JP7629468B2 - 半導体装置用Ａｇ合金ボンディングワイヤ - Google Patents

半導体装置用Ａｇ合金ボンディングワイヤ Download PDF

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Publication number
JP7629468B2
JP7629468B2 JP2022557326A JP2022557326A JP7629468B2 JP 7629468 B2 JP7629468 B2 JP 7629468B2 JP 2022557326 A JP2022557326 A JP 2022557326A JP 2022557326 A JP2022557326 A JP 2022557326A JP 7629468 B2 JP7629468 B2 JP 7629468B2
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JP
Japan
Prior art keywords
ppm
concentration
wire
less
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
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JP2022557326A
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English (en)
Japanese (ja)
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JPWO2022085365A1 (https=
Inventor
典俊 荒木
巧 大壁
大造 小田
智裕 宇野
哲哉 小山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Original Assignee
Nippon Micrometal Corp
Nippon Steel Chemical and Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2022085365A1 publication Critical patent/JPWO2022085365A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Wire Bonding (AREA)
JP2022557326A 2020-10-20 2021-09-24 半導体装置用Ａｇ合金ボンディングワイヤ Active JP7629468B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020175760 2020-10-20
JP2020175760 2020-10-20
PCT/JP2021/035095 WO2022085365A1 (ja) 2020-10-20 2021-09-24 半導体装置用Ａｇ合金ボンディングワイヤ

Publications (2)

Publication Number Publication Date
JPWO2022085365A1 JPWO2022085365A1 (https=) 2022-04-28
JP7629468B2 true JP7629468B2 (ja) 2025-02-13

Family

ID=81289858

Family Applications (1)

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JP2022557326A Active JP7629468B2 (ja) 2020-10-20 2021-09-24 半導体装置用Ａｇ合金ボンディングワイヤ

Country Status (7)

Country Link
US (1) US20230402422A1 (https=)
EP (1) EP4234734A4 (https=)
JP (1) JP7629468B2 (https=)
KR (1) KR20230069202A (https=)
CN (1) CN116324000B (https=)
TW (1) TW202234482A (https=)
WO (1) WO2022085365A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025092438A (ja) * 2023-12-08 2025-06-19 中国机械総院集団鄭州机械研究所有限公司 銀合金ボンディングワイヤー、その調製方法および使用

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049198A (ja) 2010-08-24 2012-03-08 Sumitomo Metal Mining Co Ltd 銀ボンディングワイヤ
JP2014201797A (ja) 2013-04-05 2014-10-27 田中電子工業株式会社 高速信号線用ボンディングワイヤ
JP2014222725A (ja) 2013-05-14 2014-11-27 田中電子工業株式会社 高速信号用ボンディングワイヤ
WO2016006326A1 (ja) 2014-07-10 2016-01-14 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP2016025114A (ja) 2014-07-16 2016-02-08 タツタ電線株式会社 ボンディング用ワイヤ
JP2019186248A (ja) 2018-04-02 2019-10-24 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
WO2020208839A1 (ja) 2019-04-12 2020-10-15 田中電子工業株式会社 金被覆銀ボンディングワイヤとその製造方法、及び半導体装置とその製造方法
WO2021065036A1 (ja) 2019-10-01 2021-04-08 田中電子工業株式会社 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60162741A (ja) * 1984-01-31 1985-08-24 Sumitomo Metal Mining Co Ltd ボンデイングワイヤ−
JPS6417436A (en) * 1987-07-10 1989-01-20 Kobe Steel Ltd Composite bonding wire
JPH01110741A (ja) * 1987-07-10 1989-04-27 Kobe Steel Ltd 複合ボンディングワイヤ
JP3483736B2 (ja) * 1997-07-23 2004-01-06 昭和電線電纜株式会社 銀合金の製造方法
JPH11288962A (ja) 1998-04-01 1999-10-19 Sumitomo Metal Mining Co Ltd ボンディングワイヤ
JP2001176912A (ja) * 1999-12-16 2001-06-29 Noge Denki Kogyo:Kk 金被覆した銀線ボンディングワイヤ
JP2002246542A (ja) 2001-02-15 2002-08-30 Matsushita Electric Ind Co Ltd パワーモジュール及びその製造方法
JP4771562B1 (ja) 2011-02-10 2011-09-14 田中電子工業株式会社 Ａｇ−Ａｕ−Ｐｄ三元合金系ボンディングワイヤ
TWI536396B (zh) * 2013-02-07 2016-06-01 光洋應用材料科技股份有限公司 Silver alloy soldered wire for semiconductor packages
JP6516465B2 (ja) * 2014-12-17 2019-05-22 日鉄ケミカル＆マテリアル株式会社 半導体装置用ボンディングワイヤ
WO2016189752A1 (ja) * 2015-05-26 2016-12-01 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
WO2017221434A1 (ja) * 2016-06-20 2017-12-28 日鉄住金マイクロメタル株式会社 半導体装置用ボンディングワイヤ
JP2020150116A (ja) 2019-03-13 2020-09-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012049198A (ja) 2010-08-24 2012-03-08 Sumitomo Metal Mining Co Ltd 銀ボンディングワイヤ
JP2014201797A (ja) 2013-04-05 2014-10-27 田中電子工業株式会社 高速信号線用ボンディングワイヤ
JP2014222725A (ja) 2013-05-14 2014-11-27 田中電子工業株式会社 高速信号用ボンディングワイヤ
WO2016006326A1 (ja) 2014-07-10 2016-01-14 新日鉄住金マテリアルズ株式会社 半導体装置用ボンディングワイヤ
JP2016025114A (ja) 2014-07-16 2016-02-08 タツタ電線株式会社 ボンディング用ワイヤ
JP2019186248A (ja) 2018-04-02 2019-10-24 田中電子工業株式会社 ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法
WO2020208839A1 (ja) 2019-04-12 2020-10-15 田中電子工業株式会社 金被覆銀ボンディングワイヤとその製造方法、及び半導体装置とその製造方法
WO2021065036A1 (ja) 2019-10-01 2021-04-08 田中電子工業株式会社 ワイヤ接合構造とそれに用いられるボンディングワイヤ及び半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025092438A (ja) * 2023-12-08 2025-06-19 中国机械総院集団鄭州机械研究所有限公司 銀合金ボンディングワイヤー、その調製方法および使用
JP7774698B2 (ja) 2023-12-08 2025-11-21 中国机械総院集団鄭州机械研究所有限公司 銀合金ボンディングワイヤー、その調製方法および使用

Also Published As

Publication number Publication date
EP4234734A4 (en) 2025-03-05
KR20230069202A (ko) 2023-05-18
TW202234482A (zh) 2022-09-01
US20230402422A1 (en) 2023-12-14
WO2022085365A1 (ja) 2022-04-28
CN116324000A (zh) 2023-06-23
JPWO2022085365A1 (https=) 2022-04-28
CN116324000B (zh) 2025-10-14
EP4234734A1 (en) 2023-08-30

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