KR20220013497A - SnZn땜납 및 그 제조방법 - Google Patents
SnZn땜납 및 그 제조방법 Download PDFInfo
- Publication number
- KR20220013497A KR20220013497A KR1020217043256A KR20217043256A KR20220013497A KR 20220013497 A KR20220013497 A KR 20220013497A KR 1020217043256 A KR1020217043256 A KR 1020217043256A KR 20217043256 A KR20217043256 A KR 20217043256A KR 20220013497 A KR20220013497 A KR 20220013497A
- Authority
- KR
- South Korea
- Prior art keywords
- solder
- snzn
- alloy
- snzn solder
- base material
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 119
- 229910005728 SnZn Inorganic materials 0.000 title claims abstract description 68
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 159
- 238000002844 melting Methods 0.000 claims abstract description 38
- 230000008018 melting Effects 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 34
- 239000000956 alloy Substances 0.000 claims abstract description 34
- 229910052718 tin Inorganic materials 0.000 claims abstract description 17
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 14
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 10
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 8
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 8
- 229910052738 indium Inorganic materials 0.000 claims abstract description 6
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 22
- 238000005275 alloying Methods 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000000843 powder Substances 0.000 claims description 13
- 235000019270 ammonium chloride Nutrition 0.000 claims description 12
- VHUUQVKOLVNVRT-UHFFFAOYSA-O azanium;hydron;hydroxide Chemical compound [NH4+].O VHUUQVKOLVNVRT-UHFFFAOYSA-O 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 5
- 239000004973 liquid crystal related substance Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 abstract description 18
- 238000005476 soldering Methods 0.000 description 58
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 22
- 229910052782 aluminium Inorganic materials 0.000 description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 18
- 239000010949 copper Substances 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 15
- 239000010703 silicon Substances 0.000 description 15
- 229910052742 iron Inorganic materials 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 229920006395 saturated elastomer Polymers 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000010944 silver (metal) Substances 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 238000002604 ultrasonography Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- TWJVNKMWXNTSAP-UHFFFAOYSA-N azanium;hydroxide;hydrochloride Chemical compound [NH4+].O.[Cl-] TWJVNKMWXNTSAP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011812 mixed powder Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019129866 | 2019-07-12 | ||
JPJP-P-2019-129866 | 2019-07-12 | ||
JPJP-P-2020-103656 | 2020-06-16 | ||
JP2020103656 | 2020-06-16 | ||
PCT/JP2020/026311 WO2021010199A1 (ja) | 2019-07-12 | 2020-07-04 | SnZn半田およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20220013497A true KR20220013497A (ko) | 2022-02-04 |
Family
ID=74210496
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020217043256A KR20220013497A (ko) | 2019-07-12 | 2020-07-04 | SnZn땜납 및 그 제조방법 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP2023130461A (zh) |
KR (1) | KR20220013497A (zh) |
CN (1) | CN114206542A (zh) |
TW (2) | TWI817020B (zh) |
WO (1) | WO2021010199A1 (zh) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69632866T2 (de) * | 1995-09-29 | 2005-07-14 | Matsushita Electric Industrial Co., Ltd., Kadoma | Bleifreies lot |
JPH09155587A (ja) * | 1995-11-30 | 1997-06-17 | Mitsui Mining & Smelting Co Ltd | 錫−亜鉛系無鉛半田合金 |
JP3306007B2 (ja) * | 1998-06-30 | 2002-07-24 | 株式会社東芝 | ハンダ材 |
JP2002361476A (ja) * | 2001-06-08 | 2002-12-18 | Showa Denko Kk | ハンダ金属、ハンダペースト、ハンダ付け方法、ハンダ付けした回路板、及びハンダ付けした接合物 |
JP2003010996A (ja) * | 2001-06-27 | 2003-01-15 | Nippon Filler Metals Co Ltd | 鉛フリーソルダペースト |
WO2003061896A1 (fr) * | 2002-01-21 | 2003-07-31 | Fujitsu Limited | Alliage de brasage et joint brase |
JP4337326B2 (ja) * | 2002-10-31 | 2009-09-30 | 千住金属工業株式会社 | 鉛フリーはんだおよびはんだ付け物品 |
CN100494436C (zh) * | 2005-08-02 | 2009-06-03 | 马莒生 | 一种低熔点无铅焊料合金 |
CN100462183C (zh) * | 2006-04-30 | 2009-02-18 | 东莞市中实焊锡有限公司 | 无铅抗氧化含稀土SnZn合金焊料及其制备方法 |
CN101092006A (zh) * | 2006-06-21 | 2007-12-26 | 北京有色金属研究总院 | 一种微合金化锡锌共晶合金无铅焊料 |
CN101780607B (zh) * | 2010-03-17 | 2012-05-09 | 华南理工大学 | 一种用于电子封装组装钎焊的无铅钎料及其制备方法 |
-
2020
- 2020-06-29 TW TW109121888A patent/TWI817020B/zh active
- 2020-06-29 TW TW110138146A patent/TW202206614A/zh unknown
- 2020-07-04 CN CN202080047251.9A patent/CN114206542A/zh active Pending
- 2020-07-04 WO PCT/JP2020/026311 patent/WO2021010199A1/ja active Application Filing
- 2020-07-04 KR KR1020217043256A patent/KR20220013497A/ko not_active Application Discontinuation
-
2023
- 2023-07-11 JP JP2023113387A patent/JP2023130461A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
TWI817020B (zh) | 2023-10-01 |
TW202108778A (zh) | 2021-03-01 |
JP2023130461A (ja) | 2023-09-20 |
CN114206542A (zh) | 2022-03-18 |
JPWO2021010199A1 (zh) | 2021-01-21 |
WO2021010199A1 (ja) | 2021-01-21 |
TW202206614A (zh) | 2022-02-16 |
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