcing member 57 and the cathode pad of the LED package structure have an integrated structure, a surface of the reinforcing member 57 opposite to the substrate body 5 is coated with a liquid photo solder resist, and the liquid photo solder resist may be a solder resist ink of any color such as green, red, white, etc., the solder resist ink is in a tacky state before use, and forms a solder resist layer 58 after printing, pre-baking, alignment, exposure, development, and curing, , completely covering the substrate main body 5 and the reinforcing member 57 facing each other. Since the solder resist layer 58 has the advantages of corrosion resistance, high temperature resistance, and high insulation, it protects the structure of the LED package well, and the high insulation prevents the component from being easily short-circuited.

In one example, referring to FIG. 33 , after the solder resist layer 58 is installed on the surface of the reinforcing member 57 facing the substrate body 5, package cutting may be further included. Optionally, first, a well-formed epoxy resin fluorescent adhesive cake 510 is placed in a compression molding machine, corresponding parameters are adjusted, and packaging treatment is performed on the preheated and cleaned semifinished product. After the plastic packaging is completed and the baking operation is performed, the cutter performs a corresponding cutting process on the entire block of the substrate body 5 using a blade of a corresponding thickness, and finally becomes a required product.

Example 6

The flash light is a next-generation special light designed for fresh food lighting, which can stimulate people's desire to purchase by emphasizing the color characteristics of fresh food. The spectrum used for flashlights in the current market is mainly white light or monochromatic light, and no special scientific adjustments for sophisticated color management and color reduction ability of the corresponding items to be investigated have been taken into account. Flashlights commonly found on the market usually adopt a white lamp bead + red lamp bead scheme, and the light mixing effect is not good. In addition, a blue light chip + green phosphor green phosphor + red phosphor is also adopted, and the normalized spectrum of the fresh white light excited by this is the wavelength peak of the red light band of the two normalized spectra, as shown in FIG. 34 or 35 The wavelengths corresponding to all are less than 600 nm, and the transmittance of red light is insufficient, so that the color of the flash lighting is distorted, and the degree of color reduction for fresh meat is low. In addition, the relative light output (ie, relative light intensity) of the red light band wavelength peaks of the two normalized spectra are both less than 0.75, and the display effect of flash red is not good. In addition, the red light band is connected to the green light band, so it is easy to generate yellow light, and the yellow light affects the demand for red saturation of fresh meat, and furthermore, misleads consumers, which is a common problem in conventional flashlights. It shows a tan color that is easy to evoke.

In view of the above problems, the present embodiment provides two light emitting units that can be applied to, but not limited to, flashlights, which have relatively excellent color reduction for fresh food and reduce the generation of yellow light to some extent so that yellow light It can prevent affecting the demand for red saturation of fresh meat, thereby improving the degree of reduction of the flash lighting color, preventing the appearance of yellowish brown affecting the purchase desire, and indicating a red light that is relatively matched with fresh meat. can The light emitting unit provided in this embodiment may be applied to various flash lighting devices such as lighting fresh meat such as fresh pork and fresh beef, but is not limited thereto. Optionally, the flash lighting device may be a flash lighting device or an electronic device having a flash lighting function, such as a refrigerator or freezer. For ease of understanding, the present embodiment will exemplarily describe the following two light emitting units.

36 and 37, one exemplary light emitting unit is an LED bracket 60 (the LED bracket shown in each embodiment can be selected and used, and brackets of other structures can also be selected and used, This embodiment is not limited thereto), a red LED chip 61, a blue LED chip 62, and an encapsulation layer, wherein the encapsulation layer includes a red medium 63. The LED bracket 60 has a substrate on which both the red LED chip 61 and the blue LED chip 62 are located, and the green medium 63 covers the red LED chip 61 and the blue LED chip 62 . The red LED chip 61 and the blue LED chip 62 excite the green medium 63 to emit white light. The normalized spectrum of the emitted white light includes a first red light band and a green light band, a half-wavelength width of the first red light band is 15 nm to 30 nm, a wavelength peak of the first red light band is a first wavelength peak, and a first wavelength peak. The relative light output corresponding to the peak satisfies the condition that the wavelength corresponding to the first wavelength peak is 645 nm to 665 nm.

Optionally, the red LED chip 61 can optionally be a vertical structure or a horizontal structure, and the blue LED chip 62 can also optionally be a vertical structure or a horizontal structure. The red LED chip 61 and the blue LED chip 62 are fixed to the lower part of the LED bracket 60 using a die-bonding adhesive, and baked for 1 to 2 hours under a condition of 150° C. so that the die-bonding adhesive can be completely cured. do. Here, when the chip has a horizontal structure, a silicone resin transparent die-bonding adhesive may be used, and when the chip has a vertical structure, a silicone resin doped die-bonding adhesive may be used. The red LED chip 61 and the blue LED chip 62 need more wire bonding installation between the LED bracket 60, the wire bonding is generally 0.9mil 80% Au, M or S wire arc process optional can be used. Arrangement and connection method of wire bonding is matched according to the structure of the LED bracket 60, the structure of the red LED chip 61 and the blue LED chip 62, and the conduction of the circuit is completed. Preferably, the red LED chip 61 of the vertical structure, the blue LED chip 62 of the horizontal structure, the bracket, the blue LED chip 62, and the red LED chip 61 are sequentially connected through wire bonding.

Referring to FIG. 38, the normalized spectrum of white light is

A condition including a first red light band having a half-wavelength width of 15 nm to 30 nm is satisfied. Specifically, the half-wavelength of the first red light band may optionally be 15nm, 18nm, 24nm, 27nm, 30nm, etc., preferably 30nm, and the half-wavelength ranges from 640nm to 670nm.

The wavelength peak of the first red light band is the first wavelength peak, the relative light output corresponding to the first wavelength peak is 0.9 to 1, and the wavelength corresponding to the first wavelength peak is 645 nm to 665 nm. Specifically, the relative light output (ie, relative light intensity) corresponding to the first wavelength peak is 0.9, 0.92, 0.95, 0.99, 1, etc., preferably 1 here. The wavelength corresponding to the first wavelength peak may optionally be 645 nm, 651 nm, 654 nm, 659 nm, 665 nm, etc., preferably 660 nm.

By installing the red LED chip 61 and the blue LED chip 62 to excite the green medium 63, the half-wavelength width of the first red light band to be excited is between 15 nm and 30 nm, and the energy is relatively concentrated. Therefore, the red light saturation is relatively high, and the wavelength of the first wavelength peak of the first red light band is between 650 nm and 670 nm, and the red light transmittance is relatively strong, so that the color reduction of fresh meat is relatively excellent. The relative light output corresponding to the wavelength peak is between 0.9 and 1, and the flash red display effect is excellent. In addition, the first red light band of the above parameter can reduce the generation of yellow light to some extent, so that the yellow light does not affect the demand for red saturation of fresh meat, further improving the degree of reduction of the flash lighting color, It prevents tan color from appearing, which affects purchase desire, and can show red color that is relatively matched with fresh meat.

In one embodiment, referring to FIG. 38 , the normalized spectrum further includes a green light band. The half-wavelength width of the green light band is 35 nm to 60 nm. Specifically, the half-wave width of the green light band may optionally be 35 nm, 41 nm, 48 nm, 53 nm, 57 nm, 60 nm, etc., preferably 60 nm, and the half-wavelength ranges from 510 nm to 570 nm. By installing the half-wave width of the green light band between 35nm and 60nm, the green light band does not affect the color development effect of white or red flashlight. When the half-wavelength width of the green light band is less than 35nm, the process cost is relatively high and the color This is easily disturbed, and the white color is easily distorted, which is detrimental to the color reduction of the white part of fresh meat; It can be understood that when the half-wavelength width of the green light band is 60 nm or more, the proportion of white light occupied by the green light band is too large and easily affects the red light, and the red color is easily distorted, which is disadvantageous to the appearance of red parts of fresh meat.

The wavelength peak of the green light band is the second wavelength peak, the relative light output corresponding to the second wavelength peak is 0.2 to 0.4, and the wavelength corresponding to the second wavelength peak is 530 nm to 550 nm. Specifically, the relative light output corresponding to the second wavelength peak may optionally be 0.2, 0.24, 0.29, 0.34, 0.38, 0.4, or the like. The wavelength corresponding to the second wavelength peak may optionally be 530 nm, 532 nm, 538 nm, 544 nm, 550 nm, etc., preferably 540 nm. By setting the relative light output of the second wavelength peak between 0.2 and 0.4, relatively excellent red color development can be performed without affecting white color development, which is advantageous in preventing distortion of flash lighting. The wavelength corresponding to the peak of the second wavelength is between 530 nm and 550 nm, and the distance from the peak of the first wavelength of the first red light band is relatively far, so that the appearance of red light is not easily affected.

In one embodiment, referring to FIG. 38 , the normalized spectrum further includes a yellow light band with a corresponding wavelength in the range of 585 nm to 630 nm and a yellow wave with a relative light output of less than 0.15. Specifically, the left side of the yellow light band is connected to the green light band, and the right side of the yellow light band is connected to the red light band. The yellow light band represents a concave image, that is, the relative light outputs corresponding to the left and right sides of the yellow light band must be higher than the relative light outputs corresponding to the central portion. Setting the relative light output of the yellow light breakdown to less than 0.15 can further reduce the generation of yellow light, avoiding the appearance of yellowish brown color due to yellow light affecting the demand for red saturation of fresh meat, thereby preventing fresh meat from appearing tan. It is advantageous to show a red color that is relatively matched to .

In one embodiment, referring to FIG. 38 , the normalized spectrum further includes a blue light band having a half-wavelength width of 15 nm to 30 nm. Specifically, the half-wavelength of the blue light band may optionally be 15nm, 17nm, 19nm, 22nm, 26nm, 29nm, 30nm, etc., preferably 15nm, and the half-wavelength ranges from 435nm to 465nm. By satisfying the half-wavelength width of the blue light band to be between 15 nm and 30 nm, the blue light band can generate white color that meets the flash demand and may not affect the appearance of the flash red color. It should be understood that, when the half-wavelength width of the blue light band is less than 15 nm, the manufacturing process is relatively difficult and demands on the wafer substrate are very high. When the half-wavelength width of the blue light band is 30 nm or more, the overall brightness of the wafer is greatly reduced, and white light is hindered, resulting in a pale color, which is disadvantageous to the flash effect of the white portion.

The wavelength peak of the blue light band is the third wavelength peak, the relative light output corresponding to the third wavelength peak is 0.3 to 0.5, and the wavelength corresponding to the third wavelength peak is 445 nm to 455 nm. Specifically, the relative light output of the third wavelength peak may optionally be 0.3, 0.34, 0.39, 0.44, 0.5 or the like. The wavelength corresponding to the third wavelength peak may optionally be 445 nm, 447 nm, 449 nm, 451 nm, 452 nm, 454 nm, 455 nm, etc., preferably 450 nm. When the relative light output of the third wavelength peak is set between 0.3 and 0.5, it is advantageous to prevent distortion of flash lighting because it does not affect white color development and at the same time can perform relatively excellent red color development. The wavelength corresponding to the second wavelength peak is between 445 nm and 455 nm, and white color that meets the flash demand of the white area can be relatively excellently generated.

To facilitate precise definition of the spectral radial distribution, the relative light power corresponding to the first wavelength peak in the red light band is between 0.9 and 1, the relative light power corresponding to the green light band is between 0.2 and 0.4, and the blue light band It can be appreciated that the relative light output corresponding to the third wavelength peak is between 0.3 and 5.

In one embodiment, referring to FIG. 38 , the normalized spectrum further includes a cyan light band having a corresponding wavelength in the range of 465 nm to 515 nm and a cyan light wave peak relative light output of less than 0.1. Specifically, the left side of the cyan light band is connected to the blue light band, and the right side is connected to the green light band. The cyan light band represents a concave image, that is, the relative light outputs corresponding to the left and right sides of the cyan light band must be higher than the relative light outputs corresponding to the central portion. By setting the relative light output of the cyan light wavelength to less than 0.1, the generation of cyan light is reduced, and cyan light is prevented from affecting the expression of fresh red and white, thereby improving the fresh effect of fresh meat. advantageous to do

In one embodiment, referring to FIG. 38 , the normalized spectrum further includes a violet light band having a corresponding wavelength in the range of 350 nm to 420 nm and a relative light output of less than 0.1. Specifically, the purple light band is connected to the left side of the blue light band. The violet light band decreases as the corresponding wavelength decreases (after being reduced to some extent, it hardly changes). Satisfying the relative light output of the violet light band to be less than 0.1 helps to reduce the expression probability of pale color, and furthermore, it is possible to improve the flash effect of the white area.

In one embodiment, referring to FIG. 38 , the normalized spectrum further includes a second red light band adjacent to the first red light band having a corresponding wavelength in the range of 680 nm to 780 nm and having a relative light output of less than 0.1. Specifically, the left side of the second red light band is connected to the first red light band. By satisfying the relative light output of the second red light band to be less than 0.1, it is advantageous to improve the saturation of red light, thereby improving the flash effect of the red part.

In one embodiment, referring to FIGS. 36 and 37 , the material of red medium 63 comprises β-Sialon, the material of blue LED chip 62 comprises gallium nitride (GaN), and the red LED chip The material of 61 includes aluminum gallium indium phosphide (AlGaInP). It should be understood that the selection of the material can determine the wavelength position corresponding to the half-wavelength width and the wavelength peak of the red light band, the blue light band, and the green light band. It is advantageous.

In one embodiment, the light emitting unit further comprises an encapsulating colloid 64 filled in a bowl 65, and the green medium 63 is mixed with the encapsulating colloid 64 in a ratio ranging from 1:12 to 1:2 . Specifically, the mixing ratio of the green medium 63 and the encapsulating colloid 64 is optionally 1:12, 1:11, 1:10.5, 1:8, 1:6.5, 1:4.5, 1:3, 1: It can be 2nd. The encapsulating colloid 64 and the red medium 63 are vibrated by the stirrer to complete mixing uniformity, the stirring condition is optionally 200s to 400s, the speed can be selected from 1000n / min to 2000n / min, This setting is advantageous for uniformly mixing the encapsulating colloid 64 and the red medium 63. In addition, the mixture of the encapsulating colloid 64 and the green medium 63 is potted in the bowl 65 of the LED bracket 60, and then baked at 150 ° C. for 3 to 4 hours to cure the mixture and complete packaging. It should be understood that the first wavelength peak, the second wavelength peak and the third wavelength peak are satisfied by satisfying the mixing ratio of the green medium 63 and the encapsulating colloid 64 to be between 1:12 and 1:2. It can be appreciated that it is advantageous to adjust the height (relative light output) of , which more precisely defines the radiant distribution of the spectrum.

In one embodiment, in the CIE1931 (also referred to as CIE 1931 color space) chromaticity diagram, the distribution of white light in the X-axis ranges from 0.31 to 0.39, the distribution in the Y-axis ranges from 0.3 to 0.4, and the color temperature of white light is from 4000K to 7000K. range, specifically, the color temperature may optionally be 4000K, 4300K, 4500K, 4900K, 5120K, 5870K, 6370K, and 7000K. By satisfying the color temperature of white light to be between 4000K and 7000K, the light ray easily adapts to the human eye, while sufficiently embodying the flash effect of the light emitting unit provided in the embodiment of the present invention, and does not irritate the eyes or become excessively dark. problem does not appear. In addition, the CIE1931 distribution of white light is relatively reasonable and is advantageous for improving the flash effect.

Referring to FIGS. 39 and 40 , another exemplary light emitting unit includes an LED bracket 70, a blue LED chip 71, a red medium 72, and a green medium 73. The LED bracket 70 includes a bowl 75 in which the blue LED chip 71 is installed, and the red medium 72 and the green medium 73 are mixed and filled in the bowl 75 to form the blue LED chip 71. cover Blue LED chip 71 excites red medium 72 and green medium 73 to emit white light.

Optionally, the blue LED chip 71 in this example may have a face-up structure or a flip mounting structure. For example, in the case of a face-up structure, the blue LED chip 71 is attached to the LED bracket 70 via die-bonding adhesive and baked for 1 to 2 hours under a condition of 150° C. to completely cure the die-bonding adhesive. In the case of a flip mounting structure, it can be fixed to the blue LED bracket 71 and undergoes reflow soldering. , the blue LED chip 71 and the LED bracket 70 must be completely bonded. In addition, in the case of the blue LED chip 71 with a face-up structure, the wire bonding process must also be completed, the welding wire is generally 0.9mil 80% Au, and adopts the S or M wire arc process. The layout and connection method of wire bonding is determined according to the structure of the LED bracket 70 and the structural matching of the blue LED chip 71, and it is only necessary to complete the conduction of the circuit.

41, the normalized spectrum of white light in this example is

It includes a red light band and a green light band, the half-wavelength width of the red light band is 80 nm to 100 nm, the wavelength peak of the red light band is the first wavelength peak, the relative light output corresponding to the first wavelength peak is 0.75 to 0.95, The wavelength corresponding to the first wavelength peak is 645 nm to 665 nm, the half-wavelength width of the green light band is 45 nm to 70 nm, the wavelength peak of the green light band is the second wavelength peak, and the wavelength corresponding to the second wavelength peak is 500 nm to 520 nm . Specifically, the half-wavelength of the red light band may optionally be 80nm, 84nm, 86nm, 89nm, 94nm, 96nm, 100nm, etc., preferably 100nm, and the half-wavelength ranges from 610nm to 710nm. The relative light output corresponding to the first wavelength peak may optionally be 0.75, 0.79, 0.84, 0.89, 0.93, 0.95, or the like. The wavelength corresponding to the first wavelength peak may optionally be 645 nm, 646 nm, 649 nm, 653 nm, 659 nm, 663 nm, 665 nm, etc., and is preferably 660 nm. The half-wave width of the green light band may optionally be 45 nm, 46 nm, 49 nm, 53 nm, 55 nm, 61 nm, 67 nm, 69 nm, 70 nm, etc., preferably 70 nm, and the half-wavelength ranges from 480 nm to 550 nm. The wavelength corresponding to the second wavelength peak may optionally be 500 nm, 503 nm, 509 nm, 511 nm, 516 nm, 519 nm, 520 nm, or the like.

When the half-wavelength of the green light band is less than 45 nm, the processing cost is relatively high, the color is easily disturbed, and the white color is easily distorted, which is unfavorable to the color reduction of the white part of fresh meat; It can be understood that when the half-wavelength width of the green light band is 70 nm or more, the proportion of white light occupied by the green light band is too large, resulting in interference with red light, and red light is easily distorted, which is disadvantageous to the appearance of red parts of fresh meat. By installing the blue LED chip 71 to excite the red medium 72 and the green medium 73, the wavelength corresponding to the first wavelength peak of the red light band to be excited is between 645 nm and 665 nm, and the red light has transmittance. is relatively strong, the color reduction of fresh food is relatively good, the relative light output corresponding to the first wavelength peak is between 0.75 and 0.95, and the red display effect is relatively good. At the same time, the wavelength corresponding to the second wavelength peak of the green light band is between 500 nm and 520 nm, the half-wavelength width of the green light band is between 45 nm and 70 nm, the green light band does not easily interfere with the red light band, and yellow light is not easily generated. , to prevent yellow light from affecting the demand for red saturation of meat, further improving the degree of flash lighting color reduction, preventing the appearance of yellowish brown affecting the purchase desire, and producing a red that is relatively matched with fresh meat. can indicate

In one embodiment, referring to FIG. 41 , the relative light output corresponding to the second wavelength peak is 0.4 to 0.7. Specifically, the relative light output corresponding to the second wavelength peak may be selectively 0.4, 0.5, 0.6, 0.7, or the like. By setting the relative light output of the second wavelength peak between 0.4 and 0.7, it is prevented that red color is distorted when the saturation of the green light is too high and white color is distorted when the saturation is too low.

In one embodiment, referring to FIG. 41 , the normalized spectrum further includes a yellow light band having a corresponding wavelength in the range of 560 nm to 590 nm and a relative light output of the yellow wave band of 0.05 to 0.25. Specifically, the left side of the yellow light band is connected to the green light band, and the right side of the yellow light band is connected to the red light band. The yellow light band represents a concave image, that is, the relative light outputs corresponding to the left and right sides of the yellow light band must be higher than the relative light outputs corresponding to the central portion. By setting the relative light power of the yellow pulses between 0.05 and 0.25, the production of yellow light can be further reduced, preventing the appearance of yellowish brown, which affects the demand for red saturation of fresh meat. It is advantageous to show a red color that is relatively matched with meat.

In one embodiment, referring to FIG. 41 , the normalized spectrum further includes a blue light band having a half-wavelength width of 15 nm to 30 nm. Specifically, the half-wavelength of the blue light band may optionally be 15nm, 17nm, 19nm, 22nm, 26nm, 29nm, 30nm, etc., preferably 15nm, and the half-wavelength ranges from 435nm to 465nm. By satisfying the half-wavelength width of the blue light band to be between 15 nm and 30 nm, the blue light band can generate white color that meets the flash demand and may not affect the appearance of the flash red color. It should be understood that, when the half-wavelength width of the blue light band is less than 15 nm, the manufacturing process is relatively difficult and demands on the wafer substrate are very high. When the half-wavelength width of the blue light band is 30 nm or more, the overall brightness of the wafer is greatly reduced, and white light is hindered, resulting in a pale color, which is disadvantageous to the flash effect of the white portion.

The wavelength peak of the blue light band is the third wavelength peak, the relative light output corresponding to the third wavelength peak is 0.9 to 1, and the wavelength corresponding to the third wavelength peak is 445 nm to 455 nm. Specifically, the relative light output of the third wavelength peak may optionally be 0.9, 0.91, 0.93, 0.96, 0.98 and 1, etc., preferably 1. The wavelength corresponding to the third wavelength peak may optionally be 445 nm, 447 nm, 449 nm, 451 nm, 452 nm, 454 nm, 455 nm, etc., preferably 450 nm. When the relative light output of the third wavelength peak is set between 0.9 and 1, it does not affect the white color and at the same time can perform relatively excellent red color, which is advantageous in preventing flash illumination distortion. If the wavelength corresponding to the third wavelength peak is between 445 nm and 455 nm, it is possible to generate relatively excellent white color that meets the demand for flashing the white area.

To facilitate accurate definition of the spectral radial distribution, the relative light power corresponding to the first wavelength peak in the red light band is between 0.75 and 0.95, the relative light power corresponding to the green light band is between 0.4 and 0.7, and the blue light band It can be appreciated that the relative optical power corresponding to the third wavelength peak is between 0.9 and 1.

In one embodiment, referring to FIG. 41 , the normalized spectrum further includes a cyan light band having a corresponding wavelength in the range of 460 nm to 490 nm and a cyan light wave peak relative light output of 0.15 to 0.35. Specifically, the left side of the cyan light band is connected to the blue light band, and the right side is connected to the green light band. The cyan light band represents a concave image, that is, the relative light outputs corresponding to the left and right sides of the cyan light band must be higher than the relative light outputs corresponding to the central portion. By setting the relative light output of the cyan light wavelength between 0.15 and 0.35, the generation of cyan light is reduced, and cyan light is prevented from affecting the expression of fresh red color and expression of fresh white color, thereby showing the fresh effect of fresh meat. useful for improving

In one embodiment, referring to FIG. 41 , the normalized spectrum further includes a violet light band having a corresponding wavelength in the range of 350 nm to 420 nm and a relative light output of less than 0.1. Specifically, the purple light band is connected to the left side of the blue light band. The violet light band decreases as the corresponding wavelength decreases (after being reduced to some extent, it hardly changes). Satisfying the relative light output of the violet light band to be less than 0.1 helps to reduce the expression probability of pale color, and furthermore, it is possible to improve the flash effect of the white area.

In one embodiment, referring to FIG. 41 , the normalized spectrum further includes an infrared light band adjacent to the red light band with a corresponding wavelength of 780 nm and a relative light output of less than 0.1. Specifically, the left side of the infrared light band is connected to the red light band. By satisfying the relative light output of the red light band to be less than 0.1, it is advantageous to enhance the flash effect of the red part by improving the saturation of the red light.

In one embodiment, referring to FIG. 41 , the material of the red medium 72 includes nitride, the material of the green medium 73 includes β-Sialon and/or silicate, and the blue LED chip 71 The material includes gallium nitride (GaN). Specifically, the green medium 73 may include only one of β-Sialon and silicate, or may include both β-Sialon and silicate. It should be understood that the selection of the material can determine the wavelength position corresponding to the half-wavelength width and the wavelength peak of the red light band, the blue light band, and the green light band. It is advantageous.

In one embodiment, referring to FIG. 41 , the ratio of red medium 72 to green medium 73 ranges from 1:13 to 1:4. Specifically, the ratio of red medium 72 and red medium 73 is optionally 1:13, 1:12, 1:9, 1:7, 1:6, 1:5, 1:4.5 and 1:4. etc. By properly adjusting the mixing ratio of the red medium 72 and the green medium 73, the first wavelength peak, the second wavelength peak, and the third wavelength peak are advantageous for adjusting the height (relative light output), and the spectral radiation distribution It is convenient for precise definitions.

In one embodiment, referring to FIG. 41 , the light emitting unit further includes an encapsulating colloid 50 filled in a bowl 75 . The mixing ratio of the mixture of the red medium 72 and the green medium 73 with the encapsulating colloid 50 is in the range of 1:8 to 1:1.8. Specifically, the ratio of the mixture of the red medium 72 and the green medium 73 to the encapsulating colloid 50 is optionally 1:8, 1:7, 1:6, 1:5.5, 1:5, 1:4.5 , 1:3, 1:2 and 1:1.8, etc. The mixture of the red medium 72 and the green medium 73 and the encapsulating colloid 50 are uniformly mixed by vibrating through an agitator, the stirring condition is 200s to 400s, and the speed can be selected from 1000n/min to 2000n/min. , and such a setting is advantageous for uniformly mixing the encapsulating colloid 50 and the green medium 73. In addition, after potting the mixture of the encapsulation colloid 50 and the green medium 73 into the bowl 75 of the LED bracket 70, the mixture is cured and the packaging is completed by baking at 150 ° C. for 3 to 4 hours. do. It should be understood that the first wavelength peak, the second wavelength peak and the third wavelength peak are satisfied by satisfying the mixing ratio of the green medium 73 and the encapsulating colloid 50 to be between 1:12 and 1:2. It can be appreciated that it facilitates the adjustment of the height of , and more precisely defines the radiant distribution of the spectrum.

In one embodiment, in the CIE1931 chromaticity diagram, the distribution of white light ranges from 0.32 to 0.38 on the X axis and from 0.275 to 0.34 on the Y axis, and the color temperature of white light ranges from 4000K to 6200K. Specifically, the color temperature may optionally be 4000K, 4230K, 4500K, 4900K, 5120K, 5530K, 5870K, and 6200K. By satisfying the color temperature of white light to be between 4500K and 8000K, the flash effect of the light emitting unit provided in the embodiment of the present invention is fully realized, while the light beam easily adapts to the human eye and does not irritate the eyes or excessively. Dark problems do not appear. In addition, the CIE1931 chromaticity range of white light is relatively reasonable, and it is advantageous to guarantee the flash effect.

Example 7

Currently, the backlight module is one of the key assemblies of the display unit, and is used to provide a light source to the display unit. Light and thin, power saving, HDR (high dynamic range, high dynamic range image) is the development trend of the display unit, These requirements require the LED light emitting unit of the backlight module to have small size, high brightness and large light emitting angle performance. In the current LED light emitting unit, the light emitting angle of the LED chip is limited by the LED bracket, and the LED bracket limits the light emitting angle of the LED chip, and furthermore, both the total light emitting luminance and the light emitting angle of the LED light emitting unit are affected, and the LED If the light-emitting luminance and the light-emitting angle are increased by increasing the light mixing distance from the light emitting surface of the chip to the light emitting surface of the backlight module or by increasing the number of LEDs, the demand for thinness and power saving of the display device cannot be satisfied. However, increasing the light emitting angle of the LED light emitting unit has become an urgent problem to be solved.

In relation to the above problem, the present embodiment provides a light emitting unit capable of improving the light emitting angle including an LED chip and an LED bracket. The LED bracket of the present embodiment can use the LED bracket described in each of the above embodiments. Other LED brackets having a structure may also be adopted, and this embodiment is not limited thereto. Here, the LED chip is installed under the bowl of the LED bracket, and the anode and cathode of the LED chip are electrically connected to the two conductive regions, respectively. The light emitting unit further includes an encapsulation layer installed in the bowl, the encapsulation layer including a first encapsulation adhesive layer and a second encapsulation adhesive layer sequentially filled, the first encapsulation adhesive layer covering the LED chip, and the second encapsulation adhesive layer comprising the LEDs. One side far from the chip has a shape in which a spherical portion protrudes; The first encapsulation adhesive layer and the second encapsulation adhesive layer having a protruding spherical portion radiate light emitted from the surface of the LED chip to the outside of the LED device, so that one side of the second encapsulating adhesive layer far from the LED chip has a protruding spherical portion of the LED. The light emitting angle of the device is increased, and the light emitting angle is generally increased, so that the light emitting angle is improved and the light emitting luminance of the LED device is improved. For better understanding, this embodiment will be described in combination with several examples shown in the drawings below.

Referring to FIG. 42 , the light emitting unit provided in one example of this embodiment includes an anode substrate 81 (ie, one of which is a conductive region), a cathode substrate 82 (ie, another one of which is a conductive region), and an anode substrate 81 ) and a cathode substrate 82, including a separation region 83 that insulates and separates, and includes an LED bracket 8 further including an LED chip 84; The package body of the LED bracket 8 is installed on the surfaces of the anode substrate 81 and the cathode substrate 82 and is surrounded to form a bowl, and the LED chip 84 is installed on the surfaces of the anode substrate 81 and the cathode substrate 82. installed on at least one substrate; In the LED bracket 8, the first encapsulation adhesive layer 85 and the second encapsulation adhesive layer 86 are sequentially filled inside the bowl-shaped structure formed with the anode substrate 81 and the cathode substrate 82, and the first encapsulation adhesive layer ( 85) covers the LED chip 84, and the second encapsulation adhesive layer 86 has a spherical portion protruding on one side away from the LED chip 84, and the first encapsulation adhesive layer and the second encapsulation adhesive layer 86 are vapor can be blocked, thereby protecting the LED chip 84 and at the same time refracting, reflecting, and diffusing the light emitted from the LED chip 84 through the first encapsulating adhesive layer 85 and the second encapsulating adhesive layer 86, thereby reducing the LED Light emitted from the surface of the chip 84 is refracted to the periphery to increase the luminous intensity of the light emitting unit.

In this example, as shown in FIG. 42, the second encapsulation adhesive layer 86 completely covers the first encapsulation adhesive layer 85; Here, the first encapsulation adhesive layer 85 and/or the second encapsulation adhesive layer 86 may be a transparent adhesive layer formed by curing a transparent adhesive, and the transparent adhesive includes, but is not limited to, epoxy resin, silica gel, and silicone resin. no; Of course, the first encapsulation adhesive layer 85 and/or the second encapsulation adhesive layer 86 may also be fluorescent adhesive layers formed after mixing a transparent adhesive and a phosphor.

It should be understood that the anode substrate 81 and the cathode substrate 82 in this example are both conductive substrates, and the conductive substrate in this embodiment includes any one of a copper substrate, an aluminum substrate, an iron substrate, a silver substrate, etc. It may be a variety of metal conductive substrates, but not limited thereto; The conductive substrate may be a mixed material conductive substrate including a conductive material such as conductive rubber, and the LED chip 84 may be fixed on at least one conductive substrate through a die bonding adhesive such as silver adhesive or insulating adhesive. Here, the LED chip 84 may be a face-up chip LED electrically connected to the substrate through wire bonding, or may be a flip-mounted LED chip electrically connected to the substrate through a eutectic process. Here, the light emitting surface of the LED chip 84 is covered with reflective layers having different thicknesses, and according to different needs, reflective layers of different materials and thicknesses can be adopted to increase the half-output angle of light emitted from the chip, and furthermore, the light emitting unit Further increase the light emission angle.

In this example, as shown in FIG. 42, the height h of the first encapsulating adhesive layer 85 in the bowl-shaped structure formed by the LED bracket 8 together with the anode substrate 81 and the cathode substrate 82 is It should not exceed the height (H) of the package body, and since the first encapsulation adhesive layer 85 covers the LED chip 84, the lowest height (h) of the first encapsulation adhesive layer 85 in the bowl-shaped structure is the LED exceeds the height h1 of the chip 84; In some application scenarios, the lowest height (h) of the first encapsulating adhesive layer 85 in the bowl-shaped structure should be understood as covering the wire bonding, and covering the LED chip 84 in the case of covering the wire bonding; Here, the first encapsulation adhesive layer 85 completely covers the LED chip 84, and refracts and diffuses the light emitted from the surface of the LED chip 84 to the second encapsulation adhesive layer 86 and the LED bracket 8, respectively. , the luminous intensity of the light emitted from the LED chip 84 is increased.

In another example of this embodiment, as shown in FIG. 43 , the top surface of the first encapsulation adhesive layer 85 has the same height as the top surface of the LED bracket.

In some examples of this embodiment, the surface of the first encapsulation adhesive layer 85 away from the LED chip 84 may be an arc surface concave into the LED chip 84, and the arc surface concave inside of the first encapsulation adhesive layer 85 may be a ray of light. can change the angle of reflection and angle of refraction, so that the light beam more easily illuminates the LED bracket 8 and the second encapsulating adhesive layer 86, thereby making the light emitting unit emit more uniform light, as shown in FIGS. 43 and 44. As shown, the light emitting angle of the light emitting unit is further increased, where the lowest height after being recessed into the first encapsulation adhesive layer 85 is equal to the height of the LED chip 84; It should be understood that, here, the first encapsulation adhesive layer 85 may start to concave inward from a portion directly in contact with the LED bracket 8, and the first encapsulation adhesive layer 85 is leveled for a certain period of time from the transparent bracket. may begin to concave in while holding; It should be understood that in some instances the first encapsulation adhesive layer 85 is of a horizontal structure and is not recessed inward.

In some examples of this embodiment, as shown in FIG. 45 , the width E of the second encapsulation adhesive layer 86 is not wider than the width e of the upper surface of the bowl-shaped structure, and furthermore, the second encapsulation adhesive layer 86 ) to the bowl-shaped structure of the light emitting unit, and its bonding strength is improved; The width (E) of the second encapsulation adhesive layer 86 is the width E1 of the surface of one side of the first encapsulation adhesive layer 85 at the lowest distance away from the LED chip 84, and further covers the first encapsulation adhesive layer 85 completely. Here, the first encapsulation adhesive layer 85 completely covers the LED chip 84, and the light emitted from the surface of the LED chip 84 is refracted and diffused into the second encapsulation adhesive layer 86 and the LED bracket 8, respectively. The first encapsulation adhesive layer 85 refracts the light emitted from the LED chip 84 to the second encapsulation adhesive layer 86, and the second encapsulation adhesive layer 86 additionally refracts and diffuses the LED chip ( 84); It should be understood that, as shown in FIGS. 43 and 44 , when the first encapsulation adhesive layer 85 is concave, the surface of one side of the second encapsulation adhesive layer 86 close to the first encapsulation adhesive layer 85 is It is to be understood that it protrudes toward the first encapsulation adhesive layer 85, and the protrusion matches a concave portion in the first encapsulation adhesive layer 85.

It should be understood that one side of the second encapsulating adhesive layer 86 away from the LED chip 84 has a spherical portion protruding to form a convex lens shape, and can act to emit light, furthermore, the light emitting angle of the light emitting unit. increases; Here, the height of the second encapsulation adhesive layer 86 is not limited, that is, the arc protruding outward from the second encapsulation adhesive layer 86 is not limited, and preferably, as shown in FIG. 44, the second encapsulation adhesive layer The height (k) of (86) does not exceed the height (K) of the LED bracket (8), and furthermore, the degree of protrusion of the second package angle to the outside is maintained within a reasonable range. In some examples of this embodiment, the refractive index of the first encapsulation adhesive layer 85 is greater than the refractive index of the second encapsulation adhesive layer 86, the refractive index of the second encapsulation adhesive layer 86 is greater than the refractive index of air, and furthermore, the LED chip 84 The light emitted from ) is refracted through the first encapsulation adhesive layer 85 and then reaches the second encapsulation adhesive layer 86, and then is refracted by the second encapsulation adhesive layer 86 and reaches the outside, whereby the LED chip 84 ), the light emitted from the front side is refracted more to the periphery, so that the light emitting angle of the light emitting unit is increased, and the maximum light emitting angle of the light emitting unit can reach 180°.

In some examples of this embodiment, the package body of the LED bracket 8 forming the bowl may be a transparent bracket, but is not limited thereto, that is, the LED bracket 8 is a transparent thermoplastic such as a transparent resin, polyphthalamide (PPA), etc. It can be made of a transparent material such as plastic, epoxy resin, epoxy molding packaging (EMC), etc. Further, the light emitted from the LED chip 84 directly penetrates the LED bracket 8 to reach the outside, and the light emitting angle of the light emitting unit further increase; In some examples, the LED bracket 8 is made of limited epoxy resin (EP, Epoxide resin), high-temperature resistant nylon (PPA plastic), polyphthalamide (PPA, Polyphthalamide), polyethylene terephthalate 1,4-cyclohexanedimethanol ester ( PCT, Poly1, 4-cyclohexylenedimethylene terephthalate), liquid crystal polymer (LCP), sheet molding compound (SMC), epoxy molding compound (EMC), unsaturated polyester (UP) resin, poly As an example, it should be understood that materials used for opaque brackets such as ester resin (PET, Polyethylene terephthalate), PC, Polycarbonate, polyhexamethylene adipamide (nylon66), glass fiber, etc. may be used.

In some examples of this embodiment, distributed bragg reflectors (DBR) are installed in the LED chip 84 . For example, the front side of the LED chip 84 is plated with DBR to reduce the front light output, increase the sidewall light emission area, further increase the light emitting angle, and re-match the transparent LED bracket 8 to emit light. Further improve the luminous efficiency of the sidewall of the unit, and increase the overall luminous efficiency.

In some examples of this embodiment, the upper surface of the LED bracket 8 is saw-toothed (C), and as shown in FIGS. When coupled to the LED bracket 8, the bonding ability of the second encapsulation adhesive layer 86 and the LED bracket 8 is increased; At the same time, the sawtooth upper surface of the LED bracket 8 can limit the fluidity of the second encapsulation adhesive layer 86, and achieves the purpose of controlling the formation of the second encapsulation adhesive layer 86.

In some examples of this embodiment, LED chip 84 includes at least one of a red LED chip, a green LED chip, a blue LED chip, and a yellow LED chip. Specifically, it can be set flexibly according to application needs, and is not further described here.

In some examples of this embodiment, the insulating region 83 may be installed as an insulating separator, but is not limited thereto, and the insulating separator is positioned between the anode substrate 81 and the cathode substrate 82, and the two are insulated and separated. As should be understood, the material of the insulating separator may be the same as or different from that of the LED bracket (8).

For better understanding, this embodiment describes the light emitting unit by providing a more specific example. As shown in FIG. 48, the first encapsulation adhesive layer 85 covers the LED chip 84, and the upper surface of the first encapsulation adhesive layer 85 is at the same level as the upper surface of the LED bracket, and the LED chip 84 is The surface of the separated first encapsulation adhesive layer 85 is an arc surface concave into the LED chip 84, and the width of the second encapsulation adhesive layer 86 is the same as the width of the upper surface of the bowl-shaped structure to form the first encapsulation adhesive layer 85. A surface of one side of the second encapsulation adhesive layer 6 completely covered and close to the first encapsulation adhesive layer 85 protrudes into the first encapsulation adhesive layer 85, and the protrusion fits into a recess in the first encapsulation adhesive layer 85. One surface of the second encapsulating adhesive layer 86 away from the LED chip 84 has a convex lens shape with a spherical portion protruding, and can function to emit light, further increasing the light emitting angle of the light emitting unit.

This embodiment further provides a light emitting assembly, the light emitting assembly may be, but is not limited to, a backlight module including a driving circuit and the light emitting unit, the driving circuit is connected to the light emitting unit, and the backlight module has a larger Since it has a light emitting angle, its display effect can be improved, and the same or better display effect can be achieved by installing fewer light emitting units in the same circuit board area, and the cost is lower. This embodiment further provides a display unit including the backlight module and the backplane, and a driving circuit and a light emitting unit of the backlight module are disposed on the backplane.

Example 8

The present embodiment provides a light emitting assembly that may be, but is not limited to, a backlight module, a lighting module, and the like. The light emitting assembly is installed on a circuit board and a light emitting unit electrically connected to a corresponding circuit on the circuit board. includes The light emitting unit of this embodiment may adopt the light emitting unit shown in each of the above embodiments, and may also adopt a light emitting unit of a different structure (eg, bracketless LED), but the present embodiment is not limited thereto. .

When the light emitting assembly is a backlight module, the backlight module is widely used in folding display screens. In the backlight module of the prior art, in the process of multiple bending and restoring bending of the folding display screen, the flexible circuit board adopted by the backlight module is likely to cause relative displacement with the support plate on the back side, so that the backlight module partially cannot receive effective support and protection. do. Regarding the above problem, one example of the present embodiment provides a backlight module capable of solving the above problem. The circuit board of the backlight module of this example is a flexible circuit board, the backlight module includes a support plate and a magnetic sticker, the flexible circuit board includes a reinforcement plate and a base plate, the reinforcement plate is fixed to the base plate, and the support plate is supported. A groove is installed, and the support groove accommodates at least some reinforcing plates, that is, the reinforcing plates may be integrally disposed in the supporting groove, only a part may be installed in the supporting groove, and some may be located outside the supporting groove. The support groove is provided with an open end facing the base plate, the open end of the support groove is covered by the base plate, the support groove is further provided with a bottom surface of the groove, a magnetic sticker is fixed to the bottom surface of the groove, and the magnetic sticker is a reinforcing plate. The flexible circuit board and the support plate are restored to an unfolded state through two magnetic materials that are magnetically attracted to each other in the process of multi-bending and recovery bending and improve the structural stability of the backlight module. For better understanding, this embodiment will be described in combination with examples shown in the drawings below.

In one example, the thickness of the support plate can be set higher than the height of the support groove, and after the support plate is installed in the support groove, the upper surface of the support plate can protrude from the support groove and is located outside the support groove, and the flexible circuit board and the support plate There is a certain gap between them, and the gap can provide a certain direction of folding and deformation recovery space between the flexible printed circuit board and the support plate during the folding process, and can also reduce the frictional force generated when contact between the two during the folding process.

In another example, referring to FIGS. 49 and 50 , the flexible circuit board 90 includes a base board 901 , a pad 903 , a light emitting unit 904 and a reinforcing plate 905 , and 901 includes a welded portion 902, and a first surface 9021 and a second surface 9022 opposite to the first surface 9021 are installed on the welded portion 902, and the pad 903 is fixed to the first surface 9021, the light emitting unit 904 is fixed to the first surface 9021, the pin pair of the light emitting unit 904 is stacked and welded together with the corresponding pad 903, and the reinforcing plate 905 ) is bonded and fixed to the second surface 9022 of the welded portion 902, and the reinforcing plate 905 is installed to correspond to the pad 903.

The flexible circuit board 90 can implement a folding and conducting action, and the way in which the light emitting unit 904 is fixed to the flexible circuit board 90 in the prior art is generally to connect pins at both ends of the component to the flexible circuit board 90. In the process of bending the flexible circuit board 90, the bending resistance capability of the light emitting unit 904 is less than the bending force for bending the flexible circuit board 90, and the flexible circuit board 90 Since there is no protection against bending resistance of the silver light emitting unit 904 , the light emitting unit 904 is easily damaged when subjected to a bending force in a repetitive folding process. The reinforcement plate 905 of this embodiment is bonded and fixed to one side of the flexible circuit board 90 away from the light emitting unit 904, the reinforcement plate 905 adopts a hard material, and the reinforcement plate 905 has a welded portion 902 ), the bending force of the curved flexible circuit board 90 is transferred to the reinforcement plate 905, and the internal stress of the reinforcement board 905 is used to offset the bending force of the curved flexible circuit board 90. The welding part 902 does not fold, the light emitting unit 904 is fixed to the first surface 9021, the light emitting unit 904 is installed to correspond to the reinforcing plate 905, and furthermore, the first surface The light emitting unit 904 located at 9021 is not damaged. The reinforcing plate 905 can reinforce the hardness of the welded portion 902 to prevent the light emitting unit 904 fixed to the welded portion 902 from being subjected to a bending force, and furthermore, the light emitting unit 904 can prevent the flexible circuit board 904 from being subjected to a bending force. ) so that it is not damaged by folding.

The flexible circuit board 90 includes a conductive layer 906 provided on the first surface 9021 and capable of conducting the light emitting units 904 arranged in an array. The function of the conductive layer 906 is to implement the electrode lead-out of the light emitting unit 904. In this embodiment, the material of the conductive layer 906 can be tin, which can cause a very good conductive effect and is easy to fix by welding the pad 903 and the substrate 901, and of course silver, copper, aluminum and It can be replaced with other conductive materials such as gold.

In some examples of this embodiment, when a metal material corresponding to an external device is installed on the reinforcing plate 905 and the flexible circuit board 90 is mounted on the external device, it is necessary to adopt a conventional screw or adhesive mounting method. There is no magnetic attraction, the reinforcing plate 905 has magnetic attraction, and the flexible circuit board 90 can be directly installed on the support plate 912. A magnetic material can be selected and used. The reinforcing plate 905 is convenient to mount compared to the conventional mounting method, the process is simple, material is saved, there is no need to add other fixing parts, and further, the production cost is reduced.

When the flexible circuit board 90 of the present embodiment is applied to a folding screen, the folding screen is required to have stretch characteristics, and in order to ensure that the flexible circuit board 90 is not damaged, the flexible circuit board 90 is attached to the supporting plate. After fixing, when the flexible circuit board 90 is bent or folded, the welded portion 902 receives a relatively large tensile force, which may cause circuit breakage of the flexible circuit board 90 . In this embodiment, the reinforcing plate 905 adopts a magnetic material. The reinforcing plate 905 is fixed to the support plate 912 by a magnetic attraction method, and the plurality of welds 902 are all fixed to the support plate 912 by magnetic attraction, and when the screen is curved or folded, the reinforcing plate 905 ) is fixed by a magnetic attraction method, so it has a very good buffering effect compared to the adhesive fixation method, and can cause a protective effect on the flexible circuit board 90.

Referring to FIG. 51 , the present application further provides a light emitting assembly. The light emitting assembly may be a backlight module 91, the backlight module 91 includes a flexible circuit board 90, a support plate 912 and a magnetic sticker 913, and the flexible circuit board 90 is a reinforcing plate ( 905) and a base plate 901, the reinforcement plate 905 is fixed to the base plate 901, a support groove 9121 is installed in the support plate 912, and the support groove 9121 is at least partially reinforced. The plate 905 is accommodated, the support groove 9121 has an open end facing the base plate 901, the open end of the support groove 9121 is covered by the base plate 901, and the support groove 9121 ), the groove bottom 9124 is further installed, the magnetic sticker 913 is fixed to the groove bottom 9124, the magnetic sticker 913 is installed parallel to the reinforcing plate 905, and the magnetic sticker 913 is self-adsorbed and incorporated into the reinforcing plate 905. The support plate 912 is used to fix the flexible circuit board 90. In the prior art, the support plate 912 is directly bonded and fixed to the flexible circuit board 90, and when applied to a folding screen or a curved screen, the support plate ( 912) is easy to damage the flexible circuit board 90, and there is a very large potential risk to product quality. In this embodiment, a plurality of support grooves 9121 are installed in the support plate 912, the plurality of support grooves 9121 are installed in a plurality of welded parts 902 corresponding to the flexible circuit board 90, and the support grooves ( The groove bottom surface 9124 of 9121 is parallel to the second surface 9022. The flexible circuit board 90 is mounted correspondingly to the support plate 912, the magnetic sticker 913 is a material comprising a magnetic material, in this embodiment, the magnetic sticker 913 may be a magnetic material, and the magnetic sticker ( One side of the reinforcing plate 905 facing 913 is opposite to the magnetic pole of the reinforcing plate 905, that is, the N pole of the magnetic sticker 913 faces the S pole of the reinforcing plate 905, or the magnetic sticker 913 The S pole of ) faces the N pole of the reinforcing plate 905, and one side of the magnetic sticker 913 opposite to the reinforcing plate 905 is bonded and fixed to the bottom surface of the groove 9124, and the magnetic sticker 913 and reinforcement A mutually attracted magnetic force exists between the plates 905 to fix the flexible circuit board 90 to the support plate 912 . In one embodiment, the magnetic sticker 913 is fixed to the support plate 912, the reinforcing plate 905 is fixed to the light emitting unit 904, and the reinforcing plate 905 is magnetically suctioned and fixed to the magnetic sticker 913. And, the reinforcing plate 905 and the magnetic sticker 913 are bonded to each other. Through the reinforcement plate 905 being fixed to the magnetic sticker 913, the relative position between the light emitting unit 904 and the support plate 912 is fixed, further improving the structural stability of the product.

Referring to FIG. 51 , a distance exists between the magnetic sticker 913 and the reinforcing plate 905 . The side wall of the support groove 9121 is provided with a groove side surface 9122 close to the notch thereof, and a veneer surface 9123 positioned between the notch and the groove bottom surface of the support groove 9121 is formed by connecting the groove side surface 9122. As shown in the drawing, in this example, the veneer surface 9123 is formed as a stepped surface, the veneer surface 9123 exists at a distance from the groove bottom surface 9124, and the reinforcing plate 905 is Spaced apart from the groove side 9122, the reinforcing plate 905 is bonded to the veneer surface 9123. A mutual attraction force exists between the support plate 912 and the reinforcing plate 905 and the magnetic sticker 913, and when the support plate 912 is folded, the flexible circuit board 90 receives a biasing force, and the flexible circuit board 90 tends to move relative to the support plate 912, and at this time, a magnetic attraction force deflecting to resist the deflection force is generated, and as the degree of folding of the support plate 912 increases, the flexible circuit The biasing force received by the board 90 is also greater, and when the biasing force received by the flexible circuit board 90 is greater than the deflected magnetic attraction force between the flexible circuit board 90 and the magnetic sticker 913, the flexible circuit board 90 ) is staggered with the support plate 912.

When the backlight module 91 completes the folding operation, in the process of restoring the backlight module 91 flat, there is a biasing force that attracts each other between the magnetic sticker 913 and the reinforcing plate 905, so that the light emitting unit ( 904) and the support plate 912 are restored to the position facing each other, and the magnetic attraction force existing between the magnetic sticker 913 and the reinforcing plate 905 acts to adjust and correct the light emitting unit 904 and the support plate 912. cause In view of the prior art, a support groove 9121 is installed in the welding portion 902 corresponding to the support plate 912 of the present embodiment, and a magnetic sticker 913 is increased to be accommodated in the support groove 9121, and this embodiment The aspect is more environmentally friendly, does not require an encapsulation process, lowers production cost, fixes the flexible circuit board 90 to the support plate 912 through a self-suction method, and directly connects the flexible circuit board 90 and By arranging the supporting plates 912 correspondingly to complete the assembly, it is possible to simplify the mounting assembly process.

The action of installing the groove side 9122 and the veneer surface 9123 is that, when the flexible circuit board 90 and the support plate 912 are displaced, the flexible circuit board 90 follows a plane parallel to the magnetic sticker 913. It is movable, and the veneer surface 9123 is bonded to the reinforcing plate 905, that is, the reinforcing plate 905 is located between the flexible circuit board 90 and the veneer surface 9123 and the groove side 9122, When the plate 905 moves against the support plate 912, the reinforcing plate 905 causes the flexible circuit board 90 to move along a direction parallel to the second surface 9022, so that the flexible circuit board 90 ) is bonded to the support plate 912, and further prevents the folding screen or the curved screen from appearing on a non-uniform display or light rays in the process.

In this embodiment, a third surface 9051 and a fourth surface 9052 are installed on the reinforcing plate 905, and the third surface 9051 is bonded to the second surface 9022 of the flexible circuit board 90. The fourth surface 9052 faces the magnetic sticker 913, the fifth surface 9131 and the sixth surface 9132 are installed on the magnetic sticker 913, and the fifth surface 9131 is a reinforcing plate. Facing 905, sixth side 9132 is bonded to groove bottom 9124. In this embodiment, the area of the fifth surface 9131 is smaller than that of the fourth surface 9052, the magnetic range between the reinforcing plate 905 and the magnetic sticker 913 is larger, and the reinforcing plate 905 is There is an effect that the range of the suction force of the receiving magnetic sticker 913 is larger. The range of relative movement between the flexible circuit board 90 and the supporting plate 912 is greater, and the degree of curvature of the folding screen or curved screen is greater.

In this embodiment, the portion where the reinforcement plate 905 is bonded to the flexible circuit board 90 is the third surface 9051, that is, the area of the third surface 9051 is the reinforcement plate relative to the flexible circuit board 90. (905) is the protected area. Therefore, if the area of the third surface 9051 is increased, the protection force for the flexible circuit board 90 can be increased, but the folding of the backlight module 91 is disadvantageous. In this embodiment, the protection area of the reinforcing plate 905 and the light emitting unit 904 face each other, that is, the area of the third surface 9051 may correspond to the area of the pad 903 . In the process of using the backlight module 91, a good folding effect is ensured and the protection of the reinforcing plate 905 for the light emitting unit 904 is not affected.

This embodiment further provides an electronic device. 52 and 53, the electronic device 92 further includes a control circuit board 95 and a casing 93, the control circuit board 95 is accommodated in the casing 93, and the control circuit board 95 is accommodated in the casing 93. The circuit board 95 is all conductively connected to the backlight module 91, the control circuit board 95 is electrically connected to the flexible circuit board 90, and the casing 93 has a first edge side 935 installed. A second edge side 9126 facing the first edge side 935 is installed on the supporting plate 912, and the second edge side 9126 is fixed to the first edge side 935.

The electronic device 92 further includes a driving member 94 located on one side of the control circuit board 95 away from the flexible circuit board 90, and the driving member 94 controls the voltage applied to the electronic device 92. used to regulate

In this embodiment, electronic device 92 may be a TV, tablet computer, or mobile phone. The backlight module 91 is mainly applied to an electronic device 92 having a foldable screen or a curved screen. For example, when the electronic device 92 is a mobile phone, the casing 93 is installed in a folding area corresponding to the backlight module 91, and the backlight module 91 and the casing 93 are simultaneously used by the user. It is folded to implement unfolding and folding of the electronic device 92 . Due to the reinforcing plate 905 of the backlight module 91, the backlight module 20 can be folded several times in view of the prior art, furthermore, without damaging the light emitting unit 904 of the flexible circuit board 90, and furthermore The lifetime of the backlight module 91 is increased and the quality of the electronic device 92 is improved.

Example 9

Since the light emitting assembly generates a lot of heat during use, heat dissipation of the light emitting assembly has always been a key consideration in the design process. For example, in the prior art, there are methods of installing a heat conductor on the surface of the LED chip, drawing heat from the heat conductor by forcing convection using a fan, or performing water cooling heat exchange through a water pump, but heat dissipation In the process, additional power consumption occurs. Regarding the above problem, another example of the present embodiment further provides a light emitting assembly with excellent heat dissipation performance and energy saving. The circuit board of the light emitting assembly may adopt the flexible circuit board of the above example, and a rigid circuit board may also be used, but is not limited thereto in this example.

The light emitting assembly of this example further includes a driving chip and a pulsating heat pipe. Here, the circuit board includes a lamp bead area and a driving chip area; The light emitting unit and the driving chip are installed in the lamp bead area and the driving chip area, respectively, the evaporation section of the pulsating heat pipe is installed in the driving chip area, and a working medium is installed in the pulsating heat pipe, and the working medium of the evaporating section is installed in the driving chip area. close to the condensation section of the pulsating heat pipe when moving away from the chip; The pulsating heat pipe dissipates heat by drawing the heat from the driving chip area to the condensation section far away from the driving chip, and the heat exchange form of the pulsating heat pipe is passive heat exchange, which does not require additional external driving, and the driving chip area Since it can implement work only with the heat emitted from it, power consumption can be saved and the heat conduction effect is excellent. For better understanding, this embodiment will be described in combination with examples shown in the drawings below.

Referring to FIGS. 54 to 60 , the light emitting assembly provided in this embodiment includes a circuit board 101 and a pulsating heat pipe 104 .

The circuit board 101 includes a lamp bead area and a driving chip area, and a plurality of light emitting units 102 are installed in the lamp bead area, and the light emitting unit 102 is a light emitting unit ( 102), and other light emitting units 102 may be employed, for example, direct LED chips or other structured LED lamp beads may be employed, and these light emitting units 102 may have various color light emitting units Including but not limited to, the light emitting units 102 may be arranged in an array to form an LED array, and other installation methods may also be adopted, which are not described here one by one. The driving chip area may include, but is not limited to, the driving chip 103 for driving the light emitting unit 102 for light emission, and other chips may be installed in the driving chip area, and the driving chip 103 may be one may contain more than

In some application examples, as shown in FIG. 54 , the circuit board 101 includes a lamp bead region in which light emitting units 102 arranged in an array are installed; and a driving chip region installed at a central portion of one side of the circuit board 101 and disposed on both sides of the circuit board 101 together with the light emitting unit 102 . A plurality of driving chips 103 are installed on the circuit board 101 , and the driving chips 103 are connected to the light emitting unit 102 through a circuit pattern of the circuit board 101 and driven.

As shown in FIG. 55 , the light emitting assembly of this embodiment further includes a pulsating heat pipe 104, and an evaporation section of the pulsating heat pipe 104 is installed in a driving chip region, and is inside the pulsating heat pipe 104. The working medium of the evaporation section approaches the condensation section of the pulsating heat pipe 104 when moving away from the drive chip 103 . The evaporation section of the pulsating heat pipe is installed in the driving chip area and is used to derive heat emitted by a device such as the driving chip 103 in the driving chip area, and the heating value of the driving chip 103 is usually relatively large, It can be understood that an area where a device such as the driving chip 103 is installed is often also an area where the temperature is relatively high in the light emitting assembly. Since the condensation section of the pulsating heat pipe 104 is installed at a location away from the driving chip 103 , the condensing section is located in a region where the temperature is relatively low and can effectively dissipate heat conducted from the pulsating heat pipe 104 . As shown in FIG. 56, the inside of the pulsating heat pipe 104 is filled with a working medium composed of a liquid plug 1041 and a gas plug 1042 spaced at random. This working medium is in the case of no heat transfer. It is normally in a static state, and the force exerted by the working medium in a static state is mainly the pressure between the gas plug 1042, the capillary force exerted by the liquid plug 1041 and the gravitational force exerted by the working medium. In the case of external heating, capillary force, gravity, and the pressure generated by the expansion of the bubbles in the gas plug 1042 with heat are the power provided by the flow of the working medium. In this example, the fluid working medium in the pulsating heat pipe absorbs excessive heat in the driving chip area in the evaporation section, and then flows into the condensation section, where the heat is released into the air, causing a heat dissipation effect to the driving chip area. can If the pulsating heat pipe is applied, heat in the driving chip area can be quickly derived, and the pulsating heat pipe does not require additional external driving and can work only with the heat emitted from the driving chip area, saving power. It is economical and has excellent heat conduction effect.

In some application examples, the light emitting unit 102 and the driving chip 103 are not mixed and disposed on the same side of the circuit board 101, that is, the light emitting unit 102 and the driving chip 103 are on the same side of the circuit board 101. may be located at different positions on the same surface, or at corresponding positions or non-corresponding positions on different surfaces of the circuit board 101; The pulsating heat pipe 104 may be directly installed on the driving chip 103, and its size and position are adjusted so as not to obstruct light emission of the light emitting unit 102. In addition, in some embodiments, the circuit board 101 having relatively excellent heat conduction performance may be used, the light emitting unit 102 and the driving chip 103 may be mixed and disposed on the same surface of the circuit board, and the pulsating heat pipe may be used. may be installed on the other side of the circuit board, and the pulsating heat pipe rapidly derives heat transferred from the driving chip to the circuit board.

In some application examples, as shown in FIG. 57 , the light emitting assembly further includes a thermal conductive sheet 105 installed between the pulsating heat pipe 104 and the driving chip 103 . The thermal conductive sheet 105 facilitates the conduction of the heat of the driving chip 103 relatively uniformly to the pulsating heat pipe 104, thereby improving the actual heat dissipation efficiency of the pulsating heat pipe 104. The thermally conductive sheet may be a thermally conductive sheet formed of a copper sheet or other material having excellent thermal conductivity.

In some application examples, the thermal conductive sheet 105 is provided with silicone grease between the pulsating heat pipe 104 and/or the driving chip 103 . As an example, silicone grease is installed on both sides of the thermal conductive sheet 105, and one surface of the thermal conductive sheet 105 is attached to the driving chip area, contacts the driving chip 103 in the driving chip area, and pulsates. The heat pipe 104 is attached to the other side of the thermal conductive sheet 105 . In practical applications, silicone grease may be applied only to areas where the thermal conductive sheet 105 contacts the driving chip 103 or the pulsating heat pipe 104, and silicone grease may be applied to both sides of the thermal conductive sheet 105 as a whole. there is. The installation of silicone grease can not only help connect the thermal conduction sheet 105 to the pulsating heat pipe 104 and/or drive chip 103, but also expand the contact area for conducting heat through the silicone grease, so that heat Conduction efficiency can be guaranteed.

In some applications, the pulsating heat pipe 104 may include heat dissipation fins in contact with the body of the pulsating heat pipe 104, and heat from the body of the pulsating heat pipe 104 may be conducted to the heat dissipation fins. Heat is dissipated through, and the installed heat dissipation fins increase the effective area of the pulsating heat pipe heat dissipation, allowing the heat to be dissipated into the air more efficiently. The heat dissipation fin is specifically installed in the condensation section, and contacts the main body of the condensation section to quickly dissipate the heat in the condensation section. Of course, this embodiment does not exclude the possibility that the radiating fins can be installed in more positions of the pulsating heat pipe. For example, the heat dissipation fins may also be installed from the condensation section to the insulation section of the pulsating heat pipe, and the insulation section is located between the evaporation section and the condensation section.

In some application examples, the condensation section of the pulsating heat pipe may protrude from the circuit board, for example, referring to FIGS. 58 and 59 , where FIG. 58 is one surface of the light emitting unit 102 installed on the circuit board 101. 59 shows one side of the circuit board 101 on which the driving chip 103 is installed (the light emitting unit and the driving chip are not shown). The condensation section of the pulsating heat pipe 104 is installed in the outer region of the circuit board 101, the pulsating heat pipe 104 draws heat from the driving chip region of the circuit board 101, and then the circuit board 101 to the outside to dissipate heat, further ensure a heat dissipation effect, and prevent too much heat from remaining on the circuit board 101. However, it should be noted that in practical applications, the condensation section of the pulsating heat pipe 104 extends beyond the circuit board, but may still be located inside a light emitting device using the light emitting assembly. Since the condensation section is in the outer region of the circuit board 101, there is also a relatively large space around it, and in this embodiment, the heat dissipation fin may be installed in a structure covering the condensation section, for example shown in FIG. 60 As described above, the specific structure of the radiating fin 106 is that the radiating fin 106 has a rectangular sheet shape as a whole, a plurality of vias 1061 are installed, and the hole diameter of each via 1061 is the same as that of the main body of the pulsating heat pipe 104. coincides with the outer diameter, and the main body of the pulsating heat pipe 104 penetrates these vias 1061, so that the heat dissipation fin 106 is installed in the main body of the pulsating heat pipe 104 and is in contact with the main body, and the pulsating heat pipe 104 ), a plurality of heat dissipation fins 106 may be installed to improve heat dissipation efficiency.

In some application examples, a plurality of driving chips 103 are installed in the driving chip area, and each driving chip 103 has at least a part covered by the projection of the evaporation section of the pulsating heat pipe 104 on the circuit board 101. all. In other words, the pulsating heat pipe 104 completely covers all the driving chips 103 in the driving chip area, and ensures that heat from each driving chip 103 is effectively discharged. In some examples, a thermally conductive sheet 105 is installed between the pulsating heat pipe 104 and the driving chip 130, the size of the thermally conductive sheet 105 may be set equal to or greater than the size of the driving chip area, and the thermally conductive sheet 105 similarly covers all the driving chips 103, and a pulsating heat pipe 104 is installed on the other side of the heat conducting sheet 105. 59 , the pulsating heat pipe 104 of this embodiment may include a plurality of U-shaped pipe bodies, and each U-shaped pipe body communicates with each other through a U-shaped elbow, and the pulsating heat pipe 104 ) is in circulation conduction, and both ends in the longitudinal direction of the U-shaped pipe body are an evaporation section and a condensation section, respectively. That is, if the fluid working medium in the pulsating heat pipe continues to flow in the same direction, it can return to its original position. These U-shaped pipe bodies are arranged in turn, and the gap installed between the U-shaped pipe bodies is relatively small, that is, the U-shaped pipe bodies are closely arranged, so that more U-shaped pipe bodies can be installed within the same area range, ensure heat dissipation ability; In other embodiments, the pulsating heat pipe may be substituted for other shapes, which are not further discussed herein.

The light emitting assembly of this embodiment includes a circuit board and a pulsating heat pipe, an evaporation section of the pulsating heat pipe is installed in a driving chip region of the circuit board, and a condensation section is away from the driving chip region, so that the pulsating heat pipe The heat of the drive chip area is derived through and dissipated in the condensation section, so there is no need to drive with additional energy, saving power. In addition, the pulsating heat pipe is advantageous in miniaturized structure and uniform heat conduction, and can exhibit excellent effects even when the space disposed in the light emitting assembly is small.

As can be seen according to each of the above embodiments of the present application, the LED bracket, light emitting unit and light emitting assembly provided in each of the above embodiments can be applied to the backlight display field by starting with a backlight module (backlight module of terminals such as TVs, monitors, mobile phones, etc.) It can be applied in various light emitting areas such as key backlight field, photography field, home lighting field, medical lighting field, decoration area, automobile area, and traffic area. When applied to the key backlight area, it can be used as a key backlight light source for key devices such as mobile phones, calculators and keyboards; When applied to the field of photography, it can be made into a flash for a camera; When applied to the household lighting area, it can be made into floor lamps, table lamps, lighting lamps, ceiling lamps, down lights, projection lamps and the like; When applied to the field of medical lighting, it can be made into surgical lighting, low-electromagnetic lighting, etc.; When applied to the decorative area, it can be made into various color lights, for example, landscape lighting and advertising lighting; When applied to the automotive field, it can be made into automobile lights, automobile indicator lamps, etc.; When applied to the traffic area, it can be made into various traffic lights and various street lights. It should be understood that the above applications are only some of the applications exemplified in this embodiment, and that the applications of the light emitting device of this embodiment are not limited to the several areas exemplified above.

As should be understood, the application of the present application is not limited to the above examples, and a person skilled in the art may make improvements or transformations in accordance with the above description, and all such improvements and transformations fall within the scope of the claims appended hereto. should belong

Claims (18)

As an LED bracket,
a package body and a substrate partially covered by the package body, wherein a bowl is formed on the package body, and a portion of the substrate is positioned in the bowl as a lower portion of the bowl; the substrate includes two conductive regions located in the bowl, and an insulating region is provided between the two conductive regions to insulate and isolate the two;
The substrate includes a substrate body and a support extending from the substrate body into a sidewall of the bowl, the support extending from one of the conductive regions to another of the conductive regions within the sidewall, the support extending from at least the insulative region to the sidewall. Extending to the sidewall area corresponding to the LED bracket. According to claim 1,
the substrate includes two sub-substrates insulated and separated by the insulating region, and the two sub-substrates are positioned in regions within the bowl to constitute the two conductive regions respectively; The support part includes a support part extending from one of the substrate bodies of the sub-substrate into the sidewall of the bowl, or extends from both sides opposite to one of the substrate bodies of the sub-board into two opposite sidewalls of the bowl, respectively. or includes two support portions each extending into the sidewall of the bowl from one side of the substrate body of the two sub-substrates;
and/or, the supporting portion extends from one of the conductive regions to another of the conductive regions in the sidewall so that the insulating region passes through the sidewall region corresponding to the sidewall;
and/or, the support extends within the side wall to the mouth of the bowl;
and/or, an included angle between the extension direction of the support portion and the substrate body at the upper end in the sidewall is greater than or equal to 90° and less than 180°;
and/or, the support portion is an arc portion at a portion close to the substrate body;
And / or, the support portion is a structure formed integrally with the substrate body, the LED bracket. According to claim 1,
A first surface of the substrate body is provided in the two conductive regions, respectively, a first conductive layer and a second conductive layer are provided in the two conductive regions, respectively, and the first conductive layer and the second conductive layer are provided. A plurality of first grooves are provided on an edge of at least one of the layers, and at least two conductive through holes are installed in the substrate body, and the first conductive layer and the second conductive layer are electrically connected to the different conductive through holes, respectively. connected to;
The substrate further includes a third conductive layer and a fourth conductive layer covering the second surface of the substrate body, and the third conductive layer and the first conductive layer are electrically connected through corresponding conductive through holes, , the fourth conductive layer and the second conductive layer are electrically connected through corresponding conductive layer through holes; The first surface and the second surface are two opposing surfaces, LED bracket. According to claim 3,
a conductive metal layer for contact with corresponding conductive layers on the first surface and the second surface is provided in the conductive through hole;
and/or, the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer include a copper layer, and the first conductive layer, the second conductive layer, and the third conductive layer at least one of the layer and the fourth conductive layer further includes a metal plating layer, the metal plating layer includes a conductive metal whose chemical properties are more stable than copper, and the metal plating layer is coated on a surface of the copper layer;
and/or, the shape of the first groove includes at least one of an arc shape, a rectangle shape, and a sawtooth shape;
and/or, the substrate body includes a ceramic substrate, the LED bracket. According to claim 1,
A second groove is installed in a region of the substrate covered by the package body, and a portion of the package body covering the substrate is filled in the second groove. According to claim 5,
the size of the opening of the bowl gradually increases in a direction away from the substrate from the bottom of the bowl;
and/or, the inner wall of the bowl is connected to one side of the notch of the second groove close to the center of the bowl;
The projected shape of the inner wall of the bowl in the cutting surface of the substrate is straight or curved, and the cutting surface is perpendicular to the surface of the substrate;
and/or, the package body covers the substrate surface on both sides of the second groove, and the projected shape of the inner wall of the bowl in the cut surface of the substrate is relative to the substrate surface and the first segment perpendicularly connected to the substrate surface. a second segment installed obliquely, wherein the cutting surface is perpendicular to the surface of the substrate;
and/or, a third groove for fixing a chip is further installed on one surface of the substrate where the conductive region is installed. According to claim 1,
The substrate body includes a first surface and a second surface facing each other, the two conductive regions are provided on the first surface, and the conductive regions are sequentially stacked on the first surface. A first copper plating layer, nickel It includes a plating layer, a second copper plating layer, and a silver plating layer, wherein the first copper plating layer has a thickness greater than that of the second copper plating layer, and the nickel plating layer allows copper ions of the first copper plating layer to flow to the second copper plating layer. LED brackets to block transitions. According to claim 7,
the substrate further includes the first copper plating layer, the nickel plating layer, the second copper plating layer, and the silver plating layer sequentially stacked and installed on the second surface of the substrate body;
and/or, the thickness of the nickel plating layer ranges from 0.125um to 2.5um;
and/or, the thickness of the second copper plating layer ranges from 0.0625 um to 1 um;
and/or, the thickness of the first copper plating layer ranges from 0.5um to 5um;
and/or, the thickness of the silver plating layer ranges from 0.25um to 5um;
and/or, the LED bracket further comprises a palladium plating layer provided on the first surface and/or the second surface and over the silver plating layer for protecting the silver plating layer; The thickness of the silver plating layer is in the range of 0.0025um to 0.25um, LED bracket. According to claim 1,
The substrate body has a first surface and a second surface that are opposed to each other, and a region of the substrate body located in the bowl is concave downward from the first surface toward the second surface and passes through the second surface. A fourth home that does not open is opened,
the second surface is remote from the bowl; The substrate includes a first pad and a second pad installed in the fourth groove and insulated from each other by the insulating region, and both the first pad and the second pad extend from the bottom wall of the fourth groove to the substrate body. , and portions of the first pad and the second pad located in the fourth groove constitute the two conductive regions, respectively. According to claim 9,
The shape of the fourth groove corresponds to the shape of the LED chip;
and/or the number of the fourth grooves is one or more, and each of the fourth grooves is used to install at least one of the LED chips;
and/or, the substrate body includes a first side surface and a second side surface installed opposite to each other, and the first pad extends from the bottom wall of the fourth groove through the first surface and the first side surface to the second side surface. The second pad extends from the bottom wall of the fourth groove through the first surface and the second side surface to the second surface, and the first pad and the second pad extend from the bottom wall of the fourth groove to the second surface. The pad is installed symmetrically with respect to the vertical bisector of the bottom wall of the fourth groove;
and/or, the LED bracket further comprises a reinforcing member installed on the second surface of the substrate body, and a position of the reinforcing member installed on the second surface corresponds to an area where the insulating region is projected on the substrate body. is; a solder resist layer is provided on a surface of the reinforcing member remote from the substrate body; the second surface has a gap between the first pad and the second pad; The reinforcing member may be an integral structure with the first pad or the second pad, or the reinforcing member may be installed in the gap and set to be spaced apart from both the first pad and the second pad. LED bracket . As a light emitting unit,
an LED chip, and an LED bracket according to claim 1, wherein the LED chip is installed under the bowl, and an anode and a cathode of the LED chip are electrically connected to the two conductive regions, respectively;
The light emitting unit further comprises an encapsulation layer installed in the bowl. According to claim 11,
The encapsulation layer includes a first encapsulation adhesive layer and a second encapsulation adhesive layer which are sequentially filled, the first encapsulation adhesive layer covers the LED chip, and one surface of the second encapsulation adhesive layer far from the LED chip has a spherical protruding shape. ego;
and/or, the height of the first encapsulation adhesive layer on the bowl does not exceed the height of the LED bracket;
and/or, the surface of the first encapsulating adhesive layer away from the LED chip is an inwardly concave arc surface toward the LED chip;
and/or, the width of the second encapsulation adhesive layer is not wider than the width of the upper surface of the bowl;
and/or, the refractive index of the first encapsulation adhesive layer is greater than the refractive index of the second encapsulation adhesive layer, and the refractive index of the second encapsulation adhesive layer is greater than the refractive index of air;
and/or, the package body is a transparent package body;
and/or, a distributed Bragg reflective layer is installed on the LED chip;
and/or, the top surface of the package body is serrated;
and/or, the LED chip includes at least one of a red LED chip, a green LED chip, and a blue LED chip. According to claim 11,
The LED chip includes a red LED chip and a blue LED chip, the encapsulation layer includes a green medium, the green medium is filled in the bowl to cover the red LED chip and the blue LED chip, and the red LED chip and the blue LED chip excites the green medium to emit white light, and the normalized spectrum of the white light satisfies the following condition:
The normalized spectrum includes a first red light band and a green light band, a half-wavelength width of the first red light band is 15 nm to 30 nm, a wavelength peak of the first red light band is a first wavelength peak, and the first wavelength The relative light output corresponding to the peak is 0.9 to 1, and the wavelength corresponding to the first wavelength peak is 645 nm to 665 nm, where:
The material of the green medium includes β-Sialon, the material of the blue LED chip includes gallium nitride, and the material of the red LED chip includes aluminum gallium indium phosphide;
and/or, the encapsulating layer further comprises an encapsulating colloid filled in the bowl, and the mixing ratio of the green medium and the encapsulating colloid is in the range of 1:12 to 1:2;
and/or, in the CIE1931 chromaticity diagram, the X-axis distribution range of the white light is 0.31 to 0.39, the Y-axis distribution range is 0.3 to 0.4, and the color temperature range of the white light is 4000K to 7000K;
And / or, the normalized spectrogram is,
A green light band having a half-wave width of 35 nm to 60 nm, a wavelength peak of a second wavelength peak, a relative light output corresponding to the second wavelength peak of 0.2 to 0.4, and a wavelength corresponding to the second wavelength peak of 530 nm to 550 nm. ego;
The half-wavelength width is 15 nm to 30 nm, the wavelength peak is a blue light band that is the third wavelength peak, the relative light output corresponding to the third wavelength peak is 0.3 to 0.5, and the wavelength corresponding to the third wavelength peak is 445 nm to 455 nm ego;
a yellow light band with a corresponding wavelength range of 585 nm to 630 nm and a relative light output of less than 0.15;
a cyan light band with a corresponding wavelength range of 465 nm to 515 nm and a relative light output of less than 0.1;
a violet light band with a corresponding wavelength range of 350 nm to 420 nm and a relative light output of less than 0.1;
A corresponding wavelength ranges from 680 nm to 780 nm, a relative light output is less than 0.1, and further comprising at least one of a second red light wavelength band adjacent to the first red light band. According to claim 11,
The LED chip includes a blue light LED chip, the encapsulation layer includes a red medium and a green medium, the red medium and the green medium are filled in the bowl to cover the blue light LED chip, and the blue light LED chip is white light. excite the red medium and the green medium to emit , wherein the normalized spectrum of white light satisfies the following condition:
The spectrum includes a red light band and a green light band, a half-wavelength width of the red light band is 80 nm to 100 nm, a wavelength peak of the red light band is a first wavelength peak, and a relative light output corresponding to the first wavelength peak is 0.75 to 0.95, the wavelength corresponding to the first wavelength peak is 645 nm to 665 nm, the half-wavelength of the green light band is 45 nm to 70 nm, the wavelength peak of the green light band is the second wavelength peak, and the second wavelength peak The wavelength corresponding to is 500 nm to 520 nm, where:
the relative light output corresponding to the second wavelength peak is 0.4 to 0.7;
and/or, the material of the red medium includes nitride, the material of the green medium includes β-Sialon and/or silicate, and the material of the blue light LED chip includes gallium nitride;
and/or, the ratio of the red medium to the green medium ranges from 1:13 to 1:4;
and/or, the encapsulating layer further comprises an encapsulating colloid filled in the bowl, and the mixing ratio of the mixture of the red medium and the green medium with the encapsulating colloid is in the range of 1:8 to 1:1.8;
and/or, in the CIE1931 chromaticity diagram, the X-axis distribution range of the white light is 0.32 to 0.38, the Y-axis distribution range is 0.275 to 0.34, and the color temperature range of the white light is 4000K-6200K;
And / or, the normalized spectrogram is,
The half-wavelength width is 15 nm to 30 nm, the wavelength peak is a blue light band that is the third wavelength peak, the relative light output corresponding to the third wavelength peak is 0.9 to 1, and the wavelength corresponding to the third wavelength peak is 445 nm to 455 nm ego;
a yellow light band with a corresponding wavelength range of 560 nm to 590 nm and a relative light output of 0.05 to 0.25;
a cyan light band with a corresponding wavelength range of 460 nm to 490 nm and a relative light output of 0.15 to 0.35;
a violet light band with a corresponding wavelength range of 350 nm to 420 nm and a relative light output of less than 0.1;
The light emitting unit, wherein a corresponding wavelength is greater than 780 nm, a relative light output is less than 0.1, and further comprises at least one of the red light band and an adjacent infrared light band. According to claim 11,
The two conductive regions are respectively provided on the first surface of the substrate body, and a first conductive layer and a second conductive layer are respectively provided in the two conductive regions, and the first conductive layer and the second conductive layer are respectively provided. A plurality of first grooves are installed at an edge of at least one of the substrate body, and at least two conductive through holes are installed in the substrate body, and the first conductive layer and the second conductive layer are electrically connected to the different conductive through holes, respectively. connected;
The substrate further includes a third conductive layer and a fourth conductive layer covering the second surface of the substrate body, and the third conductive layer and the first conductive layer are electrically connected through corresponding conductive through holes, , the fourth conductive layer and the second conductive layer are electrically connected through corresponding conductive layer through holes; the first surface and the second surface are two opposing faces;
The anode of the LED chip is welded to the first conductive layer, and the cathode of the LED chip is welded to the second conductive layer; the encapsulation layer is provided on the first surface of the substrate body and covers the first conductive layer, the second conductive layer and the LED chip, and a portion of the encapsulation layer is filled in the first groove;
The light emitting unit further includes a zener diode, the zener diode is installed on a first surface of the substrate body, an anode of the zener diode is welded to the second conductive layer, and a cathode is welded to the first conductive layer. and the zener diode is also covered by the encapsulation layer;
and/or, the plurality of first grooves at the edges of the first conductive layer and the second conductive layer are located at positions other than the area covered by the LED chip; If the light emitting unit further includes a zener diode, the plurality of first grooves are further positioned in a position other than an area covered by the zener diode. As a light emitting assembly,
The light emitting assembly includes a circuit board and the light emitting unit according to claim 11, wherein the light emitting unit is installed on the circuit board and electrically connected to the circuit board. According to claim 16,
the light emitting assembly further includes a driving chip and a pulsating heat pipe;
the circuit board includes a lamp bead area and a driving chip area; The light emitting unit and the driving chip are installed in the lamp bead area and the driving chip area, respectively, an evaporation section of the pulsating heat pipe is installed in the driving chip area, and a working medium is installed in the pulsating heat pipe. The working medium of the evaporation section approaches the condensation section of the pulsating heat pipe when moving away from the drive chip, wherein:
the lamp bead area and the driving chip area are provided on opposite sides of the circuit board, respectively;
and/or, the light emitting assembly further includes a thermally conductive sheet, the thermally conductive sheet is installed between the pulsating heat pipe and the driving chip; silicone grease is installed between the thermal conductive sheet and the pulsating heat pipe and/or the driving chip;
and/or, the pulsating heat pipe further includes a radiation fin, the radiation fin being installed at least in the condensation section of the pulsating heat pipe, and contacting a pipe body of the condensation section;
and/or, the condensation section of the pulsating heat pipe extends out of the circuit board;
and/or, a plurality of the driving chips are installed in the driving chip area, and each driving chip is at least partially covered by the projection of the evaporation section on the circuit board;
and/or, the pulsating heat pipe includes a plurality of U-shaped pipe bodies, and the U-shaped pipe bodies are in communication with each other through a U-shaped elbow to conduct internal circulation of the pulsating heat pipe, and the U-shaped pipe bodies communicate with each other through a U-shaped elbow. The light emitting assembly, wherein both ends in the longitudinal direction of the pipe body are the evaporation section and the condensation section, respectively. According to claim 16,
The light emitting assembly further includes a support plate and a magnetic sticker, the circuit board is a flexible circuit board, the flexible circuit board includes a reinforcement plate and a base plate, the reinforcement plate is fixed to the base plate, and the support plate is A support groove is installed, the support groove accommodates at least a portion of the reinforcing plate, the support groove has an open end facing the base plate, and an open end of the support groove is covered by the base plate. The support groove is further installed on the bottom of the groove, the magnetic sticker is fixed to the bottom of the groove, the magnetic sticker is installed in parallel to face the reinforcing plate, and the magnetic sticker is magnetically adsorbed and combined with the reinforcing plate. :
the reinforcing plate is a magnetic material;
and/or, the support plate is partially bonded to the base plate;
and/or, the flexible circuit board is provided with a welding part, the welding part has a first surface and a second surface facing each other, the flexible circuit board further includes a pad, and the pad is formed on the first surface. fixed, the light emitting unit is fixed to the pad, and the reinforcing plate is fixed to the second surface, facing the pad;
and/or, the light emitting unit array is disposed on the first surface;
and/or, the flexible circuit board includes a conductive layer fixed to the first surface, and the conductive layer conducts the light emitting units arranged in an array;
And/or, the side wall of the support groove has a groove side surface close to the notch and a veneer surface connected to the groove side surface and positioned between the notch and the groove bottom surface of the support groove, and the reinforcing plate is on the veneer surface. joined to form a gap with the side of the groove;
and/or, a distance exists between the magnetic sticker and the reinforcing plate.

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