JPWO2022050372A1 - - Google Patents
Info
- Publication number
- JPWO2022050372A1 JPWO2022050372A1 JP2022546980A JP2022546980A JPWO2022050372A1 JP WO2022050372 A1 JPWO2022050372 A1 JP WO2022050372A1 JP 2022546980 A JP2022546980 A JP 2022546980A JP 2022546980 A JP2022546980 A JP 2022546980A JP WO2022050372 A1 JPWO2022050372 A1 JP WO2022050372A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020148967 | 2020-09-04 | ||
PCT/JP2021/032395 WO2022050372A1 (ja) | 2020-09-04 | 2021-09-03 | 光硬化性熱硬化性樹脂組成物、ドライフィルム、硬化物および当該硬化物を有する電子部品 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022050372A1 true JPWO2022050372A1 (ja) | 2022-03-10 |
Family
ID=80492239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022546980A Pending JPWO2022050372A1 (ja) | 2020-09-04 | 2021-09-03 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022050372A1 (ja) |
KR (1) | KR20230061448A (ja) |
CN (1) | CN115989456A (ja) |
TW (1) | TW202219169A (ja) |
WO (1) | WO2022050372A1 (ja) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200417294A (en) * | 2002-11-28 | 2004-09-01 | Taiyo Ink Mfg Co Ltd | Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
JP5688116B2 (ja) | 2013-05-13 | 2015-03-25 | 太陽ホールディングス株式会社 | 光硬化性熱硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板 |
JP6359814B2 (ja) * | 2013-09-17 | 2018-07-18 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
JP6788372B2 (ja) * | 2015-06-05 | 2020-11-25 | 太陽インキ製造株式会社 | アルカリ現像可能な樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
JP6759323B2 (ja) * | 2018-03-28 | 2020-09-23 | 太陽インキ製造株式会社 | 感光性樹脂組成物、2液型感光性樹脂組成物、ドライフィルムおよびプリント配線板 |
WO2019188591A1 (ja) * | 2018-03-30 | 2019-10-03 | 太陽インキ製造株式会社 | アルカリ現像型光硬化性熱硬化性樹脂組成物 |
-
2021
- 2021-09-03 TW TW110132831A patent/TW202219169A/zh unknown
- 2021-09-03 WO PCT/JP2021/032395 patent/WO2022050372A1/ja active Application Filing
- 2021-09-03 KR KR1020237010932A patent/KR20230061448A/ko active Search and Examination
- 2021-09-03 CN CN202180052677.8A patent/CN115989456A/zh active Pending
- 2021-09-03 JP JP2022546980A patent/JPWO2022050372A1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
CN115989456A (zh) | 2023-04-18 |
TW202219169A (zh) | 2022-05-16 |
KR20230061448A (ko) | 2023-05-08 |
WO2022050372A1 (ja) | 2022-03-10 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20230605 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240710 |