JPWO2021010199A1 - - Google Patents

Info

Publication number
JPWO2021010199A1
JPWO2021010199A1 JP2021532789A JP2021532789A JPWO2021010199A1 JP WO2021010199 A1 JPWO2021010199 A1 JP WO2021010199A1 JP 2021532789 A JP2021532789 A JP 2021532789A JP 2021532789 A JP2021532789 A JP 2021532789A JP WO2021010199 A1 JPWO2021010199 A1 JP WO2021010199A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021532789A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021010199A1 publication Critical patent/JPWO2021010199A1/ja
Priority to JP2023113387A priority Critical patent/JP2023130461A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/02—Making non-ferrous alloys by melting
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
JP2021532789A 2019-07-12 2020-07-04 Pending JPWO2021010199A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023113387A JP2023130461A (ja) 2019-07-12 2023-07-11 ＳｎＺｎ半田およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019129866 2019-07-12
JP2020103656 2020-06-16
PCT/JP2020/026311 WO2021010199A1 (ja) 2019-07-12 2020-07-04 ＳｎＺｎ半田およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023113387A Division JP2023130461A (ja) 2019-07-12 2023-07-11 ＳｎＺｎ半田およびその製造方法

Publications (1)

Publication Number Publication Date
JPWO2021010199A1 true JPWO2021010199A1 (zh) 2021-01-21

Family

ID=74210496

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021532789A Pending JPWO2021010199A1 (zh) 2019-07-12 2020-07-04
JP2023113387A Pending JP2023130461A (ja) 2019-07-12 2023-07-11 ＳｎＺｎ半田およびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023113387A Pending JP2023130461A (ja) 2019-07-12 2023-07-11 ＳｎＺｎ半田およびその製造方法

Country Status (5)

Country Link
JP (2) JPWO2021010199A1 (zh)
KR (1) KR20220013497A (zh)
CN (1) CN114206542A (zh)
TW (2) TWI817020B (zh)
WO (1) WO2021010199A1 (zh)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012719A1 (fr) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Soudure sans plomb
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP2000015478A (ja) * 1998-06-30 2000-01-18 Toshiba Corp ハンダ材
JP2002361476A (ja) * 2001-06-08 2002-12-18 Showa Denko Kk ハンダ金属、ハンダペースト、ハンダ付け方法、ハンダ付けした回路板、及びハンダ付けした接合物
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
WO2003061896A1 (fr) * 2002-01-21 2003-07-31 Fujitsu Limited Alliage de brasage et joint brase
WO2004039533A1 (ja) * 2002-10-31 2004-05-13 Senju Metal Industry Co., Ltd. 鉛フリーはんだ及びはんだ付け物品
CN1861311A (zh) * 2006-04-30 2006-11-15 北京市航天焊接材料厂 无铅抗氧化含稀土SnZn合金焊料及其制备方法
CN101092006A (zh) * 2006-06-21 2007-12-26 北京有色金属研究总院 一种微合金化锡锌共晶合金无铅焊料
JP2009502512A (ja) * 2005-08-02 2009-01-29 キョセイ マ 一種低融点無鉛はんだ合金

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101780607B (zh) * 2010-03-17 2012-05-09 华南理工大学 一种用于电子封装组装钎焊的无铅钎料及其制备方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997012719A1 (fr) * 1995-09-29 1997-04-10 Matsushita Electric Industrial Co., Ltd. Soudure sans plomb
JPH09155587A (ja) * 1995-11-30 1997-06-17 Mitsui Mining & Smelting Co Ltd 錫−亜鉛系無鉛半田合金
JP2000015478A (ja) * 1998-06-30 2000-01-18 Toshiba Corp ハンダ材
JP2002361476A (ja) * 2001-06-08 2002-12-18 Showa Denko Kk ハンダ金属、ハンダペースト、ハンダ付け方法、ハンダ付けした回路板、及びハンダ付けした接合物
JP2003010996A (ja) * 2001-06-27 2003-01-15 Nippon Filler Metals Co Ltd 鉛フリーソルダペースト
WO2003061896A1 (fr) * 2002-01-21 2003-07-31 Fujitsu Limited Alliage de brasage et joint brase
WO2004039533A1 (ja) * 2002-10-31 2004-05-13 Senju Metal Industry Co., Ltd. 鉛フリーはんだ及びはんだ付け物品
JP2009502512A (ja) * 2005-08-02 2009-01-29 キョセイ マ 一種低融点無鉛はんだ合金
CN1861311A (zh) * 2006-04-30 2006-11-15 北京市航天焊接材料厂 无铅抗氧化含稀土SnZn合金焊料及其制备方法
CN101092006A (zh) * 2006-06-21 2007-12-26 北京有色金属研究总院 一种微合金化锡锌共晶合金无铅焊料

Also Published As

Publication number Publication date
JP2023130461A (ja) 2023-09-20
TW202206614A (zh) 2022-02-16
TWI817020B (zh) 2023-10-01
WO2021010199A1 (ja) 2021-01-21
TW202108778A (zh) 2021-03-01
CN114206542A (zh) 2022-03-18
KR20220013497A (ko) 2022-02-04

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