CN216120345U

CN216120345U - Substrate, LED light-emitting device and light-emitting device

Info

Publication number: CN216120345U
Application number: CN202121528970.0U
Authority: CN
Inventors: 何刚
Original assignee: Huizhou Jufei Optoelectronics Co ltd
Current assignee: Huizhou Jufei Optoelectronics Co ltd
Priority date: 2021-07-05
Filing date: 2021-07-05
Publication date: 2022-03-22
Anticipated expiration: 2031-07-05

Abstract

The utility model provides a substrate, an LED light-emitting device and a light-emitting device, wherein the substrate comprises a substrate plate, and the substrate plate comprises at least two conductive through holes; the substrate further comprises a first conducting layer and a second conducting layer which cover the first surface of the substrate plate, the edge of the first conducting layer and/or the second conducting layer comprises a plurality of grooves, the first conducting layer and the second conducting layer are respectively connected with at least one conducting through hole, and the first conducting layer and the second conducting layer are respectively connected with different conducting through holes; the substrate also comprises a third conducting layer and a fourth conducting layer which cover the second surface of the substrate plate, the third conducting layer is connected with the conducting through hole corresponding to the first conducting layer, and the fourth conducting layer is connected with the conducting through hole corresponding to the second conducting layer so as to be electrically connected with the first conducting layer or the second conducting layer respectively; if the subsequent packaging glue is arranged on the first surface of the substrate, the substrate can be strongly combined with the packaging glue, and the packaging glue can have better adhesion on the substrate.

Description

Substrate, LED light-emitting device and light-emitting device

Technical Field

The utility model relates to the field of LEDs, in particular to a substrate, an LED light-emitting device and a light-emitting device.

Background

LEDs (Light Emitting diodes) are widely used in the fields of illumination, decoration, backlight, display, and the like. In a widely used LED device package, an LED chip is disposed on a pad, and a conductive layer such as the LED chip and the pad is protected by a package adhesive. The LED device can work in high-temperature, high-humidity and salt-fog environments, and the packaging adhesive is easy to fall off, so that the protection of the LED device is invalid.

SUMMERY OF THE UTILITY MODEL

The utility model provides a substrate, an LED light-emitting device and a light-emitting device, which mainly solve the technical problems that: the existing packaged LED light-emitting device is not firm enough in packaging glue, and the situation of separation is easy to occur, so that the protection of the LED device is failed.

In order to solve the above technical problem, the present invention provides a substrate, including a substrate plate, wherein the substrate plate includes at least two conductive through holes;

the substrate further comprises a first conducting layer and a second conducting layer which cover the first surface of the substrate plate, the edge of the first conducting layer and/or the second conducting layer comprises a plurality of grooves, the first conducting layer and the second conducting layer are respectively connected with at least one conducting through hole, and the first conducting layer and the second conducting layer are respectively connected with different conducting through holes;

the substrate further comprises a third conducting layer and a fourth conducting layer, wherein the third conducting layer and the fourth conducting layer cover the second surface of the substrate plate, the third conducting layer is connected with the conducting through hole corresponding to the first conducting layer, and the fourth conducting layer is connected with the conducting through hole corresponding to the second conducting layer so as to be electrically connected with the first conducting layer or the second conducting layer respectively.

Optionally, a conductive metal layer is disposed in the conductive through hole, and the conductive metal layer is used for contacting with the corresponding conductive layers on the first surface and the second surface of the substrate plate, so as to form an electrical connection between the corresponding conductive layers.

Optionally, the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer include copper layers.

Optionally, at least one of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer further includes a metal plating layer, the metal plating layer includes a conductive metal chemically more stable than copper, and the metal plating layer covers a surface of the copper layer.

Optionally, the substrate plate comprises a ceramic substrate.

Optionally, the shape of the groove of the first conductive layer and/or the second conductive layer includes at least one of an arc shape, a rectangular shape, and a sawtooth shape.

On the other hand, the utility model also provides an LED light-emitting device, which comprises a substrate, an LED chip and a packaging adhesive layer, wherein the substrate is the substrate; the LED chip is arranged on the first surface of the substrate plate, the anode of the LED chip is welded with the first conducting layer, and the cathode of the LED chip is welded with the second conducting layer; the packaging adhesive layer is arranged on the first surface of the substrate plate and coats the first conducting layer, the second conducting layer and the LED chip, and the packaging adhesive layer enters the groove in the edge of the first conducting layer and/or the second conducting layer.

Optionally, the LED light emitting device further includes a zener diode, the zener diode is disposed on the first surface of the substrate plate, the anode of the zener diode is welded to the second conductive layer, the cathode of the zener diode is welded to the first conductive layer, and the zener diode is also covered by the encapsulation adhesive layer.

Optionally, the plurality of grooves on the edges of the first conductive layer and the second conductive layer are located outside the area covered by the LED chip; if the LED light-emitting device further comprises a Zener diode, the grooves are also positioned outside the region covered by the Zener diode.

On the other hand, the utility model also provides a light-emitting device, which comprises a circuit substrate and an LED light-emitting device, wherein the LED light-emitting device is the LED light-emitting device, the circuit substrate comprises a circuit layer, and the third conductive layer and the fourth conductive layer are electrically connected with the circuit layer.

Advantageous effects

The substrate comprises the first conducting layer and the second conducting layer which cover the first surface of the substrate plate, the edge of the first conducting layer and/or the second conducting layer comprises a plurality of grooves, the conducting layer which is in contact with the packaging adhesive on the substrate has a larger side area, and the roughness of the side wall of the conducting layer is generally higher, so that the substrate can be combined with the packaging adhesive more strongly, namely the packaging adhesive can have better adhesiveness on the substrate of the embodiment.

Drawings

Fig. 1 is a schematic structural diagram of a substrate according to an embodiment of the utility model;

fig. 2 is a schematic structural diagram of another substrate according to an embodiment of the utility model;

FIG. 3 is a schematic cross-sectional view taken along A-A of the first conductive layer on the substrate shown in FIG. 2 according to one embodiment of the present invention;

fig. 4 is a schematic cross-sectional structure view of a substrate according to an embodiment of the utility model;

fig. 5 is a schematic structural view illustrating a substrate board covered with a copper layer according to an embodiment of the present invention;

FIG. 6 is a first schematic view illustrating a shape of a groove according to a first embodiment of the present invention;

fig. 7 is a schematic diagram illustrating a shape of a groove according to a first embodiment of the present invention;

fig. 8 is a schematic diagram of a third shape of a groove according to the first embodiment of the present invention;

fig. 9 is a schematic cross-sectional structure view of an LED light-emitting device according to a second embodiment of the present invention;

fig. 10 is a schematic structural diagram of a substrate according to a second embodiment of the present invention;

fig. 11 is a schematic structural diagram of an LED light-emitting device according to a second embodiment of the present invention;

fig. 12 is a schematic view illustrating a substrate plate punching according to a second embodiment of the present invention;

fig. 13 is a schematic view illustrating a substrate plate sputtered with a metal layer according to a second embodiment of the present invention;

fig. 14 is a schematic structural diagram of a light-emitting device according to a second embodiment of the present invention;

1 is a substrate plate; 2 is a conductive through hole; 31 is a first conductive layer; 32 is a second conductive layer; 33 is a circuit layer; 41 is a third conductive layer; 42 is a fourth conductive layer; 5 is a copper layer; 51 is a metal layer; 6 is an LED chip; 7 is a packaging adhesive layer; 8 is a Zener diode; 10 is a circuit substrate; a is a groove.

Detailed Description

In order that the contents of the present invention will be more readily understood, the present invention will now be described in further detail with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

The first embodiment is as follows:

in order to solve the problem that the packaging adhesive of the existing packaged LED light emitting device is easy to fall off, which causes the failure of protection of the packaged LED light emitting device, as shown in fig. 1, this embodiment provides a substrate, which includes a substrate plate 1, where the substrate plate 1 includes at least two conductive through holes 2;

the substrate further comprises a first conducting layer 31 and a second conducting layer 32 which cover the first surface of the substrate plate 1, the edge of the first conducting layer 31 and/or the second conducting layer 32 comprises a plurality of grooves a, the first conducting layer 31 and the second conducting layer 32 are respectively connected with at least one conducting through hole 2, and the first conducting layer 31 and the second conducting layer 32 are respectively connected with different conducting through holes 2;

the substrate further comprises a third conducting layer and a fourth conducting layer which cover the second surface of the substrate plate 1, the third conducting layer is connected with the conducting through hole 2 corresponding to the first conducting layer 31, and the fourth conducting layer is connected with the conducting through hole 2 corresponding to the second conducting layer 32, so that the third conducting layer and the fourth conducting layer are electrically connected with the first conducting layer 31 or the second conducting layer 32 respectively.

The length of the plurality of grooves at the edge of the first conductive layer and/or the second conductive layer in the height direction of the conductive layer may be consistent with the height of the conductive layer or may be smaller than the height of the conductive layer. For example, fig. 1 illustrates a case where the length of the groove in the height direction of the conductive layer coincides with the height of the conductive layer. As another example, referring to fig. 2, in the case where the length of the groove a in the height direction of the conductive layer is smaller than the height of the conductive layer, fig. 3 is a schematic sectional view of the first conductive layer 31 in fig. 2 along a-a.

It can be understood that, because the plurality of grooves are additionally formed at the edge of the first conductive layer and/or the second conductive layer, compared with the conventional rectangular or other conductive layers, the side area is larger, and the roughness of the side wall of the first conductive layer and/or the second conductive layer is generally higher, when the encapsulation adhesive is disposed at the side where the first conductive layer and the second conductive layer are disposed, the substrate of the embodiment can be more strongly bonded with the encapsulation adhesive, that is, the encapsulation adhesive can have better adhesion on the substrate of the embodiment, and in some implementation processes, the air tightness of the finally formed LED light emitting device can be improved accordingly. The conductive layers of the present embodiment include, but are not limited to, a pad and a pin, for example, in some embodiments, the first conductive layer and the second conductive layer may be a pad for disposing the light emitting chip, and the third conductive layer and the fourth conductive layer may be a pin. It should be noted that in some conventional substrates, for example, a groove or the like may be formed on the conductive layer as the positive electrode pad or the negative electrode pad, but in practice, such an arrangement is only used for distinguishing the positive electrode and the negative electrode of the pad, and is not used for intentionally enhancing the adhesion of the packaging adhesive, and in some substrates, the positive electrode and the negative electrode are distinguished by printing marks. The substrate of this embodiment is characterized in that the first conductive layer and/or the second conductive layer has a plurality of grooves, and the positions of the grooves may be continuously and regularly arranged along the edge of the conductive layer according to a certain period, or may be set according to the actual shape of the substrate and/or the layout of electronic devices such as LED chips to be mounted later.

As shown in fig. 4, the conductive through holes 2 in this embodiment penetrate from the first surface to the second surface of the substrate plate 1, the positions and the number of the conductive through holes can be selected according to actual situations, and the conductive through holes corresponding to the first conductive layer and the second conductive layer are separated by a certain distance, so as to prevent the first conductive layer and the second conductive layer from being too close to each other. Optionally, the two sides of the substrate plate may be connected by disposing a conductive metal layer in the conductive through hole, and the conductive metal layer is used to contact with the corresponding conductive layers on the first side and the second side of the substrate plate, so as to form an electrical connection between the corresponding conductive layers. The material of the conductive metal layer may be any conductive metal including, but not limited to, gold, silver, copper, platinum, and the like. The conductive metal layer can be formed in the conductive via by a film forming process, such as vacuum sputtering, or other film forming processes.

The conductive metal layer may not be filled with the conductive via, and illustratively, the conductive via is formed to have an aperture of 50-200um, and the conductive metal layer is formed on an inner wall of the conductive via, and a thickness thereof may be set to not more than 15 um. In other examples, the conductive through holes may be filled with a conductive metal material, or penetrate through the conductive metal bars, which may also achieve the effect of electrically connecting the corresponding conductive layers on the two sides of the substrate.

In some embodiments, the first, second, third, and fourth conductive layers comprise copper layers. The copper layer may be formed by a film forming process, such as vacuum sputtering or other means as described above, in combination with the type of formation of the conductive metal layer in the conductive via. The thickness of the formed copper layer can be set according to the actual size or specification of the device, and as an example, the thickness of the copper layer is about 20-100um, and the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer can be the same or different; the first conductive layer and the second conductive layer may have the same thickness, and the third conductive layer and the fourth conductive layer may have the same thickness, but the first conductive layer and the third conductive layer may have different thicknesses.

In some embodiments, at least one of the first, second, third, and fourth conductive layers further comprises a metal plating, it being noted that the metal plating herein may comprise any conductive metal that is chemically more stable than copper, such as gold plating, silver plating, platinum plating, or some alloys. By means of the metal coating, the conductive layer can have some corresponding metal surface properties, which is also more stable than when bare copper is used as the conductive layer.

The grooves on the substrate in this embodiment can be formed by etching, cutting, and the like. Illustratively, as shown in fig. 5, the entire copper layer 5 may be formed on the substrate plate 1 by, for example, vacuum sputtering, etc., and the copper layer may be formed into a desired shape by etching, cutting, etc., during which the grooves are also formed. The metal plating layer may be formed after the groove is formed, so that the sidewalls of the first conductive layer and/or the second conductive layer may be plated with a desired metal. In the process of manufacturing the substrate of this embodiment, before plating the conductive layer with metal, the surface of the conductive layer may be polished to be flat.

Optionally, the substrate plate may include a ceramic plate, that is, the substrate of this embodiment may be a ceramic substrate, such as ALN and AL₂O₃And the like. In other embodiments, the substrate plate may be made of other materials, for example, an aluminum substrate provided with an insulating layer.

In this embodiment, the grooves of the first conductive layer and the second conductive layer on the substrate may have various shapes, and in some embodiments, the shape of the groove may include at least one of an arc shape, a rectangular shape, and a sawtooth shape.

Such as the substrate shown in fig. 1, in which rectangular grooves are periodically arranged at the edges of the first conductive layer and the second conductive layer (i.e., the intervals between the grooves are fixed).

As shown in fig. 6, the edges of the conductive layer are periodically arranged with arc-shaped grooves a.

As shown in fig. 7, the edge of the conductive layer is periodically arranged with a saw-toothed groove a. In yet another example, as shown in FIG. 8, there is another form of serrated groove a.

It can be understood that the shape of the groove can be other shapes, the size and the arrangement mode can be set, as long as a plurality of grooves are formed, the side areas of the first conducting layer and the second conducting layer which can be in contact with the packaging adhesive can be increased, and the effect of increasing the adhesive property of the packaging adhesive is achieved.

It should be understood that, in some embodiments, one or more LED chips can be disposed in the substrate of the present embodiment in the corresponding areas of the first conductive layer, the second conductive layer, the third conductive layer and the fourth conductive layer, and actually, more than one such area may be included in the substrate.

The substrate of this embodiment is formed with a plurality of recesses through on the edge of first conducting layer and/or second conducting layer for the surface area increase of the comparatively crude side surface of first conducting layer and/or second conducting layer, after the encapsulation of encapsulation glue, the encapsulation glue can with the contact of the lateral wall of first conducting layer and/or second conducting layer bigger area, thereby make the substrate can with the stronger combination of encapsulation glue, reach the condition that the encapsulation glue drops on reducing the LED luminescent device that finally makes, promote the effect of the quality of the LED luminescent device that finally makes.

Example two

Based on the substrate of the above embodiment, the present embodiment provides an LED light emitting device, please refer to fig. 9, the LED light emitting device of the present embodiment includes a substrate, an LED chip 6 and a package adhesive layer 7, wherein the substrate is the substrate of the above embodiment. The LED chip 6 is arranged on the first surface of the substrate plate 1, the anode of the LED chip 6 is welded with the first conducting layer, and the cathode of the LED chip 6 is welded with the second conducting layer 32; the packaging adhesive layer 7 is arranged on the first surface of the substrate plate 1, and wraps the first conductive layer, the second conductive layer 32 and the LED chip 6, and the packaging adhesive layer 7 enters the groove at the edge of the first conductive layer and/or the second conductive layer 32.

According to the LED light-emitting device, the packaging adhesive layer enters the groove at the edge of the first conducting layer and/or the second conducting layer, the contact area of the packaging adhesive layer and the side wall of the first conducting layer and/or the second conducting layer which are rougher on the substrate is increased, and the bonding strength between the packaging adhesive layer and the substrate is effectively improved.

Optionally, the LED light emitting device further includes a zener diode disposed on the first surface of the substrate plate, i.e., on the same surface of the LED chip, the anode of the zener diode is welded to the second conductive layer, the cathode of the zener diode is welded to the first conductive layer, and the zener diode is also covered by the encapsulation adhesive layer. The reverse zener diode can protect the LED chip. And the Zener diode is arranged on the same surface of the LED chip, so that the Zener diode can be covered by the packaging adhesive layer to be protected. It is understood that other components can be included on the LED light emitting device, and the LED light emitting device can be disposed on the same side of the LED chip as the circuit structure allows.

In some embodiments, the plurality of grooves on the edges of the first and second conductive layers are located outside the area covered by the LED chip; if the LED lighting device further includes a zener diode, the plurality of grooves are also located outside the region covered by the zener diode. After the component is installed on the substrate, a part of area of the component can be in contact with the first conducting layer or the second conducting layer, heat can be led out through the first conducting layer or the second conducting layer with large area, the groove is prevented from being arranged at the position of the component, and the heat of the component can be led out through the first conducting layer or the second conducting layer.

In order to better understand the substrate and the LED light emitting device of the present invention, the following embodiment illustrates a specific LED light emitting device, which includes a substrate, an LED chip, a zener diode, and an encapsulant layer. In this example, the substrate is rectangular as a whole, and the first conductive layer and the second conductive layer are also substantially rectangular, but a plurality of rectangular grooves are further included on the first conductive layer and the second conductive layer. As shown in fig. 10, in the substrate used in the LED light emitting device in this example, the grooves a on the first conductive layer 31 and the second conductive layer 32 are respectively disposed along the edges of the first conductive layer 31 and the second conductive layer 32, and more grooves a are disposed on the side away from the center of the substrate in the length direction of the first conductive layer and the second conductive layer, and in fact, the grooves a may be periodically arranged; grooves a are also formed on several corners of the first conductive layer 31 and the second conductive layer 32; and a little groove a is also arranged on one side of the first conducting layer or the second conducting layer in the length direction and close to the center of the substrate. As shown in fig. 11, which is a schematic diagram of an LED light emitting device, it can be seen that in this example, the grooves on the first conductive layer and the second conductive layer are not disposed at the positions covered by the LED chip 6 and the zener diode 8, and the positions where the first conductive layer and the second conductive layer are not covered by the above components are disposed with as many grooves a as possible, so that the substrate and the encapsulant layer (not shown in fig. 11) have good adhesion. It can be seen that in practical application, the groove arrangement on the substrate can be selected according to the final layout of the components, the groove is formed along the edges of the first conductive layer and the second conductive layer as far as possible while the area covered by the components is avoided and the first conductive layer and the second conductive layer are ensured to have a certain surface area, so that the bonding strength of the substrate and the packaging adhesive layer is enhanced, and in some implementation processes, the air tightness can be improved, thereby being beneficial to ensuring the final quality of the LED light-emitting device.

In this embodiment, a manufacturing process of forming the substrate of the above embodiment and the LED light emitting chip of this embodiment is further described, including:

s101, selecting a proper substrate plate to punch;

as shown in fig. 12, a hole is punched in each of the lower left and upper right regions of the substrate plate material 1, and the hole diameter may be, for example, 50 to 200 um. In this step, the punched hole is a hole in which a conductive via is to be formed later.

S102, sputtering metal layers on the front side, the back side and the holes of the substrate plate;

referring to fig. 13, a thin metal layer 51 is sputtered on the substrate plate 1, and the thickness can be selected to be less than 15 um. The metal layer may be a conductive metal, such as copper, or the like.

S103, pad printing a circuit on the surface of the substrate plate, and plating a thick copper layer on the metal layer 51;

a structure as shown in fig. 5 can be obtained.

S104, manufacturing the thick copper layer into a required conductive layer shape;

after etching or cutting, the substrate profile as illustrated in fig. 10 is obtained.

S105, grinding and polishing the conducting layer to enable the surface of the conducting layer to be flat;

s106, electroplating the surface of the conductive layer to obtain a finished product of the substrate;

and forming a metal plating layer on the surface of the copper layer in an electroplating mode.

S107, arranging components on the substrate, and packaging through packaging glue;

illustratively, the components are disposed on the substrate by means including but not limited to eutectic soldering, and the components include zener diodes, LED chips, and the like, and after the components are fixed on the substrate, the package glue layer can be formed by means of molding or the like. In some specific examples, the thickness of the encapsulation adhesive layer may be 200-400um, and the encapsulation adhesive layer may be an insulating adhesive material, such as silicon gel. It will be appreciated that in some examples, the encapsulation adhesive is required to be higher than the highest surface of the components on the substrate to ensure that each component is encapsulated for protection.

After the molding of the encapsulation adhesive layer is completed, the encapsulation adhesive layer is placed into an oven for baking and curing, and for example, the silica gel encapsulation can be baked and cured at the temperature of 120-170 ℃.

It should be understood that when the substrate includes more than one area on which the LED chips are disposed, the cured LED light emitting device may be diced to obtain individual LED light emitting devices as illustrated in fig. 11.

The present embodiment also provides a light emitting apparatus, as shown in fig. 14, including a circuit substrate 10 and an LED light emitting device, which is the LED light emitting device exemplified in the present embodiment, the circuit substrate 10 includes a wiring layer 33, and a third conductive layer 41 and a fourth conductive layer 42 are soldered to the wiring layer 33. It can be understood that the circuit substrate of the light-emitting device may also be disposed with corresponding circuit patterns and components for driving the LED light-emitting devices to emit light. The bonding force between the packaging adhesive layer of the LED light-emitting device in the light-emitting device of the embodiment and the substrate is stronger, the LED light-emitting device is not easy to fall off from the substrate, and the quality of the light-emitting device is high.

It should be noted that the number, shape and size relationships of the elements in the drawings do not represent the actual condition of the elements, but are merely schematic diagrams for ease of understanding. While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the utility model as defined in the appended claims.

Claims

1. A substrate, comprising a substrate sheet comprising at least two conductive vias;

2. The substrate of claim 1, wherein the conductive vias have conductive metal layers disposed therein, the conductive metal layers being configured to contact corresponding conductive layers on the first and second sides of the substrate board material to form electrical connections therebetween.

3. The substrate of claim 1, wherein the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer comprise copper layers.

4. The substrate of claim 3, wherein at least one of the first conductive layer, the second conductive layer, the third conductive layer, and the fourth conductive layer further comprises a metal plating layer comprising a conductive metal chemically more stable than copper, the metal plating layer overlying a surface of the copper layer.

5. The substrate of claim 1, wherein the substrate web comprises a ceramic substrate.

6. The substrate of any one of claims 1-5, wherein the shape of the recess of the first conductive layer and/or the second conductive layer comprises at least one of an arc, a rectangle, and a sawtooth.

7. An LED light-emitting device, comprising a substrate, an LED chip and an encapsulating adhesive layer, wherein the substrate is the substrate of any one of claims 1 to 6; the LED chip is arranged on the first surface of the substrate plate, the anode of the LED chip is welded with the first conducting layer, and the cathode of the LED chip is welded with the second conducting layer; the packaging adhesive layer is arranged on the first surface of the substrate plate and coats the first conducting layer, the second conducting layer and the LED chip, and the packaging adhesive layer enters the groove in the edge of the first conducting layer and/or the second conducting layer.

8. The LED light emitting device of claim 7, further comprising a zener diode disposed on the first side of the substrate board, wherein an anode of the zener diode is bonded to the second conductive layer and a cathode of the zener diode is bonded to the first conductive layer, and the zener diode is also covered by the encapsulant.

9. The LED light emitting device according to claim 7 or 8, wherein a plurality of grooves on edges of the first conductive layer and the second conductive layer are located at positions other than a region covered by the LED chip; if the LED light-emitting device further comprises a Zener diode, the grooves are also positioned outside the region covered by the Zener diode.

10. A light-emitting apparatus comprising a circuit substrate and an LED light-emitting device according to any one of claims 7 to 9, wherein the circuit substrate comprises a wiring layer, and the third conductive layer and the fourth conductive layer are electrically connected to the wiring layer.