KR20220051172A - 도전막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 디바이스의 제조 방법 - Google Patents

도전막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 디바이스의 제조 방법 Download PDF

Info

Publication number
KR20220051172A
KR20220051172A KR1020227004851A KR20227004851A KR20220051172A KR 20220051172 A KR20220051172 A KR 20220051172A KR 1020227004851 A KR1020227004851 A KR 1020227004851A KR 20227004851 A KR20227004851 A KR 20227004851A KR 20220051172 A KR20220051172 A KR 20220051172A
Authority
KR
South Korea
Prior art keywords
film
conductive film
substrate
reflective mask
upper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020227004851A
Other languages
English (en)
Korean (ko)
Inventor
마사노리 나카가와
다카시 우치다
Original Assignee
호야 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 호야 가부시키가이샤 filed Critical 호야 가부시키가이샤
Publication of KR20220051172A publication Critical patent/KR20220051172A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof
    • G03F1/24Reflection masks; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Physical Vapour Deposition (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020227004851A 2019-08-30 2020-07-13 도전막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 디바이스의 제조 방법 Pending KR20220051172A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019158348A JP7350571B2 (ja) 2019-08-30 2019-08-30 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法
JPJP-P-2019-158348 2019-08-30
PCT/JP2020/027298 WO2021039163A1 (ja) 2019-08-30 2020-07-13 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法

Publications (1)

Publication Number Publication Date
KR20220051172A true KR20220051172A (ko) 2022-04-26

Family

ID=74684482

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020227004851A Pending KR20220051172A (ko) 2019-08-30 2020-07-13 도전막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 디바이스의 제조 방법

Country Status (5)

Country Link
US (1) US12572065B2 (https=)
JP (2) JP7350571B2 (https=)
KR (1) KR20220051172A (https=)
TW (2) TWI855125B (https=)
WO (1) WO2021039163A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240148049A (ko) * 2023-04-03 2024-10-11 주식회사 에스앤에스텍 후면 도전막을 구비한 극자외선 리소그래피용 블랭크마스크 및 포토마스크

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020261986A1 (ja) * 2019-06-27 2020-12-30 Hoya株式会社 薄膜付基板、多層反射膜付基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法
JP7482197B2 (ja) * 2021-12-31 2024-05-13 エスケー エンパルス カンパニー リミテッド ブランクマスク及びそれを用いたフォトマスク
JPWO2024071026A1 (https=) * 2022-09-28 2024-04-04
KR20250060932A (ko) * 2023-03-17 2025-05-07 에이지씨 가부시키가이샤 Euv 리소그래피용 반사형 마스크 블랭크 및 도전막 구비 기판
JP2024142243A (ja) * 2023-03-29 2024-10-10 Hoya株式会社 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、および半導体装置の製造方法
JP2025095450A (ja) * 2023-12-14 2025-06-26 Hoya株式会社 導電膜付き基板、多層反射膜付き基板、反射型マスクブランク、反射型マスク、および半導体装置の製造方法
WO2025239181A1 (ja) * 2024-05-16 2025-11-20 Agc株式会社 反射型マスクブランク、反射型マスク、反射型マスクの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003501823A (ja) 1999-06-07 2003-01-14 ザ、リージェンツ、オブ、ザ、ユニバーシティ、オブ、カリフォルニア 反射マスク基板のコーティング
WO2008072706A1 (ja) 2006-12-15 2008-06-19 Asahi Glass Company, Limited Euvリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050238922A1 (en) 2003-12-25 2005-10-27 Hoya Corporation Substrate with a multilayer reflection film, reflection type mask blank for exposure, reflection type mask for exposure and methods of manufacturing them
JP4908119B2 (ja) * 2005-10-19 2012-04-04 株式会社リガク 蛍光x線分析装置
JP2010168603A (ja) * 2009-01-20 2010-08-05 Ntn Corp 耐摩耗性CrN膜
KR101857844B1 (ko) * 2011-02-04 2018-05-14 아사히 가라스 가부시키가이샤 도전막이 형성된 기판, 다층 반사막이 형성된 기판, 및 euv 리소그래피용 반사형 마스크 블랭크
KR101877896B1 (ko) * 2013-09-27 2018-07-12 호야 가부시키가이샤 도전막 부착 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 장치의 제조방법
US9618836B2 (en) 2014-04-22 2017-04-11 Asahi Glass Company, Limited Reflective mask blank for EUV lithography, substrate with funtion film for the mask blank, and methods for their production
US9897910B2 (en) 2014-12-24 2018-02-20 Taiwan Semiconductor Manufacturing Company, Ltd. Treating a capping layer of a mask
SG11201710317RA (en) 2015-06-17 2018-01-30 Hoya Corp Substrate with electrically conductive film, substrate with multilayer reflective film, reflective mask blank, reflective mask, and method of manufacturing semiconductor device
JP6863169B2 (ja) * 2017-08-15 2021-04-21 Agc株式会社 反射型マスクブランク、および反射型マスク
US11435660B2 (en) 2017-11-22 2022-09-06 Taiwan Semiconductor Manufacturing Co., Ltd. Photomask and method of fabricating a photomask

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003501823A (ja) 1999-06-07 2003-01-14 ザ、リージェンツ、オブ、ザ、ユニバーシティ、オブ、カリフォルニア 反射マスク基板のコーティング
WO2008072706A1 (ja) 2006-12-15 2008-06-19 Asahi Glass Company, Limited Euvリソグラフィ用反射型マスクブランク、および該マスクブランク用の機能膜付基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240148049A (ko) * 2023-04-03 2024-10-11 주식회사 에스앤에스텍 후면 도전막을 구비한 극자외선 리소그래피용 블랭크마스크 및 포토마스크

Also Published As

Publication number Publication date
JP2021039144A (ja) 2021-03-11
JP2023171382A (ja) 2023-12-01
JP7569428B2 (ja) 2024-10-17
TW202449496A (zh) 2024-12-16
TWI855125B (zh) 2024-09-11
US20220283490A1 (en) 2022-09-08
US12572065B2 (en) 2026-03-10
JP7350571B2 (ja) 2023-09-26
WO2021039163A1 (ja) 2021-03-04
TW202122907A (zh) 2021-06-16

Similar Documents

Publication Publication Date Title
KR102698817B1 (ko) 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 그리고 반도체 장치의 제조 방법
JP7401356B2 (ja) 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法
JP7569428B2 (ja) 導電膜付基板、反射型マスクブランク及び反射型マスク、並びに半導体デバイスの製造方法
JP7268211B2 (ja) 反射型マスクブランク、反射型マスク及びその製造方法、並びに半導体装置の製造方法
KR20190102192A (ko) 도전막 부착 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법
WO2022138434A1 (ja) 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法
JP7746160B2 (ja) 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体装置の製造方法
KR20210134605A (ko) 반사형 마스크 블랭크, 반사형 마스크 및 그 제조 방법, 그리고 반도체 장치의 제조 방법
KR102830574B1 (ko) 도전막 부착 기판, 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법
CN112666788A (zh) 带多层反射膜的基板、反射型掩模坯料、反射型掩模及制造方法、及半导体装置制造方法
KR102653352B1 (ko) 다층 반사막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 장치의 제조 방법
KR20230119120A (ko) 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법
KR20220054280A (ko) 다층 반사막 부착 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 장치의 제조 방법
TW202332985A (zh) 附多層反射膜之基板、反射型遮罩基底、反射型遮罩、及半導體裝置之製造方法
KR20220139879A (ko) 반사형 마스크 블랭크, 반사형 마스크 및 반도체 장치의 제조 방법
JP6855645B1 (ja) 薄膜付基板、多層反射膜付基板、反射型マスクブランク、反射型マスク及び半導体装置の製造方法
JP7271760B2 (ja) 多層反射膜付き基板、反射型マスクブランク、反射型マスク、及び半導体デバイスの製造方法
JP2020160354A (ja) 多層反射膜付き基板、反射型マスクブランク及び反射型マスク、並びに半導体装置の製造方法
KR20230148328A (ko) 다층 반사막 부착 기판, 반사형 마스크 블랭크, 반사형마스크, 및 반도체 장치의 제조 방법
CN111752085A (zh) 带多层反射膜的基板、反射型掩模坯料及反射型掩模、以及半导体装置的制造方法
KR20260051337A (ko) 다층 반사막을 갖는 기판, 반사형 마스크 블랭크 및 반사형 마스크, 그리고 반도체 장치의 제조 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11 Administrative time limit extension requested

Free format text: ST27 STATUS EVENT CODE: U-3-3-T10-T11-OTH-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13 Application amended

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P13-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000