JPWO2021157504A1 - - Google Patents

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Publication number
JPWO2021157504A1
JPWO2021157504A1 JP2021575771A JP2021575771A JPWO2021157504A1 JP WO2021157504 A1 JPWO2021157504 A1 JP WO2021157504A1 JP 2021575771 A JP2021575771 A JP 2021575771A JP 2021575771 A JP2021575771 A JP 2021575771A JP WO2021157504 A1 JPWO2021157504 A1 JP WO2021157504A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021575771A
Other languages
Japanese (ja)
Other versions
JP7325550B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021157504A1 publication Critical patent/JPWO2021157504A1/ja
Application granted granted Critical
Publication of JP7325550B2 publication Critical patent/JP7325550B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2021575771A 2020-02-06 2021-02-01 めっき処理方法およびめっき処理装置 Active JP7325550B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020019042 2020-02-06
JP2020019042 2020-02-06
PCT/JP2021/003455 WO2021157504A1 (ja) 2020-02-06 2021-02-01 めっき処理方法およびめっき処理装置

Publications (2)

Publication Number Publication Date
JPWO2021157504A1 true JPWO2021157504A1 (enExample) 2021-08-12
JP7325550B2 JP7325550B2 (ja) 2023-08-14

Family

ID=77200636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021575771A Active JP7325550B2 (ja) 2020-02-06 2021-02-01 めっき処理方法およびめっき処理装置

Country Status (5)

Country Link
US (1) US20230042744A1 (enExample)
JP (1) JP7325550B2 (enExample)
KR (1) KR20220139347A (enExample)
TW (1) TWI895334B (enExample)
WO (1) WO2021157504A1 (enExample)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270945A (en) * 1975-12-10 1977-06-13 Inoue Japax Res Plating method
JPS5792191A (en) * 1980-11-29 1982-06-08 Nec Corp Partial plating method
JP2004315889A (ja) * 2003-04-16 2004-11-11 Ebara Corp 半導体基板のめっき方法
WO2012050057A1 (ja) * 2010-10-13 2012-04-19 東京エレクトロン株式会社 テンプレート及び基板の処理方法
US20150159289A1 (en) * 2010-05-19 2015-06-11 Novellus Systems, Inc. Through silicon via filling using an electrolyte with a dual state inhibitor
US20150315720A1 (en) * 2009-10-12 2015-11-05 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100334691C (zh) * 2002-05-17 2007-08-29 株式会社荏原制作所 衬底加工设备和衬底加工方法
JP2005133160A (ja) 2003-10-30 2005-05-26 Ebara Corp 基板処理装置及び方法
JP2007051362A (ja) * 2005-07-19 2007-03-01 Ebara Corp めっき装置及びめっき液の管理方法
WO2013108452A1 (ja) * 2012-01-20 2013-07-25 東京エレクトロン株式会社 支持基板及び基板の処理方法
JP2018040048A (ja) * 2016-09-09 2018-03-15 株式会社東芝 電気めっき装置、電気めっき方法、及び半導体装置の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5270945A (en) * 1975-12-10 1977-06-13 Inoue Japax Res Plating method
JPS5792191A (en) * 1980-11-29 1982-06-08 Nec Corp Partial plating method
JP2004315889A (ja) * 2003-04-16 2004-11-11 Ebara Corp 半導体基板のめっき方法
US20150315720A1 (en) * 2009-10-12 2015-11-05 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US20150159289A1 (en) * 2010-05-19 2015-06-11 Novellus Systems, Inc. Through silicon via filling using an electrolyte with a dual state inhibitor
WO2012050057A1 (ja) * 2010-10-13 2012-04-19 東京エレクトロン株式会社 テンプレート及び基板の処理方法

Also Published As

Publication number Publication date
US20230042744A1 (en) 2023-02-09
TWI895334B (zh) 2025-09-01
KR20220139347A (ko) 2022-10-14
JP7325550B2 (ja) 2023-08-14
TW202140864A (zh) 2021-11-01
WO2021157504A1 (ja) 2021-08-12

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