KR20210015662A - Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method - Google Patents

Abstract

The present invention relates to a work transfer device, a work chuck, and a work transfer method for preventing excessive deformation of a plurality of plate works due to excessive pressure of an adhesive part in order to receive the plurality of plate works on a transfer member from a first substrate. The work transfer device comprises: a transfer member moving between a first opposing position opposite to a first substrate and a second opposing position opposite to a second substrate; an adhesive part provided at a transfer surface of the transfer member opposite to a plurality of plate works arranged on the first substrate and including an adhesive surface elastically deformed in a direction opposite to the plurality of plate works; a reaction force support part protruding to a first receiving surface outward of a plurality of plate works at a first surface of the substrate outward of the adhesive part in the transfer surface of the transfer member to have a reaction surface of a light material as compared with that of the adhesive surface; a first folding driver to relatively approach and separate the adhesive part of the transfer member from a first opposing direction to an opposing direction with respect to the first substrate; and a controller to control an operation of the first folding driver. An adhesive force of the adhesive surface is stronger than retention of each plate work of a first maintenance part of the first substrate but is weaker than retention of each plate work of a second maintenance part of the second substrate. The controller controls to stick a plurality of plate works by touching the adhesive surface and the plurality of plate works to be compressed by relative approach between a transfer member and the first substrate by the first folding driver. The controller controls to stop relative approach between the transfer member and the first substrate by the first folding driver by touch the repulsive surface and a first receiving surface of the first substrate by compression deformation of the adhesive surface.

Description

Work transfer device, work transfer chuck, and work transfer method {WORKPIECE TRANSFER DEVICE, WORKPIECE TRANSFER CHUCK, AND WORKPIECE TRANSFER METHOD}

The present invention provides a work transfer device and a work transfer device used to receive a plate-like work including micro-elements such as micro LEDs from a first substrate and transfer them to a predetermined position on a second substrate as a transfer destination. It relates to a work transfer chuck to be used, and a work transfer method using a work transfer device or a work transfer chuck.

Conventionally, as this kind of work transfer method, an element separation process in which a plurality of elements arranged on a wafer at a predetermined period are separated into individual elements while maintaining the arrangement of the plurality of elements, and the individually separated elements are operated. There is an element mounting method comprising a rearrangement process in which each element is rearranged on a substrate and a transfer process in which each element is transferred to a mounting substrate while maintaining the rearrangement on the substrate (for example, , See Patent Document 1).

As an element, it is not limited to the LED chip refined to 20 square micrometers, A thin film transistor etc. are included.

In the element separation process, a plurality of elements are arranged in a planar arrangement on a sapphire substrate made of a wafer for element formation, and then separation grooves are formed in a lattice shape around each element, and the alignment is maintained by the separation grooves. Is separated into the elements of.

An adhesive layer is applied to the surface of the substrate (temporary holding substrate) used in the rearrangement process, and the surface of the adhesive layer is pressed against the surface side of the element by moving the sapphire substrate and the temporary holding substrate closer together. By the pressure bonding of the pressure-sensitive adhesive layer to the surface side of the device, the surface of the pressure-sensitive adhesive layer is compressed and deformed to adhere and hold the surface side of the device.

Next, by irradiating only the selected element among the plurality of elements so that the laser light of the pulsed ultraviolet laser is transmitted from the rear surface of the sapphire substrate to the surface side, the bonding force with the sapphire substrate is weakened. Subsequently, by removing the temporary holding substrate from the sapphire substrate, only the selected element is separated from the sapphire substrate and transferred to the temporary holding substrate.

After that, the element transferred to the temporary holding substrate is retransferred to another substrate. This other substrate is also provided with an adhesive layer similarly to the temporary holding substrate, and retransfer is performed in the same manner as the transfer by the temporary holding substrate.

A wiring electrode is formed on the mounting substrate (wiring substrate) used in the transfer process, and the element is securely fixed to the wiring electrode by pressing the element to the wiring electrode by placing another inverted substrate close to the wiring substrate (electrical connection). As a result, mounting of the device to the mounting substrate is completed.

Patent Document 1: Japanese Laid-Open Patent Publication No. 2002-118124

By the way, among the micro-elements, the miniaturized LED chip has been miniaturized in order to reduce the display size, high resolution, and cost, and measures are being taken to mount the miniaturized LED chip at high speed and high precision. In particular, LEDs used in LED displays have a size called micro LED of 50 μm × 50 μm or less, and thin-plate (thin-film) LED chips are aligned and formed so that the distance between adjacent chips is less than 1 mm. It is required to transfer and mount at high speed with precision of μm.

However, in Patent Document 1, only the surface of the adhesive layer is pressed against the surface side of each element when receiving each element from a wafer to a substrate or the like or when transferring each element from a substrate to another substrate, etc. Since the surface of the pressure-sensitive adhesive layer is compressively deformed, excessive pressing force is liable to be applied to the surface side of each element according to the compressive deformation of the surface of the pressure-sensitive adhesive layer.

In detail, in order to maintain adhesion by applying adhesive force to each element, it is necessary to obtain necessary adhesive force by compressive force that compresses and deforms the adhesive layer by only a certain amount. The necessary deformation (displacement) in the compression deformation from such a flat state is generally referred to as a "crushing part", and if the adhesive layer is pressed toward the surface of each element and compression deformation is not performed as much as the crushed part, the necessary adhesive strength Is not obtained.

However, the pressure-sensitive adhesive material made of the pressure-sensitive adhesive layer, unlike rigid bodies such as metal, has a large size error and is difficult to process with high precision, so it is difficult to fine-tune the amount of compressive deformation on the surface side of each element (至難). Further, depending on the processing precision of the pressure-sensitive adhesive layer and the accuracy of assembling the substrate to the wafer, it is difficult to move the pressure-sensitive adhesive layer of the substrate in a completely parallel state toward each element on the wafer.

Therefore, at the time of compressive deformation of the pressure-sensitive adhesive layer on the surface side of each element, the surface side of each element is unreasonably deformed by excessive pressing pressure due to the influence of factors such as processing precision and assembly precision of the pressure-sensitive adhesive layer. There is a problem that it is easy to cause breakage such as cracking or damage. In particular, when the microelement is a brittle thin chip, the incidence of breakage increases, which causes a decrease in product yield.

In order to solve such a problem, the workpiece transfer device according to the present invention receives a plurality of plate-like workpieces including microelements arranged on a first substrate from the first substrate, and places them at a predetermined position on the second substrate as a transfer destination. A work transfer device for transferring, comprising: a transfer member provided to be movable from a first facing position facing the first substrate to a second facing position facing the second substrate; and the plurality of pieces arranged on the first substrate An adhesive portion provided on the transfer surface of the transfer member facing the plate-like work of, and having an adhesive surface elastically deformable in a direction opposite to the plurality of plate-like work, and an outer side of the adhesive portion on the transfer surface of the transfer member In the first surface of the first substrate, a reaction force support portion provided in a protruding shape toward a first receiving surface outside the plurality of plate-like workpieces, and having a reaction force surface that is harder than the adhesive surface, with respect to the first substrate A first folding driving unit for relatively approaching and isolated moving the adhesive part of the transfer member in the opposite direction from the first facing position, and a control unit for operating and controlling the first folding driving unit, the The adhesive force of the adhesive surface is stronger than the holding force of each plate-like workpiece of the first holding portion of the first substrate, and is set weaker than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate, and the control unit , By the relative approach movement between the transfer member and the first substrate by the first folding driving unit, the adhesive surface contacts and compressively deforms the plurality of plate-shaped workpieces, and the plurality of plate-shaped workpieces are adhered and maintained. And, according to the compression deformation of the adhesive surface, the reaction force surface abuts the first receiving surface of the first substrate, so that the relative approach movement between the transfer member and the first substrate by the first folding driver is stopped. It characterized in that it is controlled to be.

In addition, in order to solve such a problem, the workpiece transfer chuck according to the present invention receives a plurality of plate-like workpieces including microelements arranged on a first substrate from the first substrate, As a work transfer chuck for transferring to a position, while relatively approaching and moving from a first opposite position facing the first substrate toward a receiving position of the plurality of plate-like work, from the receiving position to the second substrate A transfer member provided to be movable toward a transfer position of a plurality of plate-like workpieces, and a transfer member provided on a transfer surface of the transfer member facing the plurality of plate-like workpieces arranged on the first substrate, and facing the plurality of plate-like workpieces An adhesive portion having an adhesive surface that is elastically deformable in a direction, and a first accommodation outside the adhesive portion on the transfer surface of the transfer member and outside the plurality of plate-like workpieces on the first surface of the first substrate It is provided in a protruding shape toward the surface, and has a reaction force support portion having a reaction force surface that is harder than the adhesive surface, and the adhesive force of the adhesive surface is stronger than the holding force of each plate-like work possessed by the first holding portion of the first substrate, and The second holding portion of the second substrate is set weaker than the holding force of each of the plate-like workpieces, and the adhesive surface moves the transfer member relative to the first substrate toward the receiving position from the first facing position. Thus, while being in contact with the plurality of plate-like workpieces and compressively deforming, the plurality of plate-like workpieces are adhered and held, and the reaction force surface is in accordance with the compression deformation of the adhesive surface at the receiving position, the first In contact with the first receiving surface of the substrate, the transfer member may stop moving relative to the first substrate by abutting the reaction force surface with respect to the first receiving surface.

In addition, in order to solve such a problem, in the work transfer method according to the present invention, a plurality of plate-like works including microelements arranged on a first substrate are received from the first substrate and transferred to a predetermined position on the second substrate. A method for transferring a work, wherein an adhesive portion provided on a transfer surface of a transfer member is opposed to the plurality of plate-like workpieces arranged on the first substrate, and is located outside the adhesive portion on the transfer surface of the transfer member. Approach movement process of relatively approaching and moving the transfer member toward the first substrate while the reaction force support part faces the first receiving surface outside the plurality of plate-like workpieces on the first surface of the first substrate And, an adhesive surface capable of elastically deforming in a direction opposite to the plurality of plate-like workpieces in the adhesive portion of the transfer surface that has been moved relatively close to each other, while abutting against the plurality of plate-like workpieces, the transfer member A contact step of bringing a reaction force surface harder than the adhesive surface in the reaction force support portion into contact with the first receiving surface of the first substrate, and a movement step of moving the transfer member away from the first substrate. Including, the adhesive force of the adhesive surface is set to be stronger than the holding force of each plate-like work of the first holding portion of the first substrate, and weaker than the holding force of each of the plate-like work of the second holding portion of the second substrate, In the contact process, the adhesive surface is compressed and deformed by contact with the plurality of plate-like workpieces, and the first substrate of the first substrate according to the compressive deformation of the adhesive surface while adherently holding the plurality of plate-like workpieces 1 It is characterized in that by the contact of the reaction force surface with respect to the receiving surface, the transfer member is characterized in that the further approaching movement to the first substrate is stopped.

Fig. 1 is an explanatory diagram showing the entire configuration of a work transfer device according to an embodiment (first embodiment) of the present invention, a work transfer chuck, and a case where a "selective transfer method" is adopted as a work transfer method, (a) The longitudinal front view in the initial state, (b) is a plan view of the first substrate along the lines (1B)-(1B) in Fig. 1(a), and (c) is (1C)-(1C) in Fig. 1(a) It is a bottom view of the transfer member along the line.
2 is an explanatory view of the work receiving process and the work transfer process, (a) is an enlarged longitudinal front view of the work receiving process (contact process), and (b) is an enlarged longitudinal front view of the work transfer process (contact process).
Fig. 3 is an explanatory view when repeating the "interval selection procedure" and the "partial transfer procedure" in the "selective transfer method", (a) is an enlarged longitudinal front view of the workpiece receiving process (contact process), (b) It is an enlarged longitudinal front view of the workpiece transfer process (contact process).
4 is an explanatory view showing in detail the work receiving process and the work transfer process, (a) is a partially enlarged longitudinal front view of the work receiving process (contact process), and (b) is a part of the work transfer process (contact process) It is an enlarged longitudinal front view.
5 is an explanatory view showing a modified example of the adhesive portion, where (a) is a longitudinal front view in an initial state, and (b) is a longitudinal front view of a workpiece receiving process (contact process).
6 is an explanatory view showing a modified example of the reaction force support portion, and (a) to (c) are reduced bottom views of a transfer member made of a soft material.
Fig. 7 is an explanatory view showing a modified example of the reaction force support, and (a) to (c) are reduced bottom views of the transfer member made of a hard material.
Fig. 8 is an explanatory diagram of a case where a "full surface transfer method" is adopted as a work transfer device, a work transfer chuck, and a work transfer method according to an embodiment (second embodiment) of the present invention, where (a) is in an initial state. An enlarged longitudinal front view, (b) is an enlarged bottom view of the transfer member along lines (8B)-(8B) in Fig. 8(a), and (c) is an enlarged longitudinal front view of a work receiving process (contact process).
Fig. 9 is an enlarged longitudinal front view of a case where the adhesive portion moves in a non-parallel state with respect to a plate-like work.

Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

In the work transfer device A according to the embodiment of the present invention, as shown in FIGS. 1 to 8, a plurality of plate-like workpieces W arranged on the first substrate 10 are transferred from the first substrate 10. It is a conveyance chuck device for receiving, holding (holding), conveying to the second substrate 20 as a transfer destination, and then transferring it to a predetermined position on the second substrate 20. In particular, it is an adhesive-type conveyance chuck apparatus which holds (holds) a plurality of plate-like workpieces W in a detachable manner by an adhesive member usable in a vacuum atmosphere or a reduced pressure atmosphere.

That is, the work transfer device A according to the embodiment of the present invention can also be disposed inside the transformation chamber B in which the indoor pressure can be adjusted, and includes the work transfer chuck C.

In detail, the work transfer device A and the work transfer chuck C according to the embodiment of the present invention have a receiving position P2 from a first facing position P1 facing the first substrate 10. A transfer member 1 provided to be relatively movable toward the front and an adhesive portion provided on the transfer surface 1a of the transfer member 1 facing a plurality of plate-like workpieces W arranged on the first substrate 10 (2) and a reaction force support portion 3 provided outside the adhesive portion 2 in the transfer surface 1a of the transfer member 1 as main components.

In addition, in the work transfer device A according to the embodiment of the present invention, the adhesive portion 2 of the transfer member 1 is moved relatively approaching from the first opposing position P1 toward the first substrate 10 and The first folding driving unit 4 to be separated and moved, and the transfer driving unit 5 for moving the transfer member 1 from the first facing position P1 to the second facing position P3 facing the second substrate 20. ) And a second folding driving unit 6 for relatively approaching and separating the adhesive portion 2 of the transfer member 1 from the second opposing position P3 toward the second substrate 20, and a first A control unit 7 for operating and controlling the folding drive unit 4 or the like is provided as a main component.

In addition, the transfer member 1 is usually disposed so as to face the first substrate 10 or the second substrate 20 in the vertical direction, and the upward and downward facing direction is hereinafter referred to as "Z direction". The direction along the first substrate 10 or the second substrate 20 crossing the Z direction is hereinafter referred to as "XY direction".

The plurality of plate-like workpieces W is formed in the shape of a thin plate or thin film of a substantially rectangular (rectangular shape and a quadrangle having a right angle including a square) on which the surface side W1 is smooth, and the first substrate 10 A plurality of plate-like workpieces W are arranged on the first surface 10a.

As a specific example of a plurality of plate-like workpieces (W), such as 50 μm × 50 μm or less, specifically 30 μm × 30 μm or less, more specifically called a micro LED, and more specifically several tens of square μm LED chips, other micro-devices, etc. Elements, etc. are mentioned.

These microelements also include brittle platelets having very thin shapes such as glass and thin film elements.

In addition, as another example of the plurality of plate-like workpieces W, it is also possible to include a workpiece of a general size, such as a micro element of less than 100 square μm, a fine flat plate other than the micro element, and an LED chip such as 300 square μm. Do.

In the case of the illustrated example, all of the plurality of plate-like workpieces W are set to the same size.

In the device mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, which is the prior art of the present invention, a plurality of devices (light emitting diodes having a side of about 5 μm to 100 μm) are placed on a wafer for element formation (sapphire substrate) at a predetermined cycle. While being arranged and formed, they are separated into individual elements while maintaining the arrangement of a plurality of elements.

In addition, in the element mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, the rearrangement process of rearranging each element by manipulating individually separated elements is performed by selecting and cultivating elements spaced at intervals corresponding to an integer multiple of the cycle. The transfer process of transferring each element to a mounting substrate while maintaining the rearranged state includes a procedure for selecting an interval to be aligned, and a partial transfer procedure for transferring the selected element to a portion of the mounting substrate.

When a plurality of elements are mounted on a mounting substrate, a selective transfer method in which an interval selection procedure and a partial transfer procedure are repeated is adopted.

In the spacing selection procedure, only selected elements from among a plurality of arrayed elements are re-arranged on a top plate (temporary holding substrate), and in the partial transfer procedure, the elements transferred to the top plate (temporary holding substrate) are different It is retransferred to the substrate, and finally, it is transferred from another substrate to the mounting substrate (wiring substrate).

In the present invention, the plurality of plate-like workpieces W correspond to "multiple elements" of the element mounting method described in Japanese Patent Laid-Open No. 2002-118124 described above, and the transfer member 1 of the present invention is It is equivalent to a cut board (temporary holding board)" or a "other cut board". The first substrate 10 of the present invention is equivalent to a "element formation wafer (sapphire substrate)" or the like.

That is, the first substrate 10 referred to in the present invention is not limited to a wafer for element formation whose at least the surface side is made of sapphire, gallium arsenide, etc., as shown in FIGS. 1 to 8, but a carrier substrate for transporting work Also included.

In the first substrate 10, the transfer member 1 to be described later and the first surface 10a facing in the Z direction are a first holding unit for temporarily fixing a plurality of individually separated plate-like workpieces W in a detachable manner. (11) has. The 1st holding|maintenance part 11 is provided in the inner part in the 1st surface 10a. For this reason, with respect to the inner part of the first surface 10a, the plurality of plate-like workpieces W are held immovably in a state arranged in a predetermined period in the X direction or Y direction by the first holding portion 11. .

Further, a first receiving surface 10b is provided at a portion outside the first holding portion 11 on the first surface 10a.

As a specific example of the first substrate 10, in the case of the illustrated example, it is composed of a carrier substrate or the like having a rectangular first surface 10a, and the first holding portion 11 is disposed over approximately the entire first surface 10a. Temporarily fixed layers are stacked. In the inner portion of the first surface 10a, a plurality of plate-like workpieces W are arranged in a grid in a predetermined period in the X and Y directions, respectively. The first holding portion (temporary fixing layer) 11 is arranged by protruding an adhesive material made of a UV curable resin, etc., which can be separated by irradiation with laser light, etc., so as to be elastically deformable in the Z direction toward the transfer member 1. It is desirable.

Further, in the illustrated example, the first receiving surface 10b is integrally formed at an outer portion of the surface of the first holding portion (temporary fixing layer) 11. In addition, although not shown as another example, by laminating a temporary fixing layer serving as the first holding portion 11 only on the inner portion of the first surface 10a, the outer portion on the surface of the first surface 10a is first It is also possible to change to the receiving surface 10b.

In the present invention, the second substrate 20 corresponds to a "mounting substrate (wiring substrate)" or the like.

That is, the second substrate 20 referred to in the present invention is not limited only to a mounting substrate (a wiring substrate) or a circuit board, as shown in Figs. 2 or 3, and includes a carrier substrate for transporting a work.

In the second substrate 20, a transfer member 1 to be described later and a second surface 20a facing the Z direction are a second holding portion in which a plurality of plate-like workpieces W conveyed by the transfer member 1 abut It has (21). The 2nd holding part 21 is provided in the inner part in the 2nd surface 20a. For this reason, the plurality of plate-like workpieces W with respect to the second surface 20a of the second substrate 20 are provided by the second holding portion 21 from the transfer member 1 in the X or Y direction. It remains unmovable while maintaining its arrangement in a periodic manner.

Further, a second receiving surface 20b is provided outside the second holding portion 21 in the second surface 20a.

As a specific example of the second substrate 20, in the case of the illustrated example, it is composed of a carrier substrate or the like having a rectangular second surface 20a, and the second holding portion 21 is disposed substantially over the second surface 20a. Temporarily fixed layers are stacked. It is preferable that the second holding portion (temporary fixing layer) 21 protrudes toward the transfer member 1 so as to be elastically deformable in the Z direction so that an adhesive material made of a paste or the like is disposed. At least the inner portion of the temporary fixing layer is formed by pressing the rear side W2 of the plurality of plate-like workpieces W in the same manner as the wiring electrode or the conductive material for bonding of the element mounting method described in Japanese Patent Laid-Open No. 2002-118124. , It is configured to make electrical connection while deforming.

Further, in the illustrated example, the second receiving surface 20b is integrally formed at an outer portion of the surface of the second holding portion (temporary fixing layer) 21. In addition, although not shown as another example, a temporary fixing layer serving as the second holding portion 21 is laminated only on the inner portion of the second surface 20a, and the outer portion on the surface of the second surface 20a is second It is also possible to change to the receiving surface 20b.

When the work transfer device A and the work transfer chuck C according to the first embodiment of the present invention are shown in Figs. 1 to 7, it is an example adopted by the above-described "selective transfer method".

In the "selective transfer method", first, as shown in Fig. 2(a) as the "interval selection procedure", only the plate-shaped workpieces W selected from among the plurality of plate-shaped workpieces W arranged on the first substrate 10 are selected. In an arrayed state, a household appliance is transferred to the adhesive portion 2 of the transfer member 1 described later and rearranged (received). Next, as shown in Fig. 2(b) as a "partial transfer procedure", the plate-like work W received on the transfer member 1 is transferred to the second substrate 20 as the transfer destination, and then the second substrate ( It retransfers (transfers) to the 2nd holding part 21 of 20). Subsequently, as shown in Figs. 3(a) and (b), the "interval selection procedure" and the "partial transfer procedure" are repeated a plurality of times. Thereby, only the plate-shaped workpiece W selected among the plurality of plate-shaped workpieces W arranged on the first substrate 10 corresponds to an integer multiple of the arrangement period of each plate-shaped workpiece W in the first substrate 10. They are received at intervals, transferred to the second substrate 20 with an interval of an integer multiple of the arrangement period, and rearranged.

Further, in the case shown in Fig. 8 as the work transfer device A and the work transfer chuck C according to the second embodiment of the present invention, it is an example in which the "full surface transfer method" is adopted instead of the "selective transfer method".

In the "full-surface transfer method", as shown in Figs. 8(a) and (c), all of the plurality of plate-like workpieces W arranged on the first substrate 10 are described later in the arrangement state. It is received from the adhesive portion 2 of the transfer member 1. Although not shown following this, it is conveyed and transmitted toward the 2nd board|substrate 20 which is a transfer destination.

As shown in Figs. 1 to 8, the transfer member 1 is a rigid body such as metal, synthetic quartz, or ceramics, and the plan view is managed and has a uniform thickness, so that it is not distorted (warped). It is composed of a platen formed in a flat plate shape, and has a transfer surface 1a on one surface thereof.

The transfer member 1 faces the transfer surface 1a parallel to the first holding portion 11 of the first substrate 10 or the second holding portion 21 of the second substrate 20 in a Z direction. While being disposed, it is supported so as to be movable in the Z direction and the XY direction while maintaining this parallel state.

The transfer surface 1a of the transfer member 1 is formed in a rectangle or the like in conformity with the shape of the first surface 10a of the first substrate 10 or the second surface 20a of the second substrate 20.

The transfer surface 1a includes an adhesive portion 2 disposed to be compressively deformable in a direction opposite to the plurality of plate-like workpieces W (Z direction), and a reaction force support portion 3 disposed outside the adhesive portion 2 Has.

The adhesive portion 2 is formed on the transfer surface 1a of a material that is elastically deformable in the thickness direction (Z direction) of the transfer member 1 and is arranged on the first substrate 10. It has a smooth adhesive surface 2a on the front end surface which faces parallel to the surface side W1 of the Z direction.

The adhesive surface 2a of the adhesive portion 2 is a front end surface facing the first holding portion 11 of the first substrate 10 or the second holding portion 21 of the second substrate 20 in the Z direction. It is placed on the inner part of the, and has a predetermined adhesive strength. The adhesive force of the adhesive surface 2a is stronger than the holding force of each plate-like work W of the first holding portion 11 of the first substrate 10, and the second holding portion of the second substrate 20 ( It is set weaker than the holding force of each plate-like work W possessed by 21). Thereby, while making it possible to receive the plate-like work W from the first holding part 11 to the adhesive surface 2a, the plate-like work W from the adhesive surface 2a to the second holding part 21 ).

In addition, as shown in Fig. 4(a), the transfer member 1 moves relatively close in the Z direction toward the first substrate 10 in the first folding driving unit 4 to be described later. , The adhesion surface 2a abuts against the surface side W1 of the plurality of plate-like workpieces W. It is configured such that the pressure-sensitive adhesive portion 2 compresses and deforms in the Z direction by the pressing pressure due to the subsequent approach movement. The amount of compression of the adhesive portion 2 with respect to the surface side W1 of the plurality of plate-like workpieces W is set so that the adhesive force required for the rise of each plate-like workpiece W is obtained by continuously pressing the adhesive surface 2a. Has been.

In addition, as shown in Fig. 4(b), the transfer member 1 is relatively approached and moved in the Z direction toward the second substrate 20 in the second folding drive 6 to be described later, so that a plurality of plate-like workpieces W The rear side W2 of) abuts against the second holding part 21 of the second substrate 20. It is configured such that the pressure-sensitive adhesive portion 2 compresses and deforms in the Z direction by the pressing pressure due to the subsequent approach movement. The amount of compression of the adhesive portion 2 with respect to the surface side W1 of the plurality of plate-shaped workpieces W is determined by continuous pressure contact with the adhesive surface 2a, so that each plate-shaped workpiece W with respect to the second holding portion 21 It is set so as to obtain a pressing pressure required for adhesion of the back side W2 of the.

As the cross-sectional shape of the adhesive portion 2, a concave shape shown in Figs. 1 to 4, a column shape shown in Figs. 5(a) and (b), a plate shape shown in Figs. 8(a) to (c), etc. Can be mentioned.

In the concave shape of FIGS. 1 to 4, the base 2b of the adhesive portion 2 is laminated along the transfer surface 1a, and only the adhesive surface 2a is partially formed from a part of the base 2b. It is protruding. In the columnar shape of Figs. 5(a) and (b), a columnar adhesive portion 2 is formed on a part of the transfer surface 1a, and the adhesive surface 2a' from the transfer surface 1a on the tip surface thereof. Is partially protruding. In the plate shape of Figs. 8A to 8C, a flat adhesive portion 2 is laminated and molded along the transfer surface 1a, and has a smooth adhesive surface 2a'' on the tip surface thereof.

In addition, the shape of the adhesive surface 2a is different from the above-described "selective transfer method" and "full surface transfer method".

That is, in the "selective transfer method" shown in FIGS. 1 to 7, the plate-shaped workpiece W selected from among the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the first substrate 10 is opposed. The adhesion surface 2a is arranged in plural or singular.

In the illustrated example, a plurality of adhesive surfaces 2a formed of approximately the same size as the surface side W1 of each plate-like workpiece W are spaced apart at intervals corresponding to an integer multiple of the arrangement period of the plurality of plate-shaped workpieces W. They are arranged to be rearranged (interval selection procedure). In addition, the cross-sectional shape of the adhesive part 2 shown in FIGS. 6(a)-(c) and 7(a)-(c) is either a concave shape or a column shape.

In contrast, in the "full-surface transfer method" shown in FIG. 8, the adhesive portion 2 is arranged to face all of the plurality of plate-like workpieces W arranged on the first holding portion 11 of the first substrate 10. Arranged singular or plural.

In the illustrated example, the cross-sectional shape of the adhesive portion 2 is a flat plate shape, and a single number of adhesive surfaces 2a formed in a size covering all of the surface side W1 of the plurality of plate-like workpieces W is disposed. In addition, although not shown as other examples, the cross-sectional shape of the adhesive portion 2 is changed to a concave shape or a column shape instead of a flat plate shape, and the size is approximately the same as that of the surface side W1 of each plate-shaped workpiece W. It is also possible to arrange the formed plurality of adhesive surfaces 2a in a grid shape at the same period as the plurality of plate-like workpieces W arranged on the first holding portion 11 of the first substrate 10.

The reaction force support portion 3 is a soft material having a strain substantially equal to that of the elastically deformable material serving as the adhesive portion 2 or a hard material having a lower strain than the elastically deformable material serving as the adhesive portion 2, and the transfer surface 1a Is formed in The reaction force support part 3 is smooth on a front end surface that faces parallel to the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20 in the Z direction. It has a reaction force surface 3a.

The reaction force surface 3a is parallel to the adhesive surface 2a of the adhesive portion 2 at a portion outside of the inner portion where the adhesive portion 2 is disposed in the transfer surface 1a of the transfer member 1 Is placed.

The amount of protrusion of the reaction force surface 3a with respect to the first receiving surface 10b is determined by the first folding driving unit 4 to be described later, as shown in Fig. 4(a), to the first substrate 10 and the transfer member ( When 1) approaches and moves relatively in the Z direction and the first gap L1 between the two reaches a predetermined dimension, it is a repulsive force due to the abutment between the reaction force surface 3a and the first receiving surface 10b. It is set so that the first distance L1 between the substrate 10 and the transfer member 1 does not fall below a predetermined dimension. In detail, the adhesive surface 2a comes into contact with the surface side W1 of the plurality of plate-like workpieces W due to the relative approach movement between the first substrate 10 and the transfer member 1, and thus the adhesive portion 2 When) is compressed by only a predetermined amount in the Z direction, compression deformation of the adhesive portion 2 is stopped. That is, when the adhesive portion 2 obtains the adhesive force required for the rise of the plate-like work W due to compression deformation in the Z direction, excessive compression of the adhesive portion 2 to the plurality of plate-like work W It is set so as to prevent deformation and obtain adhesive force corresponding to the thickness of each plate-like work W.

In addition, the amount of protrusion of the reaction force surface 3a with respect to the second receiving surface 20b is determined by the transfer member 1 and the second substrate by the second folding driving unit 6 described later, as shown in Fig. 4(b). When (20) approaches and moves relatively in the Z direction and the second gap (L2) between the two reaches a predetermined dimension, it is transferred by the repulsive force due to the contact between the reaction force surface (3a) and the second receiving surface (20b). The second distance L2 between the member 1 and the second substrate 20 is set so as not to be less than a predetermined dimension. In detail, due to the relative approach movement of the transfer member 1 and the second substrate 20, the rear side W2 of the plurality of plate-like workpieces W is a second holding part ( When the adhesive portion 2 is compressed by only a predetermined amount in the Z direction in contact with 21), the compression deformation of the adhesive portion 2 is stopped. That is, when the pressure required for adhesion of the back side (W2) of each plate-like work (W) to the second holding part (21) is obtained by compressive deformation of the adhesion part (2) in the Z direction, a plurality of It is set so as to prevent excessive compressive deformation of the adhesive portion 2 with respect to the plate-like workpieces W, and to obtain a pressing pressure corresponding to the thickness of each plate-like workpiece W.

Further, the reaction force support portion 3 is disposed so as to surround the inner portion where the adhesive portion 2 is disposed with respect to the transfer surface 1a of the transfer member 1, and in a part of the reaction force support portion 3, the adhesive portion 2 It is preferable to have a ventilation portion (3b) communicating with the inner portion and the outer portion in which) is disposed.

In addition, the size (area) of the reaction force surface 3a in the reaction force support portion 3 differs depending on the constituent material of the reaction force support portion 3. That is, as shown in FIGS. 1(c) and 8(b) or 6(a), (b), and (c), the material of the reaction force support part 3 is the same as the adhesive part 2 In the case of being integrally molded or integrally formed of a material, the adhesive portion 2 and the reaction force support portion 3 can be exchanged at the same time as the adhesive portion 2 deteriorates with time.

As a shape of the reaction force support part 3 made of a soft material, a trapezoidal shape shown in Figs. 1(c) and 8(b), a long rectangular shape shown in Fig. 6(a), or a short scale shown in Fig. 6(b) A rectangular shape, a large L-shape shown in Fig. 6(c), etc. are mentioned.

In the trapezoidal shape of FIGS. 1(c) and 8(b), a plurality (4) of trapezoidal reaction force supporting members 31 are disposed along the outer edge of the transfer surface 1a formed in a rectangle or the like. have. A ventilation portion 3b is disposed between the plurality of reaction force supporting members 31 and at a corner portion of the transfer surface 1a. In the elongated rectangular shape of Fig. 6(a), a plurality (four) of elongated rectangular reaction force supporting members 32 are discretely disposed between each of the vents 3b. In the short rectangular shape of Fig. 6(b), a plurality (eight) of short rectangular reaction force supporting members 33 are arranged discretely with a vent portion 3b interposed therebetween. In the large L-shape of Fig. 6(c), a large L-shaped reaction force support member 34 is disposed between a plurality (four) of each with a vent portion 3b interposed therebetween.

In addition, although not shown as another example, it is also possible to change the shape, number, etc. of the reaction force support part 3 to a shape, number, etc. other than the illustrated example.

In addition, when the constituent material of the reaction force support portion 3 is a hard material having a lower strain rate than the elastically deformable material used as the adhesive portion 2, as shown in Figs. 7(a), (b), and (c), Z Since the strain in the direction is small, it becomes possible to obtain a predetermined repulsive force even if the total accommodation area is reduced by miniaturization of the shape of the reaction force support portion 3.

As the shape of the reaction force support part 3 made of a hard material, a rectangular shape shown in Fig. 7(a), a round shape shown in Fig. 7(b), a thin L shape shown in Fig. 7(c), etc. Can be mentioned.

In the rectangular shape of the corners of Fig. 7 (a), a plurality of (four) rectangular reaction force supporting members 35 are disposed at four corners of the transfer surface 1a with a vent portion 3b interposed therebetween. Has been. In the round shape of Fig. 7(b), a plurality of round-shaped reaction force support members 36 (8) are provided at an intermediate position between the four corners and the outer edge of the transfer surface 1a. They are arranged separately. In the narrow L-shape of Fig. 7(c), a plurality of (four) reaction force supporting members 37 of a thin L-shape are discretely disposed between each of the vents 3b.

In addition, although not shown as another example, it is also possible to change the shape, number, etc. of the reaction force support part 3 to a shape, number, etc. other than the illustrated example.

The first folding driving unit 4 has a plurality of plate shapes in which the transfer member 1 is arranged at a first opposing position P1 away from the first substrate 10 and the adhesive unit 2 is arranged on the first substrate 10. Through the receiving position (P2) in contact with (press contacting) the surface side (W1) of the work (W), the adhesive portion (2) of the transfer member (1) is relatively approached and separated in the Z direction by an actuator, etc. Is composed.

The actuator or the like, which becomes the first folding drive unit 4, is either one of the transfer member 1 or the first substrate 10, or the transfer member 1 and the first substrate 10 by the control unit 7 described later. The transfer surface 1a (adhesive surface 2a, reaction force surface 3a) and the first surface 10a (first holding part 11, first receiving surface 10b) are parallel It is operated and controlled to move relative to or away from the Z direction while being held at.

By the first folding driving part 4, the adhesive part 2 of the transfer member 1 approaches and moves from the first facing position P1 toward the receiving position P2, as shown in Fig. 4(a). , The plurality of plate-like workpieces W are received, and after the end, they are separated from the receiving position P2 toward the first opposing position P1. In detail, in the receiving position P2, the adhesive surface 2a of the adhesive portion 2 abuts (press contact) the surface side W1 of the plurality of plate-like workpieces W, and the adhesive portion 2 Compressively transform At approximately the same time as this, the reaction force support 3 abuts (press contact) the first receiving surface 10b of the first substrate 10, and the further transfer member 1 by the first folding drive 4 The relative approaching movement of the first substrate 10 is stopped.

In the case of the example shown in FIGS. 1 to 8 as a specific example of the first folding drive unit 4, the transfer member 1 is lowered toward the first substrate 10.

In addition, although not shown as other examples, raising the first substrate 10 instead of the transfer member 1, moving both the transfer member 1 and the first substrate 10 closer to each other or moving away from each other, etc. Can be changed.

The transfer driving unit 5 includes a first facing position P1 where the transfer member 1 is away from the first substrate 10 and a second facing position P3 where the transfer member 1 is away from the second substrate 20. ), it is a driving source that relatively moves the adhesive portion 2 of the transfer member 1 in the X direction or the Y direction intersecting the Z direction.

The driving source serving as the transfer driving unit 5 is composed of an actuator or the like, and is either the transfer member 1 or the first substrate 10 and the second substrate 20 spaced apart by the control unit 7 to be described later. Alternatively, the operation is controlled to relatively move the transfer member 1 and both the first and second substrates 10 and 20 in the X direction or the Y direction.

In the case of the example shown in FIGS. 1 to 8 as a specific example of the transfer drive unit 5, only the transfer member 1 is reciprocated from the first substrate 10 to the second substrate 20.

In addition, although not shown as other examples, moving the first substrate 10 and the second substrate 20 instead of the transfer member 1, and the transfer member 1 and the first substrate 10 and the second Changes such as moving both sides of the substrate 20 to each other are possible.

The second folding driving unit 6 includes a second opposite position P3 where the transfer member 1 is separated from the second substrate 20 and the rear side of the plurality of plate-like workpieces W received from the adhesive unit 2. Over the delivery position P4 where (W2) abuts (presses) the second substrate 20, the adhesive portion 2 of the transfer member 1 is relatively approached and separated in the Z direction by an actuator, etc. Is composed.

The actuator or the like, which becomes the second folding driving unit 6, is either one of the transfer member 1 or the second substrate 20, or the transfer member 1 and the second substrate 20 by the control unit 7 described later. ), the transfer surface 1a (adhesive surface 2a, reaction force surface 3a) and the second surface 20a (second holding part 21, second receiving surface 20b) are parallel It is operated and controlled to move relative to or away from the Z direction while being held at.

A plurality of plate-like workpieces W received from the adhesive portion 2 of the transfer member 1 by the second folding driving portion 6 are, as shown in Fig. 4B, from the second opposing position P3. It approaches and moves toward the delivery position P4, the plurality of plate-like workpieces W are transferred, and after the end of the transfer, it moves in isolation from the delivery position P4 toward the second opposing position P3. In detail, in the delivery position P4, the rear side W2 of the plurality of plate-like workpieces W received from the adhesive surface 2a of the adhesive portion 2 is the second substrate 20 In contact with the holding part 21 (by pressure contact), the adhesive part 2 is compressed and deformed. At approximately the same time as this, the reaction force support portion 3 abuts (presses contact) the second receiving surface 20b of the second substrate 20, and the further transfer member 1 by the second folding driving portion 6 and The relative approach movement of the second substrate 20 is stopped.

In the case of the example shown in FIGS. 1 to 8 as a specific example of the second folding driving part 6, the transfer member 1 is lowered toward the second substrate 20.

In addition, although not shown as other examples, raising the second substrate 20 instead of the transfer member 1, moving both the transfer member 1 and the second substrate 20 closer to each other or moving in isolation, etc. Can be changed.

The control unit 7 is a control circuit (not shown) electrically connected to the actual pressure adjusting means of the transformer chamber B, as well as the first folding driving unit 4, the conveying driving unit 5, and the second folding driving unit 6 ). The controllers serving as the control unit 7 sequentially control each operation at a preset timing according to a program set in advance in the control circuit.

A program set in the control circuit of the control unit 7 will be described as a work transfer method using the work transfer device A and the work transfer chuck C.

The method of transferring a work using the work transfer device A and the work transfer chuck C according to the embodiment of the present invention includes a process of receiving a work from the first substrate 10 to the transfer member 1 and the transfer member 1 The transfer process of the work from the to the second substrate 20 is included as a main process.

In the process of receiving the work, the adhesive portion 2 of the transfer member 1 is moved to the first holding portion 11 of the first substrate 10 according to the relative movement of the first substrate 10 and the transfer member 1. And moving the reaction force support part 3 of the transfer member 1 toward the first receiving surface 10b of the first substrate 10 and moving the adhesive part 2 to a plurality of A contact process in which the plate-like work W is brought into contact and the reaction force support part 3 is brought into contact with the first receiving surface 10b, and a transfer process in which the transfer member 1 is separated from the first substrate 10 It includes.

In the approach movement process of the workpiece receiving process, the Z direction with respect to the plurality of plate-like workpieces W arranged on the first substrate 10 with the adhesive portion 2 of the transfer member 1 by the first folding driving portion 4 It is moving relatively close. Simultaneously with this, the reaction force support portion 3 of the transfer member 1 is relatively approached and moved in the Z direction with respect to the first receiving surface 10b of the first substrate 10.

In the contact process in the process of receiving the workpiece, the adhesive portion 2 of the transfer member 1 is brought into contact with the surface side W1 of the plurality of plate-like workpieces W by the first folding driving portion 4 thereafter (press contacting ) It is sticking. For this reason, the surface side W1 of the plurality of plate-like workpieces W is adhered and held to the adhesive surface 2a of the adhesive portion 2.

In addition, at the same time, the reaction force support portion 3 of the transfer member 1 is brought into contact with the first receiving surface 10b of the first substrate 10 (press contacting). For this reason, the relative approach movement of the further transfer member 1 and the first substrate 10 by the first folding drive unit 4 is stopped.

In the moving step of the work receiving process, the transfer member 1 is moved separately from the first substrate 10 by the first folding driving unit 4. At that time, since the adhesive force of the adhesive surface 2a is set to be stronger than the holding force of each plate-like work W of the first holding portion 11 of the first substrate 10, the adhesive portion of the first substrate 10 The rear side W2 of the plurality of plate-like workpieces W received in (2) is peeled from the first holding portion 11 of the first substrate 10, and the process of receiving the workpiece is completed.

In the process of transferring the work, the adhesive portion 2 of the transfer member 1 is moved to the second holding portion 21 of the second substrate 20 according to the approach movement of the transfer member 1 toward the second substrate 20. An approach moving process of moving the reaction force support part 3 of the transfer member 1 toward the second receiving surface 20b of the second substrate 20 and moving the adhesive part 2 to the second substrate A contact step of bringing the second holding part 21 in contact with the second holding part 21 of (20) and bringing the reaction force support part 3 in contact with the second receiving surface 20b, and the transfer member 1 from the second substrate 20 It includes a transfer process that is quarantined.

In the approach movement process of the workpiece transfer process, the second folding drive unit 6 holds the plurality of plate-like workpieces W received from the adhesive unit 2 of the transfer member 1 as a second of the second substrate 20 The part 21 is relatively approached and moved in the Z direction. At the same time, the reaction force support portion 3 of the transfer member 1 is relatively approached and moved in the Z direction with respect to the second receiving surface 20b of the second substrate 20.

In the contact process of the workpiece transfer process, the rear side of the plurality of plate-like workpieces W received from the adhesive surface 2a of the adhesive portion 2 of the transfer member 1 by the second folding driving portion 6 thereafter ( W2) is brought into contact with (press contacting) the second holding portion 21 of the second substrate 20 and adhered thereto. For this reason, the back side W2 of the plurality of plate-like workpieces W is adhered and held to the second holding portion 21 of the second substrate 20.

In addition, at the same time, the reaction force support portion 3 of the transfer member 1 is brought into contact with the second receiving surface 20b of the second substrate 20 (press contacting). For this reason, the relative approach movement of the further transfer member 1 and the second substrate 20 by the second folding driving unit 6 is stopped.

In the moving step of the work transfer process, the transfer member 1 is moved separately from the second substrate 20 by the second folding driving unit 6. At this time, the adhesive force of the adhesive surface 2a is set to be weaker than the holding force of each of the plate-like workpieces W of the second holding portion 21 of the second substrate 20. The adhesive portion 2 of the first substrate 10 is peeled off from the surface side W1 of the plurality of plate-shaped workpieces W adhered to the holding portion 21, and the workpiece transfer process is completed.

On the other hand, the adhesive portion 2 is compressed in the Z direction by contacting (press contacting) each plate-like work W according to the approaching movement of the transfer member 1 and the first substrate 10 or the second substrate 20 It deforms, but gradually approaches the elastic deformation limit of the adhesive portion 2 and finally reaches the elastic deformation limit. The adhesive portion (2) exceeding the elastic deformation limit cannot be compressed beyond that, and the approach movement after that becomes excessive pressing force and forcefully deforms the plate-like work (W), causing damage such as cracks or damage. It causes the occurrence of.

In order to solve such a problem, the deformation displacement when a compressive force is applied to the adhesive portion 2 due to the proximity movement of the transfer member 1 and the first substrate 10 or the second substrate 20 and the deformation displacement It is preferable to measure the correlation with the compression force obtained by measuring in advance, and to set the deformation displacement at the time of compression of the adhesive part 2 in an appropriate range based on this measured value. In other words, it is preferable to set the reaction force support portion 3 with respect to the adhesive portion 2 so that a difference in elevation occurs.

The compressive force of the adhesive portion 2 is that the distance between the transfer member 1 and the first substrate 10 is narrowed due to the approach movement by the first folding driving portion 4, and the adhesive surface 2a of the adhesive portion 2 It occurs by contacting the surface side W1 of the plurality of plate-like workpieces W. This compressive force is measured by installing a load sensor (not shown) such as a load cell on either the first substrate 10 or the transfer member 1 or by monitoring the driving torque of the first folding drive unit 4 It becomes possible.

However, in the case where the plurality of plate-like workpieces W are micro-elements such as micro LEDs, etc., since the contact area with the adhesive portion 2 is very small, the deformation displacement and compressive force during compression of the adhesive portion 2 are also small. So it is very difficult to detect.

Therefore, the work transfer device (A) and the work transfer chuck (C) according to the embodiment of the present invention have a reaction force support part (3) outside the adhesive part (2) on the transfer surface (1a) of the transfer member (1). And, as the transfer member 1 and the first substrate 10 approach and move, the adhesive surface 2a of the adhesive portion 2 abuts against the surface side W1 of the plurality of plate-like workpieces W. , The reaction force support 3 is brought into contact with the first receiving surface 10b of the first substrate 10. In this case, it is necessary to set the abutting area between the reaction force support part 3 and the first receiving surface 10b to an area that can be detected by a load sensor such as a load cell or the driving torque of the first folding drive unit 4. .

That is, by increasing the pressure receiving area of the adhesive portion 2 of the transfer member 1 with respect to the plurality of plate-like workpieces W of the first substrate 10, the compressive stress per unit area is reduced, and it is easy to generate reaction force at the same time. Lose.

This makes it possible to accurately detect the deformation displacement and compressive force during compression of the adhesive portion 2, and the deformation displacement during compression of the adhesive portion 2 can be set in an appropriate range based on the previously measured correlation. have.

Then, the function of disposing the reaction force support portion 3 outside the adhesive portion 2 on the transfer surface 1a of the transfer member 1 will be described.

In the approaching and moving step of the process of receiving the workpiece, even when it is difficult to obtain a reaction force such as when the adhesive portion 2 contacts a small number of plate-shaped workpieces (W), a small number of plate-shaped workpieces (W) and the adhesive portion ( After the contact of 2), by bringing the reaction force support part 3 into contact with the first receiving surface 10b of the first substrate 10, a clear reaction force is generated, and the contact displacement with a small number of plate-like workpieces W is accurately Becomes detectable.

For example, as in the "selective transfer method" shown in Figs. 2(a), (b) and 3(a) and (b), a small number of the plurality of plate-like workpieces W arranged on the first substrate 10 Even in the case where the adhesive surface 2a of the adhesive portion 2 is brought into contact with only the plate-like work W of the few, the adhesive surface of the adhesive portion 2 to the surface side W1 of the small number of plate-shaped workpieces W ( The contact displacement of 2a) can be accurately detected.

In the contact process during the process of receiving the workpiece, even if the adhesive portion 2 is excessively pressed against the plurality of plate-like workpieces W, the reaction force support portion 3 and the first reception against the pressure by the adhesive portion 2 By generating a reaction force due to the abutment of the surface 10b, it may become a compression resistance against the pressing pressure.

This makes it possible to prevent excessive compressive force with respect to each of the plate-like workpieces W, and prevent plastic deformation, cracks and fractures of the finely structured adhesive portion 2 in advance.

As shown in Fig. 9 in the approach movement process of the process of receiving the workpiece, even when the adhesive portion 2 moves in a non-parallel state with respect to the plurality of plate-shaped workpieces W, the plate-shaped workpiece W and the adhesive portion Before the contact of (2), the reaction force support portion 3 abuts against the first receiving surface 10b and receives the pressing force, whereby a reaction force is generated and occurrence of an abnormality in the pressing pressure can be accurately detected.

In the example shown in FIG. 9, the reaction force support portion 3 is formed in a frame shape along the outer edge of the transfer surface 1a of the transfer member 1. The reaction force of the reaction force support part 3 is initially moved by approaching and moving the adhesive surface 2a of the transfer member 1 and the reaction force support part 3 in an inclined state with respect to the first receiving surface 10b of the first substrate 10 The outer edge 3a' of the surface 3a abuts the first receiving surface 10b. For this reason, the inclination of the transfer member 1 with respect to the first substrate 10 can be detected beforehand.

In addition, when receiving or transferring each plate-like workpiece W by pressure welding of the adhesive portion 2, it is configured to propagate minute vibrations from the transfer member 1 to the adhesive surface 2a of the adhesive portion 2, etc. It is also possible to do.

In addition, there are fine irregularities on the surface side W1 of each plate-like work W, and even if each plate-like work W is a micro element such as a micro LED or a thin brittle platelet or a flat plate, the surface side W1 It is unchanged that there are fine irregularities. Similarly to this, the adhesion surface 2a of the adhesion portion 2 also has fine irregularities.

In addition, the adhesive material constituting the adhesive surface 2a is more flexible than the surface side W1 of each plate-like work W and is easily deformed.

For this reason, for the following reasons, at the time of contact by pressing the adhesive surface 2a of the adhesive portion 2 with the surface side W1 of the plurality of plate-like workpieces W arranged on the first substrate 10 ( In the contact process of the process of receiving the workpiece), the surface side (W1) of each plate-shaped workpiece (W) and the adhesive surface (2a) of the adhesive portion (2) are adhered to a greater strength than necessary, and during subsequent delivery ( It becomes difficult to peel in a contact process).

As a first reason for difficulty in peeling, the fine irregularities of the adhesive surface 2a of the adhesive portion 2 are elastically compressed and deformed by external pressing pressure, and air in the fine irregularities of the adhesive surface 2a is extruded. After the pressing pressure is released, since the fine irregularities on the adhesive surface 2a are restored (expanded) and deformed, a decompression space is generated between the fine irregularities on the surface side W1 of each plate-like work W and peeling off. It becomes difficult to do.

As a second reason for difficulty in peeling, the surface side W1 of each plate-like work W is buried in the flexible adhesion surface 2a of the adhesion portion 2 due to external pressing pressure. For this reason, the adhesive material of the adhesive surface 2a is wound around the outer peripheral edge part of each plate-like work W, and peeling becomes difficult.

Therefore, the operation of the work transfer device A and the work transfer chuck C according to the embodiment of the present invention can be "atmospheric operation" performed in an atmospheric atmosphere, but a "pressure reduction operation" performed in a reduced pressure atmosphere is preferable. Do.

In the case of "depressurization operation", as shown in Fig. 2 or 3, the work transfer device (A) is disposed inside the transformation chamber (B) in which the indoor pressure is adjustable, and the first folding drive unit (4) Receiving of each plate-like work W from the first substrate 10 to the transfer member 1, transfer of each plate-like work W by the transfer drive unit 5, and transfer by the second folding drive unit 6 It is preferable to transfer from the member 1 to the second substrate 20 in the interior of the transformer chamber B.

The transformation chamber B is formed inside a chamber (not shown) and has an actual pressure adjusting means (not shown) that adjusts the interior of the transformation chamber B from an atmospheric atmosphere to a reduced pressure atmosphere with a predetermined vacuum degree.

The actual pressure adjusting means is made of an exhaust source such as a vacuum pump, and is operated and controlled by the control unit 7.

As a control example of the actual pressure adjusting means, it is preferable to control the inside of the transformation chamber B in a first reduced pressure atmosphere that is lower than atmospheric pressure when receiving each plate-like work W. It is preferable to control at atmospheric pressure during transfer and transfer to the second substrate 20. At the time of peeling of the adhesive portion 2 from each of the plate-like work W, it is preferable to control the second decompression atmosphere equal to or lower than the first decompression atmosphere.

As a specific example of the first decompression atmosphere or the second decompression atmosphere, it is preferable to set the first decompression atmosphere to be about 90 Kpa, the second decompression atmosphere to about 80 Kpa, etc. from atmospheric pressure (about 101.3 KPa) P0 to about 10 Kpa.

According to the work transfer device A, the work transfer chuck C, and the work transfer method according to the embodiment of the present invention, the transfer member 1 and the first substrate 10 in the first folding drive unit 4 It approaches and moves toward the first substrate 10 (in the Z direction) from the separated first opposing position P1.

Thereby, the adhesive portion 2 (adhesive surface 2a) of the transfer member 1 abuts against a plurality of plate-like workpieces W (surface side W1), and according to the subsequent approach movement, the adhesive portion 2 ) Is compressed and transformed. In accordance with this compression deformation, the adhesive portion 2 (adhesive surface 2a) is continuously press-contacted to a plurality of plate-like workpieces W (surface side W1), so that the adhesive portion 2 (adhesive surface 2a) A plurality of plate-like workpieces W (surface side W1) are adhered and held.

The reaction force support part 3 abuts against the first receiving surface 10b of the first substrate 10 at approximately the same time as the work adhesion is maintained, and the further transfer member 1 and the first by the first folding driving part 4 The relative approach movement of the substrate 10 is stopped. For this reason, excessive compressive deformation of the adhesive portion 2 with respect to the plurality of plate-like workpieces W (surface side W1) is avoided, and an adhesive force corresponding to the thickness of each plate-like workpiece W is obtained.

Thereafter, in the first folding driving part 4, the transfer member 1 moves relatively isolated from the first substrate 10 (in the Z direction), and a plurality of transfer members 1 from the first surface 10a of the first substrate 10 The plate-like work W (back side side W2) is peeled. For this reason, a plurality of plate-like workpieces W are received by the transfer member 1 from the first substrate 10.

Therefore, when receiving the plurality of plate-like workpieces W from the first substrate 10 to the transfer member 1, excessive deformation of the plurality of plate-like workpieces W due to excessive pressure of the adhesive portion 2 Can be prevented.

As a result, compared to the conventional method in which only the surface of the adhesive material layer is compressed to the surface side of each element at the time of receiving each element, the surface of the adhesive material layer is compressed ) Can be received in the transfer member 1 without damage.

For this reason, even if the plurality of plate-like workpieces W are micro-elements such as micro LEDs or thin brittle platelets, the incidence of damage due to receipt of the workpieces is reduced, and the product yield is improved.

In addition, when the adhesive portion 2 and the reaction force support portion 3 are integrally molded or integrally formed of a homogeneous material, the adhesive portion 2 may be caused by wear due to deterioration of the adhesive portion 2 or a decrease in adhesive force or flatness. ) And the reaction force support (3) can be exchanged at the same time. Thereby, the maintenance and management of the adhesive part 2 and the reaction force support part 3 become easy, and the convenience is excellent.

In addition, when the reaction force support portion 3 is formed of a material that is harder than the constituent material of the adhesive portion 2, compared to the case where the reaction force support portion 3 is formed of the same soft material as the adhesive portion 2, Z Since the strain in the direction is small, it becomes possible to obtain a predetermined repulsive force even if the abutting area of the reaction force supporting portion 3 is relatively narrow. Thereby, the transfer surface 1a of the transfer member 1 can be made compact, and weight reduction is achieved.

In addition, as the transfer member 1 and the first substrate 10 approach movement, the adhesive surface 2a of the adhesive portion 2 abuts against the surface side W1 of the plurality of plate-like workpieces W, When the reaction force support portion 3 is brought into contact with the first receiving surface 10b of the first substrate 10, the deformation displacement and the compressive force at the time of compression of the adhesive portion 2 can be accurately detected. Thereby, the deformation displacement at the time of compression of the adhesive portion 2 can be set in an appropriate range based on the previously measured correlation, and the incidence of breakage of the plate-like work W can be reliably reduced.

In particular, the adhesive portion 2 of the transfer member 1 is moved from the first facing position (P1) to the second facing position (P3) in a direction crossing the opposite direction (Z direction) (X direction or Y direction) The transfer driving unit 5 and the adhesive unit 2 of the transfer member 1 relative to the second substrate 20 are moved from the second facing position (P3) to the opposite direction (Z direction) in a relatively approaching and isolated movement The second folding driving part 6 is provided, and the second surface 20a of the second substrate 20 faces the transfer member 1 and the holding part (the second It has a holding part) 21 and a second receiving surface 20b provided outside the holding part 21, and the control part 7 includes the transfer member 1 and the second folding driving part 6 2 Due to the relative approach movement of the substrate 20, a plurality of plate-like workpieces W received from the adhesive portion 2 abut against the holding portion (second holding portion) 21 of the second substrate 20 and adhered. While compressively deforming the part 2, the reaction force support part 3 abuts the second receiving surface 20b of the second substrate 20, and the transfer member 1 by the second folding driving part 6 It is preferable that the control is controlled to stop the relative approaching movement of the second substrate 20.

In this case, after receiving the plurality of plate-like workpieces W from the first substrate 10 to the transfer member 1, the transfer member 1 is transferred from the first opposing position P1 to the second It is conveyed toward the opposite position P3 (in the X direction or Y direction). Subsequently, the transfer member 1 moves toward the second substrate 20 (in the Z direction) from the second opposite position P3 away from the second substrate 20 by the second folding driving unit 6. .

Thereby, the plurality of plate-like workpieces W (rear side W2) received from the plurality of adhesive portions 2 of the transfer member 1 are held in the second substrate 20 (the second holding portion) ( 21), and a plurality of plate-like workpieces W (rear side W2) in pressure contact with the holding portion (second holding portion) 21 of the second substrate 20 according to the subsequent approach movement, 2 A plurality of plate-like workpieces W (rear side W2) are held (held) by adhesion or the like on the holding portion (second holding portion) 21 of the substrate 20.

At approximately the same time as the workpiece is held, the reaction force support portion 3 abuts the second receiving surface 20b of the second substrate 20, and further transfer members 1 and the second substrate by the second folding driving portion 6 The approach movement of (20) is stopped. For this reason, the excessive compressive deformation of the adhesive portion 2 with respect to the plurality of plate-shaped workpieces W (surface side W1) is avoided, and each plate-shaped workpiece W due to the excessive repulsive force of the adhesive portion 2 The (rear side W2) is not excessively pressed toward the holding portion (second holding portion) 21 of the second substrate 20.

After that, the transfer member 1 moves relatively isolated from the second substrate 20 (in the Z direction) in the second folding drive 6, and transfers from a plurality of plate-like workpieces W (surface side W1). The adhesive portion 2 (adhesive surface 2a) of the member 1 is peeled off. For this reason, a plurality of plate-like workpieces W are transferred from the transfer member 1 to the second substrate 20.

Therefore, at the time of transfer of the plurality of plate-like workpieces W from the transfer member 1 to the second substrate 20, the plurality of plate-like workpieces W due to excessive pressure of the adhesive portion 2 are unreasonable. It can prevent deformation.

As a result, compared to the conventional one in which only the surface of the adhesive material layer is compressed to the surface side of each element at the time of transfer of each element, the surface of the adhesive material layer is compressed and deformed, a plurality of plate-like workpieces (W) from the transfer member 1 Can be transferred to the second substrate 20 without damage.

For this reason, even if the plurality of plate-like workpieces W are micro-elements such as micro LEDs or thin brittle platelets, the incidence of breakage due to the transfer of the workpieces is reduced, and the product yield is improved.

In addition, the reaction force support portion 3 of the transfer member 1 faces parallel to the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20. It has (3a), and it is preferable to arrange|position so that the reaction force surface 3a may be parallel with the adhesion surface 2a of the adhesion part 2, and may surround the placement part of the adhesion part 2.

In this case, the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20 due to the relative approach movement of the transfer member 1 and the first substrate 10 ) By contacting the reaction force surface (3a) of the reaction force support unit (3), the transfer member (1) through the reaction force support unit (3) is generally posture along the first receiving surface (10b) or the second receiving surface (20b) Is controlled.

For this reason, the adhesive surface 2a of the adhesive portion 2 parallel to the reaction force surface 3a abuts in parallel with the plurality of plate-like workpieces W (surface side W1) and press-contacts.

Accordingly, it is possible to prevent the plurality of plate-like workpieces W from being unreasonably deformed due to excessive biasing of the adhesive portion 2 at the time of receiving or transferring the plurality of plate-like workpieces W.

As a result, when the adhesive portion 2 is made of an elastic material that has a large size error and is difficult to process with high precision, or a transfer member 1 for a plurality of plate-like workpieces W arranged on the first substrate 10 Even when the assembly accuracy of is inferior, a plurality of plate-like workpieces W can be pressed in parallel by the adhesive portion 2.

For this reason, the incidence of breakage due to the receipt of the work or transfer of the work is reliably reduced, and the product yield is further improved. Receiving can be reliably performed while reducing the incidence of damage, and the product yield is improved.

In addition, since the reaction force surface 3a is disposed so as to surround the placement portion of the adhesive portion 2, a relative approach movement of the transfer member 1 and the first substrate 10 results in a reaction force surface of the reaction force support unit 3 ( When 3a) contacts the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20, the adhesive portion 2 surrounded by the reaction force surface 3a The placement part (inner part) becomes airtight. In this airtight state, there is a possibility that the internal pressure of the inner portion surrounded by the reaction force surface 3a may increase excessively due to compression deformation of the adhesive portion 2.

Therefore, it is preferable to have a vent portion 3b communicating in and out of a portion where the adhesive portion 2 is placed in a part of the reaction force support portion 3. In this case, even if the internal pressure of the placement portion (inner portion) of the adhesive portion 2 surrounded by the reaction force surface 3a increases, it passes through the ventilation portion 3b and escapes to the outer portion, thereby preventing excessive internal pressure increase. I can.

In addition, the transfer member 1 and the adhesive portion 2 or the first substrate 10 or the second substrate 20 are disposed inside the transformation chamber B, and the transformation chamber B is a control unit 7 It has an actual pressure adjustment means that is operated and controlled at, and the control unit 7 has a pressure control chamber (B) that is lower than atmospheric pressure when receiving a plurality of plate-like workpieces (W) by the adhesive unit (2) by the actual pressure adjustment means. Controlled by the first reduced pressure atmosphere, and returned to atmospheric pressure at the time of transfer to the second substrate 20 by the second folding driving unit 6, and from the plurality of plate-like workpieces W by the second folding driving unit 6 At the time of peeling of the adhesive portion 2, it is preferable to control the pressure to a second pressure reducing atmosphere equal to or lower than that of the first pressure reducing atmosphere.

In this case, fine irregularities on the surface side (W1) of the plurality of plate-like workpieces (W) or the adhesive surface (2a) of the adhesive portion (2) are elastically compressed and deformed by the pressing pressure, or Even if the surface side (W1) of the plate-like work (W) is filled with the adhesion surface (2a) of the flexible adhesion part (2), and the adhesive material of the adhesion part (2) is wound around the outer peripheral edge of each plate-like work (W). Then, peeling does not become difficult.

Therefore, adhesion and peeling of a plurality of plate-like workpieces W can be performed more reliably by controlling the internal pressure of the transformer chamber B.

As a result, the plurality of plate-like workpieces W can be reliably received from the first substrate 10 and transferred to a predetermined position on the second substrate 20, thereby further improving the transfer accuracy.

In addition, in the embodiment of the exhibition, in the illustrated example, the case where the first substrate 10 is composed of a carrier substrate having a rectangular first surface 10a has been described, but is not limited thereto, and the first substrate 10 ) May be changed to an element formation wafer or the like.

In addition, although the case where the second substrate 20 is composed of a carrier substrate having a rectangular second surface 20a is described, it is not limited to this, and the second substrate 20 is mounted on a mounting substrate (a wiring substrate) or a circuit board. You may change it to etc.

Also in these cases, the same actions and advantages as those of the first and second embodiments described above are obtained.

A work transfer device
C work transfer chuck
1 transfer member
1a transfer surface
2 Adhesive part
2a adhesive side
3 reaction support
3a reaction surface
4 first folding driving part
5 Transfer drive
6 second folding driving part
7 control unit
10 first substrate
10a first surface
10b first receiving surface
20 second substrate
20a second surface
20b second receiving surface
21 maintenance part (2nd maintenance part)
P1 first opposing position
P2 receiving location
P3 second facing position
P4 delivery position
W plate work

Claims (5)

A work transfer device for receiving a plurality of plate-like workpieces including microelements arranged on a first substrate from the first substrate and transferring them to a predetermined position on a second substrate as a transfer destination,
A transfer member provided to be movable from a first facing position facing the first substrate to a second facing position facing the second substrate;
An adhesive portion provided on a transfer surface of the transfer member facing the plurality of plate-like workpieces arranged on the first substrate and having an adhesive surface elastically deformable in a direction opposite to the plurality of plate-like workpieces;
It is provided in a protruding shape toward a first receiving surface outside the plurality of plate-like workpieces on the first surface of the first substrate on the transfer surface of the transfer member outside the adhesive portion, and is harder than the adhesive surface A reaction force support having a reaction force surface,
A first folding driving part for relatively approaching and separating the adhesive part of the transfer member with respect to the first substrate in the opposite direction from the first opposite position;
And a control unit for operating and controlling the first folding driving unit,
The adhesive force of the adhesive surface is stronger than the holding force of each plate-like workpiece of the first holding portion of the first substrate, and is set weaker than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate,
The control unit is configured to compress and deform the adhesive surface against the plurality of plate-like workpieces by a relative approach movement between the transfer member and the first substrate by the first folding driving unit, and the plurality of plate-like workpieces And maintaining the adhesion, the reaction force surface abuts the first receiving surface of the first substrate according to the compression deformation of the adhesive surface, the relative access between the transfer member and the first substrate by the first folding driving unit A work transfer device, characterized in that it is controlled to stop the movement. The method according to claim 1,
A conveyance driving part for moving the adhesive part of the transfer member from the first opposite position to the second opposite position in a direction crossing the opposite direction,
And a second folding driving part for relatively approaching and separating the adhesive part of the transfer member with respect to the second substrate in the opposite direction from the second opposite position,
The second surface of the second substrate has a second holding portion of the plurality of plate-like workpieces provided to face the transfer member, and a second receiving surface provided outside the second holding portion,
The control unit, by the relative approach movement of the transfer member and the second substrate by the second folding driving unit, the plurality of plate-like workpieces received from the adhesive surface fit into the second holding unit of the second substrate. And compressively deform the adhesive surface, and the plurality of plate-like workpieces are held by the second holding portion, and the reaction force surface abuts against the second receiving surface of the second substrate according to the compression deformation of the adhesive surface. And control to stop a relative approach movement between the transfer member and the second substrate by the second folding driving unit. The method according to claim 2,
Arranged so that the reaction force surface faces parallel to the first receiving surface of the first substrate or the second receiving surface of the second substrate, parallel to the adhesive surface of the adhesive portion, and surrounds the placement portion of the adhesive portion Work transfer device, characterized in that. A work transfer chuck for receiving a plurality of plate-like workpieces including microelements arranged on a first substrate from the first substrate and transferring them to a predetermined position on a second substrate as a transfer destination,
From the first opposing position facing the first substrate toward the receiving position of the plurality of plate-like workpieces, while relatively approaching and moving from the receiving position toward the transfer position of the plurality of plate-shaped workpieces to the second substrate A transfer member provided to be movable,
An adhesive portion provided on a transfer surface of the transfer member facing the plurality of plate-like workpieces arranged on the first substrate and having an adhesive surface elastically deformable in a direction opposite to the plurality of plate-like workpieces;
It is provided in a protruding shape toward a first receiving surface outside the plurality of plate-like workpieces on the first surface of the first substrate on the transfer surface of the transfer member outside the adhesive portion, and is harder than the adhesive surface It has a reaction force support having a reaction force surface,
The adhesive force of the adhesive surface is stronger than the holding force of each plate-like workpiece of the first holding portion of the first substrate, and is set weaker than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate,
The adhesive surface is in contact with the plurality of plate-like workpieces and compressively deformed by a relative approach movement of the transfer member with respect to the first substrate from the first opposing position toward the receiving position, and the plurality of plate-shaped Keeps the work sticky,
The reaction force surface is in contact with the first receiving surface of the first substrate according to the compressive deformation of the adhesive surface at the receiving position,
The transfer member is a work transfer chuck, characterized in that the relative approach movement to the first substrate is stopped by the contact of the reaction force surface with respect to the first receiving surface. A work transfer method for receiving a plurality of plate-like workpieces including microelements arranged on a first substrate from the first substrate and transferring them to a predetermined position on a second substrate,
The adhesive portion provided on the transfer surface of the transfer member faces the plurality of plate-like workpieces arranged on the first substrate, and a reaction force support portion outside the adhesive portion on the transfer surface of the transfer member is provided. 1 An approach movement step of relatively approaching and moving the transfer member toward the first substrate while facing a first receiving surface outside the plurality of plate-like workpieces on the first surface of the substrate,
The reaction force support part of the transfer member while bringing an adhesive surface elastically deformable in a direction opposite to the plurality of plate-like workpieces in the adhesive portion of the transfer surface that has been relatively approached and moved to abut against the plurality of plate-like workpieces. A contact step of bringing a reaction force surface harder than the adhesive surface into contact with the first receiving surface of the first substrate,
A moving step of moving the transfer member to be isolated from the first substrate,
The adhesive force of the adhesive surface is stronger than the holding force of each plate-like workpiece of the first holding portion of the first substrate, and is set weaker than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate,
In the contacting step, the adhesive surface is compressed and deformed by contact with the plurality of plate-shaped workpieces, and the first substrate of the first substrate according to the compressive deformation of the adhesive surface while maintaining the adhesiveness of the plurality of plate-shaped workpieces. 1 A method of transferring a work, characterized in that by abutting the reaction force surface to the receiving surface, further movement of the transfer member to the first substrate is stopped.

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