KR20230085917A - 열전도성 실리콘 조성물 및 열전도성 부재 - Google Patents

열전도성 실리콘 조성물 및 열전도성 부재 Download PDF

Info

Publication number
KR20230085917A
KR20230085917A KR1020237014938A KR20237014938A KR20230085917A KR 20230085917 A KR20230085917 A KR 20230085917A KR 1020237014938 A KR1020237014938 A KR 1020237014938A KR 20237014938 A KR20237014938 A KR 20237014938A KR 20230085917 A KR20230085917 A KR 20230085917A
Authority
KR
South Korea
Prior art keywords
component
thermally conductive
powder
silicone composition
average particle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237014938A
Other languages
English (en)
Korean (ko)
Inventor
켄지 오타
Original Assignee
다우 도레이 캄파니 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다우 도레이 캄파니 리미티드 filed Critical 다우 도레이 캄파니 리미티드
Publication of KR20230085917A publication Critical patent/KR20230085917A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/04—Ingredients characterised by their shape and organic or inorganic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0812—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C08K2003/282—Binary compounds of nitrogen with aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0091—Complexes with metal-heteroatom-bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/05—Alcohols; Metal alcoholates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
    • C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020237014938A 2020-10-09 2021-10-08 열전도성 실리콘 조성물 및 열전도성 부재 Pending KR20230085917A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020171542 2020-10-09
JPJP-P-2020-171542 2020-10-09
PCT/JP2021/037267 WO2022075434A1 (ja) 2020-10-09 2021-10-08 熱伝導性シリコーン組成物および熱伝導性部材

Publications (1)

Publication Number Publication Date
KR20230085917A true KR20230085917A (ko) 2023-06-14

Family

ID=81126524

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237014938A Pending KR20230085917A (ko) 2020-10-09 2021-10-08 열전도성 실리콘 조성물 및 열전도성 부재

Country Status (7)

Country Link
US (1) US20230399559A1 (https=)
EP (1) EP4227356A4 (https=)
JP (1) JP7756100B2 (https=)
KR (1) KR20230085917A (https=)
CN (1) CN116113663B (https=)
TW (1) TWI894350B (https=)
WO (1) WO2022075434A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230242736A1 (en) * 2020-11-30 2023-08-03 Tokuyama Corporation Resin Composition
US20250145799A1 (en) * 2022-02-22 2025-05-08 Fuji Polymer Industries Co., Ltd. Thermally conductive composition, thermally conductive sheet, and method for manufacturing same
US20250304790A1 (en) * 2022-06-17 2025-10-02 Sekisui Chemical Co., Ltd. Thermally conductive composition and thermally conductive member
CN119768914A (zh) * 2022-08-26 2025-04-04 电化株式会社 散热润滑脂
CN115612446B (zh) * 2022-10-27 2024-01-26 江西蓝星星火有机硅有限公司 灌封用导热加成型有机硅组合物
KR20260007221A (ko) 2023-04-27 2026-01-13 다우 실리콘즈 코포레이션 경화성 열전도성 조성물
JP2024178019A (ja) * 2023-06-12 2024-12-24 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート
CN120208677B (zh) * 2025-04-01 2025-11-14 军瓷电子材料河北有限公司 一种高导热率氮化铝陶瓷基板及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003831A (ja) 2000-06-26 2002-01-09 Shin Etsu Chem Co Ltd 放熱用部材
JP2013147600A (ja) 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3020779B1 (en) * 2013-12-11 2018-06-20 Fuji Polymer Industries Co., Ltd. Heat-storage composition
JP6510315B2 (ja) * 2015-05-14 2019-05-08 デンカ株式会社 熱伝導性グリース用組成物、熱伝導性グリースおよび放熱部材
JP6610429B2 (ja) * 2016-05-24 2019-11-27 信越化学工業株式会社 熱伝導性シリコーン組成物、その硬化物及びその製造方法
KR102335616B1 (ko) * 2016-07-22 2021-12-06 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 열전도성 폴리실록산 조성물
SG11201810798PA (en) * 2016-08-08 2018-12-28 Toray Industries Resin composition, and sheet, laminate, power semiconductor device, and plasma processing apparatus including the same, and method of producing semiconductor using the same
KR102384193B1 (ko) * 2016-10-18 2022-04-07 신에쓰 가가꾸 고교 가부시끼가이샤 열전도성 실리콘 조성물
JP6731829B2 (ja) * 2016-10-19 2020-07-29 日立ジョンソンコントロールズ空調株式会社 電力変換装置および空気調和機
TWI746856B (zh) * 2017-05-31 2021-11-21 日商邁圖高新材料日本合同公司 熱傳導性聚矽氧烷組成物
CN111051433B (zh) * 2017-07-24 2022-12-30 陶氏东丽株式会社 导热性硅酮凝胶组合物、导热性部件及散热构造体
CN107828105B (zh) * 2017-11-09 2021-03-16 北京北化新橡特种材料科技股份有限公司 不含有机硅的凝胶状导热组合物
EP3753993B1 (en) * 2018-12-25 2024-10-16 Fuji Polymer Industries Co., Ltd. Heat-conductive composition and heat-conductive sheet employing same
US20210403716A1 (en) * 2018-12-29 2021-12-30 Dow Global Technologies Llc Thermally conductive composition containing mgo filler and methods and devices in which said composition is used
KR20210148204A (ko) * 2019-03-29 2021-12-07 다우 도레이 캄파니 리미티드 다성분형 열전도성 실리콘 겔 조성물, 열전도성 부재 및 방열 구조체

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002003831A (ja) 2000-06-26 2002-01-09 Shin Etsu Chem Co Ltd 放熱用部材
JP2013147600A (ja) 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物

Also Published As

Publication number Publication date
US20230399559A1 (en) 2023-12-14
WO2022075434A1 (ja) 2022-04-14
EP4227356A1 (en) 2023-08-16
TW202227588A (zh) 2022-07-16
JP7756100B2 (ja) 2025-10-17
CN116113663A (zh) 2023-05-12
CN116113663B (zh) 2025-06-13
JPWO2022075434A1 (https=) 2022-04-14
EP4227356A4 (en) 2024-11-13
TWI894350B (zh) 2025-08-21

Similar Documents

Publication Publication Date Title
JP7756100B2 (ja) 熱伝導性シリコーン組成物および熱伝導性部材
TWI784028B (zh) 導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體
TWI811225B (zh) 多成分固化型導熱性聚矽氧凝膠組合物、導熱性構件及散熱結構體
JP4588285B2 (ja) 熱伝導性シリコーンゴム組成物
JPWO2019021825A1 (ja) 熱伝導性シリコーンゲル組成物、熱伝導性部材および放熱構造体
CN112334542B (zh) 热间隙填料及其在电池管理系统中的应用
KR20160143783A (ko) 열전도성 실리콘 조성물 및 전기·전자 기기
TW202307172A (zh) 固化性有機聚矽氧烷組成物、導熱性構件及散熱結構體
KR20230053635A (ko) 경화성 오가노폴리실록산 조성물, 열전도성 부재 및 방열 구조체
US12509585B2 (en) Thermal conductive silicone composition
WO2021240987A1 (ja) 熱伝導性付加硬化型シリコーン組成物及びその製造方法
WO2022030108A1 (ja) 熱伝導性２液付加硬化型シリコーン組成物及びその製造方法
JP2005325212A (ja) 熱伝導性シリコーンゴム組成物及び成型品
JP7174197B1 (ja) 熱伝導性ポリシロキサン組成物
WO2026076628A1 (en) Thermally conductive silicone composition
TW202603064A (zh) 熱傳導性聚矽氧組成物、硬化物及製造方法
CN121752669A (zh) 导热性组合物、导热性构件及散热结构体
WO2022264715A1 (ja) 熱伝導性ポリシロキサン組成物

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902