KR20210039329A - 원통형 스퍼터링 타깃, In 계 솔더재, 및, 원통형 스퍼터링 타깃의 제조 방법 - Google Patents

원통형 스퍼터링 타깃, In 계 솔더재, 및, 원통형 스퍼터링 타깃의 제조 방법 Download PDF

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Publication number
KR20210039329A
KR20210039329A KR1020207034562A KR20207034562A KR20210039329A KR 20210039329 A KR20210039329 A KR 20210039329A KR 1020207034562 A KR1020207034562 A KR 1020207034562A KR 20207034562 A KR20207034562 A KR 20207034562A KR 20210039329 A KR20210039329 A KR 20210039329A
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KR
South Korea
Prior art keywords
sputtering target
solder
backing tube
cylindrical
mass
Prior art date
Application number
KR1020207034562A
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English (en)
Korean (ko)
Inventor
신 오카노
신지 가토
Original Assignee
미쓰비시 마테리알 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 미쓰비시 마테리알 가부시키가이샤 filed Critical 미쓰비시 마테리알 가부시키가이샤
Publication of KR20210039329A publication Critical patent/KR20210039329A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
    • H01J37/3491—Manufacturing of targets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physical Vapour Deposition (AREA)
KR1020207034562A 2018-08-10 2019-07-17 원통형 스퍼터링 타깃, In 계 솔더재, 및, 원통형 스퍼터링 타깃의 제조 방법 KR20210039329A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-151553 2018-08-10
JP2018151553A JP2020026546A (ja) 2018-08-10 2018-08-10 円筒型スパッタリングターゲット、Ｉｎ系はんだ材、及び、円筒型スパッタリングターゲットの製造方法
PCT/JP2019/027999 WO2020031631A1 (fr) 2018-08-10 2019-07-17 Cible de pulvérisation cylindrique, matériau de soudure à base de métal et procédé de fabrication de cible cylindrique

Publications (1)

Publication Number Publication Date
KR20210039329A true KR20210039329A (ko) 2021-04-09

Family

ID=69413465

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207034562A KR20210039329A (ko) 2018-08-10 2019-07-17 원통형 스퍼터링 타깃, In 계 솔더재, 및, 원통형 스퍼터링 타깃의 제조 방법

Country Status (4)

Country Link
JP (1) JP2020026546A (fr)
KR (1) KR20210039329A (fr)
CN (1) CN112292474A (fr)
WO (1) WO2020031631A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111468799A (zh) * 2020-04-22 2020-07-31 宁波江丰电子材料股份有限公司 一种陶瓷旋转靶材的焊接方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599006B2 (ja) 1978-03-10 1984-02-28 松下電器産業株式会社 液体燃料燃焼装置
JP2006257510A (ja) 2005-03-17 2006-09-28 Mitsui Mining & Smelting Co Ltd スパッタリングターゲットの製造方法およびスパッタリングターゲット

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62197291A (ja) * 1986-02-24 1987-08-31 Mitsubishi Metal Corp 残留熱歪の少ない半導体装置の組立て用Ｉｎ合金ろう材
JP3618005B2 (ja) * 1994-08-23 2005-02-09 三井金属鉱業株式会社 回転カソード用スパッタリングターゲットの製造方法
CN101921988A (zh) * 2010-05-05 2010-12-22 广州市尤特新材料有限公司 一种硅基合金旋转靶材及其制备方法
JP2012052175A (ja) * 2010-08-31 2012-03-15 Jx Nippon Mining & Metals Corp 積層構造体及びその製造方法
JP6089983B2 (ja) * 2012-07-18 2017-03-08 三菱マテリアル株式会社 円筒形スパッタリングターゲットおよびその製造方法
CN104289783B (zh) * 2013-07-18 2017-04-26 首都航天机械公司 一种适用于钢铝异种金属的硬钎焊工艺及其硬钎焊连通器
TWI519636B (zh) * 2013-12-10 2016-02-01 川錫科研有限公司 高導熱複合焊材
JP5799154B2 (ja) * 2013-12-13 2015-10-21 Jx日鉱日石金属株式会社 スパッタリングターゲット及びその製造方法
JP6233224B2 (ja) * 2014-07-17 2017-11-22 住友金属鉱山株式会社 接合材シート及び円筒形スパッタリングターゲットの製造方法
CN105483625B (zh) * 2014-10-07 2018-01-02 Ｊｘ金属株式会社 溅射靶
JP6332078B2 (ja) * 2015-02-24 2018-05-30 住友金属鉱山株式会社 円筒形スパッタリングターゲットの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS599006B2 (ja) 1978-03-10 1984-02-28 松下電器産業株式会社 液体燃料燃焼装置
JP2006257510A (ja) 2005-03-17 2006-09-28 Mitsui Mining & Smelting Co Ltd スパッタリングターゲットの製造方法およびスパッタリングターゲット

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WO2020031631A1 (fr) 2020-02-13
CN112292474A (zh) 2021-01-29
JP2020026546A (ja) 2020-02-20

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