KR20230061448A - 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품 - Google Patents

광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품 Download PDF

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Publication number
KR20230061448A
KR20230061448A KR1020237010932A KR20237010932A KR20230061448A KR 20230061448 A KR20230061448 A KR 20230061448A KR 1020237010932 A KR1020237010932 A KR 1020237010932A KR 20237010932 A KR20237010932 A KR 20237010932A KR 20230061448 A KR20230061448 A KR 20230061448A
Authority
KR
South Korea
Prior art keywords
resin composition
resin
photocurable thermosetting
epoxy resin
thermosetting resin
Prior art date
Application number
KR1020237010932A
Other languages
English (en)
Korean (ko)
Inventor
신이치로 후쿠다
츠요시 우치야마
가요코 도쿠미츠
히데카즈 미야베
Original Assignee
다이요 잉키 세이조 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20230061448A publication Critical patent/KR20230061448A/ko

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020237010932A 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품 KR20230061448A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020148967 2020-09-04
JPJP-P-2020-148967 2020-09-04
PCT/JP2021/032395 WO2022050372A1 (ja) 2020-09-04 2021-09-03 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品

Publications (1)

Publication Number Publication Date
KR20230061448A true KR20230061448A (ko) 2023-05-08

Family

ID=80492239

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237010932A KR20230061448A (ko) 2020-09-04 2021-09-03 광경화성 열경화성 수지 조성물, 드라이 필름, 경화물 및 당해 경화물을 갖는 전자 부품

Country Status (5)

Country Link
JP (1) JPWO2022050372A1 (zh)
KR (1) KR20230061448A (zh)
CN (1) CN115989456A (zh)
TW (1) TW202219169A (zh)
WO (1) WO2022050372A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688116B2 (ja) 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200417294A (en) * 2002-11-28 2004-09-01 Taiyo Ink Mfg Co Ltd Photo- and thermo-setting resin composition and printed wiring boards made by using the same
JP6359814B2 (ja) * 2013-09-17 2018-07-18 太陽インキ製造株式会社 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6788372B2 (ja) * 2015-06-05 2020-11-25 太陽インキ製造株式会社 アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP6759323B2 (ja) * 2018-03-28 2020-09-23 太陽インキ製造株式会社 感光性樹脂組成物、２液型感光性樹脂組成物、ドライフィルムおよびプリント配線板
KR102633403B1 (ko) * 2018-03-30 2024-02-06 다이요 홀딩스 가부시키가이샤 알칼리 현상형 광경화성 열경화성 수지 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5688116B2 (ja) 2013-05-13 2015-03-25 太陽ホールディングス株式会社 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板

Also Published As

Publication number Publication date
JPWO2022050372A1 (zh) 2022-03-10
TW202219169A (zh) 2022-05-16
WO2022050372A1 (ja) 2022-03-10
CN115989456A (zh) 2023-04-18

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