CN116324000B - 半导体装置用Ag合金接合线 - Google Patents

半导体装置用Ag合金接合线

Info

Publication number
CN116324000B
CN116324000B CN202180071142.5A CN202180071142A CN116324000B CN 116324000 B CN116324000 B CN 116324000B CN 202180071142 A CN202180071142 A CN 202180071142A CN 116324000 B CN116324000 B CN 116324000B
Authority
CN
China
Prior art keywords
ppm
concentration
bonding wire
wire
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180071142.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN116324000A (zh
Inventor
荒木典俊
大壁巧
小田大造
宇野智裕
小山田哲哉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Steel and Sumikin Chemical Co Ltd
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumikin Chemical Co Ltd, Nippon Steel Chemical and Materials Co Ltd filed Critical Nippon Steel and Sumikin Chemical Co Ltd
Publication of CN116324000A publication Critical patent/CN116324000A/zh
Application granted granted Critical
Publication of CN116324000B publication Critical patent/CN116324000B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
CN202180071142.5A 2020-10-20 2021-09-24 半导体装置用Ag合金接合线 Active CN116324000B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-175760 2020-10-20
JP2020175760 2020-10-20
PCT/JP2021/035095 WO2022085365A1 (ja) 2020-10-20 2021-09-24 半導体装置用Ａｇ合金ボンディングワイヤ

Publications (2)

Publication Number Publication Date
CN116324000A CN116324000A (zh) 2023-06-23
CN116324000B true CN116324000B (zh) 2025-10-14

Family

ID=81289858

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180071142.5A Active CN116324000B (zh) 2020-10-20 2021-09-24 半导体装置用Ag合金接合线

Country Status (7)

Country Link
US (1) US20230402422A1 (https=)
EP (1) EP4234734A4 (https=)
JP (1) JP7629468B2 (https=)
KR (1) KR20230069202A (https=)
CN (1) CN116324000B (https=)
TW (1) TW202234482A (https=)
WO (1) WO2022085365A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117712072A (zh) * 2023-12-08 2024-03-15 郑州机械研究所有限公司 一种银合金键合线及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60162741A (ja) * 1984-01-31 1985-08-24 Sumitomo Metal Mining Co Ltd ボンデイングワイヤ−
JPS6417436A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Composite bonding wire
CN104103616A (zh) * 2013-04-05 2014-10-15 田中电子工业株式会社 高速信号线用接合线
CN104157625A (zh) * 2013-05-14 2014-11-19 田中电子工业株式会社 高速信号线用接合线
CN107004613A (zh) * 2014-12-17 2017-08-01 新日铁住金高新材料株式会社 半导体装置用接合线
CN111276459A (zh) * 2015-05-26 2020-06-12 日铁新材料股份有限公司 半导体装置用接合线

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01110741A (ja) * 1987-07-10 1989-04-27 Kobe Steel Ltd 複合ボンディングワイヤ
JP3483736B2 (ja) * 1997-07-23 2004-01-06 昭和電線電纜株式会社 銀合金の製造方法
JPH11288962A (ja) 1998-04-01 1999-10-19 Sumitomo Metal Mining Co Ltd ボンディングワイヤ
JP2001176912A (ja) * 1999-12-16 2001-06-29 Noge Denki Kogyo:Kk 金被覆した銀線ボンディングワイヤ
JP2002246542A (ja) 2001-02-15 2002-08-30 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
JP5616165B2 (ja) * 2010-08-24 2014-10-29 タツタ電線株式会社 銀ボンディングワイヤ
JP4771562B1 (ja) 2011-02-10 2011-09-14 田中電子工業株式会社 Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ
TWI536396B (zh) * 2013-02-07 2016-06-01 光洋應用材料科技股份有限公司 Silver alloy soldered wire for semiconductor packages
JP5839763B1 (ja) * 2014-07-10 2016-01-06 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP6343197B2 (ja) * 2014-07-16 2018-06-13 タツタ電線株式会社 ボンディング用ワイヤ
WO2017221434A1 (ja) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP6869920B2 (ja) * 2018-04-02 2021-05-12 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
JP2020150116A (ja) 2019-03-13 2020-09-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6807426B2 (ja) * 2019-04-12 2021-01-06 田中電子工業株式会社 金被覆銀ボンディングワイヤとその製造方法、及び半導体装置とその製造方法
WO2021065036A1 (ja) * 2019-10-01 2021-04-08 田中電子工業株式会社 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60162741A (ja) * 1984-01-31 1985-08-24 Sumitomo Metal Mining Co Ltd ボンデイングワイヤ−
JPS6417436A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Composite bonding wire
CN104103616A (zh) * 2013-04-05 2014-10-15 田中电子工业株式会社 高速信号线用接合线
CN104157625A (zh) * 2013-05-14 2014-11-19 田中电子工业株式会社 高速信号线用接合线
CN107004613A (zh) * 2014-12-17 2017-08-01 新日铁住金高新材料株式会社 半导体装置用接合线
CN111276459A (zh) * 2015-05-26 2020-06-12 日铁新材料股份有限公司 半导体装置用接合线

Also Published As

Publication number Publication date
EP4234734A4 (en) 2025-03-05
KR20230069202A (ko) 2023-05-18
TW202234482A (zh) 2022-09-01
US20230402422A1 (en) 2023-12-14
JP7629468B2 (ja) 2025-02-13
WO2022085365A1 (ja) 2022-04-28
CN116324000A (zh) 2023-06-23
JPWO2022085365A1 (https=) 2022-04-28
EP4234734A1 (en) 2023-08-30

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