TWI895334B - 鍍敷處理方法及鍍敷處理裝置 - Google Patents

鍍敷處理方法及鍍敷處理裝置

Info

Publication number
TWI895334B
TWI895334B TW110102618A TW110102618A TWI895334B TW I895334 B TWI895334 B TW I895334B TW 110102618 A TW110102618 A TW 110102618A TW 110102618 A TW110102618 A TW 110102618A TW I895334 B TWI895334 B TW I895334B
Authority
TW
Taiwan
Prior art keywords
liquid
wafer
substrate
coating
supply
Prior art date
Application number
TW110102618A
Other languages
English (en)
Chinese (zh)
Other versions
TW202140864A (zh
Inventor
濵田正人
飽本正巳
白石雅敏
金子聡
元松一騎
後藤一幸
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202140864A publication Critical patent/TW202140864A/zh
Application granted granted Critical
Publication of TWI895334B publication Critical patent/TWI895334B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW110102618A 2020-02-06 2021-01-25 鍍敷處理方法及鍍敷處理裝置 TWI895334B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-019042 2020-02-06
JP2020019042 2020-02-06

Publications (2)

Publication Number Publication Date
TW202140864A TW202140864A (zh) 2021-11-01
TWI895334B true TWI895334B (zh) 2025-09-01

Family

ID=77200636

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110102618A TWI895334B (zh) 2020-02-06 2021-01-25 鍍敷處理方法及鍍敷處理裝置

Country Status (5)

Country Link
US (1) US20230042744A1 (enExample)
JP (1) JP7325550B2 (enExample)
KR (1) KR20220139347A (enExample)
TW (1) TWI895334B (enExample)
WO (1) WO2021157504A1 (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
WO2012050057A1 (ja) * 2010-10-13 2012-04-19 東京エレクトロン株式会社 テンプレート及び基板の処理方法
TW201336030A (zh) * 2012-01-20 2013-09-01 東京威力科創股份有限公司 支持基板及基板之處理方法
TW201816195A (zh) * 2016-09-09 2018-05-01 日商東芝股份有限公司 電氣鍍覆裝置、電氣鍍覆方法及半導體裝置之製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270945A (en) * 1975-12-10 1977-06-13 Inoue Japax Res Plating method
JPS5792191A (en) * 1980-11-29 1982-06-08 Nec Corp Partial plating method
JP2004315889A (ja) * 2003-04-16 2004-11-11 Ebara Corp 半導体基板のめっき方法
JP2005133160A (ja) 2003-10-30 2005-05-26 Ebara Corp 基板処理装置及び方法
JP2007051362A (ja) * 2005-07-19 2007-03-01 Ebara Corp めっき装置及びめっき液の管理方法
US10472730B2 (en) * 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
CN102286760B (zh) * 2010-05-19 2016-10-05 诺发系统有限公司 用金属电化学填充高纵横比的大型凹入特征的方法、水溶液电镀槽溶液、电镀设备以及系统

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060234508A1 (en) * 2002-05-17 2006-10-19 Mitsuhiko Shirakashi Substrate processing apparatus and substrate processing method
WO2012050057A1 (ja) * 2010-10-13 2012-04-19 東京エレクトロン株式会社 テンプレート及び基板の処理方法
TW201336030A (zh) * 2012-01-20 2013-09-01 東京威力科創股份有限公司 支持基板及基板之處理方法
TW201816195A (zh) * 2016-09-09 2018-05-01 日商東芝股份有限公司 電氣鍍覆裝置、電氣鍍覆方法及半導體裝置之製造方法

Also Published As

Publication number Publication date
WO2021157504A1 (ja) 2021-08-12
JPWO2021157504A1 (enExample) 2021-08-12
KR20220139347A (ko) 2022-10-14
TW202140864A (zh) 2021-11-01
JP7325550B2 (ja) 2023-08-14
US20230042744A1 (en) 2023-02-09

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