KR20210056332A - 핀 리프팅 디바이스 - Google Patents

핀 리프팅 디바이스 Download PDF

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Publication number
KR20210056332A
KR20210056332A KR1020217005237A KR20217005237A KR20210056332A KR 20210056332 A KR20210056332 A KR 20210056332A KR 1020217005237 A KR1020217005237 A KR 1020217005237A KR 20217005237 A KR20217005237 A KR 20217005237A KR 20210056332 A KR20210056332 A KR 20210056332A
Authority
KR
South Korea
Prior art keywords
housing
lifting device
pin lifting
pin
connection
Prior art date
Application number
KR1020217005237A
Other languages
English (en)
Korean (ko)
Inventor
마이클 두에르
리코 로너
아드리안 에센모저
마르코 아폴로니
Original Assignee
배트 홀딩 아게
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 배트 홀딩 아게 filed Critical 배트 홀딩 아게
Publication of KR20210056332A publication Critical patent/KR20210056332A/ko

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
KR1020217005237A 2018-09-17 2019-09-16 핀 리프팅 디바이스 KR20210056332A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018007307.7 2018-09-17
DE102018007307.7A DE102018007307A1 (de) 2018-09-17 2018-09-17 Stifthubvorrichtung
PCT/EP2019/074610 WO2020058150A1 (de) 2018-09-17 2019-09-16 Stifthubvorrichtung

Publications (1)

Publication Number Publication Date
KR20210056332A true KR20210056332A (ko) 2021-05-18

Family

ID=68066775

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217005237A KR20210056332A (ko) 2018-09-17 2019-09-16 핀 리프팅 디바이스

Country Status (7)

Country Link
US (1) US20220044957A1 (de)
JP (1) JP7368460B2 (de)
KR (1) KR20210056332A (de)
CN (1) CN112714950B (de)
DE (1) DE102018007307A1 (de)
TW (1) TWI809177B (de)
WO (1) WO2020058150A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102019006050A1 (de) 2019-08-28 2021-03-04 Vat Holding Ag Stifthubvorrichtung mit Gleitführung
US20220293452A1 (en) * 2021-03-12 2022-09-15 Applied Materials, Inc. Lift pin mechanism
CN113488370A (zh) * 2021-07-06 2021-10-08 北京屹唐半导体科技股份有限公司 用于等离子体处理设备的升降销组件
CN115991896A (zh) 2021-10-18 2023-04-21 住友橡胶工业株式会社 轮胎

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US4701081A (en) * 1985-02-15 1987-10-20 Honda Giken Kogyo Kabushiki Kaisha Boring process and apparatus
DE3940916A1 (de) * 1989-12-12 1991-06-13 Stabilus Gmbh Teleskopierbare verstelleinrichtung mit loesbarer arretierung
JPH11336660A (ja) * 1998-05-27 1999-12-07 Toyota Autom Loom Works Ltd 可変容量圧縮機およびその組み付け方法
US6305677B1 (en) * 1999-03-30 2001-10-23 Lam Research Corporation Perimeter wafer lifting
US6537011B1 (en) * 2000-03-10 2003-03-25 Applied Materials, Inc. Method and apparatus for transferring and supporting a substrate
US6481723B1 (en) * 2001-03-30 2002-11-19 Lam Research Corporation Lift pin impact management
US6646857B2 (en) * 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
CN101495668A (zh) * 2005-01-18 2009-07-29 Asm美国公司 晶片支撑销组件
JP2007250796A (ja) 2006-03-15 2007-09-27 Tokyo Electron Ltd リフタ及びリフタを備える被処理体の処理装置
JP4597894B2 (ja) 2006-03-31 2010-12-15 東京エレクトロン株式会社 基板載置台および基板処理装置
JP4799325B2 (ja) * 2006-09-05 2011-10-26 東京エレクトロン株式会社 基板受け渡し装置,基板処理装置,基板受け渡し方法
JP2008112801A (ja) 2006-10-30 2008-05-15 Dainippon Screen Mfg Co Ltd ピンホルダおよび基板処理装置
KR101335302B1 (ko) 2006-11-10 2013-12-03 엘아이지에이디피 주식회사 리프트 핀 구동장치 및 이를 구비한 평판표시소자 제조장치
JP4951536B2 (ja) 2007-03-27 2012-06-13 東京エレクトロン株式会社 基板載置台及び基板処理装置
KR101058810B1 (ko) * 2008-01-17 2011-08-23 주식회사 아토 진공처리장치의 리프트 핀 구동장치
JP5406475B2 (ja) 2008-07-28 2014-02-05 大日本スクリーン製造株式会社 熱処理装置
US9011602B2 (en) 2009-01-29 2015-04-21 Lam Research Corporation Pin lifting system
US8313612B2 (en) * 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
KR101115868B1 (ko) * 2009-04-27 2012-02-21 주식회사 테스 기판처리장치
DE102010007483B4 (de) * 2010-02-09 2013-04-18 Winfried Felber Anschlussvorrichtung
TWI674168B (zh) 2015-07-27 2019-10-11 美商應用材料股份有限公司 升降杆致動器、基板材支撐組件、及利用基板材支撐組件的方法
US10332778B2 (en) * 2015-11-11 2019-06-25 Lam Research Corporation Lift pin assembly and associated methods
US10468288B2 (en) * 2016-10-19 2019-11-05 Kla-Tencor Corporation Methods and systems for chucking a warped wafer
JP6746471B2 (ja) * 2016-11-08 2020-08-26 東京エレクトロン株式会社 基板処理装置
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder

Also Published As

Publication number Publication date
CN112714950A (zh) 2021-04-27
JP2022501811A (ja) 2022-01-06
TW202013591A (zh) 2020-04-01
DE102018007307A1 (de) 2020-03-19
WO2020058150A1 (de) 2020-03-26
JP7368460B2 (ja) 2023-10-24
US20220044957A1 (en) 2022-02-10
CN112714950B (zh) 2023-04-25
TWI809177B (zh) 2023-07-21

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