KR20230042565A - 레이저 가공 장치 - Google Patents

레이저 가공 장치 Download PDF

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Publication number
KR20230042565A
KR20230042565A KR1020220114624A KR20220114624A KR20230042565A KR 20230042565 A KR20230042565 A KR 20230042565A KR 1020220114624 A KR1020220114624 A KR 1020220114624A KR 20220114624 A KR20220114624 A KR 20220114624A KR 20230042565 A KR20230042565 A KR 20230042565A
Authority
KR
South Korea
Prior art keywords
laser beam
unit
laser
light modulator
spatial light
Prior art date
Application number
KR1020220114624A
Other languages
English (en)
Korean (ko)
Inventor
테페이 노무라
시게후미 오카다
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20230042565A publication Critical patent/KR20230042565A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Laser Beam Processing (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
KR1020220114624A 2021-09-21 2022-09-13 레이저 가공 장치 KR20230042565A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021153409A JP2023045156A (ja) 2021-09-21 2021-09-21 レーザー加工装置
JPJP-P-2021-153409 2021-09-21

Publications (1)

Publication Number Publication Date
KR20230042565A true KR20230042565A (ko) 2023-03-28

Family

ID=85574888

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220114624A KR20230042565A (ko) 2021-09-21 2022-09-13 레이저 가공 장치

Country Status (4)

Country Link
JP (1) JP2023045156A (ja)
KR (1) KR20230042565A (ja)
CN (1) CN115837512A (ja)
TW (1) TW202313235A (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011051011A (ja) 2009-08-03 2011-03-17 Hamamatsu Photonics Kk レーザ加工方法及び半導体装置の製造方法
JP2011161491A (ja) 2010-02-10 2011-08-25 Disco Abrasive Syst Ltd レーザー加工装置
JP2017131945A (ja) 2016-01-28 2017-08-03 浜松ホトニクス株式会社 レーザ光照射装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011051011A (ja) 2009-08-03 2011-03-17 Hamamatsu Photonics Kk レーザ加工方法及び半導体装置の製造方法
JP2011161491A (ja) 2010-02-10 2011-08-25 Disco Abrasive Syst Ltd レーザー加工装置
JP2017131945A (ja) 2016-01-28 2017-08-03 浜松ホトニクス株式会社 レーザ光照射装置

Also Published As

Publication number Publication date
JP2023045156A (ja) 2023-04-03
TW202313235A (zh) 2023-04-01
CN115837512A (zh) 2023-03-24

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