KR20220013497A - SnZn땜납 및 그 제조방법 - Google Patents

SnZn땜납 및 그 제조방법 Download PDF

Info

Publication number
KR20220013497A
KR20220013497A KR1020217043256A KR20217043256A KR20220013497A KR 20220013497 A KR20220013497 A KR 20220013497A KR 1020217043256 A KR1020217043256 A KR 1020217043256A KR 20217043256 A KR20217043256 A KR 20217043256A KR 20220013497 A KR20220013497 A KR 20220013497A
Authority
KR
South Korea
Prior art keywords
solder
snzn
alloy
snzn solder
base material
Prior art date
Application number
KR1020217043256A
Other languages
English (en)
Korean (ko)
Inventor
모리히로 오카다
가쓰야 아라이
미에코 스가와라
겐이치 고바야시
히데토시 고미야
쇼고 마쓰이
준 니시고리
나오히사 모리
Original Assignee
아토비무 유겐가이샤
모리히로 오카다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아토비무 유겐가이샤, 모리히로 오카다 filed Critical 아토비무 유겐가이샤
Publication of KR20220013497A publication Critical patent/KR20220013497A/ko

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/0008Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016Brazing of electronic components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C1/00Making non-ferrous alloys
    • C22C1/02Making non-ferrous alloys by melting
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C13/00Alloys based on tin
    • C22C13/02Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Photovoltaic Devices (AREA)
KR1020217043256A 2019-07-12 2020-07-04 SnZn땜납 및 그 제조방법 KR20220013497A (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2019129866 2019-07-12
JPJP-P-2019-129866 2019-07-12
JPJP-P-2020-103656 2020-06-16
JP2020103656 2020-06-16
PCT/JP2020/026311 WO2021010199A1 (ja) 2019-07-12 2020-07-04 SnZn半田およびその製造方法

Publications (1)

Publication Number Publication Date
KR20220013497A true KR20220013497A (ko) 2022-02-04

Family

ID=74210496

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217043256A KR20220013497A (ko) 2019-07-12 2020-07-04 SnZn땜납 및 그 제조방법

Country Status (5)

Country Link
JP (1) JP2023130461A (zh)
KR (1) KR20220013497A (zh)
CN (1) CN114206542A (zh)
TW (2) TWI817020B (zh)
WO (1) WO2021010199A1 (zh)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69632866T2 (de) * 1995-09-29 2005-07-14 Matsushita Electric Industrial Co., Ltd., Kadoma Bleifreies lot
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
JP2002361476A (ja) * 2001-06-08 2002-12-18 Showa Denko Kk ハンダ金属、ハンダペースト、ハンダ付け方法、ハンダ付けした回路板、及びハンダ付けした接合物
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
WO2003061896A1 (fr) * 2002-01-21 2003-07-31 Fujitsu Limited Alliage de brasage et joint brase
JP4337326B2 (ja) * 2002-10-31 2009-09-30 千住金属工業株式会社 鉛フリーはんだおよびはんだ付け物品
CN100494436C (zh) * 2005-08-02 2009-06-03 马莒生 一种低熔点无铅焊料合金
CN100462183C (zh) * 2006-04-30 2009-02-18 东莞市中实焊锡有限公司 无铅抗氧化含稀土SnZn合金焊料及其制备方法
CN101092006A (zh) * 2006-06-21 2007-12-26 北京有色金属研究总院 一种微合金化锡锌共晶合金无铅焊料
CN101780607B (zh) * 2010-03-17 2012-05-09 华南理工大学 一种用于电子封装组装钎焊的无铅钎料及其制备方法

Also Published As

Publication number Publication date
TWI817020B (zh) 2023-10-01
TW202108778A (zh) 2021-03-01
JP2023130461A (ja) 2023-09-20
CN114206542A (zh) 2022-03-18
JPWO2021010199A1 (zh) 2021-01-21
WO2021010199A1 (ja) 2021-01-21
TW202206614A (zh) 2022-02-16

Similar Documents

Publication Publication Date Title
JP4667455B2 (ja) 導電性フィラー、及びはんだ材料
EP2617515B1 (en) Semiconductor device bonding material
JPWO2008001740A1 (ja) 導電性フィラー
WO2013132942A1 (ja) 接合方法、接合構造体およびその製造方法
TWI270428B (en) Solder for use on surfaces coated with nickel by electroless plating
TWI222197B (en) Manufacturing method of semiconductor device and electronic apparatus, and calculating method of connection condition
EP1894667A1 (en) METHOD FOR SOLDERING ELECTROLESS Ni PLATING PART
EP3590652B1 (en) Solder alloy, solder junction material, and electronic circuit substrate
JPWO2003020468A1 (ja) 無鉛半田合金およびそれを用いた電子部品
EP3707285B1 (en) Low-silver tin based alternative solder alloy to standard sac alloys for high reliability applications
TWI782572B (zh) SnZn銲料及其製造方法
JP2008080392A (ja) 接合体および接合方法
KR20220013497A (ko) SnZn땜납 및 그 제조방법
JP6688417B2 (ja) はんだ接合方法
JP2004154864A (ja) 鉛フリーはんだ合金
KR20230075504A (ko) 저온땜납, 저온땜납의 제조방법 및 저온땜납 피복 리드선
JP7572008B2 (ja) SnZn半田およびその製造方法
JP6936351B2 (ja) 成形はんだの製造方法
JP2016018915A (ja) 半導体装置及びその製造方法
JP4175858B2 (ja) はんだ被覆ボールの製造方法
JP2004167569A (ja) 無鉛はんだペースト組成物およびはんだ付け方法
JP5652689B2 (ja) 電子部品接合構造体の製造方法及び該製造方法により得られた電子部品接合構造体
US6390355B1 (en) Method for forming a metallic contact on an electronic printed circuit board and a product therefrom
JP5884513B2 (ja) Pbフリーはんだ
JP2000052027A (ja) 耐高温用金属接合法

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E601 Decision to refuse application