KR20220094106A - 수지 시트 표면 처리 방법 및 수지 시트 표면 처리 장치 - Google Patents
수지 시트 표면 처리 방법 및 수지 시트 표면 처리 장치 Download PDFInfo
- Publication number
- KR20220094106A KR20220094106A KR1020210125637A KR20210125637A KR20220094106A KR 20220094106 A KR20220094106 A KR 20220094106A KR 1020210125637 A KR1020210125637 A KR 1020210125637A KR 20210125637 A KR20210125637 A KR 20210125637A KR 20220094106 A KR20220094106 A KR 20220094106A
- Authority
- KR
- South Korea
- Prior art keywords
- resin sheet
- surface treatment
- thin film
- electrode
- vacuum chamber
- Prior art date
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 163
- 239000011347 resin Substances 0.000 title claims abstract description 163
- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004381 surface treatment Methods 0.000 claims abstract description 81
- 239000010409 thin film Substances 0.000 claims abstract description 67
- 239000000853 adhesive Substances 0.000 claims abstract description 64
- 230000001070 adhesive effect Effects 0.000 claims abstract description 64
- 239000011261 inert gas Substances 0.000 claims abstract description 43
- 239000010408 film Substances 0.000 claims abstract description 30
- 239000010949 copper Substances 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 239000004642 Polyimide Substances 0.000 claims description 13
- 229920001721 polyimide Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- -1 polytetrafluoroethylene Polymers 0.000 claims description 10
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 9
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 9
- 125000005647 linker group Chemical group 0.000 claims description 7
- 125000000524 functional group Chemical group 0.000 abstract description 7
- 238000007788 roughening Methods 0.000 abstract description 6
- 230000000052 comparative effect Effects 0.000 description 19
- 238000010586 diagram Methods 0.000 description 8
- 230000003746 surface roughness Effects 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000007740 vapor deposition Methods 0.000 description 5
- 238000009713 electroplating Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- CIJJJPBJUGJMME-UHFFFAOYSA-N [Ta].[Ta] Chemical compound [Ta].[Ta] CIJJJPBJUGJMME-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009495 transient activation Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/021—Cleaning or etching treatments
- C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/12—Chemical modification
- C08J7/123—Treatment by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Electrochemistry (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2020-218834 | 2020-12-28 | ||
| JP2020218834A JP7377543B2 (ja) | 2020-12-28 | 2020-12-28 | 樹脂シート表面処理方法及び樹脂シート表面処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20220094106A true KR20220094106A (ko) | 2022-07-05 |
Family
ID=82135371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020210125637A KR20220094106A (ko) | 2020-12-28 | 2021-09-23 | 수지 시트 표면 처리 방법 및 수지 시트 표면 처리 장치 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7377543B2 (ja) |
| KR (1) | KR20220094106A (ja) |
| CN (1) | CN114686805A (ja) |
| TW (1) | TWI808539B (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071985A (ja) | 2001-09-05 | 2003-03-12 | Kakogawa Plastic Kk | 薄膜形成法 |
| JP2004031370A (ja) | 2002-06-07 | 2004-01-29 | Matsushita Electric Ind Co Ltd | フレキシブルプリント回路基板及びその製造方法 |
| JP2004162098A (ja) | 2002-11-11 | 2004-06-10 | Sumitomo Heavy Ind Ltd | 樹脂金属積層構造体およびその製造方法 |
| JP2005054259A (ja) | 2003-08-07 | 2005-03-03 | Matsushita Electric Ind Co Ltd | プラスチックフィルム及びその製造方法及びそれを応用したフレキシブルプリント回路基板 |
| JP2005199544A (ja) | 2004-01-15 | 2005-07-28 | Matsushita Electric Ind Co Ltd | プラスチックフィルム及びその製造方法及びその製造装置及びプラスチックフィルムを用いたフレキシブル回路基板 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62185877A (ja) * | 1986-02-12 | 1987-08-14 | Toray Ind Inc | 真空薄膜形成装置 |
| JP2664265B2 (ja) * | 1989-03-20 | 1997-10-15 | 株式会社日立製作所 | 金属／有機高分子合成樹脂複合体及びその製造方法 |
| JP3489299B2 (ja) * | 1995-04-21 | 2004-01-19 | 株式会社デンソー | 表面改質装置 |
| JP3331308B2 (ja) * | 1997-09-19 | 2002-10-07 | 日東電工株式会社 | 有機基材のプラズマ処理方法及び有機基材への金属層形成方法 |
| JP2000204179A (ja) * | 1999-01-12 | 2000-07-25 | Okura Ind Co Ltd | シ―ト状物の連続プラズマ表面処理方法及び装置 |
| JP2001123263A (ja) * | 1999-10-27 | 2001-05-08 | Sumitomo Chem Co Ltd | スパッタリング用基板およびその製造方法 |
| JP2003094560A (ja) * | 2001-09-25 | 2003-04-03 | Matsushita Electric Works Ltd | 樹脂基板の金属膜形成方法および金属膜形成樹脂基板 |
| JP4494824B2 (ja) * | 2004-02-24 | 2010-06-30 | 株式会社クラレ | 表示装置用フィルムの製造方法 |
| JP2008108590A (ja) * | 2006-10-26 | 2008-05-08 | Fuji Electric Holdings Co Ltd | 有機ｅｌ素子及びその製造方法 |
| JP5056114B2 (ja) * | 2007-03-29 | 2012-10-24 | 東レ株式会社 | シートの薄膜形成装置および薄膜付きシートの製造方法 |
| JP2010163654A (ja) * | 2009-01-15 | 2010-07-29 | Nitto Denko Corp | 銅蒸着基材およびその製造方法 |
| CN103392024A (zh) * | 2011-02-10 | 2013-11-13 | 吉坤日矿日石金属株式会社 | 双层覆铜层压材料及其制造方法 |
| US9355864B2 (en) * | 2013-08-06 | 2016-05-31 | Tel Nexx, Inc. | Method for increasing adhesion of copper to polymeric surfaces |
| JP2020117785A (ja) * | 2019-01-25 | 2020-08-06 | 株式会社島津製作所 | ポリアリーレンスルフィド樹脂成形品に対するめっき方法 |
-
2020
- 2020-12-28 JP JP2020218834A patent/JP7377543B2/ja active Active
-
2021
- 2021-09-18 CN CN202111098599.3A patent/CN114686805A/zh active Pending
- 2021-09-23 KR KR1020210125637A patent/KR20220094106A/ko not_active Application Discontinuation
- 2021-11-18 TW TW110142867A patent/TWI808539B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003071985A (ja) | 2001-09-05 | 2003-03-12 | Kakogawa Plastic Kk | 薄膜形成法 |
| JP2004031370A (ja) | 2002-06-07 | 2004-01-29 | Matsushita Electric Ind Co Ltd | フレキシブルプリント回路基板及びその製造方法 |
| JP2004162098A (ja) | 2002-11-11 | 2004-06-10 | Sumitomo Heavy Ind Ltd | 樹脂金属積層構造体およびその製造方法 |
| JP2005054259A (ja) | 2003-08-07 | 2005-03-03 | Matsushita Electric Ind Co Ltd | プラスチックフィルム及びその製造方法及びそれを応用したフレキシブルプリント回路基板 |
| JP2005199544A (ja) | 2004-01-15 | 2005-07-28 | Matsushita Electric Ind Co Ltd | プラスチックフィルム及びその製造方法及びその製造装置及びプラスチックフィルムを用いたフレキシブル回路基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7377543B2 (ja) | 2023-11-10 |
| TW202225291A (zh) | 2022-07-01 |
| TWI808539B (zh) | 2023-07-11 |
| JP2022103918A (ja) | 2022-07-08 |
| CN114686805A (zh) | 2022-07-01 |
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