KR20230085917A - 열전도성 실리콘 조성물 및 열전도성 부재 - Google Patents

열전도성 실리콘 조성물 및 열전도성 부재 Download PDF

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Publication number
KR20230085917A
KR20230085917A KR1020237014938A KR20237014938A KR20230085917A KR 20230085917 A KR20230085917 A KR 20230085917A KR 1020237014938 A KR1020237014938 A KR 1020237014938A KR 20237014938 A KR20237014938 A KR 20237014938A KR 20230085917 A KR20230085917 A KR 20230085917A
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South Korea
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component
thermally conductive
powder
silicone composition
average particle
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KR1020237014938A
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English (en)
Korean (ko)
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켄지 오타
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다우 도레이 캄파니 리미티드
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Publication of KR20230085917A publication Critical patent/KR20230085917A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
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    • C08K3/00—Use of inorganic substances as compounding ingredients
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    • C—CHEMISTRY; METALLURGY
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    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C—CHEMISTRY; METALLURGY
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    • C08K5/00—Use of organic ingredients
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
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    • C—CHEMISTRY; METALLURGY
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    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020237014938A 2020-10-09 2021-10-08 열전도성 실리콘 조성물 및 열전도성 부재 Pending KR20230085917A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020171542 2020-10-09
JPJP-P-2020-171542 2020-10-09
PCT/JP2021/037267 WO2022075434A1 (ja) 2020-10-09 2021-10-08 熱伝導性シリコーン組成物および熱伝導性部材

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Publication Number Publication Date
KR20230085917A true KR20230085917A (ko) 2023-06-14

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KR1020237014938A Pending KR20230085917A (ko) 2020-10-09 2021-10-08 열전도성 실리콘 조성물 및 열전도성 부재

Country Status (7)

Country Link
US (1) US20230399559A1 (https=)
EP (1) EP4227356A4 (https=)
JP (1) JP7756100B2 (https=)
KR (1) KR20230085917A (https=)
CN (1) CN116113663B (https=)
TW (1) TWI894350B (https=)
WO (1) WO2022075434A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022113941A1 (ja) * 2020-11-30 2022-06-02 株式会社トクヤマ 樹脂組成物
KR20240150441A (ko) * 2022-02-22 2024-10-15 후지고분시고오교오가부시끼가이샤 열전도성 조성물, 열전도성 시트 및 그 제조 방법
US20250376591A1 (en) * 2022-06-17 2025-12-11 Sekisui Chemical Co., Ltd. Heat-conductive composition and heat-conductive member
EP4579731A4 (en) * 2022-08-26 2025-12-17 Denka Company Ltd HEAT DISSIPATION GREASE
CN115612446B (zh) * 2022-10-27 2024-01-26 江西蓝星星火有机硅有限公司 灌封用导热加成型有机硅组合物
KR20260007221A (ko) 2023-04-27 2026-01-13 다우 실리콘즈 코포레이션 경화성 열전도성 조성물
JP2024178019A (ja) * 2023-06-12 2024-12-24 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート
CN120208677B (zh) * 2025-04-01 2025-11-14 军瓷电子材料河北有限公司 一种高导热率氮化铝陶瓷基板及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003831A (ja) 2000-06-26 2002-01-09 Shin Etsu Chem Co Ltd 放熱用部材
JP2013147600A (ja) 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105264039B (zh) * 2013-12-11 2019-05-07 富士高分子工业株式会社 蓄热性组合物
JP6510315B2 (ja) * 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
JP6610429B2 (ja) * 2016-05-24 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及びその製造方法
CN109415564B (zh) * 2016-07-22 2021-12-21 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
CN109563343B (zh) * 2016-08-08 2021-03-23 东丽株式会社 树脂组合物、使用其的片材、层叠体、功率半导体器件、等离子体处理装置及半导体的制造方法
US11248154B2 (en) * 2016-10-18 2022-02-15 Shin-Etsu Chemical Co., Ltd. Thermoconductive silicone composition
JP6731829B2 (ja) 2016-10-19 2020-07-29 日立ジョンソンコントロールズ空調株式会社 電力変換装置および空気調和機
CN110719939B (zh) * 2017-05-31 2022-02-18 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
KR102625362B1 (ko) * 2017-07-24 2024-01-18 다우 도레이 캄파니 리미티드 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체
CN107828105B (zh) * 2017-11-09 2021-03-16 北京北化新橡特种材料科技股份有限公司 不含有机硅的凝胶状导热组合物
KR102509813B1 (ko) * 2018-12-25 2023-03-14 후지고분시고오교오가부시끼가이샤 열전도성 조성물 및 이것을 사용한 열전도성 시트
KR102693604B1 (ko) * 2018-12-29 2024-08-12 다우 글로벌 테크놀로지스 엘엘씨 MgO 충전제를 함유하는 열전도성 조성물 및 상기 조성물이 사용되는 방법 및 장치
WO2020203299A1 (ja) * 2019-03-29 2020-10-08 ダウ・東レ株式会社 多成分型熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003831A (ja) 2000-06-26 2002-01-09 Shin Etsu Chem Co Ltd 放熱用部材
JP2013147600A (ja) 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物

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CN116113663B (zh) 2025-06-13
US20230399559A1 (en) 2023-12-14
EP4227356A1 (en) 2023-08-16
EP4227356A4 (en) 2024-11-13
WO2022075434A1 (ja) 2022-04-14
JPWO2022075434A1 (https=) 2022-04-14
TWI894350B (zh) 2025-08-21
JP7756100B2 (ja) 2025-10-17
CN116113663A (zh) 2023-05-12
TW202227588A (zh) 2022-07-16

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