WO2021010199A1 - SnZn半田およびその製造方法 - Google Patents
SnZn半田およびその製造方法 Download PDFInfo
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- WO2021010199A1 WO2021010199A1 PCT/JP2020/026311 JP2020026311W WO2021010199A1 WO 2021010199 A1 WO2021010199 A1 WO 2021010199A1 JP 2020026311 W JP2020026311 W JP 2020026311W WO 2021010199 A1 WO2021010199 A1 WO 2021010199A1
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- solder
- snzn
- alloy
- snzn solder
- base material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
Definitions
- the present invention relates to SnZn solder used for a solar cell substrate, a liquid crystal substrate, etc., and a method for manufacturing the same.
- lead wires are often soldered to electrodes of solar cell substrates, liquid crystal substrates, etc. because tin-lead solder has strong strength and is inexpensive.
- the conventional lead-free solder Compared with tin-lead solder, the conventional lead-free solder had problems that the strength was slightly insufficient for the required strength and that the price was high and it could not be replaced.
- the present inventors have mixed a small amount of 1 to 1.5 wt% or less in total of main materials such as P, In, Bi, and Sb with respect to SnZ solder composed of an alloy of Sn and Zn, which is a kind of lead-free solder.
- SnZold solder that has been melted / alloyed and melted / alloyed by mixing a small amount of auxiliary materials such as Al, Si, Ag, Cu, and Ni as necessary is extremely strong and repeats high and low temperatures on electrodes such as solar cell substrates. It was found that the solder is strong in the test, and the melting temperature of the SnZn solder is almost the same or lowered even if it is mixed.
- the present inventions add a total of 1 main material containing one or more of P, In, Bi, and Sb to the base material which is an alloy of Sn and Zn. It is made to melt and alloy by mixing 1.5 wt% or less.
- the melting temperature of the SnZn solder after melting and alloying is set to be the same as or lower than the melting temperature of the base metal.
- the main material is alloyed in the skeleton of the Sn and Zn alloy.
- an auxiliary material containing glass containing one or more or one or more of Al, Si, Cu, Ag, and Ni is melted and alloyed by mixing 5 wt% or less into the base material, if necessary. I am trying to do it.
- the alloy of the main material and auxiliary material is mixed with the base material and melted and alloyed.
- the alloy of the main material and the auxiliary material is an alloy of Cu and P.
- the base material, main material, and auxiliary material are mixed together or divided into multiple parts to melt and alloy them.
- the prepared SnZn solder is mixed with ammonium chloride / hydrate powder or powder containing ammonium chloride / hydrate from 3 wt% or less to 0.05 wt% or more, and is decomposed during soldering heating to be soldered. We are trying to improve the degree of soldering adhesion to objects.
- a total amount of 1 to 1.5 wt% or less of a main material containing at least one of P, In, Bi, Sb, etc. is added to the base material which is an alloy of Sn and Zn.
- a small amount of an auxiliary material containing glass containing one or more or one or more of Al, Si, Cu, Ag, Ni, etc. is mixed and melted / alloyed to form a solar cell substrate or the like. It is a solder that is extremely strong and resistant to repeated high-temperature and low-temperature tests on the electrodes of No. 1, and even if it is mixed, the melting temperature of SnZn solder is almost the same or lowered, and it has become possible to manufacture it at a lower cost.
- the melting temperature of the SnZn solder after melting and alloying was the same as or lower than the melting temperature of the base metal, and it was possible to eliminate the increase in the melting temperature due to mixing.
- the main material was alloyed in the skeleton of the alloy of Sn and Zn, and the harmful effect of precipitation could be eliminated.
- the main material could be stabilized and the solder could be made resistant to repeated high and low temperature tests.
- the prepared SnZn solder is mixed with ammonium chloride / hydrate powder or powder containing ammonium chloride / hydrate from 3 wt% or less to 0.05 wt% or more, and is decomposed during soldering heating to be soldered. It is possible to improve the degree of soldering adhesion to an object.
- FIG. 1 shows an explanatory diagram of solder production of the present invention.
- FIG. 1 (a) shows a flowchart
- FIG. 1 (b) shows a material example.
- S1 prepares a base material, a main material, and an auxiliary material. For this, the following materials shown in the material example of FIG. 1 (b) are prepared.
- the base material is a basic material (base material) of the SnZn alloy forming the SnZn solder of the present invention, and here, Sn is 91 wt%. 9 wt% of Zn was used in the trial production.
- the weight ratio of Sn and Zn may be arbitrary within the range in which an alloy can be produced, for example, Zn may be 1 to 15 wt% and the rest may be Sn (which ratio should be selected by experimenting with the melting temperature as a guide. Good).
- the main material is the removal of the oxide film on the surface to be soldered and the adhesion when soldering. It is a material that affects soldering such as wettability, fluidity, and viscosity, and in the present invention, the total amount of the main material is 1 to 1.5 wt% or less.
- P removal of oxide film to be soldered, adhesion
- In wetting property, fluidity
- Bi adhesion
- Sb asdhesion
- the melting temperature of SnZn solder after mixing the main material with the base material and melting / alloying is equal to the melting temperature of the base material in combination with a trace amount of 1 to 1.5 wt% or less. Alternatively, it was slightly lower (for example, about 1 to 5 ° C lower). It is presumed that this is because the total amount of the main material is a small amount of 1 to 1.5 wt% or less with respect to the base material, so that it enters the skeleton of the base material and is re-skeletonized.
- the auxiliary material is a material further added to the base material and the main material, and has electrical characteristics (such as a solar cell substrate, a semiconductor substrate such as a liquid crystal substrate, a fired aluminum film, and a copper electrode). It is a material for improving contact potential difference, contact resistance, IV characteristics in the case of solar cells, adhesion, etc.
- Al for fired aluminum film
- Si for silicon substrate
- Materials such as Cu (for copper electrodes), Ag (for all), Ni (for when a small amount of Ni is plated on a silicon substrate).
- As an auxiliary material not only metal but also glass containing metal may be added by mixing, melting, and alloying (gas components such as oxygen in the glass are released to the outside during melting and alloying, etc.). To do).
- S2 mixes the main material and the auxiliary material with the base material.
- the main material and the auxiliary material are mixed with the base material prepared in S1.
- the base material, main material, and auxiliary material are melted and alloyed. This is done by mixing the main material and the auxiliary material with the base material in S2, heating and melting, and stirring well to alloy. At this time, if the main material and the auxiliary material are oxidized by oxygen in the air and alloying is difficult, an inert gas (for example, nitrogen gas) may be blown into the crucible as necessary, or even worse. A melting furnace or vacuum melting furnace filled with active gas is used.
- an inert gas for example, nitrogen gas
- the SnZn solder (ABS-S) according to the present invention can be produced by preparing the base material, the main material, and the auxiliary material, mixing them, and melting and alloying them. This will be described in detail below.
- FIG. 2 shows an explanatory diagram of the material manufacturing apparatus of the present invention.
- the solder material 1 is the base material, the main material, and the auxiliary material prepared in S1 of FIG. 1 described above, and here, it is a fragment (coarsely crushed) of metal, glass, or the like.
- the solder material input plate 2 is for placing the solder material 1 and charging it into the melting furnace 3.
- the melting furnace 3 is for heating with a heater 4 or the like, putting the solder material 1 inside, melting the base material, the main material, and the auxiliary material, and stirring and alloying.
- the melting furnace 3 usually melts the base material, the main material, and the auxiliary material that have been put into the inside in the atmosphere, and stirs them to alloy them.
- an inert gas nitrogen gas, etc.
- an inert gas is blown in as necessary to reduce oxidation due to oxygen in the air, and if necessary, the inert gas is filled (or vacuum exhausted) by sealing. ..
- the base material, main material, and auxiliary material prepared in S1 of FIG. 1 can be mixed, melted in the melting furnace 3, stirred and alloyed to produce the SnZn solder of the present invention. Become.
- FIG. 3 shows a soldering explanatory view of the lead connection of the present invention.
- FIG. 3A shows a flowchart
- FIG. 3B shows an example of substrate / lead connection.
- S11 ultrasonically solders the solder (ABS-S) to the substrate pattern.
- the SnZn solder of the present invention (SnZn solder manufactured in S4 of FIG. 1) is supplied to the iron tip of the ultrasonic soldering iron to the portion (pattern) to be soldered to the electrode of the solar cell substrate. And melted, and ultrasonic waves are applied to solder the pattern portion on the substrate (referred to as ultrasonic pre-soldering) in advance.
- lead connections and the like are ultrasonically soldered or ultrasonically non-soldered. This is done in S11, for example, with or without applying ultrasonic waves to the portion (pattern) of the solar cell substrate pre-soldered with ultrasonic waves along the lead connection.
- the SnZn solder of the present invention is melted and the lead connection is soldered. When SnZn solder is pre-soldered in the lead connection in advance, it is not necessary to supply the solder.
- the SnZn solder of the present invention is pre-soldered using ultrasonic waves (S11), and the pre-soldering is performed.
- S11 ultrasonic waves
- S12 ultrasonic soldering
- the electrode portion of the conventional non-soldering solar cell substrate For example, pre-soldering with ultrasonic waves can be performed, and lead connections can be soldered with ultrasonic waves or without soldering.
- ultrasonic soldering is performed at 10 W or less, usually 2 to 3 W. If it is strong, it will damage the film (for example, nitride film) formed on the solar cell substrate and the crystals on the surface of the substrate, so it should not be strengthened.
- FIG. 3 shows an example of substrate / lead connection.
- the substrate is an Al, Si substrate, a glass substrate, or the like, which is an example of a substrate that is extremely difficult to solder by normal soldering.
- the SnZn solder of the present invention is ultrasonically pre-soldered to the electrodes (patterns) of these substrates. Then, the lead connection can be soldered to the substrate by soldering the lead connection to the pre-soldered portion (pattern) with ultrasonic waves or without ultrasonic soldering.
- the lead connection is a lead formation in which the SnZn solder of the present invention is soldered to the electrode portion (pattern) on the substrate, and the wire (the SnZn solder of the present invention is solder-plated on a circular copper wire).
- the wire is easy to solder if it is crushed into an elliptical shape), a ribbon (a thin copper plate cut to a width of about 1 mm, and the SnZn solder of the present invention is solder-plated in advance).
- FIG. 4 shows an explanatory diagram of soldering of the present invention.
- FIG. 4 shows an example of preliminary soldering
- (b) of FIG. 4 shows an example of soldering a ribbon or a wire.
- the silicon substrate 11 is an example of a solar cell substrate in which an aluminum sintered film 12 is formed on, for example, the entire back surface of the silicon substrate 11.
- the aluminum sintered film 12 is an electrode (aluminum sintered film) formed by applying aluminum paste (or screen printing to a predetermined pattern) on the entire back surface of the illustrated silicon substrate 11 which is a solar cell substrate and sintering the film. is there.
- the ultrasonic soldering iron tip 13 is a soldering iron tip that is heated while applying ultrasonic waves from an ultrasonic generator (not shown).
- the solder (ABS-S) 14 is the SnZn solder of the present invention (SnZn solder manufactured in S4 of FIG. 1).
- the silicon substrate 11 is transported onto a preheating table, vacuum-adsorbed and fixed, and preheated (for example, preheated to about 180 ° C.).
- solder 14 While the solder 14 is automatically supplied to the tip 13 of the ultrasonic soldering iron shown in the figure from the start point to the end point of the electrode pattern (strip-shaped pattern) formed on the aluminum sintered film 12, the solder 14 is melted. An ultrasonic wave is applied to move the aluminum sintered film 12 close to the aluminum sintered film 12 so as not to rub it at a constant speed to form a strip-shaped preliminary solder pattern on the aluminum sintered film 12.
- the SnZn solder 14 of the present invention can be soldered on the aluminum sintered film 12 with a preliminary solder pattern of a predetermined pattern.
- (B) of FIG. 4 shows an example of soldering a ribbon or a wire.
- the ultrasonic soldering iron tip 13-1 is a soldering iron tip that is heated with or without applying ultrasonic waves from an ultrasonic generator (not shown).
- the soldered ribbon or wire 15 is a ribbon or wire obtained by pre-soldering the SnZn solder of the present invention in advance. It should be noted that the wire 15 has better solderability when it is slightly deformed into an elliptical shape.
- the silicon substrate 11 is preheated in the same manner as in (a) of FIG.
- soldered ribbon or wire 15 arranged along the preliminary solder pattern portion formed on the aluminum sintered film 12 on the silicon substrate 11 (back surface) of the soldered ribbon or wire 14, the soldered ribbon or wire 15 is superposed from above. With or without sound, while lightly pressing with the tip 13-1 of the soldering iron, move it to the right in the figure at a constant speed to melt the solder of the soldered ribbon or wire 15 and solder it to the preliminary solder pattern portion.
- the ribbon or wire 15 in which the SnZn solder 14 of the present invention is pre-soldered can be soldered to the portion of the pre-solder pattern on the aluminum sintered film 12.
- the quality of the soldering with ultrasonic waves and the soldering without ultrasonic waves of the present invention is determined by soldering the ribbon or wire to the part to be soldered with ultrasonic waves or soldering without ultrasonic waves, and then the ribbon or wire. It is pulled with a force slightly weaker than the force to crack the substrate, etc., and it is judged to be good when it does not peel off from the substrate, etc., and bad when it peels off.
- FIG. 5 shows a composition example (ABS-S) of the solder of the present invention.
- the base material, the main material, and the auxiliary material are the distinctions between the base material, the main material, and the auxiliary material described in FIG.
- the composition example is a composition example of the base material, the main material, and the auxiliary material.
- the wt% example is an example of wt% of the composition of the base material, the main material, and the auxiliary material.
- the wt% range is an example of the wt% range of the composition of the base material, the main material, and the auxiliary material.
- composition, wt% example, and wt% range are as shown in FIG.
- Sn91 wt% and Zn9 wt% shown in the figure were used as the base material in the trial production.
- the composition range may be stable as long as the SnZn alloy can be produced, for example, Zn1 to 15 wt% and the rest may be Sn.
- the melting temperature of the produced SnZn base material may be measured and tested. You just have to decide.
- P is P (red phosphorus) and CuP8 alloy (P is 8 wt%, the residue is Cu alloy, P wt% is 8% of CuP8. (Copper phosphide) and When P (red phosphorus) is added in an amount of about 0.1 wt% (P saturated state) and when P in CuP8 is added as a main material, a large amount of about 0.16 wt% (P saturated state) is added. I needed it.
- the total amount of the main material be 1 to 1.5 wt% or less.
- the SnZn solder of the present invention in which the total amount of the main material of 1 to 1.5 wt% or less is mixed, melted, and alloyed with the base material (Sn91 wt%, Zn9 wt%) is compared with the melting temperature of the base material (for example, around 195 ° C.). However, the same or 1 to 5 ° C. lower melting temperature was measured. It is presumed that this is because the total amount of the main material of 1 to 1.5 wt% or less is taken into the skeleton of the base material (SnZn alloy) to reconstruct the skeleton, and as a result, the melting temperature is equal to or lowered. .. It is also inferred from the observation that a mesh-like skeleton appears during mixing, melting, and alloying in the crucible, and when this is stirred to dissolve and melt the whole, a uniform alloy is formed.
- the auxiliary material, the solar cell substrate, the liquid crystal substrate, etc. are made of silicon, and since an aluminum sintered film is present on the silicon, Si, Al, Cu (copper wire, copper pattern, etc.), Ag (sintered electrode) , Ni (nickel plating on the surface of silicon), etc. are added in consideration of electrical characteristics (contact potential difference, contact resistance, IV characteristics in the case of solar cells, etc.) and further bonding strength. Etc. are to be improved.
- FIG. 6 shows an example of a solder prototype of the present invention.
- the illustration shows an example of a large number of prototypes that can be used for soldering in FIG. 4 described above. Those that cannot be used are omitted.
- Sn91 wt% and Zn9 wt% were used as the base material of the SnZn solder of the present invention (SnZn solder produced in S4 of FIG. 1).
- metal materials were used for In, Bi, and P (red phosphorus).
- CuP8 copper phosphate having a P content of 8 wt% and a residue of Cu was used. As described above, when CuP8 was used, it was not saturated unless the amount of P added was equivalent to 0.16 wt% (P (red phosphorus) was saturated at 0.1 wt%). ..
- the sample number is the number of the prototype sample.
- FIG. 7 shows an explanatory diagram of the TC test of the solder of the present invention.
- the sample No. “A-14” of FIG. 6 described above was used for the TC test.
- FIG. 7A schematically shows a TC test example of ABS-S solder (A-14). At this time, the TC test has exceeded 1000 hours (and is ongoing).
- FIG. 7 shows an example of a sample photograph.
- the copper wire was soldered (ultrasonic soldering or scratching and soldering) to the aluminum plate, the silicon surface, and the aluminum surface using A-14.
- FIG. 7 (c) shows an example of the temperature condition of the TC test.
- ⁇ Maximum temperature is 87.5 °C
- Minimum temperature is -24
- Maximum humidity is 98.3%
- Minimum humidity is 1.6%
- the TC test was carried out under the conditions of.
- FIG. 7D shows an example of the test environment and results.
- the test period is from May 1st to June 12th, 2019 (1000 hours).
- test pass result was obtained for sample No. "A-14".
- FIG. 8 shows a TC test example of the solder (A-14) of the present invention.
- the horizontal axis represents the elapsed time (h).
- the vertical axis represents temperature (° C.) / humidity (%), the upper graph in the graph shows humidity, and the lower graph shows temperature.
- the temperature graph at the bottom of the graph is The high temperature (maximum temperature) is 87.6 ° C. as shown in FIG. 7 (c).
- the low temperature (minimum temperature) is ⁇ 24.4 ° C. described in FIG. 7 (c). It shows the record up to the lapse of 1000 hours.
- the humidity graph at the top of the graph is -Maximum humidity is 98.3% shown in (c) of FIG.
- -Minimum humidity is 1.6% as shown in (c) of FIG. It shows the record up to the lapse of 1000 hours.
- FIG. 9 shows an example of ultrasonic (rubbing) / paste of the present invention.
- “paste / ultrasonic (rubbing)” refers to "soldering with ultrasonic waves” and “without ultrasonic waves” when soldering to an object to be soldered using the SnZn solder of the present invention.
- the object to be soldered is a material to be soldered using the SnZn solder of the present invention, which is Si (wafer, about 0.2 mm thick), an Al sintered film sintered on the wafer, and Cu (0. 1 mm thick plate), Al (0.1 mm thick plate), and stainless steel (0.1 mm thick plate) are distinguished.
- ⁇ ⁇ indicates a weak adhesion of the SnZn solder of the present invention to the soldering target (a state in which the tin-plated wire of 0.4 mm ⁇ is immediately peeled off when soldered and pulled).
- ⁇ X represents poor adhesion of the SnZn solder of the present invention to the soldering target.
- a hole (about 1-3 mm) is made in the center of the thick rod-shaped solder, or a notch is made, and the inside of this hole or the inside of the notch, etc.
- a predetermined amount of powder for example, powder of ammonium chloride, hydrate, resin, etc.
- a rolling roller grooved
- Process roll into thread-like solder. The powder put (mixed) can be observed near the center of the cross section of the filamentous solder.
- the tip of the iron is applied to a soldering target (for example, a Cu plate or the like, if necessary, placed on a preheating table (for example, 180 ° C.)) to heat the thread-like solder, and the powder mixed in the thread-like solder (For example, ammonium chloride / hydrate powder) was decomposed to attempt to significantly improve the adhesion to the portion to be soldered (for example, in the case of a Cu plate, the adhesion could be significantly improved). reference).
- a soldering target for example, a Cu plate or the like, if necessary, placed on a preheating table (for example, 180 ° C.)
- a preheating table for example, 180 ° C.
- solder manufacturing explanatory drawing of this invention It is explanatory drawing of the solder material manufacturing apparatus of this invention. It is a soldering explanatory drawing of the lead connection of this invention. It is a soldering explanatory drawing of this invention. It is a composition example (ABS-S) of the solder of this invention. This is a prototype example of the solder of the present invention. It is a TC test explanatory drawing of the solder of this invention. This is a TC test example of the solder (A-14) of the present invention. This is an example of ultrasonic (rubbing) / paste of the present invention.
- Solder material 2 Solder material input tray 3: Melting furnace 4: Heater 11: Silicon substrate 12: Aluminum sintered film 13: Ultrasonic soldering iron tip 13-1: With or without ultrasonic soldering iron tip 14: Solder 15: Soldered ribbon or wire
Abstract
Description
・主材:P、In、Bi、Sb
・副材:Al、Si、Cu、Ag、Ni
ここで、母材は、本発明のSnZn半田を形成するSnZn合金の基本となる材料(母材)であって、ここでは、Snが91wt%。Znが9wt%を試作では用いた。Sn,Znの重量比は合金を作成できる範囲で任意、例えばZnが1から15wt%、残りはSnとすればよい(いずれの割合にするかは溶融温度などを目安に実験して適宜選択すればよい)。
組成例 SnZn合金 P In Bi Al Si Cu Ag
wt%例 Sn Zn CuP8 In Bi Al Si Cu Ag
91 9 0.3 0.3 0.3 0.3 0.3 0.3 0.3
wt%範囲 99-85 1-15 微量-0.1(P) 0.1-1.0 微量-0.5 各5Wwt以下
ここで、組成例として、試作では母材は図示のSn91wt%、Zn9wt%を用いた。また、組成範囲は、SnZn合金が作成可能な範囲で安定であればよく、例えばZn1から15wt%、残りをSnとしたものでよく、作成したSnZn母材の溶融温度などを実測して実験で決めればよい。
・最大温度は 87.5℃
・最小温度は-24、4℃
・最大湿度は 98.3%
・最小湿度は 1.6%
の条件でTCテストを実施した。
(1) 試験期間は2019年5月1日から6月12日(1000時間)
(2) 銅線をアルミ板、シリコン板、アルミ面に半田A-14で接合
(3) 高温条件は高温炉で80℃に入れる。サンプルを入れてから昇温させる。
・高温(最大温度)が図7の(c)に記載の87.6℃
・低温(最小温度)が図7の(c)に記載の-24.4℃
であり、1000時間経過までの記録を示す。
・最大湿度が図7の(c)に記載の98.3%
・最小湿度が図7の(c)に記載の1.6%
であり、1000時間経過までの記録を示す。
・「ペースト/超音波(擦る)」は、本発明のSnZn半田を用いて半田付け対象物に半田付けする場合の「超音波有りで半田付け」、「超音波無しでコテ先で半田付け対象物を擦る」、「ペーストの塩化アンモニウム(NH4Cl)・水和物(3wt%以下、0.05wt%以上)を用いる」、「ペーストの塩化アンモニウム・無水物(3wt%以下、0.05wt%以上)を用いる」、「ペーストのレジン(松脂)(3wt%以下、0.05wt%以上)を用いる」の区別である。
2:半田材料投入皿
3:溶融炉
4:ヒーター
11:シリコン基板
12:アルミニウム焼結膜
13:超音波半田コテ先端
13-1:超音波有又は超音波無半田コテ先端
14:半田
15:半田付きリボン又はワイヤー
Claims (17)
- SnとZnの合金からなるSnZn半田において、
SnとZnの合金である母材に、P、In、Bi、Sbのうちの1つ以上を含む主材を、合計1ないし1.5wt%以下を混入して溶融・合金化したことを特徴とするSnZn半田。 - 前記溶融・合金化した後のSnZn半田の溶融温度は、前記母材の溶融温度と同じあるいは低いことを特徴とする請求項1に記載のSnZn半田。
- 前記主材は、SnとZnの合金の骨格内に合金化したことを特徴とする請求項1から請求項2のいずれかに記載のSnZn半田。
- Al、Si、Cu、Ag、Niのうちの1つ以上あるいは1つ以上を含有するガラスを
含む副材を、必要に応じて5wt%以下を前記母材に混入して溶融・合金化したことを特徴とする請求項1から請求項3のいずれかに記載のSnZn半田。 - 前記主材および前記副材として、該主材と該副材との合金を、前記母材に混入して溶融・合金化したことを特徴とする請求項1から請求項4のいずれかに記載のSnZn半田。
- 前記主材と前記副材の合金として、CuとPとの合金としたことを特徴とする請求項5に記載のSnZn半田。
- 前記母材、主材、副材をまとめてあるいは複数に分けて混合して溶融・合金化することを特徴とする請求項1から請求項6のいずれかに記載のSnZn半田。
- 太陽電池基板、液晶基板の電極に、リード線の半田付けに用いることを特徴とする請求項1から請求項7のいずれかに記載のSnZn半田。
- 請求項1から請求項8のいずれかに記載のSnZn半田に、塩化アンモニウム・水和物の粉末あるいは塩化アンモニウム・水和物を含む粉末を3wt%以下から0.05wt%以上混入し、半田付け加熱時に分解して被半田付け対象物への半田付け密着度を改善することを特徴とするSnZn半田。
- SnとZnの合金からなるSnZn半田の製造方法において、
SnとZnの合金である母材に、P、In、Bi、Sbのうちの1つ以上を含む主材を、合計1ないし1.5wt%以下を混入して溶融・合金化して製造することを特徴とするSnZn半田の製造方法。 - 前記溶融・合金化した後のSnZn半田の溶融温度は、前記母材の溶融温度と同じあるいは低いことを特徴とする請求項10に記載のSnZn半田の製造方法。
- 前記主材は、SnとZnの合金の骨格内に合金化したことを特徴とする請求項10から請求項11のいずれかに記載のSnZn半田の製造方法。
- Al、Si、Cu、Ag、Niのうちの1つ以上あるいは1つ以上を含有するガラスを含む副材を、必要に応じて5wt%以下を前記母材に混入して溶融・合金化したことを特徴とする請求項10から請求項12のいずれかに記載のSnZn半田の製造方法。
- 前記主材および前記副材として、該主材と該副材との合金を、前記母材に混入して溶融・合金化したことを特徴とする請求項10から請求項13のいずれかに記載のSnZn半田の製造方法。
- 前記主材と前記副材の合金として、CuとPとの合金としたことを特徴とする請求項14に記載のSnZn半田の製造方法。
- 前記母材、主材、副材をまとめてあるいは複数に分けて混合して溶融・合金化することを特徴とする請求項10から請求項15のいずれかに記載のSnZn半田の製造方法。
- 請求項10から請求項16のいずれかに記載のSnZn半田に、塩化アンモニウム・水和物の粉末あるいは塩化アンモニウム・水和物を含む粉末を3wt%以下から0.05wt%以上混入し、半田付け加熱時に分解して被半田付け対象物への半田付け密着度を改善することを特徴とするSnZn半田の製造方法。
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