JP2003209346A - Method for mounting component and electronic device - Google Patents
Method for mounting component and electronic deviceInfo
- Publication number
- JP2003209346A JP2003209346A JP2002007222A JP2002007222A JP2003209346A JP 2003209346 A JP2003209346 A JP 2003209346A JP 2002007222 A JP2002007222 A JP 2002007222A JP 2002007222 A JP2002007222 A JP 2002007222A JP 2003209346 A JP2003209346 A JP 2003209346A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- component
- thermoplastic resin
- resin layer
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば、発光素子
等からなる部品の実装方法、及びこの部品を実装した画
像表示装置等の電子装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method of a component such as a light emitting element and an electronic device such as an image display device mounted with the component.
【０００２】[0002]
【従来の技術】従来、発光素子等の電子部品は、例えば
図５に示す方法で実装されている。2. Description of the Related Art Conventionally, electronic parts such as light emitting devices are mounted by the method shown in FIG.
【０００３】まず、図５（ａ）に示すように、通常、電
子部品の実装方法において紫外線の照射又は加熱により
粘着力を失うような粘着材１２を塗布したシート基材１
３の上にシリコンウェーハを貼り付け、ダイシングを行
って、各電子部品１１に分割する。First, as shown in FIG. 5 (a), usually, in a mounting method of electronic parts, a sheet base material 1 coated with an adhesive material 12 which loses its adhesive force by irradiation of ultraviolet rays or heating.
A silicon wafer is pasted on 3 and dicing is performed to divide each electronic component 11.
【０００４】次に、図５（ｂ）に示すように、裏面から
紫外線１７を照射することによって、粘着材１２の粘着
力を低下させ、吸着ヘッド１４などを用いて一対一で電
子部品１１を剥離する。Next, as shown in FIG. 5B, the adhesive force of the adhesive material 12 is reduced by irradiating the back surface with ultraviolet rays 17, and the electronic parts 11 are attached one-to-one with the suction head 14 or the like. Peel off.
【０００５】次に、図５（ｃ）に示すように、吸着ヘッ
ド１４に吸着された電子部品１１を実装基板１６上の接
着剤１５（又ははんだ）に接触させて接着又は接合し、
更に実装基板１６上の配線（図示せず）に電気的に接続
することによって、電子部品１１を転写し、実装を終了
する。Next, as shown in FIG. 5C, the electronic component 11 sucked by the suction head 14 is brought into contact with the adhesive 15 (or solder) on the mounting substrate 16 to be bonded or joined,
Further, by electrically connecting to a wiring (not shown) on the mounting substrate 16, the electronic component 11 is transferred and the mounting is completed.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、同じ電
子部品を等間隔で高精度に数多く並べるようなプロセス
の場合、上記のように一対一で電子部品１１を実装する
と、非常に時間がかかり、また時間を短縮するために実
装機のインデックスタイムを上げようとすると、不可避
的に位置決め精度が低下するという問題が生じてしま
う。現行の実装機では、１０μｍ程度の位置決め精度が
限界であり、現行の機構的位置決め方法では、それ以上
の位置決め精度の向上は難しい。However, in the process of arranging a large number of the same electronic parts at equal intervals with high accuracy, if the electronic parts 11 are mounted one-to-one as described above, it takes a very long time. If an attempt is made to increase the index time of the mounting machine in order to shorten the time, there arises a problem that the positioning accuracy inevitably decreases. With the current mounting machine, the positioning accuracy of about 10 μm is the limit, and it is difficult to further improve the positioning accuracy with the current mechanical positioning method.
【０００７】本発明の目的は、多数の部品を同時に転
写、実装でき、作業時間の短縮、位置決め精度の向上が
可能な部品の実装方法、及びこの実装方法で作製される
電子装置を提供することにある。It is an object of the present invention to provide a component mounting method capable of transferring and mounting a large number of components at the same time, shortening the working time, and improving the positioning accuracy, and an electronic device manufactured by this mounting method. It is in.
【０００８】[0008]
【課題を解決するための手段】即ち、本発明は、実装基
体に部品を実装する方法において、前記実装基体と前記
部品との間に熱可塑性樹脂層を介在させ、前記熱可塑性
樹脂層を加熱して前記実装基体に前記部品を接着するこ
とを特徴とする、部品の実装方法に係り、更にこの実装
方法により作製された電子装置に係るものである。That is, according to the present invention, in a method for mounting a component on a mounting base, a thermoplastic resin layer is interposed between the mounting base and the component, and the thermoplastic resin layer is heated. The present invention also relates to a method for mounting a component, characterized in that the component is adhered to the mounting substrate, and further relates to an electronic device manufactured by this mounting method.
【０００９】熱可塑性樹脂は、加熱すれば、溶解により
流動性を生じ、部品の接着に用いるとその接着位置が変
化し、位置ずれを生じ易いので、熱可塑性樹脂を部品の
実装時の接着に用いることはこれまで考えられないこと
であった。しかし、本発明者は、熱可塑性樹脂が加熱に
より十分な接着力を発現し、粘着材よりも大きな接着力
を生じることをつき止め、本発明に到達したものであ
る。[0009] The thermoplastic resin causes fluidity due to melting when heated, and when it is used for bonding components, the bonding position changes and the position is apt to be displaced. Therefore, the thermoplastic resin is used for bonding when mounting components. It was unthinkable to use. However, the inventor of the present invention has arrived at the present invention by finding out that the thermoplastic resin develops a sufficient adhesive force by heating and produces a larger adhesive force than the adhesive material.
【００１０】本発明によれば、前記実装基体と前記部品
との間に熱可塑性樹脂層を介在させ、前記熱可塑性樹脂
層を加熱して前記実装基体に前記部品を接着するので、
次の（１）〜（３）に示す顕著な作用効果を奏すること
ができる。According to the present invention, the thermoplastic resin layer is interposed between the mounting base and the component, and the thermoplastic resin layer is heated to bond the component to the mounting base.
The following remarkable effects can be achieved (1) to (3).
【００１１】（１）前記熱可塑性樹脂層は加熱すること
によって接着力が発現するので、全面の加熱プロセスに
より多数の部品を同時に転写、実装することができる。
この多数の部品は、基材に粘着固定された状態にて全面
加熱等により同時に別の支持体に剥離転写した後、実装
基体に同時に転写することができる。(1) Since the adhesive force of the thermoplastic resin layer is developed by heating, a large number of components can be transferred and mounted at the same time by a heating process on the entire surface.
A large number of these components can be simultaneously peeled and transferred to another support by heating the entire surface while being adhesively fixed to the base material, and then simultaneously transferred to the mounting substrate.
【００１２】（２）従って、剥離、転写、実装のプロセ
スは、局部的な加熱や紫外線照射が不要となり、全面を
加熱するだけで実現できるため、位置精度を高く保持し
つつ短時間に行うことができる。(2) Therefore, the peeling, transferring, and mounting processes do not require local heating or ultraviolet irradiation, and can be realized only by heating the entire surface. Therefore, the positioning accuracy can be kept high and the process can be performed in a short time. You can
【００１３】（３）前記熱可塑性樹脂層は、再加熱によ
って再び接着力が生じるので、再加熱により別の位置に
部品を更に転写することもできる。(3) Since the thermoplastic resin layer re-heats to generate an adhesive force, it is possible to further transfer the component to another position by re-heating.
【００１４】[0014]
【発明の実施の形態】本発明においては、前記熱可塑性
樹脂層を前記実装基体の全面又は一部分に塗布してお
き、支持体に粘着固定した前記部品としての電子部品を
前記熱可塑性樹脂層に接触させた状態で加熱して、前記
実装基体に転写するのがよい。この場合、基材上に前記
電子部品を粘着固定した状態から前記電子部品を前記支
持体に転写して粘着固定し、更に前記実装基体に転写す
るのがよい。BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the thermoplastic resin layer is applied to the entire surface or a part of the mounting substrate, and an electronic component as the component adhesively fixed to a support is applied to the thermoplastic resin layer. It is preferable that the mounting substrate is heated and transferred to the mounting substrate. In this case, it is preferable to transfer the electronic component to the support by adhering and fixing the electronic component on the base material, and then transfer the electronic component to the mounting substrate.
【００１５】実装状態では、前記実装基体に転写した前
記部品を前記実装基体上の配線に電気的に接続する。In the mounted state, the component transferred to the mounting base is electrically connected to the wiring on the mounting base.
【００１６】以下、本発明の好ましい実施の形態を図面
参照下に詳しく説明する。Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.
【００１７】本実施の形態では、まず図１（ａ）に示す
ように、紫外線硬化粘着材１２（又は熱再剥離シートの
粘着材）を塗布したシート基材１３上に、所望の間隔、
位置関係で予め多数の電子部品１１が粘着固定された状
態で提供されているとする。例えば、シリコンウェーハ
などの部品をダイシングしたものなどである。粘着材１
２は、加熱によって粘着力が極端に低下する性質を有す
る。基材１３は、後述の加熱プロセスの温度条件に対し
て十分な耐熱性と低熱膨張特性を有しているものであ
る。In the present embodiment, first, as shown in FIG. 1A, a desired distance is set on a sheet base material 13 coated with an ultraviolet curing adhesive material 12 (or an adhesive material of a heat re-peeling sheet).
It is assumed that a large number of electronic components 11 are provided in advance in a state of being adhesively fixed due to a positional relationship. For example, it is obtained by dicing a component such as a silicon wafer. Adhesive material 1
No. 2 has a property that the adhesive strength is extremely reduced by heating. The base material 13 has sufficient heat resistance and low thermal expansion characteristics against the temperature conditions of the heating process described later.
【００１８】そして、粘着材２２を塗布した一時転写ブ
ロック２１を対向させ、これに対して図１（ｂ）に示す
ように、基材１３上の多数の電子部品１１を同時に貼り
付け、裏面からレーザー光２３を照射して粘着材１２の
粘着力を低下させ、図１（ｃ）に示すように、各電子部
品１１を剥離してブロック２１へ同時に転写する。Then, the temporary transfer block 21 coated with the adhesive material 22 is opposed to this, and as shown in FIG. 1B, a large number of electronic components 11 are simultaneously attached to the base material 13 and the rear surface is The adhesive force of the adhesive material 12 is reduced by irradiating the laser light 23, and each electronic component 11 is peeled off and simultaneously transferred to the block 21 as shown in FIG.
【００１９】次に、図１（ｄ）に示すように、熱可塑性
樹脂層（例えばアクリル系樹脂層）２４を接着剤として
全面に塗布してある実装基板２５上にブロック２１を、
電子部品１１の側で対向させ、更に図２（ｅ）に示すよ
うに、互いに貼り合わせる。この状態で全体を全面加熱
して熱可塑性樹脂層２４を溶解させ、その十分な、接着
力を発現させる。Next, as shown in FIG. 1 (d), the block 21 is mounted on a mounting substrate 25 on which a thermoplastic resin layer (for example, an acrylic resin layer) 24 is applied as an adhesive.
The electronic components 11 are made to face each other, and further attached to each other as shown in FIG. In this state, the entire surface is heated to melt the thermoplastic resin layer 24, and its sufficient adhesive force is developed.
【００２０】実際、熱可塑性樹脂層２４が溶解状態であ
れば、粘着材２２よりも強い接着力を有しているため
に、通常は融解温度のまま、図２（ｆ）に示すように、
電子部品１１を実装基板２５に接着させて同時に剥離転
写することができる。また、粘着材２２の材質によって
は剥離することが難しいことがあるが、この場合は一度
冷却すると、剥離し易くなる。但し、粘着材２２を長時
間高温下にさらすと、アウトガスが生じたり、粘着力が
上がったり、再利用が不可能になるので、高温で剥離す
る方法を用い、必要に応じて冷却する方法が望ましい．In fact, when the thermoplastic resin layer 24 is in a dissolved state, it has a stronger adhesive force than the adhesive material 22, so that it is usually at the melting temperature, as shown in FIG.
The electronic component 11 can be adhered to the mounting substrate 25 and simultaneously peeled and transferred. Further, it may be difficult to peel off depending on the material of the adhesive material 22, but in this case, once cooled, it becomes easy to peel off. However, if the adhesive material 22 is exposed to a high temperature for a long time, outgas is generated, the adhesive strength is increased, and the adhesive cannot be reused. Therefore, a method of peeling at a high temperature and a method of cooling as necessary are preferable. ．
【００２１】こうして、熱可塑性樹脂（接着剤）層２４
を用いた転写方法によって、多数の電子部品１１を同時
に転写し、図２（ｇ）に示すように実装基板２５に実装
することができる。Thus, the thermoplastic resin (adhesive) layer 24
A large number of electronic components 11 can be simultaneously transferred by the transfer method using and can be mounted on the mounting substrate 25 as shown in FIG.
【００２２】図３は、実装構造の具体例を示すものであ
る。実装基板であるプリント配線基板２５上の熱可塑性
樹脂層２４に接着固定された電子部品１１の上に、保護
層となる絶縁層３２を形成する。電子部品１１は、例え
ば発光素子２０をリード線３５で外部端子１０に接続
し、全体をモールド樹脂２６で固めたチップからなる。
その外部端子１０上のモールド樹脂２６及び絶縁層３
２、及びプリント配線基板２５上の配線８ａ及び８ｂ上
の熱可塑性樹脂層２４及び絶縁層３２に、配線接続用の
ビアホール３４をレーザ処理等によって設け、ビアホー
ル３４内及び絶縁層３２に配線２３をスパッタ法等によ
って形成し、電子部品１１をプリント配線基板２５に対
し電気的に接続し、実装を終了する。FIG. 3 shows a specific example of the mounting structure. An insulating layer 32 serving as a protective layer is formed on the electronic component 11 adhered and fixed to the thermoplastic resin layer 24 on the printed wiring board 25 which is a mounting board. The electronic component 11 is, for example, a chip in which the light emitting element 20 is connected to the external terminal 10 with a lead wire 35 and the whole is fixed with a molding resin 26.
Mold resin 26 and insulating layer 3 on the external terminal 10
2, and the thermoplastic resin layer 24 and the insulating layer 32 on the wirings 8a and 8b on the printed wiring board 25 are provided with via holes 34 for wiring connection by laser processing or the like, and the wirings 23 are provided in the via holes 34 and on the insulating layer 32. The electronic component 11 is formed by a sputtering method or the like, and is electrically connected to the printed wiring board 25, and the mounting is completed.
【００２３】図４は、他の転写プロセスを示すものであ
る。FIG. 4 shows another transfer process.
【００２４】即ち、図４（ａ）に示すように、既に実装
基板２５上に実装された電子部品３１が存在している場
合でも、その部品より高さが同等か或いはより高い電子
部品３２をブロック２１に粘着固定した状態から、これ
を上記と同様に実装基板２５上に一括して転写すること
ができる。That is, as shown in FIG. 4A, even when the electronic component 31 already mounted on the mounting substrate 25 already exists, an electronic component 32 having a height equal to or higher than that of the electronic component 31 is mounted. From the state of being adhesively fixed to the block 21, this can be collectively transferred onto the mounting substrate 25 in the same manner as described above.
【００２５】この場合、実装基板２５上の熱可塑性樹脂
層２４は再加熱によって再び接着力を発現するので、こ
れに対し、ブロック２１に粘着固定された別の電子部品
３２を既に実装されている電子部品３１に隣接して転写
して接着固定することができる。従って、既に実装され
ている電子部品３１に悪影響を与えることなしに異種の
電子部品３２を実装でき、実装時間を大幅に短縮するこ
とができる。なお、上記の熱可塑性樹脂層２４の加熱温
度は、接着力を発現させるものであればよく、樹脂の種
類にもよるが、通常はガラス転移温度（Ｔｇ）以下、例
えば１５０〜１８０℃で１〜２分間加熱して、その流動
性を防止しつつ位置精度良く剥離、転写を行うと共に仮
硬化させ、しかる後に１８０〜２７０℃、５〜１０分間
で本硬化させ、これによって電子部品の固定を終了す
る。In this case, since the thermoplastic resin layer 24 on the mounting substrate 25 re-exhibits an adhesive force by reheating, on the contrary, another electronic component 32 adhesively fixed to the block 21 is already mounted. It can be transferred adjacent to the electronic component 31 and fixed by adhesion. Therefore, different kinds of electronic components 32 can be mounted without adversely affecting the already mounted electronic components 31, and the mounting time can be greatly shortened. The heating temperature of the thermoplastic resin layer 24 may be any temperature as long as it develops an adhesive force, and it depends on the type of resin, but is usually not higher than the glass transition temperature (Tg), for example, 150 to 180 ° C. It is heated for ~ 2 minutes to prevent its fluidity, peeling and transferring with high positional accuracy, and temporarily cured, and then finally cured at 180 to 270 ° C for 5 to 10 minutes, thereby fixing electronic parts. finish.
【００２６】以上に述べた本実施の形態による転写（実
装）プロセスは、次の（ａ）〜（ｅ）の顕著な作用効果
を奏することができる。The transfer (mounting) process according to this embodiment described above can exhibit the following remarkable effects (a) to (e).
【００２７】(ａ)実装基板２５に熱可塑性樹脂層２４を
接着剤として設けているので、加熱のみで、電子部品の
剥離と転写による実装を行うことが可能となる。従っ
て、紫外線反応型の物質を用いる必要がなく、紫外線照
射装置も必要なくなる。(A) Since the thermoplastic resin layer 24 is provided on the mounting substrate 25 as an adhesive, the electronic components can be separated and mounted by transfer only by heating. Therefore, it is not necessary to use a UV-reactive substance, and a UV irradiation device is also unnecessary.
【００２８】（ｂ）熱可塑性樹脂層２４は加熱すること
によって接着力が発現するので、全面の加熱プロセスに
より多数の電子部品を同時に転写、実装することができ
る。この多数の電子部品は、基材１３に粘着固定された
状態にて全面加熱等により同時にブロック２１に剥離転
写した後、実装基板２５に同時に転写することができる
ので、剥離、転写、実装のプロセスは、局部的な加熱や
紫外線照射が不要となり、全面を加熱するだけで実現で
きるため、位置精度を高く保持しつつ短時間に行うこと
ができる。(B) Since the adhesive force of the thermoplastic resin layer 24 is developed by heating, a large number of electronic components can be simultaneously transferred and mounted by a heating process on the entire surface. Since a large number of electronic components can be simultaneously peeled and transferred to the block 21 by heating the entire surface while being adhesively fixed to the base material 13 and then simultaneously transferred to the mounting substrate 25, the peeling, transferring, and mounting processes are performed. Does not require local heating or ultraviolet irradiation, and can be realized by only heating the entire surface. Therefore, it can be performed in a short time while maintaining high positional accuracy.
【００２９】（ｃ）熱可塑性接着剤２４を用いることに
よって、再加熱すれば、再度剥離転写が可能である。特
に、再加熱プロセスにより、高さの違うチップの転写が
可能となる（図４参照）。フェイスダウン型の電子部品
では、配線上にはんだを用いて接着すれば、部品の最配
線の必要もなくなる。(C) By using the thermoplastic adhesive 24, if reheating is performed, peeling transfer can be performed again. In particular, the reheating process makes it possible to transfer chips of different heights (see FIG. 4). In the face-down type electronic component, if the wiring is adhered using solder, it is not necessary to re-wire the component.
【００３０】（ｄ）基板を全面的に加熱した後、冷却せ
ずに剥離、転写すると、粘着材へのダメージも少なく、
粘着材のライフの向上に役立つ。また、粘着材が必要以
上に温まらないように加熱できるために、部品の位置ず
れのおそれもなくなる。(D) When the substrate is entirely heated and then peeled and transferred without cooling, the damage to the adhesive material is small,
Useful for improving the life of adhesive materials. Further, since the adhesive material can be heated so as not to warm up more than necessary, there is no risk of misalignment of parts.
【００３１】（ｅ）上記した転写プロセスは、実装時間
の大幅な短縮に貢献する。(E) The transfer process described above contributes to a significant reduction in mounting time.
【００３２】以上に説明した実施の形態は、本発明の技
術的思想に基づいて更に変更が可能である。The embodiment described above can be further modified based on the technical idea of the present invention.
【００３３】例えば、上述の熱可塑性接着剤の種類や塗
布面積、塗布方法は種々であってよく、電子部品の実装
面積分だけパターン塗布してもよい。或いは、熱可塑性
接着剤を実装基板上に塗布する代りに、電子部品の側に
塗布してこれを実装基板上に接着してもよい。For example, the type, application area, and application method of the above-mentioned thermoplastic adhesive may be various, and pattern application may be applied only for the mounting area of the electronic component. Alternatively, instead of applying the thermoplastic adhesive on the mounting board, it may be applied on the electronic component side and then adhered to the mounting board.
【００３４】また、実装基板への電子部品の接続方法及
び接続構造は上述したものに限定されることはない。な
お、本発明が適用される電子部品は発光素子以外の種々
の素子であってよい。The method and structure for connecting electronic components to the mounting board are not limited to those described above. The electronic component to which the present invention is applied may be various elements other than the light emitting element.
【００３５】[0035]
【発明の作用効果】上述したように、本発明の方法によ
れば、実装基体と部品との間に熱可塑性樹脂層を介在さ
せ、この熱可塑性樹脂層を加熱して実装基体に部品を接
着するので、次の（１）〜（３）に示す顕著な作用効果
を奏することができる。As described above, according to the method of the present invention, the thermoplastic resin layer is interposed between the mounting substrate and the component, and the thermoplastic resin layer is heated to bond the component to the mounting substrate. Therefore, it is possible to exert the remarkable operational effects shown in the following (1) to (3).
【００３６】（１）前記熱可塑性樹脂層は加熱すること
によって接着力が発現するので、全面の加熱プロセスに
より多数の部品を同時に転写、実装することができる。
この多数の部品は、基材に粘着固定された状態にて全面
加熱等により同時に別の支持体に剥離転写した後、実装
基体に同時に転写することができる。(1) Since the adhesive force of the thermoplastic resin layer is developed by heating, a large number of parts can be transferred and mounted at the same time by a heating process on the entire surface.
A large number of these components can be simultaneously peeled and transferred to another support by heating the entire surface while being adhesively fixed to the base material, and then simultaneously transferred to the mounting substrate.
【００３７】（２）従って、剥離、転写、実装のプロセ
スは、局部的な加熱や紫外線照射が不要となり、全面を
加熱するだけで実現できるため、位置精度を高く保持し
つつ短時間に行うことができる。(2) Therefore, the peeling, transferring, and mounting processes do not require local heating or ultraviolet irradiation, and can be realized only by heating the entire surface. You can
【００３８】（３）前記熱可塑性樹脂層は、再加熱によ
って再び接着力が生じるので、再加熱により別の位置に
部品を更に転写することもできる。(3) Since the thermoplastic resin layer re-heats to have an adhesive force, the part can be further transferred to another position by re-heating.
【図１】本発明の実施の形態による電子部品の固定及び
電子装置の製造の工程を順次示す断面図である。FIG. 1 is a sectional view sequentially showing a process of fixing an electronic component and manufacturing an electronic device according to an embodiment of the present invention.
【図２】同、工程を順次示す断面図である。FIG. 2 is a cross-sectional view showing the same process step by step.
【図３】同、電子装置の要部断面図である。FIG. 3 is a sectional view of relevant parts of the electronic device.
【図４】本発明の他の実施の形態による電子部品の固定
及び電子装置の製造の工程を示す断面図である。FIG. 4 is a cross-sectional view showing a process of fixing an electronic component and manufacturing an electronic device according to another embodiment of the present invention.
【図５】従来例における電子部品の固定及び電子装置の
製造の工程を示す断面図である。FIG. 5 is a cross-sectional view showing a process of fixing an electronic component and manufacturing an electronic device in a conventional example.
１１…ダイシング済み（もしくは実装済み）電子部品、
１２…紫外線硬化粘着材（または熱再剥離シートの粘着
材）、１３…シート基材、２１…ブロック、２２…粘着
材、２３…レーザー光、２４…熱可塑性樹脂層、２５…
実装基板11 ... Dicing (or mounting) electronic components,
12 ... UV curable adhesive (or adhesive of heat-releasing sheet), 13 ... Sheet base material, 21 ... Block, 22 ... Adhesive material, 23 ... Laser light, 24 ... Thermoplastic resin layer, 25 ...
Mounting board
フロントページの続き Ｆターム(参考） 5E319 AA03 AB05 AC02 CC61 CD04 CD16 CD26 GG09 GG15 5F041 AA37 DA13 DA34 DA35 DA43 DA55 DA75 DA83 DB08 DC08 FF06 5F047 AA17 BA21 BA37 BB11 Continued front page F-term (reference) 5E319 AA03 AB05 AC02 CC61 CD04 CD16 CD26 GG09 GG15 5F041 AA37 DA13 DA34 DA35 DA43 DA55 DA75 DA83 DB08 DC08 FF06 5F047 AA17 BA21 BA37 BB11
Claims (7)
て、 前記実装基体と前記部品との間に熱可塑性樹脂層を介在
させ、 前記熱可塑性樹脂層を加熱して前記実装基体に前記部品
を接着することを特徴とする、部品の実装方法。1. A method of mounting a component on a mounting base, wherein a thermoplastic resin layer is interposed between the mounting base and the component, and the thermoplastic resin layer is heated to bond the component to the mounting base. A method for mounting a component, which comprises:
面又は一部分に塗布しておき、支持体に粘着固定した電
子部品を前記熱可塑性樹脂層に接触させた状態で加熱し
て、前記実装基体に転写する、請求項１に記載した部品
の実装方法。2. The thermoplastic resin layer is applied to the entire surface or a part of the mounting substrate, and an electronic component adhesively fixed to a support is heated in a state of being in contact with the thermoplastic resin layer to carry out the mounting. The method for mounting a component according to claim 1, wherein the component is transferred onto a substrate.
態から前記電子部品を前記支持体に転写して粘着固定
し、更に前記実装基体に転写する、請求項２に記載した
部品の実装方法。3. The mounting of the component according to claim 2, wherein the electronic component is transferred to the support by adhesively fixing it from a state in which the electronic component is adhesively fixed on a base material, and further transferred to the mounting base. Method.
実装基体上の配線に電気的に接続する、請求項１に記載
した部品の実装方法。4. The component mounting method according to claim 1, wherein the component transferred to the mounting substrate is electrically connected to a wiring on the mounting substrate.
装置において、 前記実装基体と前記部品との間に介在した熱可塑性樹脂
層によって前記部品が前記実装基体に接着されているこ
とを特徴とする、電子装置。5. An electric circuit device in which a component is mounted on a mounting base, wherein the component is adhered to the mounting base by a thermoplastic resin layer interposed between the mounting base and the component. And an electronic device.
れた前記熱可塑性樹脂層によって前記部品が前記実装基
体に接着されている、請求項５に記載した電子装置。6. The electronic device according to claim 5, wherein the component is adhered to the mounting substrate by the thermoplastic resin layer applied to the entire surface or a part of the mounting substrate.
的に接続されている、請求項５に記載した電子装置。7. The electronic device according to claim 5, wherein the component is electrically connected to a wiring on the mounting substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002007222A JP2003209346A (en) | 2002-01-16 | 2002-01-16 | Method for mounting component and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002007222A JP2003209346A (en) | 2002-01-16 | 2002-01-16 | Method for mounting component and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003209346A true JP2003209346A (en) | 2003-07-25 |
Family
ID=27645786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002007222A Pending JP2003209346A (en) | 2002-01-16 | 2002-01-16 | Method for mounting component and electronic device |
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| Country | Link |
|---|---|
| JP (1) | JP2003209346A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009283806A (en) * | 2008-05-26 | 2009-12-03 | Stanley Electric Co Ltd | Production process of semiconductor device |
| JP2010532089A (en) * | 2007-06-29 | 2010-09-30 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Photoelectric component manufacturing method and photoelectric component |
| JP2018508971A (en) * | 2014-12-19 | 2018-03-29 | グロ アーベーＧｌｏ Ａｂ | Method for generating a light emitting diode array on a backplane |
| JP2018515942A (en) * | 2015-10-20 | 2018-06-14 | ゴルテック インコーポレイテッド | Micro light-emitting diode transport method, manufacturing method, apparatus, and electronic apparatus |
| JP2020181910A (en) * | 2019-04-25 | 2020-11-05 | 大日本印刷株式会社 | Manufacturing method and manufacturing device of transfer member, chip substrate, and manufacturing method of light emitting substrate |
| CN112309907A (en) * | 2019-08-01 | 2021-02-02 | 信越工程株式会社 | Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method |
-
2002
- 2002-01-16 JP JP2002007222A patent/JP2003209346A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010532089A (en) * | 2007-06-29 | 2010-09-30 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Photoelectric component manufacturing method and photoelectric component |
| KR101433423B1 (en) * | 2007-06-29 | 2014-08-27 | 오스람 옵토 세미컨덕터스 게엠베하 | Method for producing optoelectronic components, and optoelectronic component |
| JP2009283806A (en) * | 2008-05-26 | 2009-12-03 | Stanley Electric Co Ltd | Production process of semiconductor device |
| JP2018508971A (en) * | 2014-12-19 | 2018-03-29 | グロ アーベーＧｌｏ Ａｂ | Method for generating a light emitting diode array on a backplane |
| JP2018515942A (en) * | 2015-10-20 | 2018-06-14 | ゴルテック インコーポレイテッド | Micro light-emitting diode transport method, manufacturing method, apparatus, and electronic apparatus |
| JP2020181910A (en) * | 2019-04-25 | 2020-11-05 | 大日本印刷株式会社 | Manufacturing method and manufacturing device of transfer member, chip substrate, and manufacturing method of light emitting substrate |
| CN112309907A (en) * | 2019-08-01 | 2021-02-02 | 信越工程株式会社 | Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method |
| JP2021027098A (en) * | 2019-08-01 | 2021-02-22 | 信越エンジニアリング株式会社 | Work-piece transfer device and work-piece transfer chuck, and work-piece transfer method |
| CN112309907B (en) * | 2019-08-01 | 2024-04-26 | 信越工程株式会社 | Workpiece transfer device, workpiece transfer chuck, and workpiece transfer method |
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