KR20210077972A - 적층형 전자 부품 - Google Patents
적층형 전자 부품 Download PDFInfo
- Publication number
- KR20210077972A KR20210077972A KR1020190169536A KR20190169536A KR20210077972A KR 20210077972 A KR20210077972 A KR 20210077972A KR 1020190169536 A KR1020190169536 A KR 1020190169536A KR 20190169536 A KR20190169536 A KR 20190169536A KR 20210077972 A KR20210077972 A KR 20210077972A
- Authority
- KR
- South Korea
- Prior art keywords
- conductive resin
- resin layer
- layer
- electrode
- disposed
- Prior art date
Links
- 229920005989 resin Polymers 0.000 claims abstract description 202
- 239000011347 resin Substances 0.000 claims abstract description 202
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 21
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 239000000945 filler Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 14
- 239000000377 silicon dioxide Substances 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 239000002923 metal particle Substances 0.000 claims description 12
- 229910000765 intermetallic Inorganic materials 0.000 claims description 11
- 229910052759 nickel Inorganic materials 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 7
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 claims description 3
- 238000010891 electric arc Methods 0.000 abstract description 19
- 238000005452 bending Methods 0.000 abstract description 8
- 239000010410 layer Substances 0.000 description 259
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 18
- 239000000843 powder Substances 0.000 description 17
- 239000010949 copper Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000012360 testing method Methods 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 7
- 230000035939 shock Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 239000011575 calcium Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 239000003985 ceramic capacitor Substances 0.000 description 5
- 230000006872 improvement Effects 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 230000001629 suppression Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000010944 silver (metal) Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 3
- 229910002113 barium titanate Inorganic materials 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007676 flexural strength test Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002052 molecular layer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190169536A KR20210077972A (ko) | 2019-12-18 | 2019-12-18 | 적층형 전자 부품 |
| US16/857,264 US11508522B2 (en) | 2019-12-18 | 2020-04-24 | Multilayer electronic component |
| CN202010596968.0A CN112992535A (zh) | 2019-12-18 | 2020-06-28 | 多层电子组件 |
| US17/971,914 US11798747B2 (en) | 2019-12-18 | 2022-10-24 | Multilayer electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020190169536A KR20210077972A (ko) | 2019-12-18 | 2019-12-18 | 적층형 전자 부품 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20210077972A true KR20210077972A (ko) | 2021-06-28 |
Family
ID=76344223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190169536A KR20210077972A (ko) | 2019-12-18 | 2019-12-18 | 적층형 전자 부품 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US11508522B2 (zh) |
| KR (1) | KR20210077972A (zh) |
| CN (1) | CN112992535A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI628678B (zh) * | 2016-04-21 | 2018-07-01 | Tdk 股份有限公司 | 電子零件 |
| KR20220060286A (ko) * | 2020-11-04 | 2022-05-11 | 삼성전기주식회사 | 적층형 커패시터 |
| KR20220074262A (ko) * | 2020-11-27 | 2022-06-03 | 삼성전기주식회사 | 적층형 커패시터 |
| JP2023072760A (ja) * | 2021-11-15 | 2023-05-25 | Tdk株式会社 | 電子部品 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3307133B2 (ja) * | 1995-01-27 | 2002-07-24 | 株式会社村田製作所 | セラミック電子部品 |
| WO2008108089A1 (ja) * | 2007-03-08 | 2008-09-12 | Panasonic Corporation | ケースモールド型コンデンサおよびその使用方法 |
| JP4964102B2 (ja) * | 2007-11-26 | 2012-06-27 | 三洋電機株式会社 | 固体電解コンデンサ |
| JP5439954B2 (ja) * | 2009-06-01 | 2014-03-12 | 株式会社村田製作所 | 積層型電子部品およびその製造方法 |
| KR101548770B1 (ko) * | 2011-06-23 | 2015-09-01 | 삼성전기주식회사 | 칩 타입 적층 커패시터 |
| KR101792268B1 (ko) * | 2012-03-13 | 2017-11-01 | 삼성전기주식회사 | 적층 세라믹 전자 부품 |
| KR101462769B1 (ko) * | 2013-03-28 | 2014-11-20 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 전자부품이 실장된 회로기판 |
| JP2017034010A (ja) * | 2015-07-30 | 2017-02-09 | 株式会社村田製作所 | 積層セラミックコンデンサおよびその製造方法 |
| US10446320B2 (en) | 2016-04-15 | 2019-10-15 | Samsung Electro-Mechanics Co., Ltd. | Multilayer capacitor having external electrode including conductive resin layer |
| KR102105345B1 (ko) * | 2016-12-09 | 2020-04-28 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 세라믹 콘덴서 |
| JP6806035B2 (ja) * | 2017-10-31 | 2021-01-06 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| KR102185055B1 (ko) * | 2018-10-02 | 2020-12-01 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
| KR102276514B1 (ko) * | 2019-08-28 | 2021-07-14 | 삼성전기주식회사 | 적층형 전자 부품 |
| JP2023113333A (ja) * | 2022-02-03 | 2023-08-16 | 太陽誘電株式会社 | セラミック電子部品およびその製造方法 |
-
2019
- 2019-12-18 KR KR1020190169536A patent/KR20210077972A/ko not_active Application Discontinuation
-
2020
- 2020-04-24 US US16/857,264 patent/US11508522B2/en active Active
- 2020-06-28 CN CN202010596968.0A patent/CN112992535A/zh active Pending
-
2022
- 2022-10-24 US US17/971,914 patent/US11798747B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20230066593A1 (en) | 2023-03-02 |
| US11798747B2 (en) | 2023-10-24 |
| US20210193391A1 (en) | 2021-06-24 |
| US11508522B2 (en) | 2022-11-22 |
| CN112992535A (zh) | 2021-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102561937B1 (ko) | 적층형 전자 부품 | |
| KR102276514B1 (ko) | 적층형 전자 부품 | |
| KR102283077B1 (ko) | 적층형 전자 부품 | |
| US11798747B2 (en) | Multilayer electronic component | |
| US11049661B2 (en) | Multilayer electronic component | |
| US20240038449A1 (en) | Multilayer electronic component including a silicon organic compound layer arranged between layers of an external electrode | |
| US11664164B2 (en) | Multilayer electronic component | |
| KR20190116176A (ko) | 적층 세라믹 전자부품 | |
| US11393634B2 (en) | Multilayer electronic component | |
| KR20220059824A (ko) | 적층형 전자 부품 | |
| KR102145311B1 (ko) | 세라믹 전자 부품 | |
| KR20220081632A (ko) | 적층형 전자 부품 | |
| KR102441653B1 (ko) | 세라믹 전자 부품 | |
| US20230215627A1 (en) | Multilayer electronic component | |
| CN112447396B (zh) | 多层电子组件 | |
| US20240186070A1 (en) | Multilayer electronic component | |
| KR20220092166A (ko) | 적층형 전자 부품 | |
| KR20230114067A (ko) | 적층형 전자 부품 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal |