KR20230049098A - 수지층 부착 동박 및 이것을 사용한 적층체 - Google Patents

수지층 부착 동박 및 이것을 사용한 적층체 Download PDF

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Publication number
KR20230049098A
KR20230049098A KR1020237005098A KR20237005098A KR20230049098A KR 20230049098 A KR20230049098 A KR 20230049098A KR 1020237005098 A KR1020237005098 A KR 1020237005098A KR 20237005098 A KR20237005098 A KR 20237005098A KR 20230049098 A KR20230049098 A KR 20230049098A
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KR
South Korea
Prior art keywords
resin layer
copper foil
compound
resin
layer
Prior art date
Application number
KR1020237005098A
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English (en)
Korean (ko)
Inventor
고키 고마쓰
신야 기타무라
노리아키 스기모토
요스케 마쓰야마
다케시 노부쿠니
Original Assignee
미츠비시 가스 가가쿠 가부시키가이샤
엠지씨 에레쿠토로테쿠노 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미츠비시 가스 가가쿠 가부시키가이샤, 엠지씨 에레쿠토로테쿠노 가부시키가이샤 filed Critical 미츠비시 가스 가가쿠 가부시키가이샤
Publication of KR20230049098A publication Critical patent/KR20230049098A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
    • C08K5/3415—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2371/00—Polyethers, e.g. PEEK, i.e. polyether-etherketone; PEK, i.e. polyetherketone
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2379/00—Other polymers having nitrogen, with or without oxygen or carbon only, in the main chain
    • B32B2379/08—Polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
KR1020237005098A 2020-08-13 2021-08-07 수지층 부착 동박 및 이것을 사용한 적층체 KR20230049098A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-136713 2020-08-13
JP2020136713 2020-08-13
PCT/JP2021/029459 WO2022034872A1 (ja) 2020-08-13 2021-08-07 樹脂層付き銅箔、及び、これを用いた積層体

Publications (1)

Publication Number Publication Date
KR20230049098A true KR20230049098A (ko) 2023-04-12

Family

ID=80247898

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237005098A KR20230049098A (ko) 2020-08-13 2021-08-07 수지층 부착 동박 및 이것을 사용한 적층체

Country Status (5)

Country Link
JP (1) JPWO2022034872A1 (zh)
KR (1) KR20230049098A (zh)
CN (1) CN116096805A (zh)
TW (1) TW202218874A (zh)
WO (1) WO2022034872A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20240165934A1 (en) * 2021-03-31 2024-05-23 Taiyo Holdings Co., Ltd. Curable resin multilayer body, dry film, cured product and electronic component
JP7197047B1 (ja) 2022-05-27 2022-12-27 三菱瓦斯化学株式会社 樹脂組成物、硬化物、封止材料、接着剤、絶縁材料、塗料、プリプレグ、多層体、および、繊維強化複合材料

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017050561A (ja) 2016-11-16 2017-03-09 味の素株式会社 絶縁樹脂シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5421540B2 (ja) * 2007-01-29 2014-02-19 ソマール株式会社 樹脂被覆金属箔及びその製造方法、並びにこの製造方法で得られた樹脂被覆金属箔を用いた金属張積層板及びその製造方法
US20110281126A1 (en) * 2008-12-26 2011-11-17 Mitsuru Nozaki Resin composite copper foil
JP5659673B2 (ja) * 2010-10-06 2015-01-28 住友ベークライト株式会社 樹脂シート、積層板、電子部品、プリント配線板及び半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017050561A (ja) 2016-11-16 2017-03-09 味の素株式会社 絶縁樹脂シート

Also Published As

Publication number Publication date
WO2022034872A1 (ja) 2022-02-17
TW202218874A (zh) 2022-05-16
JPWO2022034872A1 (zh) 2022-02-17
CN116096805A (zh) 2023-05-09

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