KR20220139347A - 도금 처리 방법 및 도금 처리 장치 - Google Patents

도금 처리 방법 및 도금 처리 장치 Download PDF

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Publication number
KR20220139347A
KR20220139347A KR1020227030048A KR20227030048A KR20220139347A KR 20220139347 A KR20220139347 A KR 20220139347A KR 1020227030048 A KR1020227030048 A KR 1020227030048A KR 20227030048 A KR20227030048 A KR 20227030048A KR 20220139347 A KR20220139347 A KR 20220139347A
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KR
South Korea
Prior art keywords
plating
wafer
supply
unit
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227030048A
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English (en)
Korean (ko)
Inventor
마사토 하마다
마사미 아키모토
마사토시 시라이시
사토시 가네코
카즈키 모토마츠
카즈유키 고토
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20220139347A publication Critical patent/KR20220139347A/ko
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
KR1020227030048A 2020-02-06 2021-02-01 도금 처리 방법 및 도금 처리 장치 Pending KR20220139347A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-019042 2020-02-06
JP2020019042 2020-02-06
PCT/JP2021/003455 WO2021157504A1 (ja) 2020-02-06 2021-02-01 めっき処理方法およびめっき処理装置

Publications (1)

Publication Number Publication Date
KR20220139347A true KR20220139347A (ko) 2022-10-14

Family

ID=77200636

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227030048A Pending KR20220139347A (ko) 2020-02-06 2021-02-01 도금 처리 방법 및 도금 처리 장치

Country Status (5)

Country Link
US (1) US20230042744A1 (enExample)
JP (1) JP7325550B2 (enExample)
KR (1) KR20220139347A (enExample)
TW (1) TWI895334B (enExample)
WO (1) WO2021157504A1 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005133160A (ja) 2003-10-30 2005-05-26 Ebara Corp 基板処理装置及び方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270945A (en) * 1975-12-10 1977-06-13 Inoue Japax Res Plating method
JPS5792191A (en) * 1980-11-29 1982-06-08 Nec Corp Partial plating method
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
JP2004315889A (ja) * 2003-04-16 2004-11-11 Ebara Corp 半導体基板のめっき方法
JP2007051362A (ja) * 2005-07-19 2007-03-01 Ebara Corp めっき装置及びめっき液の管理方法
US10472730B2 (en) * 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
CN102286760B (zh) * 2010-05-19 2016-10-05 诺发系统有限公司 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统
WO2012050057A1 (ja) * 2010-10-13 2012-04-19 東京エレクトロン株式会社 テンプレート及び基板の処理方法
WO2013108452A1 (ja) * 2012-01-20 2013-07-25 東京エレクトロン株式会社 支持基板及び基板の処理方法
JP2018040048A (ja) * 2016-09-09 2018-03-15 株式会社東芝 電気めっき装置、電気めっき方法、及び半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005133160A (ja) 2003-10-30 2005-05-26 Ebara Corp 基板処理装置及び方法

Also Published As

Publication number Publication date
WO2021157504A1 (ja) 2021-08-12
JPWO2021157504A1 (enExample) 2021-08-12
TWI895334B (zh) 2025-09-01
TW202140864A (zh) 2021-11-01
JP7325550B2 (ja) 2023-08-14
US20230042744A1 (en) 2023-02-09

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