KR20220157949A - 수지막, 그 제조 방법, 수지 조성물, 디스플레이 및 그 제조 방법 - Google Patents

수지막, 그 제조 방법, 수지 조성물, 디스플레이 및 그 제조 방법 Download PDF

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KR20220157949A
KR20220157949A KR1020227031366A KR20227031366A KR20220157949A KR 20220157949 A KR20220157949 A KR 20220157949A KR 1020227031366 A KR1020227031366 A KR 1020227031366A KR 20227031366 A KR20227031366 A KR 20227031366A KR 20220157949 A KR20220157949 A KR 20220157949A
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formula
resin film
resin
carbon atoms
film
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Korean (ko)
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도모키 아시베
다이치 미야자키
미츠히토 스와
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도레이 카부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • H01L27/32—
    • H01L51/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020227031366A 2020-03-24 2021-03-22 수지막, 그 제조 방법, 수지 조성물, 디스플레이 및 그 제조 방법 Withdrawn KR20220157949A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-052296 2020-03-24
JP2020052296 2020-03-24
PCT/JP2021/011710 WO2021193530A1 (ja) 2020-03-24 2021-03-22 樹脂膜、その製造方法、樹脂組成物、ディスプレイおよびその製造方法

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KR20220157949A true KR20220157949A (ko) 2022-11-29

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Country Link
US (1) US20230167252A1 (https=)
JP (1) JP7823391B2 (https=)
KR (1) KR20220157949A (https=)
CN (1) CN115315462A (https=)
WO (1) WO2021193530A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016188367A (ja) 2015-03-27 2016-11-04 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 組成物、これから製造された複合体、及びこれを含むフィルム並びに電子素子
WO2017099183A1 (ja) 2015-12-11 2017-06-15 東レ株式会社 樹脂組成物、樹脂の製造方法、樹脂膜の製造方法および電子デバイスの製造方法
WO2017221776A1 (ja) 2016-06-24 2017-12-28 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0617474B2 (ja) * 1985-05-31 1994-03-09 チッソ株式会社 高接着性シリコン含有ポリアミド酸の製造法
JP2607104B2 (ja) * 1987-11-11 1997-05-07 チッソ株式会社 シリコン含有ポリイミド硬化物及びその製造法
EP0316154B1 (en) * 1987-11-10 1995-02-08 Chisso Corporation Silicon-containing polyimide precursor, cured product therefrom, and preparation thereof
JP2619515B2 (ja) * 1989-02-02 1997-06-11 チッソ株式会社 シリコンポリイミド前駆体組成物
JPH0350235A (ja) * 1989-07-17 1991-03-04 Chisso Corp 高接着性シリコン系ポリアミド酸及びその硬化物の各製造法
JPH05310934A (ja) * 1992-05-11 1993-11-22 Chisso Corp 接着性ポリイミドフィルムの製造方法
JPH06235922A (ja) * 1993-02-09 1994-08-23 Japan Synthetic Rubber Co Ltd 液晶配向剤
WO2001040851A1 (fr) * 1999-11-30 2001-06-07 Hitachi, Ltd. Afficheur a cristaux liquides et composition de resine
JPWO2011122198A1 (ja) * 2010-03-31 2013-07-08 Jsr株式会社 ポリイミド前駆体、該前駆体を含む樹脂組成物および樹脂組成物を用いた膜形成方法
JP2012149196A (ja) * 2011-01-21 2012-08-09 Jnc Corp 熱硬化性組成物、硬化膜、及び表示素子
US10435510B2 (en) * 2013-02-07 2019-10-08 Kaneka Corporation Alkoxysilane-modified polyamic acid solution, laminate and flexible device each produced using same, and method for producing laminate
KR102164313B1 (ko) * 2013-12-02 2020-10-13 삼성전자주식회사 폴리(이미드-아미드) 코폴리머, 상기 폴리(이미드-아미드) 코폴리머를 포함하는 성형품, 및 상기 성형품을 포함하는 디스플레이 장치
JP6413434B2 (ja) * 2014-07-25 2018-10-31 富士ゼロックス株式会社 ポリイミド前駆体組成物、ポリイミド前駆体の製造方法、ポリイミド成形体、及びポリイミド成形体の製造方法
JP6491742B2 (ja) * 2015-04-17 2019-03-27 旭化成株式会社 樹脂組成物、ポリイミド樹脂膜、及びその製造方法
CN105601964A (zh) * 2015-12-30 2016-05-25 西北工业大学 超低介电常数、低介电损耗聚酰亚胺薄膜的制备方法
JP6754607B2 (ja) * 2016-04-27 2020-09-16 株式会社カネカ アルコキシシラン変性ポリイミド前駆体溶液、積層体およびフレキシブルデバイスの製造方法
JP7322699B2 (ja) * 2018-01-18 2023-08-08 東レ株式会社 ディスプレイ基板用樹脂組成物、ディスプレイ基板用樹脂膜およびそれを含む積層体、画像表示装置、有機ｅｌディスプレイ、並びに、それらの製造方法
JP2020033540A (ja) * 2018-08-28 2020-03-05 日立化成株式会社 シルセスキオキサン含有ポリイミド
CN110229332A (zh) * 2019-06-15 2019-09-13 深圳市创智成功科技有限公司 耐等离子蚀刻的笼型倍半硅氧烷聚酰胺酸聚合物及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016188367A (ja) 2015-03-27 2016-11-04 三星電子株式会社Ｓａｍｓｕｎｇ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 組成物、これから製造された複合体、及びこれを含むフィルム並びに電子素子
WO2017099183A1 (ja) 2015-12-11 2017-06-15 東レ株式会社 樹脂組成物、樹脂の製造方法、樹脂膜の製造方法および電子デバイスの製造方法
WO2017221776A1 (ja) 2016-06-24 2017-12-28 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法

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JP7823391B2 (ja) 2026-03-04
JPWO2021193530A1 (https=) 2021-09-30
CN115315462A (zh) 2022-11-08
US20230167252A1 (en) 2023-06-01
WO2021193530A1 (ja) 2021-09-30

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