KR20210075150A - 에칭액 조성물 및 에칭 방법 - Google Patents

에칭액 조성물 및 에칭 방법 Download PDF

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Publication number
KR20210075150A
KR20210075150A KR1020217014243A KR20217014243A KR20210075150A KR 20210075150 A KR20210075150 A KR 20210075150A KR 1020217014243 A KR1020217014243 A KR 1020217014243A KR 20217014243 A KR20217014243 A KR 20217014243A KR 20210075150 A KR20210075150 A KR 20210075150A
Authority
KR
South Korea
Prior art keywords
etching
silver
acid
liquid composition
component
Prior art date
Application number
KR1020217014243A
Other languages
English (en)
Korean (ko)
Inventor
요시히데 사이오
다이스케 오미야
다마미 아오키
Original Assignee
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아데카 filed Critical 가부시키가이샤 아데카
Publication of KR20210075150A publication Critical patent/KR20210075150A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
KR1020217014243A 2018-10-17 2019-10-08 에칭액 조성물 및 에칭 방법 KR20210075150A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018195565 2018-10-17
JPJP-P-2018-195565 2018-10-17
PCT/JP2019/039614 WO2020080178A1 (ja) 2018-10-17 2019-10-08 エッチング液組成物及びエッチング方法

Publications (1)

Publication Number Publication Date
KR20210075150A true KR20210075150A (ko) 2021-06-22

Family

ID=70283974

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217014243A KR20210075150A (ko) 2018-10-17 2019-10-08 에칭액 조성물 및 에칭 방법

Country Status (5)

Country Link
JP (1) JP7377212B2 (zh)
KR (1) KR20210075150A (zh)
CN (1) CN112867812A (zh)
TW (1) TW202028534A (zh)
WO (1) WO2020080178A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116601332A (zh) * 2020-12-15 2023-08-15 Dic株式会社 银用蚀刻液及使用其的印刷配线板的制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060671A (ja) 1996-08-16 1998-03-03 Asahi Denka Kogyo Kk 銀薄膜用エッチング液および銀薄膜エッチング方法
JP2003213460A (ja) 2002-01-16 2003-07-30 The Inctec Inc 銀系薄膜用エッチング液
JP2004176115A (ja) 2002-11-26 2004-06-24 Kanto Chem Co Inc 銀を主成分とする金属薄膜のエッチング液組成物
JP2012194024A (ja) 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS488704B1 (zh) * 1969-04-17 1973-03-16
JPS5278632A (en) * 1975-12-12 1977-07-02 Tokyo Shibaura Electric Co Peeling solution for silver plating
JPS55164075A (en) * 1979-06-06 1980-12-20 Nippon Columbia Co Ltd Removal of silver from plastic base material
JP2553574B2 (ja) * 1987-07-24 1996-11-13 エヌ・イーケムキャット株式会社 銀剥離液
US20030168431A1 (en) * 2002-02-25 2003-09-11 Ritdisplay Corporation Etchant composition for silver alloy
KR100440343B1 (ko) * 2002-04-03 2004-07-15 동우 화인켐 주식회사 고 선택성 은 식각용액-1
JP4161691B2 (ja) * 2002-11-21 2008-10-08 ソニー株式会社 エッチング工程を有する液晶ディスプレイの製造方法
WO2006103751A1 (ja) * 2005-03-29 2006-10-05 Mitsubishi Chemical Corporation 銅エッチング液及びエッチング方法
JP2009076601A (ja) * 2007-09-19 2009-04-09 Nagase Chemtex Corp エッチング溶液
KR101518055B1 (ko) * 2008-10-30 2015-05-06 동우 화인켐 주식회사 금속막 에칭액 조성물
JP5621671B2 (ja) * 2011-03-17 2014-11-12 株式会社村田製作所 電子部品の製造方法
JP6207248B2 (ja) * 2013-06-17 2017-10-04 株式会社Adeka エッチング液組成物及びエッチング方法
CN105603425A (zh) * 2016-01-25 2016-05-25 熙腾电子科技（上海）有限公司 铜选择性蚀刻液和钛选择性蚀刻液

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1060671A (ja) 1996-08-16 1998-03-03 Asahi Denka Kogyo Kk 銀薄膜用エッチング液および銀薄膜エッチング方法
JP2003213460A (ja) 2002-01-16 2003-07-30 The Inctec Inc 銀系薄膜用エッチング液
JP2004176115A (ja) 2002-11-26 2004-06-24 Kanto Chem Co Inc 銀を主成分とする金属薄膜のエッチング液組成物
JP2012194024A (ja) 2011-03-16 2012-10-11 Sumiko Techno-Research Co Ltd 銀メッキ層溶解液及び銀メッキ層溶解方法、並びに銀メッキ層含有元素の定量方法

Also Published As

Publication number Publication date
CN112867812A (zh) 2021-05-28
WO2020080178A1 (ja) 2020-04-23
JP7377212B2 (ja) 2023-11-09
TW202028534A (zh) 2020-08-01

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