KR20230069202A - 반도체 장치용 Ag 합금 본딩 와이어 - Google Patents

반도체 장치용 Ag 합금 본딩 와이어 Download PDF

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Publication number
KR20230069202A
KR20230069202A KR1020237012812A KR20237012812A KR20230069202A KR 20230069202 A KR20230069202 A KR 20230069202A KR 1020237012812 A KR1020237012812 A KR 1020237012812A KR 20237012812 A KR20237012812 A KR 20237012812A KR 20230069202 A KR20230069202 A KR 20230069202A
Authority
KR
South Korea
Prior art keywords
wire
ppm
concentration
bonding
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020237012812A
Other languages
English (en)
Korean (ko)
Inventor
노리토시 아라키
다쿠미 오카베
다이조 오다
도모히로 우노
데츠야 오야마다
Original Assignee
닛데쓰마이크로메탈가부시키가이샤
닛테츠 케미컬 앤드 머티리얼 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛데쓰마이크로메탈가부시키가이샤, 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 filed Critical 닛데쓰마이크로메탈가부시키가이샤
Publication of KR20230069202A publication Critical patent/KR20230069202A/ko
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • H01L21/60—
    • H01L24/45—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H01L2224/45139—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
KR1020237012812A 2020-10-20 2021-09-24 반도체 장치용 Ag 합금 본딩 와이어 Ceased KR20230069202A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-175760 2020-10-20
JP2020175760 2020-10-20
PCT/JP2021/035095 WO2022085365A1 (ja) 2020-10-20 2021-09-24 半導体装置用Ａｇ合金ボンディングワイヤ

Publications (1)

Publication Number Publication Date
KR20230069202A true KR20230069202A (ko) 2023-05-18

Family

ID=81289858

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237012812A Ceased KR20230069202A (ko) 2020-10-20 2021-09-24 반도체 장치용 Ag 합금 본딩 와이어

Country Status (7)

Country Link
US (1) US20230402422A1 (https=)
EP (1) EP4234734A4 (https=)
JP (1) JP7629468B2 (https=)
KR (1) KR20230069202A (https=)
CN (1) CN116324000B (https=)
TW (1) TW202234482A (https=)
WO (1) WO2022085365A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117712072A (zh) * 2023-12-08 2024-03-15 郑州机械研究所有限公司 一种银合金键合线及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288962A (ja) 1998-04-01 1999-10-19 Sumitomo Metal Mining Co Ltd ボンディングワイヤ
JP2012169374A (ja) 2011-02-10 2012-09-06 Tanaka Electronics Ind Co Ltd Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60162741A (ja) * 1984-01-31 1985-08-24 Sumitomo Metal Mining Co Ltd ボンデイングワイヤ−
JPS6417436A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Composite bonding wire
JPH01110741A (ja) * 1987-07-10 1989-04-27 Kobe Steel Ltd 複合ボンディングワイヤ
JP3483736B2 (ja) * 1997-07-23 2004-01-06 昭和電線電纜株式会社 銀合金の製造方法
JP2001176912A (ja) * 1999-12-16 2001-06-29 Noge Denki Kogyo:Kk 金被覆した銀線ボンディングワイヤ
JP2002246542A (ja) 2001-02-15 2002-08-30 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
JP5616165B2 (ja) * 2010-08-24 2014-10-29 タツタ電線株式会社 銀ボンディングワイヤ
TWI536396B (zh) * 2013-02-07 2016-06-01 光洋應用材料科技股份有限公司 Silver alloy soldered wire for semiconductor packages
JP5420783B1 (ja) * 2013-04-05 2014-02-19 田中電子工業株式会社 高速信号線用ボンディングワイヤ
JP5399581B1 (ja) * 2013-05-14 2014-01-29 田中電子工業株式会社 高速信号用ボンディングワイヤ
JP5839763B1 (ja) * 2014-07-10 2016-01-06 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP6343197B2 (ja) * 2014-07-16 2018-06-13 タツタ電線株式会社 ボンディング用ワイヤ
JP6516465B2 (ja) * 2014-12-17 2019-05-22 日鉄ケミカル＆マテリアル株式会社 半導体装置用ボンディングワイヤ
WO2016189752A1 (ja) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2017221434A1 (ja) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6869920B2 (ja) * 2018-04-02 2021-05-12 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
JP2020150116A (ja) 2019-03-13 2020-09-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6807426B2 (ja) * 2019-04-12 2021-01-06 田中電子工業株式会社 金被覆銀ボンディングワイヤとその製造方法、及び半導体装置とその製造方法
WO2021065036A1 (ja) * 2019-10-01 2021-04-08 田中電子工業株式会社 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11288962A (ja) 1998-04-01 1999-10-19 Sumitomo Metal Mining Co Ltd ボンディングワイヤ
JP2012169374A (ja) 2011-02-10 2012-09-06 Tanaka Electronics Ind Co Ltd Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ

Also Published As

Publication number Publication date
EP4234734A4 (en) 2025-03-05
TW202234482A (zh) 2022-09-01
US20230402422A1 (en) 2023-12-14
JP7629468B2 (ja) 2025-02-13
WO2022085365A1 (ja) 2022-04-28
CN116324000A (zh) 2023-06-23
JPWO2022085365A1 (https=) 2022-04-28
CN116324000B (zh) 2025-10-14
EP4234734A1 (en) 2023-08-30

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