TW202119507A - Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method - Google Patents

Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method Download PDF

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TW202119507A
TW202119507A TW109124562A TW109124562A TW202119507A TW 202119507 A TW202119507 A TW 202119507A TW 109124562 A TW109124562 A TW 109124562A TW 109124562 A TW109124562 A TW 109124562A TW 202119507 A TW202119507 A TW 202119507A
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substrate
plate
adhesive
transfer member
shaped workpieces
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TW109124562A
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Chinese (zh)
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TWI747389B (en
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横田道也
稲葉亮一
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日商信越工程股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention prevents excessive deformation of a plurality of plate-shaped workpieces due to excessive pressing of a bonding portion when the plurality of plate-shaped workpieces are received from a first substrate to a transfer member. The present invention is provided with: a transfer member provided so as to be movable from a first facing position to a second facing position; an adhesive part provided on the transfer surface of the transfer member and having an elastically deformable adhesive surface; a reaction force support section that is provided on the transfer surface further to the outside than the bonding section so as to protrude toward a first receiving surface further to the outside than the plurality of plate-shaped workpieces, and that has a hard reaction force surface; a first contact/separation drive unit that moves the bonding unit closer to and away from the first substrate; and a control unit for controlling the operation of the first contact separation drive unit, the control unit performing control so as to bond and hold the plurality of plate-shaped workpieces while the bonding surface comes into contact with the plurality of plate-shaped work pieces and is compressed and deformed by the approaching movement of the transfer member and the first substrate. The reaction force surface abuts against the first receiving surface of the first substrate and stops approaching movement.

Description

工件轉印裝置及工件轉印卡盤、以及工件轉印方法Workpiece transfer device, work piece transfer chuck, and work piece transfer method

本發明係有關一種用於從第一基板接收包括微型LED等微小元件之板狀的工件並將其交接到作為轉印對象的第二基板的特定位置之工件轉印裝置及用於工件轉印裝置之工件轉印卡盤、以及使用工件轉印裝置或工件轉印卡盤之工件轉印方法。The present invention relates to a workpiece transfer device for receiving a plate-shaped workpiece including micro LEDs and other small elements from a first substrate and transferring it to a specific position on a second substrate as a transfer target, and for workpiece transfer The workpiece transfer chuck of the device, and the workpiece transfer method using the workpiece transfer device or the workpiece transfer chuck.

以往，作為這種工件轉印方法有如下元件安裝方法，包括：元件分離步驟，維持複數個元件的排列狀態而將晶圓上以特定周期排列之複數個元件分離為各個元件；重排步驟，操作各自分離之元件並在臨時基板上將各元件進行重排；及轉印步驟，保持臨時基板上進行重排之狀態而將各元件轉印到安裝基板(例如，參閱專利文獻1)。 作為元件，並不限於微細至20μm角之LED晶片，包括薄膜晶體管等。 元件分離步驟中，在成為元件形成用晶圓之藍寶石基板平面地排列形成複數個元件之後，分離槽在各元件的周圍形成為方格狀，藉由分離槽維持排列狀態而分離為各個元件。 在重排步驟中使用之臨時基板(暫時保持用基板)的表面塗佈有黏著材料層，藉由藍寶石基板與暫時保持用基板的靠近移動，將黏著材料層的表面壓接於元件的表面側。藉由黏著材料層對該元件的表面側之壓接，黏著材料層的表面壓縮變形並黏著保持元件的表面側。 接著，藉由僅對複數個元件中所選擇之元件從藍寶石基板的背面以使脈衝紫外線雷射的雷射光束在表面側透射之方式照射，與藍寶石基板之間的接合力變弱。隨後，藉由從藍寶石基板拉開暫時保持用基板，從藍寶石基板僅剝離所選擇之元件並將其轉印到暫時保持用基板。 之後，將交接到暫時保持用基板之元件再轉印到另一個臨時基板。該另一個臨時基板亦與暫時保持用基板相同地具備黏著材料層，以與基於暫時保持用基板之轉印相同的方式進行再轉印。 轉印步驟中使用之安裝基板(配線用基板)上形成有配線電極，藉由使翻轉之另一個臨時基板靠近配線用基板而將元件壓接於配線電極，元件被牢牢地固定(電連接)於配線電極，以結束元件對安裝基板之安裝。 [先前技術文獻] [專利文獻]In the past, as this kind of workpiece transfer method, there are the following component mounting methods, including: a component separation step, maintaining the arrangement state of a plurality of components and separating a plurality of components arranged in a specific cycle on the wafer into individual components; a rearrangement step, Operate the separated components and rearrange the components on the temporary substrate; and in the transfer step, transfer the components to the mounting substrate while maintaining the rearranged state on the temporary substrate (for example, refer to Patent Document 1). As components, they are not limited to LED chips with an angle of 20μm, including thin film transistors. In the element separation step, after the sapphire substrate used as the element formation wafer is arranged in a plane to form a plurality of elements, the separation grooves are formed in a grid shape around each element, and the separation grooves maintain the alignment state to separate the individual elements. The surface of the temporary substrate (substrate for temporary holding) used in the rearrangement step is coated with an adhesive material layer, and the surface of the adhesive material layer is crimped to the surface side of the element by the close movement of the sapphire substrate and the substrate for temporary holding . By the pressure bonding of the adhesive material layer to the surface side of the element, the surface of the adhesive material layer is compressed and deformed and adheres to the surface side of the holding element. Then, by irradiating only the selected element among the plurality of elements from the back surface of the sapphire substrate so that the laser beam of the pulsed ultraviolet laser is transmitted on the surface side, the bonding force with the sapphire substrate is weakened. Subsequently, by pulling away the temporary holding substrate from the sapphire substrate, only the selected element is peeled from the sapphire substrate and transferred to the temporary holding substrate. After that, the component transferred to the temporary holding substrate is transferred to another temporary substrate. This other temporary substrate is also provided with an adhesive material layer like the substrate for temporary holding, and retransfer is performed in the same manner as the transfer based on the substrate for temporary holding. Wiring electrodes are formed on the mounting substrate (wiring substrate) used in the transfer step, and the component is crimped to the wiring electrode by bringing another temporary substrate that is turned over close to the wiring substrate, and the component is firmly fixed (electrically connected) ) On the wiring electrode to complete the installation of the component on the mounting substrate. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2002-118124號公報[Patent Document 1] JP 2002-118124 A

[發明所欲解決之問題][The problem to be solved by the invention]

微小元件中微細化之LED晶片為了顯示的小型化、高解析度化及成本降低而被小型化，而正努力將小型化之LED晶片高速/高精度地安裝。尤其，LED顯示器中使用之LED要求將稱為微型LED之尺寸為50μm×50μm以下且薄板狀(薄膜狀)的LED晶片整列形成為相鄰之晶片彼此的間隔小於1mm，且以幾μm的精度高速轉印LED晶片並進行安裝。 然而，專利文獻1中，在從晶圓將各元件接收到臨時基板等時或從臨時基板將各元件交接到另一個臨時基板等時，只有黏著材料層的表面壓接於各元件的表面側而使黏著材料層的表面壓縮變形，因此容易伴隨黏著材料層的表面的壓縮變形而在各元件的表面側施加過度的擠壓力。 詳細而言，對各元件施加黏著力而進行黏著保持時，需要藉由使黏著材料層壓縮變形一定量之壓縮力來獲得所需的黏著力。這種來自平面狀態的壓縮變形中的必要變形(位移)通常被稱為“壓縮餘量”等，若不將黏著材料層推壓到各元件的表面側而進行相當於壓縮餘量的壓縮變形，則無法獲得所需的黏著力。 成為黏著材料層之能夠壓縮變形(彈性變形)的黏著材料與金屬等剛體不同，因其尺寸誤差較大而難以進行高精度的加工，相對於各元件的表面側之壓縮變形量的微調極其困難。而且，依據黏著材料層的加工精度和臨時基板對晶圓之組裝精度，在完全平行的狀態下使臨時基板的黏著材料層朝向晶圓上的各元件靠近移動亦很困難。 因此，黏著材料層相對於各元件的表面側進行壓縮變形時，由於黏著材料層的加工精度和組裝精度等變化因素的影響，導致因過度的擠壓力致使各元件的表面側過分變形，存在容易發生破裂或崩碎等破損之問題。尤其在微小元件為脆性的薄晶片時，破損的發生率變高而成為降低成品率之原因。 [解決問題之技術手段]Miniaturized LED chips among micro-components have been miniaturized for display miniaturization, high resolution, and cost reduction, and efforts are being made to mount the miniaturized LED chips with high speed and high precision. In particular, LEDs used in LED displays require thin-plate-like (film-like) LED chips with a size of 50μm×50μm or less called micro LEDs to be aligned so that the distance between adjacent chips is less than 1mm and with an accuracy of several μm. High-speed transfer and installation of LED chips. However, in Patent Document 1, when each component is received from a wafer to a temporary substrate, etc., or when each component is transferred from the temporary substrate to another temporary substrate, etc., only the surface of the adhesive material layer is crimped on the surface side of each component Since the surface of the adhesive material layer is compressed and deformed, it is easy to apply an excessive pressing force on the surface side of each element along with the compressive deformation of the surface of the adhesive material layer. In detail, when the adhesive force is applied to each element for adhesive holding, it is necessary to obtain the required adhesive force by compressing and deforming the adhesive material layer by a certain amount of compression force. The necessary deformation (displacement) in the compression deformation from the plane state is usually called "compression allowance", etc. If the adhesive material layer is not pressed to the surface side of each element, the compression deformation equivalent to the compression allowance is performed , You can not get the required adhesion. Unlike rigid bodies such as metals, which can be compressed and deformed as the adhesive material layer, it is difficult to perform high-precision processing due to its large dimensional error, and it is extremely difficult to fine-tune the amount of compression deformation on the surface side of each element. . Moreover, depending on the processing accuracy of the adhesive material layer and the assembly accuracy of the temporary substrate to the wafer, it is also difficult to move the adhesive material layer of the temporary substrate closer to the components on the wafer in a completely parallel state. Therefore, when the adhesive material layer is compressed and deformed with respect to the surface side of each element, due to the influence of the processing accuracy and assembly accuracy of the adhesive material layer and other changing factors, the surface side of each element is excessively deformed due to excessive pressing force. It is prone to breakage problems such as cracking or chipping. In particular, when the micro device is a brittle thin wafer, the occurrence rate of breakage increases, which causes a decrease in yield. [Technical means to solve the problem]

為了解決這種課題，本發明之工件轉印裝置從第一基板接收前述第一基板上排列之包括微小元件之複數個板狀工件，並將其交接到作為轉印對象的第二基板的特定位置，前述工件轉印裝置的特徵為，具備：轉印構件，其從與前述第一基板對置之第一對置位置至與前述第二基板對置之第二對置位置移動自如地設置；黏著部，設置於與前述第一基板上排列之前述複數個板狀工件對置之前述轉印構件的轉印面，且具有能夠在與前述複數個板狀工件對置的方向上彈性變形的黏著面；反作用力支撐部，在前述轉印構件的前述轉印面中比前述黏著部更靠外側設置成向前述第一基板的第一表面中比前述複數個板狀工件更靠外側的第一接收面突出，且具有比前述黏著面硬質的反作用力面；第一接觸分離驅動部，使前述轉印構件的前述黏著部相對於前述第一基板從前述第一對置位置向前述對置方向相對地靠近移動及分離移動；及控制部，對前述第一接觸分離驅動部進行運行控制，前述黏著面的黏著力設定為比前述第一基板的第一保持部所具有之各板狀工件的保持力強且比前述第二基板的第二保持部所具有之前述各板狀工件的保持力弱，前述控制部如下進行控制：藉由基於前述第一接觸分離驅動部之前述轉印構件與前述第一基板的相對地靠近移動，前述黏著面與前述複數個板狀工件抵接而壓縮變形的同時黏著保持前述複數個板狀工件，伴隨前述黏著面的壓縮變形，前述反作用力面與前述第一基板的前述第一接收面抵接而停止基於前述第一接觸分離驅動部之前述轉印構件與前述第一基板的相對地靠近移動。 而且，為了解決這種課題，本發明所涉及的工件轉印卡盤從第一基板接收前述第一基板上排列之包括微小元件之複數個板狀工件，並將其交接到作為轉印對象的第二基板的特定位置，前述工件轉印卡盤的特徵為，具備：轉印構件，設置成在從與前述第一基板對置之第一對置位置朝向前述複數個板狀工件的接收位置相對地靠近移動的同時，從前述接收位置朝向將前述複數個板狀工件交接至前述第二基板之交接位置移動自如；黏著部，設置於與前述第一基板上排列之前述複數個板狀工件對置之前述轉印構件的轉印面，且具有能夠在與前述複數個板狀工件對置的方向上彈性變形的黏著面；及反作用力支撐部，在前述轉印構件的前述轉印面中比前述黏著部更靠外側設置成朝向前述第一基板的第一表面中比前述複數個板狀工件更靠外側的第一接收面突出，且具有比前述黏著面硬質的反作用力面；前述黏著面的黏著力設定為比前述第一基板的第一保持部所具有之各板狀工件的保持力強且比前述第二基板的第二保持部所具有之前述各板狀工件的保持力弱，前述黏著面藉由前述轉印構件從前述第一對置位置朝向前述接收位置之相對於前述第一基板之相對地靠近移動，與前述複數個板狀工件抵接而壓縮變形的同時黏著保持前述複數個板狀工件，前述反作用力面伴隨前述接收位置上前述黏著面的壓縮變形，與前述第一基板的前述第一接收面抵接，前述轉印構件藉由前述反作用力面對前述第一接收面的抵接而停止對前述第一基板之相對地靠近移動。 又，為了解決這種課題，本發明所涉及的工件轉印方法，從第一基板接收前述第一基板上排列之包括微小元件之複數個板狀工件，並將其交接到第二基板的特定位置，前述工件轉印方法的特徵為，包括：靠近移動步驟，使設置於轉印構件的轉印面之黏著部與前述第一基板上排列之前述複數個板狀工件對置的同時，在前述轉印構件的前述轉印面中比前述黏著部更靠外側的反作用力支撐部與前述第一基板的第一表面中比前述複數個板狀工件更靠外側的第一接收面對置之狀態下，使前述轉印構件朝向前述第一基板相對地靠近移動；抵靠步驟，使相對地靠近移動之前述轉印面的前述黏著部中能夠在與前述複數個板狀工件對置的方向上彈性變形的黏著面與前述複數個板狀工件抵接的同時，使前述轉印構件的前述反作用力支撐部中比前述黏著面硬質的反作用力面與前述第一基板的前述第一接收面抵接；及分離移動步驟，使前述轉印構件從前述第一基板分離移動，前述黏著面的黏著力設定為比前述第一基板的第一保持部所具有之各板狀工件的保持力強且比前述第二基板的第二保持部所具有之前述各板狀工件的保持力弱，前述抵靠步驟中，藉由與前述複數個板狀工件的抵接，前述黏著面壓縮變形並黏著保持前述複數個板狀工件的同時，藉由伴隨前述黏著面的壓縮變形之前述反作用力面對前述第一基板的前述第一接收面的抵接而停止前述轉印構件向前述第一基板的進一步的靠近移動。In order to solve this problem, the work transfer device of the present invention receives from the first substrate a plurality of plate-shaped workpieces including micro-elements arranged on the first substrate, and transfers them to the specified second substrate as the transfer target. Position. The work transfer device is characterized by including: a transfer member that is movably provided from a first opposed position opposed to the first substrate to a second opposed position opposed to the second substrate The adhesive portion is provided on the transfer surface of the transfer member facing the plurality of plate-shaped workpieces arranged on the first substrate, and has an elastically deformable in the direction facing the plurality of plate-shaped workpieces Adhesive surface; a reaction force support portion, in the transfer surface of the transfer member, is arranged more outside than the adhesion portion to the first surface of the first substrate that is more outside than the plurality of plate-shaped workpieces The receiving surface is protruding and has a reaction force surface that is harder than the adhesive surface; a first contact separation driving portion that causes the adhesive portion of the transfer member to move from the first opposing position to the opposing direction with respect to the first substrate Relatively close movement and separation movement; and a control unit that controls the operation of the first contact and separation drive unit, and the adhesion force of the adhesion surface is set to be higher than that of each plate-shaped workpiece of the first holding portion of the first substrate The holding force is stronger and weaker than the holding force of each of the plate-shaped workpieces possessed by the second holding portion of the second substrate, and the control portion controls as follows: the transfer member and the transfer member based on the first contact separation drive portion The relatively close movement of the first substrate, the adhesive surface abuts the plurality of plate-shaped workpieces and compressively deforms while adhering and holding the plurality of plate-shaped workpieces. Accompanying the compression deformation of the adhesive surface, the reaction force surface and the aforementioned The first receiving surface of the first substrate abuts to stop the relatively close movement of the transfer member and the first substrate based on the first contact separation driving portion. Furthermore, in order to solve this problem, the work transfer chuck according to the present invention receives from the first substrate a plurality of plate-shaped work including micro-elements arranged on the first substrate, and transfers them to the transfer target The specific position of the second substrate, and the work transfer chuck is characterized by comprising: a transfer member provided to move from a first opposing position opposed to the first substrate toward the receiving position of the plurality of plate-shaped workpieces While moving relatively close, move freely from the receiving position toward the transfer position for transferring the plurality of plate-shaped workpieces to the second substrate; the adhesive part is provided on the plurality of plate-shaped workpieces arranged on the first substrate Opposing the transfer surface of the transfer member, and has an adhesive surface that can be elastically deformed in a direction facing the plurality of plate-shaped workpieces; and a reaction force support portion, which is larger than the transfer surface of the transfer member The adhesive part is arranged further to the outside so as to protrude toward the first receiving surface of the first surface of the first substrate, which is further outside than the plurality of plate-shaped workpieces, and has a reaction force surface that is harder than the adhesive surface; the adhesive surface The adhesion force of is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and weaker than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate, The adhesive surface moves relatively close to the first substrate from the first opposing position toward the receiving position by the transfer member, abuts against the plurality of plate-shaped workpieces and compresses and deforms while adhering and holding the For a plurality of plate-shaped workpieces, the reaction force surface is in contact with the first receiving surface of the first substrate in accordance with the compression and deformation of the adhesive surface at the receiving position, and the transfer member faces the first receiving surface by the reaction force. The contact of the receiving surface stops the relatively close movement of the first substrate. In addition, in order to solve this problem, the workpiece transfer method according to the present invention receives a plurality of plate-shaped workpieces including micro-elements arranged on the first substrate from the first substrate, and transfers them to the specified second substrate. Position, the work piece transfer method is characterized in that it includes the step of moving closer to the transfer surface of the transfer member, while facing the plurality of plate-shaped work pieces arranged on the first substrate. In the state where the reaction force support portion on the transfer surface of the transfer member that is more outside than the adhesion portion and the first receiving surface on the first surface of the first substrate that is more outside than the plurality of plate-shaped workpieces , The transfer member is moved relatively close to the first substrate; in the step of abutting, the adhesive portion relatively close to the moving transfer surface can be elastically deformed in a direction facing the plurality of plate-shaped workpieces While the adhesive surface is in contact with the plurality of plate-shaped workpieces, the reaction force surface of the reaction force support portion of the transfer member, which is harder than the adhesive surface, is in contact with the first receiving surface of the first substrate; And the step of separating and moving, the transfer member is separated and moved from the first substrate, and the adhesive force of the adhesive surface is set to be stronger than the holding force of each plate-shaped workpiece possessed by the first holding portion of the first substrate and higher than that of the foregoing The second holding portion of the second substrate has a weak holding force for each of the plate-shaped workpieces. In the step of abutting, by abutting against the plurality of plate-shaped workpieces, the adhesive surface is compressed and deformed to adhere and hold the plurality of plate-shaped workpieces. At the same time as a plate-shaped workpiece, the further approach of the transfer member to the first substrate is stopped by the abutment of the first receiving surface of the first substrate by the reaction force accompanying the compression and deformation of the adhesive surface mobile.

以下，依據附圖對本發明的實施形態進行詳細說明。 如圖1～圖8所示，本發明的實施形態之工件轉印裝置A為用於從第一基板10接收並保持(把持)第一基板10上排列之複數個板狀工件W，輸送至作為轉印對象的第二基板20之後，將其交接到第二基板20的特定位置的輸送卡盤裝置。尤其，為藉由在真空氣氛或減壓氣氛下亦能夠利用的黏著構件，將複數個板狀工件W保持(把持)得裝卸自如之黏著型輸送卡盤裝置。 亦即，本發明的實施形態之工件轉印裝置A亦能夠配置於室內壓力可調的變壓室B的內部，並具備工件轉印卡盤C。 詳細而言，本發明的實施形態之工件轉印裝置A及工件轉印卡盤C作為主要的構成要件，具備：轉印構件1，設置成從與第一基板10對置之第一對置位置P1朝向接收位置P2相對地移動自如；黏著部2，設置於與第一基板10上排列之複數個板狀工件W對置之轉印構件1的轉印面1a；及反作用力支撐部3，設置於轉印構件1的轉印面1a中比黏著部2更靠外側。 此外，本發明的實施形態之工件轉印裝置A作為主要的構成要件，具備：第一接觸分離驅動部4，使轉印構件1的黏著部2從第一對置位置P1朝向第一基板10相對地靠近移動及分離移動；輸送驅動部5，其使轉印構件1從第一對置位置P1至與第二基板20對置之第二對置位置P3移動；第二接觸分離驅動部6，使轉印構件1的黏著部2從第二對置位置P3朝向第二基板20相對地靠近移動及分離移動；及控制部7，對第一接觸分離驅動部4等進行運行控制。 另外，轉印構件1通常相對於第一基板10或第二基板20配置成在上下方向上對置，以下，將上下的對置方向稱為“Z方向”。以下，將順著與Z方向交叉之第一基板10或第二基板20之方向稱為“XY方向”。Hereinafter, embodiments of the present invention will be described in detail based on the drawings. As shown in FIGS. 1 to 8, the workpiece transfer device A of the embodiment of the present invention is used to receive and hold (hold) a plurality of plate-shaped workpieces W arranged on the first substrate 10 from the first substrate 10, and transport them to After the second substrate 20 as the transfer target, it is transferred to a transport chuck device at a specific position of the second substrate 20. In particular, it is an adhesive transport chuck device that holds (holds) a plurality of plate-shaped workpieces W by an adhesive member that can be used even in a vacuum atmosphere or a reduced pressure atmosphere. That is, the work transfer device A of the embodiment of the present invention can also be arranged in the variable pressure chamber B in which the indoor pressure is adjustable, and includes the work transfer chuck C. In detail, the work transfer device A and the work transfer chuck C according to the embodiment of the present invention, as main constituent elements, include: a transfer member 1 provided so as to be opposite to the first substrate 10 The position P1 is relatively free to move toward the receiving position P2; the adhesive part 2 is provided on the transfer surface 1a of the transfer member 1 opposed to the plurality of plate-shaped workpieces W arranged on the first substrate 10; and the reaction force support part 3, The transfer surface 1a of the transfer member 1 is provided on the outside of the adhesive portion 2. In addition, the work transfer device A according to the embodiment of the present invention, as a main component, includes: a first contact separation driving unit 4 that causes the adhesion portion 2 of the transfer member 1 to face the first substrate 10 from the first opposing position P1 Relatively approaching and separating movement; conveying driving part 5, which moves the transfer member 1 from the first opposing position P1 to the second opposing position P3 opposite to the second substrate 20; the second contacting and separating driving part 6 , The adhesive part 2 of the transfer member 1 is moved closer and separated from the second opposing position P3 toward the second substrate 20; and the control part 7 controls the operation of the first contact separation driving part 4 and the like. In addition, the transfer member 1 is usually arranged to face the first substrate 10 or the second substrate 20 in the vertical direction. Hereinafter, the vertical facing direction is referred to as the “Z direction”. Hereinafter, the direction along the first substrate 10 or the second substrate 20 that crosses the Z direction is referred to as "XY direction".

複數個板狀工件W至少其表面側W1形成為平滑的大致矩形(包括長方形及正方形在內之直角的四邊形)的薄板狀或薄膜狀，且在第一基板10的第一表面10a排列複數個板狀工件W。 作為複數個板狀工件W的具體例，主要可列舉被稱為微型LED之50μm×50μm以下，詳細而言為30μm×30μm以下，更詳細而言為幾十μm角的LED晶片、或其他微型器件等微細化之微小元件等。 該微小元件中還包括玻璃或薄膜元件等形狀極薄的脆性小板。 又，作為複數個板狀工件W的其他例，亦能夠包括小於100μm角的微小元件、或微小元件以外的微細的平板體、或例如300μm角等LED晶片等一般尺寸的工件。 圖示例的情況下，複數個板狀工件W均設定為相同的尺寸。The plurality of plate-like workpieces W are formed into a smooth, substantially rectangular (right-angled quadrilateral including rectangles and squares) thin plates or films at least on the surface side W1, and a plurality of them are arranged on the first surface 10a of the first substrate 10 Plate-shaped workpiece W. As a specific example of a plurality of plate-shaped workpieces W, there are mainly 50μm×50μm or less called micro LEDs, more specifically 30μm×30μm or less, more specifically, LED chips with an angle of several tens of μm, or other micro LED chips. Miniaturized components such as devices. The tiny components also include extremely thin fragile plates such as glass or thin-film components. In addition, as other examples of the plurality of plate-shaped workpieces W, micro elements with an angle of less than 100 μm, fine flat bodies other than micro elements, or general-sized workpieces such as LED wafers such as a 300 μm angle can also be included. In the case of the illustrated example, a plurality of plate-shaped workpieces W are all set to the same size.

成為本發明的現有技術之日本特開2002-118124號記載的元件安裝方法中，元件形成用晶圓(藍寶石基板)上以特定的周期排列形成有複數個元件(一個邊為5μm～100μm左右的發光二極體)，並且維持複數個元件的排列狀態而分離為各個元件。 而且，日本特開2002-118124號記載的元件安裝方法中，對各自分離之元件進行操作來將各元件進行重排之重排步驟包括以相當於周期的整數倍之間隔斷斷續續地選擇元件來進行重排之間拔選擇順序，保持重排之狀態而將各元件轉印到安裝基板之轉印步驟包括將所選擇之元件轉印到安裝基板的一部分之局部轉印順序。 將複數個元件安裝於安裝基板時，採用反覆進行間拔選擇順序和局部轉印順序之選擇轉印方式。 間拔選擇順序中，僅將所排列之複數個元件中所選擇之元件臨時轉印到臨時基板(暫時保持用基板)來進行重排，局部轉印順序中，將臨時轉印於臨時基板(暫時保持用基板)之元件再轉印到另一個臨時基板，最終從另一個臨時基板正式轉印到安裝基板(配線用基板)。In the component mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, which is the prior art of the present invention, a plurality of components (one side of about 5 μm to 100 μm) are formed on a wafer (sapphire substrate) for component formation in a specific period. Light-emitting diodes), and maintain the arrangement of a plurality of elements to separate into individual elements. Furthermore, in the component mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, the rearrangement step of rearranging the components by manipulating the separated components includes intermittently selecting components at intervals equivalent to integer multiples of the cycle. The selection sequence is selected between rearrangement, and the transfer step of transferring each component to the mounting substrate while maintaining the rearranged state includes a partial transfer sequence of transferring the selected component to a part of the mounting substrate. When multiple components are mounted on the mounting substrate, a selective transfer method of repeated thinning selection sequence and partial transfer sequence is adopted. In the thinning selection sequence, only the selected component among the arranged plural components is temporarily transferred to the temporary substrate (substrate for temporary holding) for rearrangement. In the partial transfer sequence, the temporary transfer is temporarily transferred to the temporary substrate ( The components of the temporary holding substrate) are transferred to another temporary substrate, and finally the other temporary substrate is officially transferred to the mounting substrate (wiring substrate).

本發明中複數個板狀工件W相當於上述日本特開2002-118124號記載的元件安裝方法中的“複數個元件”，本發明的轉印構件1相當於“臨時基板(暫時保持用基板)”或“另一個臨時基板”。本發明的第一基板10相當於“元件形成用晶圓(藍寶石基板)”等。 亦即，本發明中所稱之第一基板10並不僅限於如圖1～圖8所示其至少表面側由藍寶石或砷化鎵等構成之元件形成用晶圓，還包括工件輸送用載流子基板。 第一基板10中與後述轉印構件1在Z方向上對置之第一表面10a具有將各自分離之複數個板狀工件W臨時固定為裝卸自如之第一保持部11。第一保持部11設置於第一表面10a中內側部位。因此，相對於第一表面10a的內側部位，複數個板狀工件W藉由第一保持部11保持為在X方向或Y方向上以特定的周期排列之狀態下無法移動。 而且，在第一表面10a中比第一保持部11更靠外側的部位設置有第一接收面10b。 作為第一基板10的具體例為圖示例時，由具有矩形的第一表面10a之載流子基板等構成，且在大致整個第一表面10a積層有成為第一保持部11之臨時固定層。在第一表面10a的內側部位，將複數個板狀工件W在X方向及Y方向上分別以特定的周期排列成方格狀。第一保持部(臨時固定層)11將由能夠伴隨雷射光等的照射而分離的UV固化樹脂等構成之黏著材料配置成朝向轉印構件1而能夠在Z方向上彈性變形地突出為較佳。 又，圖示例中，在第一保持部(臨時固定層)11的表面的外側部位一體形成有第一接收面10b。另外，作為其他例雖未圖示，但亦能夠僅在第一表面10a的內側部位積層成為第一保持部11之臨時固定層，並將第一表面10a的表面中的外側部位變更為第一接收面10b。The plural plate-shaped workpieces W in the present invention correspond to the "plural components" in the component mounting method described in Japanese Patent Application Laid-Open No. 2002-118124, and the transfer member 1 of the present invention corresponds to a "temporary substrate (substrate for temporary holding)" "Or "another temporary substrate". The first substrate 10 of the present invention corresponds to "a wafer for element formation (sapphire substrate)" or the like. That is, the first substrate 10 referred to in the present invention is not limited to the wafers for element formation whose at least the surface side is made of sapphire or gallium arsenide as shown in FIGS. 1 to 8, but also includes current carriers for workpiece transportation. Sub-substrate. The first surface 10a of the first substrate 10 that faces the transfer member 1 described later in the Z direction has a first holding portion 11 that temporarily fixes a plurality of plate-shaped workpieces W separated from each other in a detachable manner. The first holding portion 11 is provided on the inner side of the first surface 10a. Therefore, with respect to the inner part of the first surface 10a, the plurality of plate-shaped workpieces W are held by the first holding portion 11 so as to be unable to move while being arranged in the X direction or the Y direction in a specific period. In addition, a first receiving surface 10b is provided at a location on the outer side of the first holding portion 11 of the first surface 10a. When the specific example of the first substrate 10 is shown in the figure, it is composed of a carrier substrate having a rectangular first surface 10a, etc., and a temporary fixing layer that becomes the first holding portion 11 is laminated on substantially the entire first surface 10a . In the inner part of the first surface 10a, a plurality of plate-shaped workpieces W are arranged in a grid shape at a specific period in the X direction and the Y direction, respectively. The first holding portion (temporary fixing layer) 11 preferably disposes an adhesive material composed of UV curable resin or the like that can be separated by irradiation of laser light or the like so as to protrude toward the transfer member 1 so as to be elastically deformable in the Z direction. In the example shown in the figure, a first receiving surface 10b is integrally formed at an outer portion of the surface of the first holding portion (temporary fixing layer) 11. In addition, although not shown in the figure as another example, it is also possible to laminate only the inner part of the first surface 10a to become the temporary fixing layer of the first holding portion 11, and to change the outer part of the surface of the first surface 10a to the first Receiving surface 10b.

本發明中第二基板20相當於“安裝基板(配線用基板)”等。 亦即，本發明中所稱之第二基板20並不僅限於如圖2或圖3所示安裝基板(配線用基板)或電路基板，還包括工件輸送用載流子基板。 第二基板20中與後述轉印構件1在Z方向上對置之第二表面20a具有藉由轉印構件1輸送之複數個板狀工件W所抵接之第二保持部21。第二保持部21設置於第二表面20a中內側部位。因此，相對於第二基板20的第二表面20a，複數個板狀工件W藉由第二保持部21保持為維持從轉印構件1朝向X方向或Y方向以特定的周期排列之狀態而無法移動。 而且，在第二表面20a中比第二保持部21更靠外側設置有第二接收面20b。 作為第二基板20的具體例為圖示例時，由具有矩形的第二表面20a之載流子基板等構成，且在大致整個第二表面20a積層有成為第二保持部21之臨時固定層。第二保持部(臨時固定層)21將由漿糊等構成之黏著材料配置成能夠在Z方向上彈性變形地朝向轉印構件1突出為較佳。該臨時固定層的至少內側部位與日本特開2002-118124號記載的元件安裝方法的配線電極或接合用導電材料相同地，構成為被複數個板狀工件W的背面側W2壓接而在變形的同時起到電連接的作用。 又，圖示例中，在第二保持部(臨時固定層)21的表面中的外側部位一體形成有第二接收面20b。另外，作為其他例雖未圖示，但亦能夠僅在第二表面20a的內側部位積層成為第二保持部21之臨時固定層，並將第二表面20a的表面中的外側部位變更為第二接收面20b。In the present invention, the second substrate 20 corresponds to "mounting substrate (wiring substrate)" or the like. That is, the second substrate 20 referred to in the present invention is not limited to the mounting substrate (wiring substrate) or circuit substrate as shown in FIG. 2 or FIG. 3, but also includes a carrier substrate for workpiece transportation. The second surface 20 a of the second substrate 20 facing the transfer member 1 described later in the Z direction has a second holding portion 21 against which a plurality of plate-shaped workpieces W transported by the transfer member 1 abut. The second holding portion 21 is provided at an inner part of the second surface 20a. Therefore, with respect to the second surface 20a of the second substrate 20, the plurality of plate-shaped workpieces W are held by the second holding portion 21 in a state of being arranged in a specific period from the transfer member 1 toward the X direction or the Y direction. mobile. Furthermore, a second receiving surface 20b is provided on the outside of the second holding portion 21 in the second surface 20a. When the specific example of the second substrate 20 is shown in the figure, it is composed of a carrier substrate having a rectangular second surface 20a, etc., and a temporary fixing layer that becomes the second holding portion 21 is laminated on substantially the entire second surface 20a . The second holding portion (temporary fixing layer) 21 preferably arranges an adhesive material made of paste or the like so as to be elastically deformable in the Z direction and protrude toward the transfer member 1. At least the inner part of the temporary fixing layer is the same as the wiring electrode or the conductive material for bonding in the component mounting method described in JP 2002-118124, and is configured to be crimped by the back side W2 of a plurality of plate-shaped workpieces W and deformed At the same time play the role of electrical connection. In the example shown in the figure, the second receiving surface 20b is integrally formed in the outer part of the surface of the second holding portion (temporary fixing layer) 21. In addition, although not shown as another example, it is also possible to laminate only the inner part of the second surface 20a as the temporary fixing layer of the second holding portion 21, and to change the outer part of the surface of the second surface 20a to the second Receiving surface 20b.

作為本發明的第一實施形態之工件轉印裝置A及工件轉印卡盤C如圖1～圖7所示時，為在上述“選擇轉印方式”中採用之例。 “選擇轉印方式”中，首先作為“間拔選擇順序”，如圖2(a)所示，僅將第一基板10上排列之複數個板狀工件W中選擇之板狀工件W以保持其排列狀態而臨時轉印到後述轉印構件1的黏著部2並進行重排(接收)。接著，作為“局部轉印順序”，如圖2(b)所示，將在轉印構件1接收之板狀工件W朝向作為轉印對象的第二基板20輸送之後，再轉印到第二基板20的第二保持部21(交接)。接著，如圖3(a)、圖3(b)所示，反覆進行複數次“間拔選擇順序”和“局部轉印順序”。藉此，只有第一基板10上排列之複數個板狀工件W中所選擇之板狀工件W以相當於第一基板10中各板狀工件W的排列周期的整數倍之間隔斷斷續續地被接收，保持排列周期的整數倍的間隔狀態而交接到第二基板20並進行重排。 又，作為本發明的第二實施形態之工件轉印裝置A及工件轉印卡盤C如圖8所示時，為代替“選擇轉印方式”而採用“全面轉印方式”之例。 “全面轉印方式”中，如圖8(a)、圖8(c)所示，第一基板10上排列之複數個板狀工件W全部保持其排列狀態而被後述轉印構件1的黏著部2接收。接著，雖未圖示，朝向作為轉印對象的第二基板20輸送並交接。When the work transfer device A and the work transfer chuck C as the first embodiment of the present invention are shown in FIGS. 1 to 7, they are examples used in the above-mentioned "selective transfer method". In the "selection of transfer method", first as the "thinning selection order", as shown in FIG. 2(a), only the selected plate-shaped workpiece W among the plurality of plate-shaped workpieces W arranged on the first substrate 10 is maintained The aligned state is temporarily transferred to the adhesive portion 2 of the transfer member 1 described later and rearranged (received). Next, as the "partial transfer sequence", as shown in FIG. 2(b), the plate-shaped workpiece W received by the transfer member 1 is transported toward the second substrate 20 as the transfer target, and then transferred to the second substrate 20. The second holding portion 21 of the substrate 20 (transferring). Next, as shown in FIG. 3(a) and FIG. 3(b), the "thinning selection sequence" and the "partial transfer sequence" are repeated several times. Thereby, only the selected plate-shaped workpiece W among the plurality of plate-shaped workpieces W arranged on the first substrate 10 is intermittently received at intervals equivalent to an integer multiple of the arrangement period of each plate-shaped workpiece W in the first substrate 10 , Maintaining the interval state of an integer multiple of the arrangement period, and transferring to the second substrate 20 for rearrangement. In addition, when the work transfer device A and the work transfer chuck C as the second embodiment of the present invention are shown in FIG. 8, the "full transfer method" is used instead of the "select transfer method". In the "full transfer method", as shown in FIG. 8(a) and FIG. 8(c), the plurality of plate-shaped workpieces W arranged on the first substrate 10 are all kept in their aligned state and are adhered by the transfer member 1 described later.部2 Received. Next, although not shown, it is conveyed and delivered toward the second substrate 20 as a transfer target.

如圖1～圖8所示，轉印構件1例如為金屬、合成石英或陶瓷等剛體，且具有受控之平面度且均勻的厚度，藉此由形成為不翹曲(撓曲)變形的平板狀之平板等構成，且在其一面具有轉印面1a。 轉印構件1配設成使轉印面1a與第一基板10的第一保持部11或第二基板20的第二保持部21在Z方向上平行地對置，並且支撐為維持該平行狀態而在Z方向及XY方向上移動自如。 轉印構件1的轉印面1a依據第一基板10的第一表面10a或第二基板20的第二表面20a的形狀而形成為矩形等。 轉印面1a具有：黏著部2，配置成能夠在與複數個板狀工件W對置的方向(Z方向)上壓縮變形；及反作用力支撐部3，配置於比黏著部2更靠外側。As shown in Figures 1 to 8, the transfer member 1 is, for example, a rigid body such as metal, synthetic quartz, or ceramic, and has a controlled flatness and uniform thickness, thereby being formed to be non-warping (deflection) deformation It is composed of a flat plate or the like, and has a transfer surface 1a on one surface. The transfer member 1 is arranged so that the transfer surface 1a is opposed to the first holding portion 11 of the first substrate 10 or the second holding portion 21 of the second substrate 20 in parallel in the Z direction, and is supported to maintain the parallel state. It can move freely in the Z direction and XY direction. The transfer surface 1a of the transfer member 1 is formed into a rectangle or the like depending on the shape of the first surface 10a of the first substrate 10 or the second surface 20a of the second substrate 20. The transfer surface 1a has an adhesive part 2 arranged so as to be compressible and deformable in a direction (Z direction) facing a plurality of plate-shaped workpieces W, and a reaction force support part 3 arranged outside the adhesive part 2.

黏著部2由能夠在轉印構件1的厚度方向(Z方向)上彈性變形的材料形成於轉印面1a，在與第一基板10上排列之複數個板狀工件W的表面側W1在Z方向上平行地對置之前端面具有平滑的黏著面2a。 黏著部2的黏著面2a以與第一基板10的第一保持部11或第二基板20的第二保持部21在Z方向上對置之方式配置於前端面的內側部位，且具有特定的黏著力。黏著面2a的黏著力設定為比第一基板10的第一保持部11所具有之各板狀工件W的保持力強，且比第二基板20的第二保持部21所具有之各板狀工件W的保持力弱。藉此，能夠將來自第一保持部11的板狀工件W接收至黏著面2a，並且能夠從黏著面2a將板狀工件W交接到第二保持部21。 此外，如圖4(a)所示，藉由後述第一接觸分離驅動部4，轉印構件1朝向第一基板10在Z方向上相對地靠近移動，從而黏著部2的黏著面2a與複數個板狀工件W的表面側W1抵接。構成為藉由基於隨後的靠近移動之擠壓力，黏著部2在Z方向上壓縮變形。黏著部2對複數個板狀工件W的表面側W1之壓縮量設定為，藉由黏著面2a連續壓接而可獲得吊起各板狀工件W時所需的黏著力。 又，如圖4(b)所示，藉由後述第二接觸分離驅動部6，轉印構件1朝向第二基板20在Z方向上相對地靠近移動，從而複數個板狀工件W的背面側W2與第二基板20的第二保持部21抵接。構成為藉由基於隨後的靠近移動之擠壓力，黏著部2在Z方向上壓縮變形。黏著部2對複數個板狀工件W的表面側W1之壓縮量設定為，藉由黏著面2a連續壓接而可獲得對第二保持部21黏著各板狀工件W的背面側W2時所需的擠壓力。The adhesive portion 2 is formed on the transfer surface 1a of a material that can be elastically deformed in the thickness direction (Z direction) of the transfer member 1, and is arranged on the first substrate 10 on the surface side W1 of the plurality of plate-shaped workpieces W in the Z direction The upper end faces parallel to each other and has a smooth adhesive surface 2a. The adhesive surface 2a of the adhesive portion 2 is arranged on the inner side of the front end surface so as to face the first holding portion 11 of the first substrate 10 or the second holding portion 21 of the second substrate 20 in the Z direction, and has a specific Adhesion. The adhesive force of the adhesive surface 2a is set to be stronger than the holding force of each plate-shaped workpiece W possessed by the first holding portion 11 of the first substrate 10, and is set to be stronger than each plate-shaped workpiece W possessed by the second holding portion 21 of the second substrate 20 The holding force of the workpiece W is weak. Thereby, the plate-shaped workpiece W from the first holding portion 11 can be received to the adhesive surface 2a, and the plate-shaped workpiece W can be transferred to the second holding portion 21 from the adhesive surface 2a. In addition, as shown in FIG. 4(a), the transfer member 1 moves relatively close to the first substrate 10 in the Z direction by the first contact separation driving portion 4 described later, so that the adhesive surface 2a of the adhesive portion 2 is The surface side W1 of each plate-shaped workpiece W is in contact with each other. It is configured that the adhesive portion 2 is compressed and deformed in the Z direction by the pressing force based on the subsequent approaching movement. The amount of compression of the adhesive portion 2 on the surface side W1 of the plurality of plate-shaped workpieces W is set so that the adhesive force required for lifting each plate-shaped workpiece W can be obtained by continuous pressure bonding of the adhesive surface 2a. In addition, as shown in FIG. 4(b), the transfer member 1 moves relatively close to the second substrate 20 in the Z direction by the second contact separation driving portion 6 described later, so that the back side of the plurality of plate-shaped workpieces W W2 abuts on the second holding portion 21 of the second substrate 20. It is configured that the adhesive portion 2 is compressed and deformed in the Z direction by the pressing force based on the subsequent approaching movement. The amount of compression of the adhesive portion 2 on the surface side W1 of the plurality of plate-shaped workpieces W is set to be required when the second holding portion 21 is adhered to the back side W2 of each plate-shaped workpiece W by continuous pressure bonding of the adhesive surface 2a The squeezing force.

作為黏著部2的截面形狀，可列舉圖1～圖4等所示之凸形形狀、或如圖5(a)、圖5(b)所示之柱形形狀、或圖8(a)～圖8(c)所示之板形形狀等。 圖1～圖4等的凸形形狀中，沿轉印面1a積層形成黏著部2的基部2b，僅使黏著面2a從基部2b的一部分局部突出。圖5(a)、圖5(b)的柱形形狀中，在轉印面1a的一部分形成柱狀的黏著部2，且使黏著面2a’在其前端面從轉印面1a局部突出。圖8(a)～圖8(c)的板形形狀中，沿轉印面1a積層形成平板狀的黏著部2，且在其前端面具有平滑的黏著面2a”。 而且，黏著面2a的形狀在上述“選擇轉印方式”與“全面轉印方式”中不同。 亦即，圖1～圖7所示之“選擇轉印方式”中，黏著面2a以僅與第一基板10的第一保持部11上排列之複數個板狀工件W中選擇之板狀工件W對置之方式配置有複數個或一個。 圖示例中，將形成為與各板狀工件W的表面側W1大致相同尺寸之複數個黏著面2a配置成以相當於複數個板狀工件W的排列周期的整數倍之間隔斷斷續續地進行重排(間拔選擇順序)。另外，圖6(a)～圖6(c)及圖7(a)～圖7(c)所示之黏著部2的截面形狀為凸形形狀或柱形形狀中的任一種。 相對於此，圖8所示之“全面轉印方式”中，黏著部2以與第一基板10的第一保持部11上排列之複數個板狀工件W均對置之方式配置有複數個或一個。 圖示例中，黏著部2的截面形狀為平板形狀，配置有形成為覆蓋複數個板狀工件W的表面側W1全部之尺寸之一個黏著面2a。另外，作為其他例雖未圖示，但亦能夠將黏著部2的截面形狀從平板狀變更為凸形形狀或柱形形狀，並將形成為與各板狀工件W的表面側W1大致相同的尺寸之複數個黏著面2a以與第一基板10的第一保持部11上排列之複數個板狀工件W相同的周期排列成方格狀。Examples of the cross-sectional shape of the adhesive portion 2 include the convex shape shown in FIGS. 1 to 4, etc., or the columnar shape shown in FIGS. 5(a) and 5(b), or FIGS. 8(a) to 8(a). The plate shape shown in Figure 8(c), etc. In the convex shapes shown in FIGS. 1 to 4, the base portion 2b of the adhesive portion 2 is laminated along the transfer surface 1a, and only the adhesive surface 2a partially protrudes from a part of the base portion 2b. In the columnar shape of Figs. 5(a) and 5(b), a columnar adhesive portion 2 is formed in a part of the transfer surface 1a, and the adhesive surface 2a' partially protrudes from the transfer surface 1a at the front end surface thereof. In the plate shape of Figs. 8(a) to 8(c), a flat plate-shaped adhesive portion 2 is laminated along the transfer surface 1a, and the front end surface has a smooth adhesive surface 2a". In addition, the shape of the adhesive surface 2a is different between the "selective transfer method" and the "full transfer method" described above. That is, in the "selective transfer method" shown in FIGS. 1-7, the adhesive surface 2a is only aligned with the plate-shaped workpiece selected from the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the first substrate 10 There are a plurality of or one configuration of W in the opposite way. In the example shown in the figure, a plurality of adhesive surfaces 2a formed to be approximately the same size as the surface side W1 of each plate-shaped workpiece W is arranged to be intermittently repositioned at intervals corresponding to an integer multiple of the arrangement period of the plurality of plate-shaped workpieces W Row (the order of thinning selection). In addition, the cross-sectional shape of the adhesive portion 2 shown in FIGS. 6(a) to 6(c) and FIGS. 7(a) to 7(c) is either a convex shape or a columnar shape. In contrast, in the "full transfer method" shown in FIG. 8, the adhesive portion 2 is arranged so as to face the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the first substrate 10. Or one. In the illustrated example, the cross-sectional shape of the adhesive portion 2 is a flat plate shape, and an adhesive surface 2a formed to cover all the dimensions of the surface side W1 of the plurality of plate-shaped workpieces W is arranged. In addition, although not shown as another example, it is also possible to change the cross-sectional shape of the adhesive portion 2 from a flat shape to a convex shape or a columnar shape, and to be formed to be substantially the same as the surface side W1 of each plate-shaped workpiece W The plurality of adhesive surfaces 2a of the size are arranged in a grid at the same period as the plurality of plate-shaped workpieces W arranged on the first holding portion 11 of the first substrate 10.

反作用力支撐部3由變形率與成為黏著部2之能夠彈性變形的材料大致相同的軟質材料、或由變形率比成為黏著部2之能夠彈性變形的材料小的硬質材料形成於轉印面1a。反作用力支撐部3在與第一基板10的第一接收面10b或第二基板20的第二接收面20b在Z方向上平行地對置之前端面具有平滑的反作用力面3a。 反作用力面3a在轉印構件1的轉印面1a中比配置有黏著部2之內側部位更靠外側的部位與黏著部2的黏著面2a平行地配置。 如圖4(a)所示，反作用力面3a相對於第一接收面10b之突出量設定為，藉由後述第一接觸分離驅動部4，第一基板10與轉印構件1在Z方向上相對地靠近移動而兩者之間的第一間隔L1達到特定寸法時，不會因基於反作用力面3a與第一接收面10b的抵接之推斥力致使第一基板10與轉印構件1的第一間隔L1小於特定尺寸。詳細而言，藉由第一基板10與轉印構件1的相對地靠近移動，在黏著面2a與複數個板狀工件W的表面側W1抵接而使黏著部2在Z方向上壓縮變形特定量之時刻，停止黏著部2的壓縮變形。亦即，設定為藉由黏著部2在Z方向上的壓縮變形而在獲得吊起板狀工件W時所需的黏著力之時刻，防止黏著部2對複數個板狀工件W之過度的壓縮變形以獲得符合各板狀工件W的厚度之黏著力。 又，如圖4(b)所示，反作用力面3a相對於第二接收面20b之突出量設定為，藉由後述第二接觸分離驅動部6，轉印構件1與第二基板20在Z方向上相對地靠近移動而兩者之間的第二間隔L2達到特定寸法時，不會因基於反作用力面3a與第二接收面20b的抵接之推斥力致使轉印構件1與第二基板20的第二間隔L2小於特定尺寸。詳細而言，藉由轉印構件1與第二基板20的相對地靠近移動，複數個板狀工件W的背面側W2與第二基板20的第二保持部21抵接而使黏著部2在Z方向上壓縮變形特定量之時刻，停止黏著部2的壓縮變形。亦即，設定為藉由黏著部2在Z方向上壓縮變形而在獲得各板狀工件W的背面側W2黏著於第二保持部21時所需的擠壓力之時刻，防止黏著部2對複數個板狀工件W之過度的壓縮變形，從而獲得符合各板狀工件W的厚度之擠壓力。The reaction force support portion 3 is formed on the transfer surface 1 a of a soft material having a deformation rate substantially the same as that of the elastically deformable material used as the adhesive portion 2, or a hard material having a smaller deformation rate than the elastically deformable material used as the adhesive portion 2. The reaction force support portion 3 has a smooth reaction force surface 3a before its end face facing the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20 in parallel in the Z direction. The reaction force surface 3a is arranged in parallel with the adhesion surface 2a of the adhesion portion 2 at a location on the outer side of the transfer surface 1a of the transfer member 1 than the inner portion where the adhesion portion 2 is arranged. As shown in FIG. 4(a), the protrusion amount of the reaction force surface 3a with respect to the first receiving surface 10b is set such that the first substrate 10 and the transfer member 1 are in the Z direction by the first contact separation driving portion 4 described later When moving relatively close and the first interval L1 between the two reaches a certain dimension, the repulsive force based on the abutment between the reaction force surface 3a and the first receiving surface 10b will not cause the first substrate 10 and the transfer member 1 to become The first interval L1 is smaller than a certain size. In detail, due to the relatively close movement of the first substrate 10 and the transfer member 1, the adhesive surface 2a is in contact with the surface side W1 of the plurality of plate-shaped workpieces W, and the adhesive portion 2 is compressed and deformed in the Z direction. At the moment of measurement, the compression deformation of the adhesive portion 2 is stopped. That is, it is set to prevent excessive compression of the plurality of plate-like workpieces W by the adhesive portion 2 at the time when the adhesive force required for lifting the plate-shaped workpiece W is obtained by the compression deformation of the adhesive portion 2 in the Z direction Deformation to obtain an adhesive force that conforms to the thickness of each plate-shaped workpiece W. In addition, as shown in FIG. 4(b), the protrusion amount of the reaction force surface 3a with respect to the second receiving surface 20b is set so that the transfer member 1 and the second substrate 20 are at Z When the second interval L2 between the two reaches a certain dimension, the transfer member 1 and the second substrate will not be caused by the repulsive force based on the abutment between the reaction force surface 3a and the second receiving surface 20b. The second interval L2 of 20 is smaller than a certain size. In detail, due to the relatively close movement of the transfer member 1 and the second substrate 20, the back side W2 of the plurality of plate-shaped workpieces W abuts against the second holding portion 21 of the second substrate 20, and the adhesive portion 2 is in contact with The compression deformation of the adhesive part 2 is stopped at the time when the compression deformation is a certain amount in the Z direction. That is, it is set to prevent the adhesion of the adhesion portion 2 at the time when the pressing force required when the back side W2 of each plate-like workpiece W is adhered to the second holding portion 21 is obtained by compressing and deforming the adhesion portion 2 in the Z direction. Excessive compression and deformation of a plurality of plate-shaped workpieces W, thereby obtaining a pressing force corresponding to the thickness of each plate-shaped workpiece W.

而且，反作用力支撐部3配置成包圍在轉印構件1的轉印面1a配置有黏著部2之內側部位，且在反作用力支撐部3的一部分具有連通配置黏著部2之內側部位與外側部位之通氣道3b為較佳。 又，反作用力支撐部3中反作用力面3a的尺寸(面積)依據反作用力支撐部3的構成材料而不同。亦即，如圖1(c)及圖8(b)或圖6(a)、圖6(b)、圖6(c)所示，反作用力支撐部3的構成材料由與黏著部2相同材質的彈性材料一體成形或一體形成時，伴隨黏著部2的經時劣化而能夠同時更換黏著部2和反作用力支撐部3。 作為由軟質材料製成之反作用力支撐部3的形狀，可列舉圖1(c)及圖8(b)所示之梯形形狀、或圖6(a)所示之長尺矩形形狀、或圖6(b)所示之短尺矩形形狀、或圖6(c)所示之粗L字形等。 圖1(c)及圖8(b)的梯形形狀沿形成為矩形等之轉印面1a的外緣分散配置有複數個(4個)梯形的反作用力支撐構件31。在複數個反作用力支撐構件31之間且轉印面1a的角部配置有通氣道3b。圖6(a)的長尺矩形形狀中，複數個(4個)長尺矩形的反作用力支撐構件32在各自之間隔著通氣道3b而分散配置。圖6(b)的短尺矩形形狀中，複數個(8個)短尺矩形的反作用力支撐構件33在各自之間隔著通氣道3b而分散配置。圖6(c)的粗L字形中，複數個(4個)粗L字形的反作用力支撐構件34在各自之間隔著通氣道3b而配置。 另外，作為其他例雖未圖示，但亦能夠將反作用力支撐部3的形狀或數量等變更為圖示例以外的形狀或數量等。Furthermore, the reaction force support portion 3 is arranged to surround the inner part of the transfer surface 1a of the transfer member 1 where the adhesive part 2 is arranged, and a part of the reaction force support part 3 has a part of the inner part and the outer part where the adhesive part 2 is arranged to communicate with each other. Airway 3b is preferred. In addition, the size (area) of the reaction force surface 3 a in the reaction force support portion 3 differs depending on the constituent material of the reaction force support portion 3. That is, as shown in Fig. 1(c) and Fig. 8(b) or Fig. 6(a), Fig. 6(b), Fig. 6(c), the constituent material of the reaction force support part 3 is made of the same material as the adhesive part 2. When the elastic material of the material is integrally formed or integrally formed, the adhesive part 2 and the reaction force support part 3 can be replaced at the same time as the adhesive part 2 deteriorates over time. As the shape of the reaction force support portion 3 made of a soft material, the trapezoidal shape shown in Fig. 1(c) and Fig. 8(b), or the long rectangular shape shown in Fig. 6(a), or the figure The short rectangular shape shown in 6(b), or the thick L-shaped shape shown in Fig. 6(c), etc. In the trapezoidal shape of FIGS. 1(c) and 8(b), a plurality of (4) trapezoidal reaction force support members 31 are scattered along the outer edge of the transfer surface 1a formed into a rectangle or the like. Between the plurality of reaction force support members 31 and at the corners of the transfer surface 1a, air passages 3b are arranged. In the long rectangular shape of Fig. 6(a), a plurality of (4) long rectangular reaction force support members 32 are dispersedly arranged with the air passage 3b interposed therebetween. In the short rectangular shape of FIG. 6(b), a plurality of (8) short rectangular reaction force support members 33 are dispersedly arranged with the air passage 3b interposed therebetween. In the thick L-shape of Fig. 6(c), a plurality of (4) thick L-shaped reaction force support members 34 are arranged with the air passage 3b therebetween. In addition, although it is not shown as another example, the shape, number, etc. of the reaction force support part 3 can be changed to a shape, number, etc. other than the example shown in the figure.

又，反作用力支撐部3的構成材料為變形率比成為黏著部2之能夠彈性變形的材料小的硬質材料時，如圖7(a)、圖7(b)、圖7(c)所示，Z方向上的變形率較小，因此即使因反作用力支撐部3的形狀的小型化而縮小總接收面積，亦能夠獲得特定的推斥力。 作為由硬質材料製成之反作用力支撐部3的形狀，可列舉圖7(a)所示之直角矩形形狀、或圖7(b)所示之圓角形狀、或圖7(c)所示之細L字形等。 圖7(a)的直角矩形形狀中，複數個(4個)矩形形狀的反作用力支撐構件35在各自之間隔著通氣道3b而分散配置於轉印面1a的4個角。圖7(b)的圓角形狀中，複數個(8個)圓角形狀的反作用力支撐構件36在各自之間隔著通氣道3b而分散配置於轉印面1a的4個角與外緣的中間位置。圖7(c)的細L字形中，複數個(4個)細L字形的反作用力支撐構件37在各自之間隔著通氣道3b而分散配置。 另外，作為其他例雖未圖示，但亦能夠將反作用力支撐部3的形狀或數量等變更為圖示例以外的形狀或數量等。In addition, when the constituent material of the reaction force support portion 3 is a hard material with a smaller deformation rate than the elastically deformable material that becomes the adhesive portion 2, as shown in Fig. 7(a), Fig. 7(b), and Fig. 7(c) , The deformation rate in the Z direction is small, so even if the total receiving area is reduced due to the downsizing of the shape of the reaction force support portion 3, a specific repulsive force can be obtained. As the shape of the reaction force supporting portion 3 made of a hard material, a right-angled rectangular shape shown in Fig. 7(a), a rounded corner shape shown in Fig. 7(b), or a shape shown in Fig. 7(c) can be cited The thin L shape and so on. In the right-angled rectangular shape of FIG. 7(a), a plurality of (4) rectangular-shaped reaction force support members 35 are dispersedly arranged at 4 corners of the transfer surface 1a with the air passage 3b interposed therebetween. In the rounded shape of FIG. 7(b), a plurality of (8) rounded-cornered reaction force support members 36 are arranged dispersedly between the four corners and the outer edge of the transfer surface 1a with the air passage 3b therebetween. position. In the thin L-shape of FIG. 7(c), a plurality of (4) thin L-shaped reaction force support members 37 are dispersedly arranged with the air passage 3b therebetween. In addition, although it is not shown as another example, the shape, number, etc. of the reaction force support part 3 can be changed to a shape, number, etc. other than the example shown in the figure.

第一接觸分離驅動部4由使轉印構件1的黏著部2從轉印構件1遠離第一基板10之第一對置位置P1至黏著部2與第一基板10上排列之複數個板狀工件W的表面側W1抵接(壓接)之接收位置P2而在Z方向上相對地靠近移動及分離移動之致動器等構成。 成為第一接觸分離驅動部4之致動器等藉由後述控制部7被如下運行控制：使轉印構件1或第一基板10中的任一個或轉印構件1及第一基板10這兩者在轉印面1a(黏著面2a、反作用力面3a)與第一表面10a(第一保持部11、第一接收面10b)維持平行狀態之狀態下在Z方向上相對地靠近或遠離之方式移動。 藉由第一接觸分離驅動部4，轉印構件1的黏著部2如圖4(a)所示，從第一對置位置P1朝向接收位置P2靠近移動以接收複數個板狀工件W，結束接收之後從接收位置P2朝向第一對置位置P1分離移動。詳細而言，在接收位置P2，黏著部2的黏著面2a與複數個板狀工件W的表面側W1抵接(壓接)而使黏著部2壓縮變形。在大致相同的時刻，反作用力支撐部3與第一基板10的第一接收面10b抵接(壓接)而停止基於第一接觸分離驅動部4之轉印構件1與第一基板10的進一步的相對地靠近移動。 作為第一接觸分離驅動部4的具體例為圖1～圖8所示之例子時，使轉印構件1朝向第一基板10下降。 又，作為其他例雖未圖示，但能夠進行代替轉印構件1而升高第一基板10、或使轉印構件1及第一基板10這兩者相互靠近或分離移動等變更。The first contact separation driving portion 4 is formed from the first opposing position P1 of the transfer member 1 away from the first substrate 10 of the adhesive portion 2 of the transfer member 1 to a plurality of plates arranged on the adhesive portion 2 and the first substrate 10 The surface side W1 of the workpiece W is in contact with the receiving position P2 (crimping), and is composed of an actuator that moves relatively close and moves apart in the Z direction. The actuator, etc., which becomes the first contact separation driving section 4, is controlled by the control section 7 to be described later by operating either one of the transfer member 1 or the first substrate 10 or both the transfer member 1 and the first substrate 10 A method in which the transfer surface 1a (adhesive surface 2a, reaction force surface 3a) and the first surface 10a (first holding portion 11, first receiving surface 10b) are kept parallel to each other in the Z direction. mobile. By the first contact separation driving part 4, the adhesive part 2 of the transfer member 1 moves closer to the receiving position P2 from the first opposing position P1 as shown in FIG. 4(a) to receive a plurality of plate-shaped workpieces W, and the end After receiving, it moves away from the receiving position P2 toward the first opposing position P1. Specifically, at the receiving position P2, the adhesive surface 2a of the adhesive portion 2 abuts (press-contacts) the surface side W1 of the plurality of plate-shaped workpieces W, and the adhesive portion 2 is compressed and deformed. At approximately the same moment, the reaction force support portion 3 abuts (presses) the first receiving surface 10b of the first substrate 10, and stops further the transfer member 1 and the first substrate 10 based on the first contact separation driving portion 4 Move relatively close. When the specific example of the first contact separation driving unit 4 is the example shown in FIGS. 1 to 8, the transfer member 1 is lowered toward the first substrate 10. In addition, although not shown as another example, it is possible to make changes such as raising the first substrate 10 instead of the transfer member 1, or moving both the transfer member 1 and the first substrate 10 closer to or apart from each other.

輸送驅動部5為使轉印構件1的黏著部2從轉印構件1遠離第一基板10之第一對置位置P1至轉印構件1遠離第二基板20之第二對置位置P3而在與Z方向交叉之X方向或Y方向等上相對地移動之驅動源。 成為輸送驅動部5之驅動源由致動器等構成，藉由後述控制部7被如下運行控制：轉印構件1或分離配置之第一基板10與第二基板20中的任一個、或轉印構件1及第一基板10與第二基板20這兩者在X方向或Y方向等上相對地移動。 作為輸送驅動部5的具體例為圖1～圖8所示之例子時，僅使轉印構件1從第一基板10朝向第二基板20進行往復移動。 又，作為其他例雖未圖示，但亦能夠進行代替轉印構件1而使第一基板10和第二基板20移動、或使轉印構件1及第一基板10和第二基板20這兩者相互移動等變更。The conveying driving portion 5 is used to make the adhesive portion 2 of the transfer member 1 move from the first opposed position P1 of the transfer member 1 away from the first substrate 10 to the second opposed position P3 of the transfer member 1 away from the second substrate 20 A drive source that moves relative to the X direction or Y direction that crosses the Z direction. The drive source that becomes the conveying drive section 5 is composed of an actuator or the like, and is controlled by the control section 7 described later to operate as follows: the transfer member 1 or any one of the first substrate 10 and the second substrate 20 separately arranged, or the rotation The imprint member 1 and both the first substrate 10 and the second substrate 20 move relatively in the X direction, the Y direction, or the like. When the specific example of the conveying driving unit 5 is the example shown in FIGS. 1 to 8, only the transfer member 1 is reciprocated from the first substrate 10 toward the second substrate 20. As another example, although not shown in the figure, it is also possible to move the first substrate 10 and the second substrate 20 instead of the transfer member 1, or to move the transfer member 1 and the first substrate 10 and the second substrate 20. Changes such as the movement of each other.

第二接觸分離驅動部6由致動器等構成，該致動器使轉印構件1的黏著部2從轉印構件1遠離第二基板20之第二對置位置P3至由黏著部2接收之複數個板狀工件W的背面側W2與第二基板20抵接(壓接)之交接位置P4在Z方向上相對地靠近移動及分離移動。 成為第二接觸分離驅動部6之致動器等藉由後述控制部7被如下運行控制：使轉印構件1或第二基板20中的任一個或轉印構件1及第二基板20這兩者在轉印面1a(黏著面2a、反作用力面3a)與第二表面20a(第二保持部21、第二接收面20b)維持平行狀態之狀態下在Z方向上相對地靠近或分離之方式移動。 藉由第二接觸分離驅動部6而由轉印構件1的黏著部2接收之複數個板狀工件W，如圖4(b)所示，從第二對置位置P3朝向交接位置P4靠近移動而進行複數個板狀工件W的交接，結束交接之後從交接位置P4朝向第二對置位置P3分離移動。詳細而言，在交接位置P4，由黏著部2的黏著面2a接收之複數個板狀工件W的背面側W2與第二基板20的第二保持部21抵接(壓接)而使黏著部2壓縮變形。在大致相同的時刻，反作用力支撐部3與第二基板20的第二接收面20b抵接(壓接)而停止基於第二接觸分離驅動部6之轉印構件1與第二基板20進一步的相對地靠近移動。 作為第二接觸分離驅動部6的具體例為圖1～圖8所示之例子時，使轉印構件1朝向第二基板20下降。 又，作為其他例雖未圖示，但能夠進行代替轉印構件1而升高第二基板20、或使轉印構件1及第二基板20這兩者相互靠近或分離移動等變更。The second contact separation driving portion 6 is constituted by an actuator or the like that causes the adhesive portion 2 of the transfer member 1 to move from the second opposing position P3 of the transfer member 1 away from the second substrate 20 to being received by the adhesive portion 2. The transfer position P4 at which the back side W2 of the plurality of plate-shaped workpieces W and the second substrate 20 abut (press-bonded) relatively moves closer and apart in the Z direction. The actuator, etc., which becomes the second contact separation drive unit 6 is controlled by the control unit 7 described later to operate either one of the transfer member 1 or the second substrate 20 or both the transfer member 1 and the second substrate 20 A method in which the transfer surface 1a (adhesive surface 2a, reaction force surface 3a) and the second surface 20a (second holding portion 21, second receiving surface 20b) are kept parallel to each other in the Z direction. mobile. The plurality of plate-shaped workpieces W received by the adhesive portion 2 of the transfer member 1 by the second contact separation driving portion 6 move closer to the delivery position P4 from the second opposing position P3 as shown in FIG. 4(b) The transfer of a plurality of plate-shaped workpieces W is performed, and after the transfer is completed, the transfer position P4 is separated and moved toward the second opposing position P3. In detail, at the transfer position P4, the back side W2 of the plurality of plate-shaped workpieces W received by the adhesive surface 2a of the adhesive portion 2 abuts (press-bonds) the second holding portion 21 of the second substrate 20 to make the adhesive portion 2 Compression deformation. At approximately the same time, the reaction force supporting portion 3 abuts (crimps) the second receiving surface 20b of the second substrate 20 to stop further contact between the transfer member 1 and the second substrate 20 based on the second contact separation driving portion 6 Move relatively close. When the specific example of the second contact separation driving unit 6 is the example shown in FIGS. 1 to 8, the transfer member 1 is lowered toward the second substrate 20. In addition, although not shown as another example, it is possible to make changes such as raising the second substrate 20 instead of the transfer member 1 or moving both the transfer member 1 and the second substrate 20 closer to or apart from each other.

控制部7為具有除了與第一接觸分離驅動部4、輸送驅動部5和第二接觸分離驅動部6，還與變壓室B的室內壓力調整機構等電連接之控制電路(未圖示)之控制器。成為控制部7之控制器按照預先設定於控制電路之程式，以預先設定之定時依次分別進行運行控制。 以設定於控制部7的控制電路之程式為使用工件轉印裝置A及工件轉印卡盤C之工件轉印方法來進行說明。 基於本發明的實施形態之工件轉印裝置A及工件轉印卡盤C之工件轉印方法，作為主要的步驟包括從第一基板10將工件接收至轉印構件1的工件接收過程及從轉印構件1將工件交接至第二基板20的工件交接過程。The control unit 7 has a control circuit (not shown) that is electrically connected to the first contact separation drive unit 4, the transport drive unit 5, and the second contact separation drive unit 6, as well as the indoor pressure adjustment mechanism of the transformation chamber B, etc. The controller. The controller, which becomes the control unit 7, performs operation control sequentially and individually at preset timings in accordance with a program preset in the control circuit. The program of the control circuit set in the control section 7 will be described as a work transfer method using the work transfer device A and the work transfer chuck C. The workpiece transfer method of the workpiece transfer device A and the workpiece transfer chuck C based on the embodiment of the present invention includes the workpiece receiving process of receiving the workpiece from the first substrate 10 to the transfer member 1 and the slave transfer as the main steps. The process of transferring the workpiece to the second substrate 20 by the printing member 1.

工件接收過程包括：靠近移動步驟，使轉印構件1的黏著部2伴隨第一基板10及轉印構件1的相對地靠近移動而朝向第一基板10的第一保持部11靠近移動，並且使轉印構件1的反作用力支撐部3朝向第一基板10的第一接收面10b靠近移動；抵靠步驟，使黏著部2與複數個板狀工件W抵接並且使反作用力支撐部3與第一接收面10b抵接；及分離移動步驟，使轉印構件1從第一基板10分離移動。 工件接收過程的靠近移動步驟中，藉由第一接觸分離驅動部4使轉印構件1的黏著部2相對於第一基板10上排列之複數個板狀工件W在Z方向上相對地靠近移動。在大致相同的時刻，使轉印構件1的反作用力支撐部3相對於第一基板10的第一接收面10b在Z方向上相對地靠近移動。 工件接收過程的抵靠步驟中，藉由隨後的第一接觸分離驅動部4使轉印構件1的黏著部2與複數個板狀工件W的表面側W1抵接(壓接)而進行黏著。因此，複數個板狀工件W的表面側W1被黏著保持於黏著部2的黏著面2a。 而且，在大致相同的時刻，使轉印構件1的反作用力支撐部3與第一基板10的第一接收面10b抵接(壓接)。因此，基於第一接觸分離驅動部4之轉印構件1及第一基板10的進一步的相對地靠近移動停止。 工件接收過程的分離移動步驟中，藉由第一接觸分離驅動部4使轉印構件1從第一基板10分離移動。此時，黏著面2a的黏著力設定為比第一基板10的第一保持部11所具有之各板狀工件W的保持力強，因此由第一基板10的黏著部2接收之複數個板狀工件W的背面側W2從第一基板10的第一保持部11剝離而結束工件接收過程。The workpiece receiving process includes: an approaching moving step, making the adhesive portion 2 of the transfer member 1 move closer to the first holding portion 11 of the first substrate 10 along with the relative approaching movement of the first substrate 10 and the transfer member 1, and make The reaction force support portion 3 of the transfer member 1 moves closer to the first receiving surface 10b of the first substrate 10; in the abutting step, the adhesive portion 2 is brought into contact with the plurality of plate-shaped workpieces W and the reaction force support portion 3 is brought into contact with the first receiving surface 10b. A receiving surface 10b abuts; and a separating and moving step, which separates and moves the transfer member 1 from the first substrate 10. In the approaching movement step of the workpiece receiving process, the adhesion portion 2 of the transfer member 1 is moved relatively close to the plurality of plate-shaped workpieces W arranged on the first substrate 10 in the Z direction by the first contact separation driving portion 4 . At approximately the same time, the reaction force support portion 3 of the transfer member 1 is moved relatively close to the first receiving surface 10b of the first substrate 10 in the Z direction. In the abutment step of the workpiece receiving process, the adhesion portion 2 of the transfer member 1 is abutted (pressure-bonded) with the surface side W1 of the plurality of plate-shaped workpieces by the subsequent first contact separation driving portion 4 to perform adhesion. Therefore, the surface side W1 of a plurality of plate-shaped workpieces W is adhered and held on the adhesion surface 2a of the adhesion portion 2. Then, at approximately the same timing, the reaction force support portion 3 of the transfer member 1 is brought into contact (pressure contact) with the first receiving surface 10 b of the first substrate 10. Therefore, the further relative movement of the transfer member 1 and the first substrate 10 by the first contact separation driving portion 4 is stopped. In the separation and movement step of the workpiece receiving process, the transfer member 1 is separated and moved from the first substrate 10 by the first contact separation driving part 4. At this time, the adhesive force of the adhesive surface 2a is set to be stronger than the holding force of each plate-shaped workpiece W possessed by the first holding portion 11 of the first substrate 10. Therefore, the plurality of plates received by the adhesive portion 2 of the first substrate 10 The back side W2 of the shaped workpiece W is peeled off from the first holding portion 11 of the first substrate 10 to complete the workpiece receiving process.

工件交接過程包括：靠近移動步驟，伴隨轉印構件1朝向第二基板20之靠近移動而使轉印構件1的黏著部2朝向第二基板20的第二保持部21靠近移動，並且使轉印構件1的反作用力支撐部3朝向第二基板20的第二接收面20b靠近移動；抵靠步驟，使黏著部2與第二基板20的第二保持部21抵接且使反作用力支撐部3與第二接收面20b抵接；及分離移動步驟，使轉印構件1從第二基板20分離移動。 工件交接過程的靠近移動步驟中，藉由第二接觸分離驅動部6使由轉印構件1的黏著部2接收之複數個板狀工件W相對於第二基板20的第二保持部21在Z方向上相對地靠近移動。在大致相同的時刻，使轉印構件1的反作用力支撐部3相對於第二基板20的第二接收面20b在Z方向上相對地靠近移動。 工件交接過程的抵靠步驟中，藉由隨後的第二接觸分離驅動部6使由轉印構件1的黏著部2的黏著面2a接收之複數個板狀工件W的背面側W2與第二基板20的第二保持部21抵接(壓接)而進行黏著。因此，複數個板狀工件W的背面側W2黏著保持於第二基板20的第二保持部21。 接著，在大致相同的時刻，使轉印構件1的反作用力支撐部3與第二基板20的第一接收面20b抵接(壓接)。因此，基於第二接觸分離驅動部6之轉印構件1及第二基板20的進一步的相對地靠近移動停止。 工件交接過程的分離移動步驟中，藉由第二接觸分離驅動部6使轉印構件1從第二基板20分離移動。此時，黏著面2a的黏著力設定為比第二基板20的第二保持部21所具有之各板狀工件W的保持力弱，因此第一基板10的黏著部2從黏著保持於第二基板20的第二保持部21之複數個板狀工件W的表面側W1剝離而結束工件交接過程。The work transfer process includes: an approaching movement step, as the transfer member 1 moves closer to the second substrate 20, the adhesive portion 2 of the transfer member 1 moves closer to the second holding portion 21 of the second substrate 20, and transfers The reaction force support portion 3 of the member 1 moves closer to the second receiving surface 20b of the second substrate 20; in the abutting step, the adhesive portion 2 is brought into contact with the second holding portion 21 of the second substrate 20 and the reaction force support portion 3 Abutting with the second receiving surface 20b; and the separating and moving step, separating and moving the transfer member 1 from the second substrate 20. In the approaching moving step of the workpiece transfer process, the plurality of plate-shaped workpieces W received by the adhesive portion 2 of the transfer member 1 are positioned at Z relative to the second holding portion 21 of the second substrate 20 by the second contact separation driving portion 6 Move relatively close in the direction. At approximately the same time, the reaction force support portion 3 of the transfer member 1 is moved relatively close to the second receiving surface 20b of the second substrate 20 in the Z direction. In the abutting step of the workpiece handover process, the second substrate is separated from the back side W2 of the plurality of plate-shaped workpieces W received by the adhesive surface 2a of the adhesive portion 2 of the transfer member 1 by the subsequent second contact separation driving portion 6 The second holding portion 21 of 20 abuts (crimps) to perform adhesion. Therefore, the back side W2 of the plurality of plate-shaped workpieces W is adhered and held by the second holding portion 21 of the second substrate 20. Next, at approximately the same timing, the reaction force support portion 3 of the transfer member 1 is brought into contact with the first receiving surface 20 b of the second substrate 20 (pressure contact). Therefore, the further relative movement of the transfer member 1 and the second substrate 20 by the second contact separation driving unit 6 is stopped. In the separation and movement step of the workpiece handover process, the transfer member 1 is separated and moved from the second substrate 20 by the second contact separation driving part 6. At this time, the adhesive force of the adhesive surface 2a is set to be weaker than the holding force of each plate-shaped workpiece W possessed by the second holding portion 21 of the second substrate 20, so the adhesive portion 2 of the first substrate 10 is held from the second holding part 21 to the second holding part. The surface side W1 of the plurality of plate-shaped workpieces W in the second holding portion 21 of the substrate 20 is peeled off, and the workpiece transfer process is completed.

另一方面，黏著部2伴隨轉印構件1與第一基板10或第二基板20的靠近移動與各板狀工件W抵接(壓接)而在Z方向上壓縮變形，但逐漸趨近黏著部2的彈性變形極限，最終導致達到彈性變形極限。超過彈性變形極限之黏著部2無法進一步壓縮，隨後的靠近移動成為過度的擠壓力致使板狀工件W過分變形而成為破裂或崩碎等破損的產生原因。 為了解決這種問題，預先計測藉由轉印構件1與第一基板10或第二基板20的靠近移動對黏著部2施加壓縮力時的變形位移與藉由該變形位移而獲得之壓縮力的相關關係，並依據該測定值將黏著部2壓縮時的變形位移設定在適當範圍內為較佳。亦即，相對於黏著部2，階段性地設定反作用力支撐部3為較佳。 黏著部2的壓縮力因基於第一接觸分離驅動部4之靠近移動使轉印構件1與第一基板10的間隔變窄，而黏著部2的黏著面2a與複數個板狀工件W的表面側W1抵接而產生。該壓縮力能夠藉由在第一基板10或轉印構件1中的任一個上設置測壓元件等荷載感測器(未圖示)、或監控第一接觸分離驅動部4的驅動轉矩來計測。 但是，複數個板狀工件W為如微型LED等微小元件時，與黏著部2的接觸面積極小，因此黏著部2壓縮時的變形位移或壓縮力亦微小，因此極其難以檢測。 因此，本發明的實施形態之工件轉印裝置A及工件轉印卡盤C在轉印構件1的轉印面1a中比黏著部2更靠外側設置反作用力支撐部3，藉由轉印構件1與第一基板10的靠近移動使黏著部2的黏著面2a與複數個板狀工件W的表面側W1抵接之同時，使反作用力支撐部3與第一基板10的第一接收面10b抵接。此時，需要將反作用力支撐部3與第一接收面10b的抵接面積設定為藉由測壓元件等荷載感測器或第一接觸分離驅動部4的驅動轉矩亦能夠檢測的面積。 亦即，放大轉印構件1的黏著部2相對於第一基板10的複數個板狀工件W之受壓面積，藉此每單位面積的壓縮應力減小，同時變得容易產生反作用力。 藉此，能夠準確地檢測黏著部2壓縮時的變形位移或壓縮力，且能夠依據預先計測之相關關係將黏著部2壓縮時的變形位移設定在適當範圍內。On the other hand, the adhesive portion 2 is compressed and deformed in the Z direction as the transfer member 1 and the first substrate 10 or the second substrate 20 come into contact with each of the plate-shaped workpieces (compression contact), but gradually approaches adhesion. The elastic deformation limit of part 2 eventually leads to reaching the elastic deformation limit. The adhesive portion 2 that exceeds the elastic deformation limit cannot be compressed further, and the subsequent close movement becomes an excessive pressing force, which causes the plate-shaped workpiece W to be excessively deformed and becomes a cause of damage such as cracking or chipping. In order to solve this problem, the deformation displacement when a compressive force is applied to the adhesive portion 2 by the close movement of the transfer member 1 and the first substrate 10 or the second substrate 20 and the compression force obtained by the deformation displacement are measured in advance. It is better to set the deformation displacement during compression of the adhesive part 2 within an appropriate range based on the measured value. In other words, it is better to set the reaction force support portion 3 stepwise with respect to the adhesive portion 2. The compressive force of the adhesive portion 2 narrows the distance between the transfer member 1 and the first substrate 10 due to the close movement of the first contact separation driving portion 4, and the adhesive surface 2a of the adhesive portion 2 and the surface of the plurality of plate-like workpieces W The side W1 comes into contact with each other. This compressive force can be obtained by installing a load sensor (not shown) such as a load cell on either the first substrate 10 or the transfer member 1, or by monitoring the driving torque of the first contact separation driving part 4 Measure. However, when the plurality of plate-shaped workpieces W are micro-elements such as micro LEDs, the contact surface with the adhesive part 2 is extremely small, so the deformation displacement or compression force when the adhesive part 2 is compressed is also small, and it is extremely difficult to detect. Therefore, in the work transfer device A and the work transfer chuck C of the embodiment of the present invention, the reaction force support portion 3 is provided on the transfer surface 1a of the transfer member 1 on the outside of the adhesive portion 2, and the transfer member 1 When moving closer to the first substrate 10, the adhesive surface 2a of the adhesive portion 2 is in contact with the surface side W1 of the plurality of plate-shaped workpieces W, and the reaction force support portion 3 is in contact with the first receiving surface 10b of the first substrate 10 Pick up. At this time, it is necessary to set the contact area between the reaction force support portion 3 and the first receiving surface 10b to an area that can also be detected by a load sensor such as a load cell or the driving torque of the first contact separation driving portion 4. That is, the pressure area of the adhesive portion 2 of the transfer member 1 with respect to the plurality of plate-shaped workpieces W of the first substrate 10 is enlarged, whereby the compressive stress per unit area is reduced and at the same time it becomes easy to generate a reaction force. Thereby, it is possible to accurately detect the deformation displacement or compression force of the adhesive portion 2 when compressed, and it is possible to set the deformation displacement during compression of the adhesive portion 2 within an appropriate range based on the correlation measured in advance.

接著，對在轉印構件1的轉印面1a中比黏著部2更靠外側配置反作用力支撐部3之功能進行說明。 ･工件接收過程的靠近移動步驟中，即使在如黏著部2與少數板狀工件W抵接時那樣難以獲得反作用力時，黏著部2與少數板狀工件W抵接之後，使反作用力支撐部3與第一基板10的第一接收面10b抵接，藉此產生明顯的反作用力而能夠準確地檢測與少數板狀工件W的接觸位移。 例如如圖2(a)、圖2(b)及圖3(a)、圖3(b)所示之“選擇轉印方式”那樣，即使在使黏著部2的黏著面2a僅與第一基板10上排列之複數個板狀工件W中的少數板狀工件W抵接時，亦能夠準確地檢測黏著部2的黏著面2a與少數板狀工件W的表面側W1的接觸位移。 ･工件接收過程的抵靠步驟中，即使在黏著部2過度地擠壓複數個板狀工件W時，亦相對於基於黏著部2之擠壓產生基於反作用力支撐部3與第一接收面10b的抵接之反作用力而成為相對於擠壓力之壓縮阻力。 藉此，既能夠防止對各板狀工件W施加過度的壓縮力，亦能夠預防微細結構的黏著部2的塑性變形、龜裂或破裂。 ･工件接收過程的靠近移動步驟中，如圖9所示，即使在黏著部2相對於複數個板狀工件W不平行的狀態下靠近移動時，反作用力支撐部3亦在板狀工件W與黏著部2抵接之前與第一接收面10b抵接而受到擠壓力，從而產生反作用力而能夠準確地檢測擠壓力有無發生異常。 圖9所示之例子中，反作用力支撐部3沿著轉印構件1的轉印面1a的外緣形成為邊框狀。藉由轉印構件1的黏著面2a及反作用力支撐部3在相對於第一基板10的第一接收面10b傾斜之狀態下靠近移動，使反作用力支撐部3的反作用力面3a的外緣3a’最先與第一接收面10b抵接。因此，能夠事先檢測轉印構件1相對於第一基板10的傾斜。Next, the function of arranging the reaction force support portion 3 on the transfer surface 1a of the transfer member 1 outside the adhesive portion 2 will be described. ･In the approaching moving step of the workpiece receiving process, even when it is difficult to obtain a reaction force as when the adhesive part 2 abuts a few plate-shaped workpieces W, after the adhesive part 2 abuts the few plate-shaped workpieces W, the reaction force support part 3 is in contact with the first receiving surface 10b of the first substrate 10, thereby generating a significant reaction force and accurately detecting the contact displacement with a small number of plate-shaped workpieces W. For example, as shown in Figure 2 (a), Figure 2 (b) and Figure 3 (a), Figure 3 (b) as shown in the "select transfer method", even if the adhesive surface 2a of the adhesive portion 2 is only connected to the first When a small number of plate-shaped workpieces W among the plurality of plate-shaped workpieces W arranged on the substrate 10 abut, the contact displacement between the adhesive surface 2a of the adhesive portion 2 and the surface side W1 of the small number of plate-shaped workpieces W can also be accurately detected. ･In the abutment step of the workpiece receiving process, even when the adhesive portion 2 excessively presses a plurality of plate-shaped workpieces W, the support portion 3 and the first receiving surface 10b are generated based on the reaction force relative to the pressing based on the adhesive portion 2 The reaction force of the abutment becomes the compression resistance relative to the squeezing force. Thereby, it is possible to prevent an excessive compressive force from being applied to each plate-shaped workpiece W, and it is also possible to prevent plastic deformation, cracking, or breakage of the adhesive portion 2 of the fine structure. ･In the approaching movement step of the workpiece receiving process, as shown in FIG. 9, even when the adhesive portion 2 moves closer to the plurality of plate-shaped workpieces W in a non-parallel state, the reaction force support portion 3 is also in the plate-shaped workpiece W and Before the adhesive portion 2 comes into contact with the first receiving surface 10b, it comes into contact with the first receiving surface 10b and receives a pressing force, thereby generating a reaction force, and it is possible to accurately detect whether the pressing force is abnormal. In the example shown in FIG. 9, the reaction force support portion 3 is formed in a frame shape along the outer edge of the transfer surface 1 a of the transfer member 1. As the adhesive surface 2a of the transfer member 1 and the reaction force support portion 3 move closer while being inclined with respect to the first receiving surface 10b of the first substrate 10, the outer edge of the reaction force surface 3a of the reaction force support portion 3 3a' first abuts on the first receiving surface 10b. Therefore, the inclination of the transfer member 1 with respect to the first substrate 10 can be detected in advance.

另外，亦能夠構成為在藉由黏著部2的壓接而接收或交接各板狀工件W時，從轉印構件1向黏著部2的黏著面2a等傳播微小振動。 另外，即使在各板狀工件W的表面側W1具有微細的凹凸，且各板狀工件W為微型LED或薄的脆性小板等微小元件或平板體等，在其表面側W1具有微細的凹凸之事實是一成不變的。與此相同地，在黏著部2的黏著面2a亦具有微細的凹凸。 又，構成黏著面2a之黏著材料比各板狀工件W的表面側W1柔軟而容易變形。 因此，由於下述理由，進行對第一基板10上排列之複數個板狀工件W的表面側W1壓接黏著部2的黏著面2a之抵接時(工件接收過程的抵靠步驟)，各板狀工件W的表面側W1與黏著部2的黏著面2a以必要以上的強度被黏著，在隨後的交接過程中(工件交接過程的抵靠步驟)難以剝離。 作為剝離困難的首要原因，因外在的擠壓力使黏著部2的黏著面2a的微細的凹凸彈性地壓縮變形，導致黏著面2a的微細的凹凸內的空氣被擠出。擠壓力被解除後，黏著面2a的微細的凹凸復原(膨脹)變形，因此在各板狀工件W的表面側W1的微細的凹凸之間產生減壓空間而難以剝離。 作為剝離困難的第二個理由，因外在的擠壓力導致各板狀工件W的表面側W1被埋入黏著部2的柔軟的黏著面2a。因此，黏著面2a的黏著材料盤繞於各板狀工件W的外周邊緣部而難以剝離。In addition, it can also be configured to propagate minute vibrations from the transfer member 1 to the adhesion surface 2a of the adhesion portion 2 and the like when the respective plate-shaped workpieces W are received or delivered by the pressure bonding of the adhesion portion 2. In addition, even if the surface side W1 of each plate-shaped workpiece W has fine irregularities, and each plate-shaped workpiece W is a micro-LED or a thin fragile plate or other small element or a flat body, it has fine irregularities on the surface side W1 The fact is immutable. In the same way, the adhesive surface 2a of the adhesive portion 2 also has fine irregularities. In addition, the adhesive material constituting the adhesive surface 2a is softer than the surface side W1 of each plate-shaped workpiece W and is easily deformed. Therefore, for the following reasons, when the surface side W1 of the plurality of plate-shaped workpieces W arranged on the first substrate 10 is pressed against the adhesive surface 2a of the adhesive portion 2 (the abutment step of the workpiece receiving process), each The surface side W1 of the plate-shaped workpiece W and the adhesive surface 2a of the adhesive portion 2 are adhered with more than necessary strength, and it is difficult to peel off in the subsequent transfer process (the abutment step of the workpiece transfer process). As the primary cause of the difficulty in peeling, the fine concavities and convexities of the adhesive surface 2a of the adhesive portion 2 are elastically compressed and deformed by the external pressing force, which causes the air in the fine concavities and convexities of the adhesive surface 2a to be squeezed out. After the pressing force is released, the fine irregularities of the adhesive surface 2a are restored (expanded) and deformed. Therefore, a decompression space is generated between the fine irregularities on the surface side W1 of each plate-shaped workpiece W, and it is difficult to peel off. As the second reason for the difficulty in peeling, the surface side W1 of each plate-shaped workpiece W is buried in the soft adhesive surface 2a of the adhesive portion 2 due to the external pressing force. Therefore, the adhesive material of the adhesive surface 2a coils around the outer peripheral edge part of each plate-shaped workpiece W, and it is difficult to peel off.

因此，本發明的實施形態之工件轉印裝置A及工件轉印卡盤C的運行亦能夠是在大氣氣氛下進行之“大氣運行”，但在減壓氣氛下進行之“減壓運行”為較佳。 “減壓運行”時，如圖2或圖3所示，在室內壓力可調的變壓室B的內部配置工件轉印裝置A，且在變壓室B的室內進行基於第一接觸分離驅動部4之從第一基板10向轉印構件1的各板狀工件W的接收、基於輸送驅動部5之各板狀工件W的輸送、及基於第二接觸分離驅動部6之從轉印構件1向第二基板20的交接為較佳。 變壓室B形成於腔室(未圖示)的內部，且具有將變壓室B的室內從大氣氣氛調整為特定真空度的減壓氣氛之室壓調整機構(未圖示)。 室壓調整機構由真空泵等排氣源構成，並藉由控制部7而運行控制。 作為室壓調整機構的控制例，在接收各板狀工件W時將變壓室B內部控制為壓力比大氣壓低的第一減壓氣氛為較佳。進行向第二基板20的輸送時及交接時，控制為大氣壓為較佳。從各板狀工件W剝離黏著部2時，控制為壓力與第一減壓氣氛相同或比其低的第二減壓氣氛為較佳。 作為第一減壓氣氛或第二減壓氣氛的具體例，設定為如第一減壓氣氛為大致90Kpa、第二減壓氣氛為大致80Kpa等那樣從大氣壓(大致101.3KPa)P0逐次降低大致10Kpa左右為較佳。Therefore, the operation of the work transfer device A and the work transfer chuck C according to the embodiment of the present invention can also be the "atmospheric operation" performed in an atmospheric atmosphere, but the "reduced pressure operation" performed in a reduced pressure atmosphere is Better. In the "decompression operation", as shown in Figure 2 or Figure 3, the workpiece transfer device A is arranged inside the variable pressure chamber B with adjustable indoor pressure, and the first contact separation drive is performed in the chamber of the variable pressure chamber B The receiving of each plate-shaped work W from the first substrate 10 to the transfer member 1 in the section 4, the transport of each plate-shaped work W by the conveying drive section 5, and the secondary contact separation drive section 6 from the transfer member 1 The transfer to the second substrate 20 is preferable. The variable pressure chamber B is formed inside a chamber (not shown), and has a chamber pressure adjustment mechanism (not shown) that adjusts the interior of the variable pressure chamber B from an atmospheric atmosphere to a reduced pressure atmosphere with a specific vacuum degree. The chamber pressure adjustment mechanism is composed of an exhaust source such as a vacuum pump, and is operated and controlled by the control unit 7. As a control example of the chamber pressure adjusting mechanism, it is preferable to control the inside of the variable pressure chamber B to a first reduced-pressure atmosphere whose pressure is lower than the atmospheric pressure when each plate-shaped workpiece W is received. It is preferable to control the atmospheric pressure when carrying out the transfer to the second substrate 20 and when it is handed over. When peeling the adhesive part 2 from each plate-shaped workpiece W, it is preferable to control it to the 2nd reduced pressure atmosphere whose pressure is the same as or lower than the 1st reduced pressure atmosphere. As a specific example of the first reduced-pressure atmosphere or the second reduced-pressure atmosphere, it is set such that the first reduced-pressure atmosphere is approximately 90 Kpa, the second reduced-pressure atmosphere is approximately 80 Kpa, etc., and the atmospheric pressure (approximately 101.3 KPa) P0 is gradually reduced by approximately 10 Kpa. Left and right are better.

依據這種本發明的實施形態之工件轉印裝置A及工件轉印卡盤C、以及工件轉印方法，藉由第一接觸分離驅動部4，轉印構件1從遠離第一基板10之第一對置位置P1朝向第一基板10(Z方向)靠近移動。 藉此，轉印構件1的黏著部2(黏著面2a)與複數個板狀工件W(表面側W1)抵接，黏著部2伴隨隨後的靠近移動而壓縮變形。伴隨該壓縮變形，黏著部2(黏著面2a)與複數個板狀工件W(表面側W1)持續壓接，藉此複數個板狀工件W(表面側W1)黏著保持於黏著部2(黏著面2a)。 在與該工件的黏著保持大致相同的時刻，反作用力支撐部3與第一基板10的第一接收面10b抵接，基於第一接觸分離驅動部4之轉印構件1與第一基板10的進一步相對地靠近移動停止。因此，避免黏著部2對複數個板狀工件W(表面側W1)之過度的壓縮變形，而可獲得符合各板狀工件W的厚度之黏著力。 之後，藉由第一接觸分離驅動部4，轉印構件1與第一基板10(在Z方向上)相對地分離移動，而複數個板狀工件W(背面側W2)從第一基板10的第一表面10a剝離。因此，複數個板狀工件W從第一基板10被接收至轉印構件1。 因此，能夠防止從第一基板10接收複數個板狀工件W至轉印構件1時因黏著部2的過度的擠壓致使複數個板狀工件W過分變形。 其結果，與接收各元件時只有黏著材料層的表面壓接於各元件的表面側而使黏著材料層的表面壓縮變形之習知技術相比，不破損複數個板狀工件W便能夠從第一基板10接收到轉印構件1。 因此，即使複數個板狀工件W為如微型LED或薄的脆性小板這樣的微小元件，亦可降低伴隨工件接收之破損的發生率而實現成品率的提高。 而且，將黏著部2與反作用力支撐部3以相同的材料一體成形或一體形成時，能夠出於伴隨黏著部2的經時劣化之磨損或黏著力或平面度的下降的原因而同時更換黏著部2和反作用力支撐部3。藉此，黏著部2及反作用力支撐部3的保養管理變得輕鬆且便利性優異。 又，由比黏著部2的構成材料硬質的材料形成反作用力支撐部3時，與由和黏著部2相同的軟質材料形成反作用力支撐部3時相比，Z方向上的變形率小，因此即使反作用力支撐部3的抵接面積比較狹小亦能夠獲得特定的推斥力。藉此，能夠使轉印構件1的轉印面1a緊緻並實現輕質化。 除此之外，藉由轉印構件1與第一基板10的靠近移動，黏著部2的黏著面2a與複數個板狀工件W的表面側W1抵接之同時使反作用力支撐部3與第一基板10的第一接收面10b抵接時，能夠準確地檢測黏著部2壓縮時的變形位移和壓縮力。藉此，能夠依據預先計測之相關關係將黏著部2壓縮時的變形位移設定在適當範圍內，進而能夠可靠地降低板狀工件W的破損發生率。According to the work transfer device A, the work transfer chuck C, and the work transfer method of this embodiment of the present invention, the transfer member 1 moves away from the first substrate 10 by the first contact separation driving portion 4 The opposing position P1 moves closer to the first substrate 10 (Z direction). As a result, the adhesive portion 2 (adhesive surface 2a) of the transfer member 1 abuts the plurality of plate-shaped workpieces W (surface side W1), and the adhesive portion 2 is compressed and deformed with subsequent close movement. Along with this compression deformation, the adhesive portion 2 (adhesive surface 2a) and the plurality of plate-shaped workpieces W (surface side W1) are continuously press-bonded, whereby the plurality of plate-shaped workpieces W (surface side W1) are adhered and held on the adhesive portion 2 (adhesive Face 2a). At approximately the same time as the adhesion of the workpiece is maintained, the reaction force supporting portion 3 abuts on the first receiving surface 10b of the first substrate 10, and the transfer member 1 of the driving portion 4 is separated from the first substrate 10 based on the first contact. Move closer and stop relatively. Therefore, excessive compression deformation of the adhesive portion 2 to the plurality of plate-shaped workpieces W (surface side W1) is avoided, and the adhesive force corresponding to the thickness of each plate-shaped workpiece W can be obtained. After that, by the first contact separation driving unit 4, the transfer member 1 and the first substrate 10 (in the Z direction) are relatively separated and moved, and the plurality of plate-shaped workpieces W (rear side W2) are removed from the first substrate 10 The first surface 10a peels off. Therefore, a plurality of plate-shaped workpieces W are received from the first substrate 10 to the transfer member 1. Therefore, it is possible to prevent the plurality of plate-shaped workpieces W from being excessively deformed due to excessive compression of the adhesive portion 2 when receiving the plurality of plate-shaped workpieces W from the first substrate 10 to the transfer member 1. As a result, compared with the conventional technique in which only the surface of the adhesive material layer is crimped on the surface side of each element when receiving each element, and the surface of the adhesive material layer is compressed and deformed, a plurality of plate-shaped workpieces W can be removed from the first A substrate 10 receives the transfer member 1. Therefore, even if the plurality of plate-shaped workpieces W are micro-elements such as micro LEDs or thin brittle small plates, it is possible to reduce the occurrence rate of breakage accompanying workpiece reception and achieve an improvement in yield. Moreover, when the adhesive part 2 and the reaction force support part 3 are integrally molded or integrally formed with the same material, it is possible to replace the adhesive at the same time due to abrasion or decrease in adhesion or flatness accompanying the deterioration of the adhesive part 2 over time. Section 2 and reaction force support section 3. Thereby, the maintenance management of the adhesive part 2 and the reaction force support part 3 becomes easy and it is excellent in convenience. In addition, when the reaction force support portion 3 is formed of a material harder than the constituent material of the adhesive portion 2, the deformation rate in the Z direction is smaller than when the reaction force support portion 3 is formed of the same soft material as the adhesive portion 2, so even The contact area of the reaction force support part 3 is relatively narrow and a specific repulsive force can be obtained. Thereby, the transfer surface 1a of the transfer member 1 can be made compact and reduced in weight. In addition, due to the close movement of the transfer member 1 and the first substrate 10, the adhesive surface 2a of the adhesive portion 2 abuts the surface side W1 of the plurality of plate-shaped workpieces W and simultaneously causes the reaction force support portion 3 and the second When the first receiving surface 10b of a substrate 10 abuts, the deformation displacement and compression force of the adhesive portion 2 when compressed can be accurately detected. Thereby, the deformation displacement when the adhesive portion 2 is compressed can be set in an appropriate range based on the correlation measured in advance, and the breakage rate of the plate-shaped workpiece W can be reliably reduced.

尤其如下為較佳，具備：輸送驅動部5，使轉印構件1的黏著部2從第一對置位置P1至第二對置位置P3在與對置方向(Z方向)交叉之方向(X方向或Y方向)上移動；及第二接觸分離驅動部6，使轉印構件1的黏著部2相對於第二基板20從第二對置位置P3朝向對置方向(Z方向)相對地靠近移動及分離移動，第二基板20的第二表面20a具有：複數個板狀工件W的保持部(第二保持部)21，與轉印構件1對置而設置；及第二接收面20b，設置於比保持部21更靠外側，控制部7如下進行控制：藉由基於第二接觸分離驅動部6之轉印構件1與第二基板20的相對地靠近移動，由黏著部2接收之複數個板狀工件W與第二基板20的保持部(第二保持部)21抵接而使黏著部2壓縮變形，並且反作用力支撐部3與第二基板20的第二接收面20b抵接而停止基於第二接觸分離驅動部6之轉印構件1與第二基板20的相對地靠近移動。 此時，從第一基板10將複數個板狀工件W接收到轉印構件1之後，藉由輸送驅動部5，轉印構件1從第一對置位置P1朝向第二對置位置P3(在X方向或Y方向上)輸送。接著，藉由第二接觸分離驅動部6，轉印構件1從遠離第二基板20之第二對置位置P3朝向第二基板20(在Z方向上)靠近移動。 藉此，由轉印構件1的複數個黏著部2接收之複數個板狀工件W(背面側W2)與第二基板20的保持部(第二保持部)21抵接，伴隨隨後的靠近移動，複數個板狀工件W(背面側W2)與第二基板20的保持部(第二保持部)21壓接，藉此複數個板狀工件W(背面側W2)藉由黏著等保持(把持)於第二基板20的保持部(第二保持部)21。 在與該工件保持大致相同的時刻，反作用力支撐部3與第二基板20的第一接收面20b抵接，基於第二接觸分離驅動部6之轉印構件1與第二基板20的進一步的靠近移動停止。因此，避免黏著部2相對於複數個板狀工件W(表面側W1)之過度的壓縮變形，免得因黏著部2的過度的推斥力致使各板狀工件W(背面側W2)過度地被推到第二基板20的保持部(第二保持部)21。 之後，藉由第二接觸分離驅動部6，轉印構件1與第二基板20(在Z方向上)相對地分離移動，而轉印構件1的黏著部2(黏著面2a)從複數個板狀工件W(表面側W1)剝離。因此，複數個板狀工件W從轉印構件1交接到第二基板20。 因此，能夠防止複數個板狀工件W從轉印構件1交接到第二基板20時因黏著部2的過度的擠壓致使複數個板狀工件W過分變形。 其結果，與接收各元件時只有黏著材料層的表面壓接於各元件的表面側而使黏著材料層的表面壓縮變形之習知技術相比，不破損複數個板狀工件W便能夠從轉印構件1接收到第二構件20。 因此，即使複數個板狀工件W為如微型LED或薄的脆性小板這樣的微小元件，亦可降低伴隨工件交接之破損的發生率而實現成品率的提高。In particular, it is preferable to include: a conveying drive unit 5 that causes the adhesive portion 2 of the transfer member 1 to move from the first opposing position P1 to the second opposing position P3 in the direction intersecting the opposing direction (Z direction) (X Direction or Y direction); and the second contact separation driving portion 6 makes the adhesion portion 2 of the transfer member 1 relatively close to the second substrate 20 from the second opposing position P3 toward the opposing direction (Z direction) Moving and separating, the second surface 20a of the second substrate 20 has: a plurality of holding portions (second holding portions) 21 of the plate-shaped workpieces W, which are provided to face the transfer member 1; and a second receiving surface 20b, Located on the outer side of the holding portion 21, the control portion 7 controls as follows: by the relatively close movement of the transfer member 1 and the second substrate 20 based on the second contact separation drive portion 6, the plural number received by the adhesive portion 2 A plate-shaped workpiece W abuts against the holding portion (second holding portion) 21 of the second substrate 20 to compress and deform the adhesive portion 2, and the reaction force support portion 3 abuts against the second receiving surface 20b of the second substrate 20 to form The relative approaching movement of the transfer member 1 and the second substrate 20 by the second contact separation driving portion 6 is stopped. At this time, after receiving a plurality of plate-shaped workpieces W from the first substrate 10 to the transfer member 1, by the conveying drive section 5, the transfer member 1 moves from the first opposed position P1 to the second opposed position P3 (at X direction or Y direction) conveying. Then, by the second contact separation driving portion 6, the transfer member 1 moves closer to the second substrate 20 (in the Z direction) from the second opposed position P3 away from the second substrate 20. Thereby, the plurality of plate-shaped workpieces W (rear side W2) received by the plurality of adhesive portions 2 of the transfer member 1 abuts against the holding portion (second holding portion) 21 of the second substrate 20, and the subsequent approaching movement , A plurality of plate-shaped workpieces W (back side W2) and the holding portion (second holding portion) 21 of the second substrate 20 are crimped, whereby the plurality of plate-shaped workpieces W (back side W2) are held (holded) by adhesion or the like ) On the holding portion (second holding portion) 21 of the second substrate 20. At approximately the same time as the workpiece is held, the reaction force support portion 3 abuts the first receiving surface 20b of the second substrate 20, and the second contact separation driving portion 6 further separates the transfer member 1 from the second substrate 20 Move closer and stop. Therefore, excessive compression and deformation of the adhesive portion 2 with respect to the plurality of plate-shaped workpieces W (surface side W1) is avoided, and the excessive repulsive force of the adhesive portion 2 prevents the plate-shaped workpieces W (rear side W2) from being excessively pushed To the holding portion (second holding portion) 21 of the second substrate 20. After that, by the second contact separation driving portion 6, the transfer member 1 and the second substrate 20 (in the Z direction) relatively separate and move, and the adhesive portion 2 (adhesive surface 2a) of the transfer member 1 moves from a plurality of plates The shaped workpiece W (surface side W1) peels off. Therefore, a plurality of plate-shaped workpieces W are transferred from the transfer member 1 to the second substrate 20. Therefore, it is possible to prevent the plurality of plate-shaped workpieces W from being excessively deformed due to excessive compression of the adhesive portion 2 when the plurality of plate-shaped workpieces W are transferred from the transfer member 1 to the second substrate 20. As a result, compared with the conventional technique in which only the surface of the adhesive material layer is crimped on the surface side of each element when receiving each element, and the surface of the adhesive material layer is compressed and deformed, the plurality of plate-shaped workpieces W can be rotated without breaking The printing member 1 receives the second member 20. Therefore, even if the plurality of plate-shaped workpieces W are micro-elements such as micro LEDs or thin brittle small plates, it is possible to reduce the occurrence rate of breakage accompanying the transfer of the workpieces and to achieve an improvement in yield.

而且，轉印構件1的反作用力支撐部3具有與第一基板10的第一接收面10b或第二基板20的第二接收面20b平行對置之反作用力面3a，將反作用力面3a配置成與黏著部2的黏著面2a平行且包圍黏著部2的配置部位為較佳。 此時，藉由轉印構件1及第一基板10的相對地靠近移動，使反作用力支撐部3的反作用力面3a與第一基板10的第一接收面10b和第二基板20的第二接收面20b抵接，從而轉印構件1經由反作用力支撐部3，姿勢仿照第一接收面10b和第二接收面20b而整體受控。 因此，與反作用力面3a平行的黏著部2的黏著面2a與複數個板狀工件W(表面側W1)平行抵接而壓接。 因此，能夠防止接收或交接複數個板狀工件W時因黏著部2的過度的扁壓致使複數個板狀工件W過分變形。 其結果，即使在由尺寸誤差大而難以進行高精度的加工的彈性材料製作黏著部2時、或轉印構件1相對於第一基板10上排列之複數個板狀工件W之組裝精度較差時，亦能夠藉由黏著部2平行地擠壓複數個板狀工件W。 因此，可靠地降低伴隨工件接收或工件交接之破損的發生率進而實現成品率的進一步的提高。在降低破損的發生率的同時能夠可靠地進行接收，進而實現成品率的提高。 除此之外，反作用力面3a配置成包圍黏著部2的配置部位，因此若藉由轉印構件1及第一基板10的相對地靠近移動，反作用力支撐部3的反作用力面3a與第一基板10的第一接收面10b或第二基板20的第二接收面20b抵接，則被反作用力面3a包圍之黏著部2的配置部位(內側部位)成為氣密狀態。在該氣密狀態下，藉由黏著部2的壓縮變形，有可能使被反作用力面3a包圍之內側部位的內壓過度上升。 因此，在反作用力支撐部3的一部分具有連通黏著部2的配置部位的內外之通氣道3b為較佳。此時，即使被反作用力面3a包圍之黏著部2的配置部位(內側部位)的內壓上升，亦能夠通過通氣道3b抽到外側部位而防止過度的內壓上升。Furthermore, the reaction force support portion 3 of the transfer member 1 has a reaction force surface 3a that faces parallel to the first receiving surface 10b of the first substrate 10 or the second receiving surface 20b of the second substrate 20, and the reaction force surface 3a is arranged It is preferable to be parallel to the adhesive surface 2a of the adhesive part 2 and surround the arrangement part of the adhesive part 2. At this time, due to the relatively close movement of the transfer member 1 and the first substrate 10, the reaction force surface 3a of the reaction force support portion 3 and the first receiving surface 10b of the first substrate 10 and the second substrate 20 The receiving surface 20b abuts, so that the transfer member 1 is controlled via the reaction force support portion 3 in a posture imitating the first receiving surface 10b and the second receiving surface 20b. Therefore, the adhesive surface 2a of the adhesive part 2 parallel to the reaction force surface 3a is contact|abutted in parallel with the several plate-shaped workpiece|work W (surface side W1), and is press-contacted. Therefore, it is possible to prevent the plurality of plate-shaped workpieces W from being excessively deformed due to excessive flattening of the adhesive portion 2 when receiving or transferring the plurality of plate-shaped workpieces W. As a result, even when the adhesive portion 2 is made of an elastic material that has a large dimensional error and is difficult to perform high-precision processing, or when the transfer member 1 has poor assembly accuracy with respect to the plurality of plate-shaped workpieces W arranged on the first substrate 10 , It is also possible to squeeze a plurality of plate-shaped workpieces W in parallel by the adhesive part 2. Therefore, it is possible to reliably reduce the occurrence rate of breakage accompanying workpiece reception or workpiece delivery, thereby achieving a further improvement in yield. It can receive reliably while reducing the occurrence rate of breakage, thereby achieving an increase in yield. In addition, the reaction force surface 3a is arranged to surround the placement portion of the adhesive portion 2. Therefore, if the transfer member 1 and the first substrate 10 move closer together, the reaction force surface 3a of the reaction force support portion 3 and the second When the first receiving surface 10b of the substrate 10 or the second receiving surface 20b of the second substrate 20 abuts, the placement portion (inner portion) of the adhesive portion 2 surrounded by the reaction force surface 3a becomes airtight. In this airtight state, due to the compression deformation of the adhesive portion 2, the internal pressure of the inner part surrounded by the reaction force surface 3a may increase excessively. Therefore, it is preferable that a part of the reaction force support portion 3 has an air passage 3b that communicates with the inside and outside of the placement portion of the adhesive portion 2. At this time, even if the internal pressure of the placement portion (inner portion) of the adhesive portion 2 surrounded by the reaction force surface 3a rises, it can be drawn to the outer portion through the air passage 3b to prevent excessive internal pressure rise.

又，轉印構件1及黏著部2和第一基板10或第二基板20配置於變壓室B的內部，變壓室B具有藉由控制部7運行控制之室壓調整機構，控制部7藉由室壓調整機構，在藉由黏著部2接收複數個板狀工件W時，將變壓室B控制為壓力比大氣壓低的第一減壓氣氛，在藉由第二接觸分離驅動部6交接到第二基板20時，恢復為大氣壓，藉由第二接觸分離驅動部6從複數個板狀工件W剝離黏著部2時，控制為壓力與第一減壓氣氛相同或比其低的第二減壓氣氛為較佳。 此時，即使因擠壓力致使複數個板狀工件W的表面側W1和黏著部2的黏著面2a的微細的凹凸彈性地壓縮變形，或因擠壓力致使複數個板狀工件W的表面側W1埋入於柔軟的黏著部2的黏著面2a使黏著部2的黏著材料盤繞於各板狀工件W的外周邊緣部，往後亦不難剝離。 因此，藉由變壓室B的內壓控制，能夠更可靠地進行複數個板狀工件W的黏著和剝離。 其結果，能夠從第一基板10可靠地接收複數個板狀工件W並可靠地交接到第二基板20的特定位置，而實現交接精度的進一步的提高。In addition, the transfer member 1 and the adhesive portion 2 and the first substrate 10 or the second substrate 20 are arranged inside the pressure transformation chamber B. The pressure transformation chamber B has a chamber pressure adjustment mechanism controlled by the operation of the control unit 7. The control unit 7 With the chamber pressure adjusting mechanism, when a plurality of plate-shaped workpieces W are received by the adhesive part 2, the variable pressure chamber B is controlled to a first reduced pressure atmosphere with a pressure lower than the atmospheric pressure, and the second contact separation driving part 6 When it is transferred to the second substrate 20, it returns to atmospheric pressure, and when the adhesive portion 2 is peeled from the plurality of plate-shaped workpieces W by the second contact separation drive unit 6, the pressure is controlled to be the same as or lower than the first pressure-reduced atmosphere. Second, a reduced pressure atmosphere is preferred. At this time, even if the surface side W1 of the plurality of plate-shaped workpieces W and the adhesive surface 2a of the adhesive portion 2 are elastically compressed and deformed due to the pressing force, or the surface of the plurality of plate-shaped workpieces W is caused by the pressing force The side W1 is embedded in the adhesive surface 2a of the soft adhesive part 2 so that the adhesive material of the adhesive part 2 is coiled around the outer peripheral edge of each plate-shaped workpiece W, and it is not difficult to peel off later. Therefore, by controlling the internal pressure of the variable pressure chamber B, it is possible to more reliably perform adhesion and peeling of a plurality of plate-shaped workpieces W. As a result, it is possible to reliably receive a plurality of plate-shaped workpieces W from the first substrate 10 and to be reliably delivered to a specific position of the second substrate 20, and the delivery accuracy can be further improved.

另外，在上述實施形態中的圖示例中，對第一基板10由具有矩形的第一表面10a之載流子基板構成之情況進行了說明，但並不限於此，亦可以將第一基板10變更為元件形成用晶圓等。 而且，對第二基板20由具有矩形的第二表面20a之載流子基板構成之情況進行了說明，但並不限定於此，亦可以將第二基板20變更為安裝基板(配線用基板)或電路基板等。 即使在這些情況下，亦可獲得與上述第一實施形態及第二實施形態相同的作用和優點。In addition, in the illustrated example in the above embodiment, the case where the first substrate 10 is composed of a carrier substrate having a rectangular first surface 10a has been described, but it is not limited to this, and the first substrate may be 10 Change to wafers for element formation, etc. Furthermore, the case where the second substrate 20 is composed of a carrier substrate having a rectangular second surface 20a has been described, but it is not limited to this, and the second substrate 20 may be changed to a mounting substrate (wiring substrate) Or circuit boards, etc. Even in these cases, the same functions and advantages as the first and second embodiments described above can be obtained.

1:轉印部件 1a:轉印面 2:黏著部 2a:黏著面 2b:基部 3:反作用力支撐部 3a:反作用力面 4:第一接觸分離驅動部 5:輸送驅動部 6:第二接觸分離驅動部 7:控制部 10:第一基板 10a:第一表面 10b:第一接收面 11:第一保持部 20:第二基板 20a:第二表面 20b:第二接收面 21:保持部(第二保持部) A:工件轉印裝置 C:工件轉印卡盤 L1:第一間隔 L2:第二間隔 P1:第一對置位置 P2:接收位置 P3:第二對置位置 P4:交接位置 W:板狀工件 W1:表面側 W2:背面側1: Transfer parts 1a: Transfer surface 2: Adhesive part 2a: Adhesive surface 2b: base 3: Reaction force support part 3a: Reaction surface 4: The first contact separation driving part 5: Conveying drive part 6: The second contact separation driving part 7: Control Department 10: The first substrate 10a: first surface 10b: The first receiving surface 11: The first holding part 20: second substrate 20a: second surface 20b: second receiving surface 21: Holding part (second holding part) A: Workpiece transfer device C: Workpiece transfer chuck L1: first interval L2: second interval P1: The first opposite position P2: receiving location P3: The second opposite position P4: Handover position W: plate-shaped workpiece W1: Surface side W2: back side

圖1係表示本發明的實施形態(第一實施形態)之工件轉印裝置及工件轉印卡盤、以及作為工件轉印方法採用“選擇轉印方式”時的整體結構之說明圖，圖1(a)係初始狀態的縱剖面主視圖，圖1(b)係沿圖1(a)的(1B)-(1B)線之第一基板的頂視圖，圖1(c)係沿圖1(a)的(1C)-(1C)線之轉印構件的底視圖。 圖2係工件接收過程和工件交接過程的說明圖，圖2(a)係工件接收過程(抵靠步驟)的放大縱剖面主視圖，圖2(b)係工件交接過程(抵靠步驟)的放大縱剖面主視圖。 圖3係“選擇轉印方式”下反覆進行“間拔選擇順序”和“局部轉印順序”時的說明圖，圖3(a)係工件接收過程(抵靠步驟)的放大縱剖面主視圖，圖3(b)係工件交接過程(抵靠步驟)的放大縱剖面主視圖。 圖4為詳細示出工件接收過程和工件交接過程之說明圖，圖4(a)係工件接收過程(抵靠步驟)的局部放大縱剖面主視圖，圖4(b)係工件交接過程(抵靠步驟)的局部放大縱剖面主視圖。 圖5係表示黏著部的變形例之說明圖，圖5(a)係初始狀態的縱剖面主視圖，圖5(b)係工件接收過程(抵靠步驟)的縱剖面主視圖。 圖6係表示反作用力支撐部的變形例之說明圖，圖6(a)～圖6(c)係由軟質材料製成之轉印構件的縮小底視圖。 圖7係表示反作用力支撐部的變形例之說明圖，圖7(a)～圖7(c)係由硬質材料製成之轉印構件的縮小底視圖。 圖8係本發明的實施形態(第二實施形態)之工件轉印裝置及工件轉印卡盤、以及作為工件轉印方法採用“全面轉印方式”時的說明圖，圖8(a)係初始狀態的縱剖面主視圖，圖8(b)係沿圖8(a)的(8B)-(8B)線之轉印構件的放大底視圖，圖8(c)係工件接收過程(抵靠步驟)的放大縱剖面主視圖。 圖9係黏著部在相對於板狀工件不平行的狀態下靠近移動時的放大縱剖面主視圖。Fig. 1 is an explanatory diagram showing the overall structure of a work transfer device and a work transfer chuck according to an embodiment of the present invention (first embodiment), and when the "selective transfer method" is adopted as a work transfer method, Fig. 1 (a) is a longitudinal sectional front view of the initial state, Fig. 1(b) is a top view of the first substrate along the line (1B)-(1B) of Fig. 1(a), and Fig. 1(c) is taken along the line of Fig. 1 (a) The bottom view of the transfer member of the lines (1C)-(1C). Figure 2 is an explanatory diagram of the workpiece receiving process and the workpiece handover process, Figure 2(a) is an enlarged longitudinal sectional front view of the workpiece receiving process (abutting step), and Figure 2(b) is the workpiece handing over process (abutting step) Enlarge the front view of the longitudinal section. Fig. 3 is an explanatory diagram of repeatedly performing “thinning selection order” and “partial transfer order” under “select transfer method”, and Fig. 3(a) is an enlarged longitudinal sectional front view of the workpiece receiving process (abutting step) , Figure 3(b) is an enlarged longitudinal sectional front view of the workpiece transfer process (abutment step). Figure 4 is an explanatory diagram showing in detail the workpiece receiving process and the workpiece handover process. Figure 4(a) is a partial enlarged longitudinal sectional front view of the workpiece receiving process (abutting step), and Figure 4(b) is the workpiece handing over process (abutting step). Rely on the partial enlarged longitudinal section front view of step). Fig. 5 is an explanatory diagram showing a modification of the adhesive portion, Fig. 5(a) is a longitudinal sectional front view of an initial state, and Fig. 5(b) is a longitudinal sectional front view of a workpiece receiving process (abutting step). Fig. 6 is an explanatory diagram showing a modification of the reaction force support portion, and Figs. 6(a) to 6(c) are reduced bottom views of the transfer member made of soft material. Fig. 7 is an explanatory diagram showing a modification of the reaction force support portion, and Figs. 7(a) to 7(c) are reduced bottom views of a transfer member made of a hard material. 8 is an explanatory diagram of the work transfer device and work transfer chuck of the embodiment of the present invention (the second embodiment), and when the "full transfer method" is adopted as the work transfer method, FIG. 8(a) is The longitudinal sectional front view of the initial state, Fig. 8(b) is an enlarged bottom view of the transfer member along the line (8B)-(8B) of Fig. 8(a), and Fig. 8(c) is the workpiece receiving process (butting against Step) the enlarged longitudinal section front view. Fig. 9 is an enlarged longitudinal sectional front view of the adhesive portion when it moves closer in a non-parallel state with respect to the plate-shaped workpiece.

1a:轉印面 1a: Transfer surface

2:黏著部 2: Adhesive part

2a:黏著面 2a: Adhesive surface

2b:基部 2b: base

3:反作用力支撐部 3: Reaction force support part

3a:反作用力面 3a: Reaction surface

4:第一接觸分離驅動部 4: The first contact separation driving part

6:第二接觸分離驅動部 6: The second contact separation driving part

10:第一基板 10: The first substrate

10a:第一表面 10a: first surface

10b:第一接收面 10b: The first receiving surface

11:第一保持部 11: The first holding part

20:第二基板 20: second substrate

20a:第二表面 20a: second surface

20b:第二接收面 20b: second receiving surface

21:保持部(第二保持部) 21: Holding part (second holding part)

A:工件轉印裝置 A: Workpiece transfer device

C:工件轉印卡盤 C: Workpiece transfer chuck

L1:第一間隔 L1: first interval

L2:第二間隔 L2: second interval

P1:第一對置位置 P1: The first opposite position

P2:接收位置 P2: receiving location

P3:第二對置位置 P3: The second opposite position

P4:交接位置 P4: Handover position

W:板狀工件 W: plate-shaped workpiece

W1:表面側 W1: Surface side

W2:背面側 W2: back side

Claims (5)

一種工件轉印裝置，其特徵在於，從第一基板接收前述第一基板上排列之包括微小元件之複數個板狀工件，並將其交接到作為轉印對象的第二基板的特定位置，且具備： 轉印構件，其從與前述第一基板對置之第一對置位置至與前述第二基板對置之第二對置位置移動自如地設置； 黏著部，其設置於與前述第一基板上排列之前述複數個板狀工件對置之前述轉印構件的轉印面，且具有能夠在與前述複數個板狀工件對置的方向上彈性變形的黏著面； 反作用力支撐部，其在前述轉印構件的前述轉印面中比前述黏著部更靠外側設置成朝向前述第一基板的第一表面中比前述複數個板狀工件更靠外側的第一接收面突出，且具有比前述黏著面更硬質的反作用力面； 第一接觸分離驅動部，其使前述轉印構件的前述黏著部相對於前述第一基板從前述第一對置位置向前述對置方向相對地靠近移動及分離移動；及 控制部，其對前述第一接觸分離驅動部進行運行控制， 前述黏著面的黏著力設定為比前述第一基板的第一保持部所具有之各板狀工件的保持力強且比前述第二基板的第二保持部所具有之前述各板狀工件的保持力弱， 前述控制部如下進行控制：藉由基於前述第一接觸分離驅動部之前述轉印構件與前述第一基板的相對地靠近移動，前述黏著面在與前述複數個板狀工件抵接而壓縮變形的同時黏著保持前述複數個板狀工件，伴隨前述黏著面的壓縮變形，前述反作用力面與前述第一基板的前述第一接收面抵接而停止基於前述第一接觸分離驅動部之前述轉印構件與前述第一基板的相對地靠近移動。A work transfer device, characterized in that it receives from a first substrate a plurality of plate-shaped work pieces including tiny elements arranged on the first substrate, and transfers them to a specific position on a second substrate as a transfer target, and have: The transfer member is movably arranged from a first opposed position opposed to the first substrate to a second opposed position opposed to the second substrate; The adhesive portion is provided on the transfer surface of the transfer member facing the plurality of plate-shaped workpieces arranged on the first substrate, and has an elastically deformable direction in a direction facing the plurality of plate-shaped workpieces Adhesive surface A reaction force support portion is provided on the transfer surface of the transfer member on the outer side than the adhesive portion, and faces the first receiving surface on the first surface of the first substrate that is on the outer side than the plurality of plate-shaped workpieces It is protruding and has a reaction force surface that is harder than the aforementioned adhesive surface; A first contact and separation driving portion that relatively moves the adhesive portion of the transfer member relative to the first substrate from the first opposing position to the opposing direction; and A control unit that controls the operation of the aforementioned first contact separation driving unit, The adhesive force of the adhesive surface is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and higher than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate. Weak, The control unit performs control as follows: by the relatively close movement of the transfer member and the first substrate based on the first contact separation driving unit, the adhesive surface is compressed and deformed by abutting against the plurality of plate-shaped workpieces At the same time, the plurality of plate-shaped workpieces are adhered and held. With the compression and deformation of the adhesive surface, the reaction force surface abuts against the first receiving surface of the first substrate and stops the transfer member based on the first contact separation driving portion Move closer to the aforementioned first substrate. 如請求項1之工件轉印裝置，其具備： 輸送驅動部，其使前述轉印構件的前述黏著部從前述第一對置位置至前述第二對置位置向與前述對置方向交叉之方向移動；及 第二接觸分離驅動部，其使前述轉印構件的前述黏著部相對於前述第二基板從前述第二對置位置向前述對置方向相對地靠近移動及分離移動； 前述第二基板的第二表面具有：前述複數個板狀工件的第二保持部，其與前述轉印構件對置而設置；及第二接收面，其設置於比前述第二保持部更靠外側； 前述控制部如下進行控制：藉由基於前述第二接觸分離驅動部之前述轉印構件與前述第二基板的相對地靠近移動，以前述黏著面接收之前述複數個板狀工件與前述第二基板的前述第二保持部抵接而使前述黏著面壓縮變形的同時前述複數個板狀工件被前述第二保持部保持，伴隨前述黏著面的壓縮變形，前述反作用力面與前述第二基板的前述第二接收面抵接而停止基於前述第二接觸分離驅動部之前述轉印構件與前述第二基板的相對地靠近移動。Such as the workpiece transfer device of claim 1, which has: A conveying drive unit that moves the adhesive portion of the transfer member from the first opposing position to the second opposing position in a direction that intersects the opposing direction; and A second contact and separation driving portion for moving the adhesive portion of the transfer member relative to the second substrate from the second opposing position to the opposing direction relatively close and separated; The second surface of the second substrate has: a second holding portion of the plurality of plate-shaped workpieces, which is provided opposite to the transfer member; and a second receiving surface, which is provided closer to the second holding portion Outside The control section performs control as follows: the plurality of plate-shaped workpieces and the second substrate received by the adhesive surface by the relatively close movement of the transfer member and the second substrate based on the second contact separation driving section When the second holding portion abuts and compresses and deforms the adhesive surface, the plurality of plate-shaped workpieces are held by the second holding portion. As the adhesive surface compresses and deforms, the reaction force surface and the second substrate The second receiving surface abuts to stop the relatively close movement of the transfer member and the second substrate based on the second contact separation driving portion. 如請求項2之工件轉印裝置，其中 前述反作用力面與前述第一基板的前述第一接收面或前述第二基板的前述第二接收面平行對置，並且前述反作用力面配置成與前述黏著部的黏著面平行且包圍前述黏著部的配置部位。Such as the workpiece transfer device of claim 2, where The reaction force surface is parallel to the first receiving surface of the first substrate or the second receiving surface of the second substrate, and the reaction force surface is arranged parallel to the adhesive surface of the adhesive portion and surrounds the adhesive portion The configuration site. 一種工件轉印卡盤，其特徵在於，從第一基板接收前述第一基板上排列之包括微小元件之複數個板狀工件，並將其交接到轉印對象的第二基板的特定位置，且具備： 轉印構件，其設置成在從與前述第一基板對置之第一對置位置朝向前述複數個板狀工件的接收位置相對地靠近移動的同時，從前述接收位置朝向將前述複數個板狀工件交接至前述第二基板之交接位置移動自如； 黏著部，其設置於與前述第一基板上排列之前述複數個板狀工件對置之前述轉印構件的轉印面，且具有能夠在與前述複數個板狀工件對置的方向上彈性變形的黏著面；及 反作用力支撐部，其在前述轉印構件的前述轉印面中比前述黏著部更靠外側設置成朝向前述第一基板的第一表面中比前述複數個板狀工件更靠外側的第一接收面突出，且具有比前述黏著面更硬質的反作用力面； 前述黏著面的黏著力設定為比前述第一基板的第一保持部所具有之各板狀工件的保持力強且比前述第二基板的第二保持部所具有之前述各板狀工件的保持力弱， 藉由前述轉印構件從前述第一對置位置朝向前述接收位置之相對於前述第一基板之相對地靠近移動，前述黏著面與前述複數個板狀工件抵接而壓縮變形的同時黏著保持前述複數個板狀工件， 前述反作用力面伴隨前述接收位置上前述黏著面的壓縮變形而與前述第一基板的前述第一接收面抵接， 藉由前述反作用力面相對於前述第一接收面的抵接而停止前述轉印構件相對於前述第一基板之相對地靠近移動。A work transfer chuck, characterized in that it receives a plurality of plate-shaped work pieces including tiny elements arranged on the first substrate from a first substrate, and transfers them to a specific position of a second substrate of a transfer target, and have: The transfer member is arranged to move the plurality of plate-shaped workpieces from the receiving position toward the receiving position of the plurality of plate-shaped workpieces while moving relatively close to the receiving position of the plurality of plate-shaped workpieces from the first opposing position opposed to the first substrate The workpiece is transferred freely to the transfer position of the aforementioned second substrate; The adhesive portion is provided on the transfer surface of the transfer member facing the plurality of plate-shaped workpieces arranged on the first substrate, and has an elastically deformable direction in a direction facing the plurality of plate-shaped workpieces Adhesive surface; and A reaction force support portion is provided on the transfer surface of the transfer member on the outer side than the adhesive portion, and faces the first receiving surface on the first surface of the first substrate that is on the outer side than the plurality of plate-shaped workpieces It is protruding and has a reaction force surface that is harder than the aforementioned adhesive surface; The adhesive force of the adhesive surface is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and higher than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate. Weak, As the transfer member moves from the first opposing position toward the receiving position relative to the first substrate, the adhesive surface abuts against the plurality of plate-shaped workpieces and compresses and deforms while adhering and holding the Multiple plate-shaped workpieces, The reaction force surface comes into contact with the first receiving surface of the first substrate in accordance with the compression deformation of the adhesive surface at the receiving position, The relatively close movement of the transfer member with respect to the first substrate is stopped by the abutment of the reaction force surface with the first receiving surface. 一種工件轉印方法，其特徵在於，從第一基板接收前述第一基板上排列之包括微小元件之複數個板狀工件，並將其交接到第二基板的特定位置，且包括： 靠近移動步驟，其使設置於轉印構件的轉印面之黏著部與前述第一基板上排列之前述複數個板狀工件對置的同時，在前述轉印構件的前述轉印面中比前述黏著部更靠外側的反作用力支撐部與前述第一基板的第一表面中比前述複數個板狀工件更靠外側的第一接收面對置之狀態下，使前述轉印構件朝向前述第一基板相對地靠近移動； 抵靠步驟，其使相對地靠近移動之前述轉印面的前述黏著部中能夠在與前述複數個板狀工件對置的方向上彈性變形的黏著面與前述複數個板狀工件抵接的同時，使前述轉印構件的前述反作用力支撐部中比前述黏著面硬質的反作用力面與前述第一基板的前述第一接收面抵接；及 分離移動步驟，其使前述轉印構件從前述第一基板分離移動， 前述黏著面的黏著力設定為比前述第一基板的第一保持部所具有之各板狀工件的保持力強且比前述第二基板的第二保持部所具有之前述各板狀工件的保持力弱， 前述抵靠步驟中，藉由與前述複數個板狀工件的抵接，前述黏著面壓縮變形並黏著保持前述複數個板狀工件的同時，藉由伴隨前述黏著面的壓縮變形之前述反作用力面相對於前述第一基板的前述第一接收面的抵接而停止前述轉印構件進一步向前述第一基板的靠近移動。A method for transferring a workpiece, which is characterized in that a plurality of plate-shaped workpieces including tiny components arranged on the first substrate are received from a first substrate, and transferred to a specific position on the second substrate, and includes: In the approaching moving step, the adhesive portion provided on the transfer surface of the transfer member is opposed to the plurality of plate-shaped workpieces arranged on the first substrate, and at the same time, the transfer surface of the transfer member is larger than the adhesive portion In a state where the reaction force support portion further to the outside faces the first receiving surface of the first surface of the first substrate that is more outside than the plurality of plate-shaped workpieces, the transfer member is opposed to the first substrate Move closer to the ground; The abutting step involves contacting the plurality of plate-shaped workpieces with the adhesive surface of the adhesive portion relatively close to the moving transfer surface that can be elastically deformed in a direction facing the plurality of plate-shaped workpieces, Making the reaction force surface harder than the adhesive surface of the reaction force support portion of the transfer member abut against the first receiving surface of the first substrate; and A separating and moving step of separating and moving the transfer member from the first substrate, The adhesive force of the adhesive surface is set to be stronger than the holding force of the plate-shaped workpieces of the first holding portion of the first substrate and higher than the holding force of the plate-shaped workpieces of the second holding portion of the second substrate. Weak, In the abutting step, by abutting against the plurality of plate-shaped workpieces, the adhesive surface compresses and deforms and adheres to hold the plurality of plate-shaped workpieces, and at the same time, the reaction force faces the pressure and deformation accompanying the compression deformation of the adhesive surface. In response to the abutment of the first receiving surface of the first substrate, the transfer member is stopped from further moving closer to the first substrate.
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