JP2020181910A - Manufacturing method and manufacturing device of transfer member, chip substrate, and manufacturing method of light emitting substrate - Google Patents

Abstract

To increase the productivity of a light emitting substrate on which a plurality of micro light emitting diode chips are arranged.SOLUTION: A manufacturing method of a transfer member 20 includes the steps of: preparing a holding member 30 which has a plurality of protrusion holding portions 32 that are regularly two-dimensionally arranged on one surface of a plate-shaped base material 31, and each of which holds a light emitting diode chip 50, and in which a first adhesive layer 35 is provided at the tip; preparing a chip substrate 40 having a second adhesive layer 42 which is less adhesive than the first adhesive layer 35 laminated on one surface of a plate-shaped chip base material 41, and a plurality of light emitting diode chips 50 regularly two-dimensionally arranged on the second adhesive layer 42; and bringing the light emitting diode chip 50 of the chip substrate 40 and the protruding holding portion 32 of the holding member 30 into contact with each other, then separating the chip substrate 40 and the holding member 30 from each other, and causing the protruding holding portion 32 to hold the light emitting diode chip 50.SELECTED DRAWING: Figure 15C

Description

The present invention relates to a method and an apparatus for manufacturing a transfer member of a light emitting diode chip, a chip substrate used therein, and a method for manufacturing a light emitting substrate.

In recent years, a display device using a light emitting board in which a plurality of micro light emitting diode (LED) chips are arranged on a circuit board having a circuit, a so-called micro LED display, has been developed. Micro LED displays are superior to liquid crystal displays and the like in terms of brightness, power consumption, response speed, reliability, etc., and are attracting attention as next-generation lightweight and thin displays.

Conventionally, when manufacturing a light emitting substrate used for a micro LED display, a plurality of micro light emitting diode chips formed by dicing a wafer have been arranged one by one on a circuit board by a pick and place process. In such a method for manufacturing a light emitting board, the pick-and-place process is repeated millions of times or more, so that the process of arranging the micro light emitting diode chip on the circuit board takes time, and the manufacturing cost increases accordingly. It ends up. That is, the light emitting substrate can be manufactured only with low productivity.

Therefore, as in Patent Document 1, it has been considered to arrange the micro light emitting diode chip from the wafer to the circuit board by the adhesive stamp. Since the adhesive stamp of Patent Document 1 can hold a plurality of micro light emitting diode chips, a plurality of micro light emitting diode chips can be arranged on the circuit board in one pick and place step. Therefore, the time required for the process of arranging the micro light emitting diode chip on the circuit board can be shortened, and the manufacturing cost can be reduced.

Special Table 2017-531915

By the way, the adhesive stamp of Patent Document 1 loses its adhesiveness when the pick-and-place process is repeated. When the adhesiveness of the adhesive stamp is reduced, the certainty that the adhesive stamp holds the micro light emitting diode chip during the pick-and-place process is reduced. Therefore, a step of imparting adhesiveness to the adhesive stamp and a step of exchanging the adhesive stamp are required, and it is difficult to increase the productivity of manufacturing the light emitting substrate.

Therefore, the present inventors have studied and made it possible to arrange the micro light emitting diode chips from the wafer to the circuit board without repeating the pick and place process, and further, the micro light emitting diode chips are collectively put on the circuit board. A holding member for holding a micro light emitting diode chip, a transfer member for a micro light emitting diode chip having the holding member, a method for manufacturing the transfer member, and a light emitting substrate using the transfer member. I found the method. That is, an object of the present invention is to increase the productivity of a light emitting substrate on which a plurality of micro light emitting diode chips are arranged.

In order to solve the above problems, in the method for manufacturing a transfer member of the present invention, a plate-shaped base material and a light emitting diode chip each of which is regularly arranged two-dimensionally on one surface of the base material are provided. A step of preparing a holding member having a plurality of protruding holding portions provided with a first adhesive layer at the tip portion for holding, a plate-shaped chip base material, and one surface of the chip base material. Prepare a chip substrate having a second adhesive layer which is laminated on the first adhesive layer and has a lower adhesiveness than the first adhesive layer, and a plurality of light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer. After bringing the light emitting diode chip of the chip substrate into contact with the protruding holding portion of the holding member, the chip substrate and the holding member are separated from each other, and the light emitting diode chip is projected. It includes a step of holding the holding portion.

Further, in the method for manufacturing a transfer member of the present invention, a plate-shaped base material and a tip for regularly two-dimensionally arranging on one surface of the base material and each holding one light emitting diode chip. A step of preparing a holding member having a plurality of protruding holding portions provided with a first adhesive layer in the portions, and a plate-shaped chip base material laminated on one surface of the chip base material and irradiated with ultraviolet rays. A chip substrate having a second adhesive layer whose adhesiveness is lower than that of the first adhesive layer by heating or cooling, and a plurality of light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer. A step of lowering the adhesiveness of the second adhesive layer of the chip substrate to be lower than that of the first adhesive layer by ultraviolet irradiation, heating or cooling, and the light emitting diode chip and the holding of the chip substrate. After contacting the protruding holding portion of the member, the chip substrate and the holding member are separated from each other to hold the light emitting diode chip in the protruding holding portion.

Further, the method for manufacturing a transfer member of the present invention includes a step of holding a plurality of the light emitting diode chips by a plurality of the protruding holding portions in the first region of the holding member, and the holding member with respect to the chip substrate. The step of relative movement and the plurality of other light emitting diode chips different from the plurality of light emitting diode chips are held by the plurality of protruding holding portions in a second region different from the first region of the holding member. It may be provided with a process. An integral multiple of the pitch of the arrangement of the light emitting diode chips on the chip substrate may be the pitch of the arrangement of the protruding holding portions of the holding member.

The transfer member manufacturing apparatus of the present invention is regularly arranged in two dimensions on one surface of a plate-shaped base material and the base material, and each has a tip portion for holding one light emitting diode chip. A plurality of protruding holding portions provided with a first adhesive layer, a holding member holding portion for holding a holding member having the first adhesive layer, a plate-shaped chip base material, and the chip base material are laminated on one surface of the chip base material. A chip substrate holding a chip substrate having a second adhesive layer having a lower adhesiveness than the first adhesive layer and a plurality of the light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer. A unit, a camera for observing the holding member and the chip substrate held by the holding member holding portion and the chip substrate holding portion, and a control unit for controlling the holding member holding portion, the chip substrate holding portion, and the camera. The control unit controls the holding member holding unit and the chip substrate holding unit by using the observation results of the holding member and the chip substrate by the camera, and the holding member and the chip substrate. Positioning.

The chip substrate of the present invention is regularly two-dimensionally arranged on one surface of a plate-shaped substrate and the substrate, and each of them has a first adhesion to the tip for holding one light emitting diode chip. A chip substrate used for holding the light emitting diode chip on a holding member having a plurality of protruding holding portions provided with layers, which is on one surface of a plate-shaped chip base material and the chip base material. The second adhesive layer is provided with a second adhesive layer laminated on the surface and a plurality of the light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer, and the second adhesive layer is the first of the holding members. 1 Adhesiveness is lower than that of the adhesive layer. An integral multiple of the pitch of the arrangement of the light emitting diode chips on the chip substrate may be the pitch of the arrangement of the protruding holding portions of the holding member.

The chip substrate of the present invention is regularly two-dimensionally arranged on one surface of a plate-shaped substrate and the substrate, and each of them has a first adhesion to the tip for holding one light emitting diode chip. A chip substrate used for holding the light emitting diode chip on a holding member having a plurality of protruding holding portions provided with layers, which is on one surface of a plate-shaped chip base material and the chip base material. The second adhesive layer is provided with a second adhesive layer laminated on the surface and a plurality of the light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer, and the second adhesive layer is irradiated with ultraviolet rays, heated or cooled. The adhesiveness is lower than that of the first adhesive layer of the holding member. An integral multiple of the pitch of the arrangement of the light emitting diode chips on the chip substrate may be the pitch of the arrangement of the protruding holding portions of the holding member.

The method for manufacturing a light emitting substrate of the present invention includes a step of collectively transferring a plurality of the light emitting diode chips of the transfer member manufactured by the method for manufacturing the transfer member from the holding member of the transfer member to the circuit board. ..

According to the present invention, it is possible to increase the productivity of a light emitting substrate on which a plurality of light emitting diode chips are arranged.

It is an exploded perspective view which shows the display device which used the light emitting substrate which has a micro light emitting diode chip. It is a top view of the light emitting substrate which has a micro light emitting diode chip. It is the top view which shows the part of the light emitting substrate enlarged, and shows the region A of FIG. It is an enlarged plan view which shows the peripheral part of the micro light emitting diode chip of a light emitting substrate, and shows the region B of FIG. It is a vertical sectional view which shows the part of the light emitting substrate which has a micro light emitting diode chip enlarged, and shows the CC cross section of FIG. It is a top view of the holding member. It is the top view which shows the part of the holding member enlarged, and shows the D region of FIG. It is a vertical cross-sectional view which shows a part of the holding member enlarged, and shows the EE cross section of FIG. It is a top view which shows the part of the transfer member enlarged. It is a vertical cross-sectional view which shows a part of the transfer member enlarged, and shows the FF cross section of FIG. It is a vertical sectional view which shows the process of transferring a micro light emitting diode chip from a transfer member to a circuit board. It is a top view which shows the chip substrate which has the diced micro light emitting diode chip. It is a vertical sectional view which shows the chip substrate which has a diced micro light emitting diode chip, and shows the GG cross section of FIG. It is a top view for demonstrating the process of making a holding member hold a micro light emitting diode chip. It is a vertical sectional view for demonstrating the process of having a holding member hold a micro light emitting diode chip. It is a vertical sectional view for demonstrating the process of having a holding member hold a micro light emitting diode chip. It is a vertical sectional view for demonstrating the process of having a holding member hold a micro light emitting diode chip. It is a vertical sectional view for demonstrating the process of having a holding member hold a micro light emitting diode chip. It is a top view which shows the chip substrate after undergoing the step of holding a 1st light emitting diode chip in the 1st region R1 of a holding member. It is a top view which shows the chip substrate after undergoing the step of holding a 1st light emitting diode chip in the 1st region R2 of a holding member. It is a schematic diagram which shows an example of the manufacturing apparatus of the transfer member of this embodiment schematicly. It is a vertical sectional view for demonstrating the process of transferring a micro light emitting diode chip from a transfer member to a circuit board. It is a vertical sectional view for demonstrating the process of transferring a micro light emitting diode chip from a transfer member to a circuit board. It is a vertical sectional view for demonstrating the process of transferring a micro light emitting diode chip from a transfer member to a circuit board. It is a figure for demonstrating one modification of the holding member.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, the scale, aspect ratio, etc. are appropriately changed from those of the actual product and exaggerated for the convenience of illustration and comprehension.

In the present specification, the terms "board", "sheet", and "film" are not distinguished from each other based solely on the difference in designation. For example, "board" is a concept that includes members that can be called "sheets" or "films". Further, the "plate surface (sheet surface, film surface)" is a plate-like member (sheet-like) that is a target when the target plate-like (sheet-like, film-like) member is viewed as a whole and from a broad perspective. A surface that coincides with the plane direction of a member or film-like member).

Furthermore, as used in the present specification, the terms such as "parallel", "orthogonal", and "identical" and the values of length and angle, etc., which specify the shape and geometric conditions and their degrees, are strictly referred to. Without being bound by the meaning, we will interpret it including the range where similar functions can be expected.

FIG. 1 is an exploded perspective view schematically showing a display device 1 using a light emitting substrate 10 having a micro light emitting diode chip 50. The display device 1 displays an image or the like on the display surface 5. In the example shown in FIG. 1, the display device 1 has a light emitting substrate 10 and a diffusion layer 7 arranged so as to face the light emitting substrate 10. The surface of the diffusion layer 7 opposite to the side facing the light emitting substrate 10 is the display surface 5 of the display device 1. The display device 1 is a so-called micro LED display that uses light emitted from one or a plurality of light emitting diodes as one pixel. In the illustrated example, the light emitted by the light emitting substrate 10 is diffused by the diffusion layer 7. However, the diffusion layer 7 can be omitted.

FIG. 2 is a plan view of a light emitting substrate 10 having a micro light emitting diode chip 50. FIG. 3 is a plan view showing a part of the light emitting substrate 10 in an enlarged manner, and shows a region A in FIG. FIG. 4 is an enlarged plan view showing a peripheral portion of the micro light emitting diode chip 50 of the light emitting substrate 10, and shows a region B in FIG. FIG. 5 is an enlarged vertical cross-sectional view of a part of the light emitting substrate 10 having the micro light emitting diode chip 50, and shows the CC cross section of FIG.

The light emitting substrate 10 emits light that forms an image to be displayed on the display surface 5. As shown in FIGS. 2 and 3, the light emitting substrate 10 includes a circuit board 11 and a plurality of micro light emitting diode chips (also simply referred to as “light emitting diode chips”) 50 which are regularly arranged two-dimensionally on the circuit board 11. And have.

The circuit board 11 has a positioning means for positioning with the transfer member 20 having the micro light emitting diode chip 50 in the step of transferring the micro light emitting diode chip 50 from the transfer member 20 described later. In the examples shown in FIGS. 2 and 3, the positioning means is a plurality of cross-shaped positioning marks M1. However, the cross-shaped positioning mark M1 is merely an example, and various positioning marks M1 such as a quadrangle, a triangle, and a circle can be used.

Further, as shown in FIG. 4, the circuit board 11 has a circuit 13. Further, as shown in FIG. 5, each micro light emitting diode chip 50 has two electrodes 51. The micro light emitting diode chip 50 is electrically connected to the circuit 13 via the electrode 51. By controlling the current flowing through the circuit 13 and applying a voltage between the two electrodes 51, any micro light emitting diode chip 50 can emit light. The image displayed by the display device 1 can be formed by combining the light emission of the micro light emitting diode chip 50.

The wavelength of the light emitted from the micro light emitting diode chip 50 is determined by the semiconductor material or the like constituting the micro light emitting diode chip 50. The micro light emitting diode chip 50 includes, for example, a GaAs-based compound semiconductor, an InP-based compound semiconductor, a GaN-based compound semiconductor, and the like. The dimensions of the micro light emitting diode chip 50 in a plan view can be, for example, a rectangular shape having a side of 3 μm or more and 1000 μm or less, more preferably 3 μm or more and 500 μm or less, and the thickness of the micro light emitting diode chip 50. Can be, for example, 10 μm or more and 500 μm or less, more preferably 10 μm or more and 200 μm or less.

In the illustrated example, the micro light emitting diode chip 50 includes a first light emitting diode chip 50R that emits red light having a wavelength range of 620 nm to 680 nm and a second light emitting diode chip that emits green light having a wavelength range of 530 nm to 570 nm. It includes 50G and a third light emitting diode chip 50B that emits blue light in a wavelength range of 440 nm to 480 nm. The first light emitting diode chip 50R, the second light emitting diode chip 50G, and the third light emitting diode chip 50B arranged in the vicinity of each other form one pixel of the display device 1. Therefore, the light emitting substrate 10 can emit light that forms an image to be displayed in full color.

The light emitting board 10 is manufactured by arranging the micro light emitting diode chip 50 at a position where the circuit 13 of the circuit board 11 is formed. In order to manufacture the light emitting substrate 10 on which the plurality of micro light emitting diode chips 50 are arranged with high productivity, a holding member 30 and a transfer member 20 having the holding member 30 as shown in FIGS. 6 to 11 are used.

Hereinafter, the holding member 30 of the present embodiment and the transfer member 20 having the holding member 30 will be described with reference to FIGS. 6 to 11.

FIG. 6 is a plan view of the holding member 30. FIG. 7 is an enlarged plan view showing a part of the holding member 30, and shows the D region of FIG. FIG. 8 is an enlarged vertical sectional view showing a part of the holding member 30, and shows an EE cross section of FIG. 7.

The holding member 30 is a member capable of holding a plurality of micro light emitting diode chips 50. As shown in FIGS. 6, 7 and 8, the holding member 30 has a base material 31 and a plurality of protruding holding portions 32 provided on one surface of the base material 31. The protruding holding portion 32 has a protruding structure 33 which is the main body of the protruding holding portion 32, and an adhesive layer 35 provided at the tip of the protruding structure 33.

The base material 31 is a plate-shaped member that appropriately supports the plurality of projecting holding portions 32. The base material 31 has a positioning means used for positioning the chip substrate 40 having the micro light emitting diode chip 50 and the holding member 30 in the step of causing the holding member 30 described later to hold the micro light emitting diode chip 50. In the examples shown in FIGS. 6 and 7, the positioning means is a cross-shaped positioning mark M2. However, the cross-shaped positioning mark M2 is merely an example, and various positioning marks M2 such as a quadrangle, a triangle, and a circle can be used. As shown in FIG. 6, a plurality of positioning marks M2 are provided on one surface of the base material 31 for each region in which the holding members 30 are partitioned at regular intervals. Further, in order to facilitate observation of the positioning mark M2, the base material 31 is preferably transparent.

In addition, "transparency" means having transparency to the extent that one side of the base material can be seen through the base material, for example, 30% or more. It preferably means that it has a visible light transmittance of 70% or more. Visible light transmittance is the transmittance at each wavelength when measured within the measurement wavelength range of 380 nm to 780 nm using a spectrophotometer (“UV-3100PC” manufactured by Shimadzu Corporation, JIS K 0115 compliant product). Is specified as the average value of.

The area of the base material 31 in a plan view is larger than that of the chip substrate 40 having a plurality of micro light emitting diode chips 50 described later. Specifically, the area of the base material 31 in a plan view is preferably 70 cm ² or more. Further, the dimension of the base material 31 in the plan view is preferably equal to or larger than the dimension in the plan view of the circuit board 11 so that the dimension of the transfer member 20 in the plan view is equal to or larger than the dimension in the plan view of the circuit board 11.

The thickness of the base material 31 is preferably 0.5 mm or more and 3 mm or less in consideration of transparency, appropriate supportability of the protruding structure 33, and the like. Further, in order to prevent deformation of the base material 31 in the manufacturing process of the light emitting substrate 10 described later, it is preferable that the base material 31 has high rigidity. Further, it is preferable that the base material 31 is not easily deformed by heat. Specifically, it is preferable that the linear expansion coefficient of the substrate 31 is not more than ¹⁰ × 10 ^-5 / K, more preferably not more than 5 × ^{10 -5} / K. Examples of the material of such a base material 31 include acrylic resin, polycarbonate resin, and glass.

The protrusion holding portion 32 is a portion that holds the micro light emitting diode chip 50. The protrusion holding portion 32 is provided at a position on the base material 31 where the holding member 30 holds the micro light emitting diode chip 50. That is, the protrusion holding portion 32 is provided at a position corresponding to the position where the micro light emitting diode chip 50 of the circuit board 11 is arranged. In the illustrated example, the dimensions of the protrusion holding portion 32 in a plan view are equal to the dimensions of the micro light emitting diode chip 50.

The protrusion holding portions 32 are regularly arranged two-dimensionally on one surface of the base material 31. The regular two-dimensional arrangement of the protrusion holding portions 32 corresponds to a plurality of micro light emitting diode chips 50 that are regularly arranged two-dimensionally on the circuit board 11. In other words, the arrangement spacing and arrangement pattern of the protrusion holding portion 32 are the same as the arrangement spacing and arrangement pattern of the plurality of types of micro light emitting diode chips 50 to be arranged on the circuit board 11. In the illustrated example, the arrangement interval and arrangement pattern of the protrusion holding portion 32 are the same as the arrangement interval and arrangement pattern of the first light emitting diode chip 50R. The protrusion holding portions 32 are arranged at a pitch pa1 in the first direction d1 and are arranged at a pitch pa2 in the second direction d2 which is non-parallel to the first direction d1. In the illustrated example, the first direction d1 and the second direction d2 are orthogonal to each other. The pitches pa1 and pa2 are, for example, 10 μm or more and 1000 μm or less.

The projecting structure 33, which is the main body of the projecting holding portion 32, projects in the normal direction of the plate surface of the base material 31. The length of the protruding structure 33 protruding from the base material 31 is preferably larger than the thickness of the micro light emitting diode chip 50, and is, for example, 0.1 μm or more and 100 μm or less. Further, the protruding structure 33 has flexibility. Specifically, the Young's modulus of the protruding structure 33 is preferably 10 GPa or less, and more preferably 5 GPa or less. Such a protruding structure 33 is made of, for example, an acrylic resin, and can be formed by using a photolithography technique or an imprinting technique.

The adhesive layer 35 is provided at the tip of the protruding structure 33 so that the protruding holding portion 32 can hold the micro light emitting diode chip 50. The adhesive layer 35 has adhesiveness. The adhesiveness of the adhesive layer 35 can be reduced by, for example, heating, cooling or irradiation with ultraviolet rays. In addition, in this specification, adhesiveness is a property of stickiness and is not distinguished from adhesiveness. As the material of the adhesive layer 35, for example, an acrylic adhesive is used. The thickness of the adhesive layer 35 is, for example, 0.1 μm or more and 100 μm or less.

FIG. 9 is an enlarged plan view showing a part of the transfer member 20. FIG. 10 is an enlarged vertical cross-sectional view showing a part of the transfer member 20, and shows the FF cross section of FIG.

The transfer member 20 has a holding member 30 and a plurality of micro light emitting diode chips 50 held by the holding member 30. The plurality of micro light emitting diode chips 50 are arranged so as to be held in the transfer member 20 at a position corresponding to the position where the micro light emitting diode chip 50 is arranged on the circuit board 11 to which the micro light emitting diode chip 50 is transferred. ing. In other words, the arrangement spacing and arrangement pattern of the transfer member 20 of the plurality of micro light emitting diode chips 50 are the same as the arrangement spacing and arrangement pattern in which the plurality of micro light emitting diode chips 50 should be arranged on the circuit board 11. There is. In the illustrated example, the first light emitting diode chip 50R is held by the holding member 30 as the micro light emitting diode chip 50.

FIG. 11 is a vertical cross-sectional view showing a process of transferring the micro light emitting diode chip 50 from the transfer member 20 to the circuit board 11. The transfer member 20 is configured so that a plurality of micro light emitting diode chips 50 can be collectively transferred onto the circuit 13 of the circuit board 11. The dimensions of the transfer member 20 in the plan view are preferably equal to or larger than the dimensions in the plan view of the circuit board 11 so that the micro light emitting diode chip 50 can be arranged on the entire circuit board 11 with only one transfer. In the illustrated example, the transfer member 20 is configured so that a plurality of first light emitting diode chips 50R can be collectively transferred onto the circuit 13 of the circuit board 11. By performing the same process using the transfer member 20 holding the second light emitting diode chip 50G and the transfer member 20 holding the third light emitting diode chip 50B, three types of micro light emitting diode chips 50 are formed on the circuit board 11. The arranged light emitting substrate 10 will be manufactured.

Next, a method of causing the holding member 30 to hold the micro light emitting diode chip 50, that is, a method of manufacturing the transfer member 20, will be described with reference to FIGS. 12 to 17.

FIG. 12 is a plan view showing a chip substrate 40 having a diced micro light emitting diode chip 50. FIG. 13 is a vertical cross-sectional view showing a chip substrate 40 having a diced micro light emitting diode chip 50, and shows a GG cross section of FIG.

First, as shown in FIGS. 12 and 13, a chip substrate 40 having a plurality of micro light emitting diode chips 50 diced on one surface is prepared. The chip substrate 40 is prepared for each of the first light emitting diode chip 50R, the second light emitting diode chip 50G, and the third light emitting diode chip 50B. That is, three types of chip substrates 40 are prepared: a chip substrate 40 having a first light emitting diode chip 50R, a chip substrate 40 having a second light emitting diode chip 50G, and a chip substrate having a third light emitting diode chip 50B. LED.

In the illustrated example, the chip substrate 40 is configured as a substrate on which a micro light emitting diode chip 50 is temporarily transferred from a diced wafer. The chip substrate 40 has a chip base material 41, an adhesive layer 42 laminated on the chip base material 41, and a plurality of micro light emitting diode chips 50 arranged on the adhesive layer 42.

The chip base material 41 is a plate-shaped member that holds the micro light emitting diode chip 50 via the adhesive layer 42. The chip base material 41 has a positioning means for positioning with the holding member 30. In the example shown in FIG. 12, the positioning means is a plurality of cross-shaped positioning marks M3. However, the cross-shaped positioning mark M3 is merely an example, and various positioning marks M3 such as a quadrangle, a triangle, and a circle can be used.

The material of the chip base material 41 is not limited, and for example, wafer glass or acrylic is used. The area of the chip base material 41 in a plan view is not particularly limited, but for example, an area of about 10 to 800 cm ² can be considered. The thickness of the chip base material 41 is preferably 0.1 mm or more and 5 mm or less in consideration of appropriate retention of the micro light emitting diode chip 50 and the like.

The adhesive layer 42 of the chip substrate 40 has a lower adhesiveness than the adhesive layer 35 of the holding member 30. The adhesiveness of the adhesive layer 42 should be as weak as possible from the viewpoint of reliably holding the micro light emitting diode chip 50 on the holding member 30 as long as it does not fall off during the process.

Further, the adhesive layer 42 of the chip substrate 40 may have a lower adhesiveness than the adhesive layer 35 of the holding member 30 by irradiation with ultraviolet rays, heating or cooling. Such an adhesive layer 42 has an advantage that the micro light emitting diode chip 50 can be prevented from peeling off from the chip substrate 40 during handling, and the chip substrate 40 can be easily handled.

As the material of the adhesive layer 42 of the chip substrate 40, for example, an acrylic adhesive is used. The thickness of the adhesive layer 42 of the chip substrate 40 is, for example, 0.1 μm or more and 100 μm or less.

Each micro light emitting diode chip 50 has two electrodes 51 provided on the side of the chip base material 41. Further, the micro light emitting diode chips 50 are arranged on the chip base material 41 at a pitch pb1 in the first direction d1 and at a pitch pb2 in the second direction d2 nonparallel to the first direction d1. That is, the micro light emitting diode chip 50 is formed by dicing the wafer in the first direction d1 and the second direction d2. In the illustrated example, the first direction d1 and the second direction d2 are orthogonal to each other. The pitches pb1 and pb2 are, for example, 3 μm or more and 1000 μm or less.

Here, an integral multiple (9 times in the illustrated example) of the pitch pb1 of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40 is the first of the plurality of protruding holding portions 32 of the holding member 30. It is the pitch pa1 of the array in the direction d1. Similarly, an integral multiple (9 times in the illustrated example) of the pitch pb2 of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40 is the second of the plurality of protruding holding portions 32 of the holding member 30. The pitch pa2 of the array in the direction d2.

As described above, the arrangement spacing and arrangement pattern of the protruding holding portions 32 of the holding member 30 are the same as the arrangement spacing and arrangement pattern of the plurality of micro light emitting diode chips 50 of each type arranged on the circuit board 11. There is. Therefore, an integral multiple of the pitch pb1 of the arrangement in the first direction d1 of the micro light emitting diode chip 50 of the chip substrate 40 is in the first direction d1 of the micro light emitting diode chip 50 (first light emitting diode chip 50R) having the circuit board 11. It is the pitch of the array, and the integral multiple of the pitch pb2 of the array in the second direction d2 is the pitch of the array in the second direction d2 of the micro light emitting diode chip 50 (first light emitting diode chip 50R) having the circuit board 11. It has become.

FIG. 14 is a plan view for explaining a step of causing the holding member 30 to hold the micro light emitting diode chip. In this step, after the micro light emitting diode chip 50 of the chip substrate 40 and the protruding holding portion 32 of the holding member 30 are brought into contact with each other, the chip substrate 40 and the holding member 30 are separated from each other to form the micro light emitting diode chip 50. It is held by the protruding holding portion 32.

The holding member 30 has a plurality of regions arranged in the first direction d1 and the second direction d2. The shape and area of each region are similar to the shape and area of the region in which the micro light emitting diode chips 50 are arranged in the chip substrate 40. In the illustrated example, the holding member has 15 regions from the first region R1 to the fifteenth region R15.

The step of causing the holding member 30 to hold the micro light emitting diode chip 50 is a step of bringing the chip substrate 40 having the micro light emitting diode chip 50 into contact with the first region R1 of the holding member 30 and separating the chip substrate 40 from the holding member 30. The step of holding the micro light emitting diode chip 50 in the protruding holding portion 32 and the holding member 30 being relatively moved with respect to the chip substrate 40 to bring the chip substrate 40 into contact with the second region R2 of the holding member 30. It has a step and a subsequent step of repeating a step similar to the step in the first region R1.

Next, the step of causing the holding member 30 to hold the micro light emitting diode chip 50 will be described in more detail.

15A to 15D are vertical cross-sectional views for explaining a step of causing the holding member 30 to hold the micro light emitting diode chip 50.

First, when the adhesive layer 42 of the chip substrate 40 has a lower adhesiveness than the adhesive layer 35 of the holding member 30 by ultraviolet irradiation, heating or cooling, it is subjected to ultraviolet irradiation, heating or cooling. The adhesive strength of the adhesive layer 42 of the chip substrate 40 is made lower than that of the adhesive layer 35 of the holding member. The ultraviolet irradiation, heating, or cooling may be performed when the chip substrate 40 and the holding member 30, which will be described later, come into contact with each other, that is, in the state shown in FIG. 15B.

Next, as shown in FIG. 15A, the first region R1 of the surface of the chip substrate 40 on the side where the micro light emitting diode chip 50 is arranged and the surface of the holding member 30 on the side where the protruding holding portions 32 are arranged. To face each other. After that, the chip substrate 40 and the holding member 30 are positioned. Positioning is performed based on the positioning means included in the base material 31 of the holding member 30 and the positioning means included in the chip substrate 40. As a specific example, as shown in FIG. 14, positioning is performed by matching the positioning mark M2 of the base material 31 with the positioning mark M3 of the chip substrate 40 in the first region R1 of the holding member 30. Will be. The coincidence of the positioning marks M2 and M3 can be confirmed, for example, by the camera 80 arranged on the side opposite to the surface on which the protruding holding portions 32 of the holding member 30 are arranged. Since the base material 31 is transparent, the positioning marks M2 and M3 can be confirmed via the base material 31 from the side opposite to the surface on which the protruding holding portions 32 of the holding member 30 are arranged.

The positioning of the chip substrate 40 and the holding member 30 may be performed by only one of the positioning means included in the base material 31 of the holding member 30 and the positioning means included in the chip substrate 40. Further, the positioning of the chip substrate 40 and the holding member 30 may be performed only by observing the chip substrate 40 and the holding member 30 with the camera 80 without using the positioning marks M2 and M3.

Next, as shown in FIG. 15B, the chip substrate 40 and the holding member 30 are brought close to each other, and the chip substrate 40 is brought into contact with the holding member 30 at a predetermined contact pressure. When the chip substrate 40 comes into contact with the holding member 30, the first light emitting diode chip 50R of the chip substrate 40 comes into contact with the adhesive layers 35 at the tips of the plurality of protruding holding portions 32 in the first region R1 of the holding member 30.

Here, since the protruding structure 33, which is the main body of the protruding holding portion 32, has a certain degree of flexibility, when the chip substrate 40 comes into contact with the holding member 30, the protruding holding portion 32 of the holding member 30 changes to the chip substrate 40. Can be deformed in a direction perpendicular to the contact surface between the and the protrusion holding portion 32. Therefore, the contact pressure for bringing the chip substrate 40 into contact with the protrusion holding portion 32 is uniformly applied to each protrusion holding portion 32 in contact with the chip substrate 40. In other words, it is possible to prevent a part of the protrusion holding portion 32 from coming into contact with the micro light emitting diode chip 50 of the chip substrate 40 at a high contact pressure. When a part of the protruding holding portion 32 comes into contact with the micro light emitting diode chip 50 at a high contact pressure, the adhesiveness between the protruding holding portion 32 and the micro light emitting diode chip 50 becomes increased between the other protruding holding portion 32 and the other micro light emitting diode. The adhesiveness to the chip 50 will be different, and the handling of the manufactured transfer member 20 may be defective, or the micro light emitting diode chip 50 may be destroyed by the high contact pressure. Therefore, it is preferable that a part of the protruding holding portion 32 does not come into contact with the micro light emitting diode chip 50 at a high contact pressure.

Next, as shown in FIG. 15C, the chip substrate 40 and the holding member 30 are separated from each other. At this time, since the adhesive layer 42 of the chip substrate 40 has lower adhesiveness than the adhesive layer 35 of the holding member 30, the micro light emitting diode chip 50 is attached to the adhesive layer 35 of the protruding holding portion 32. , Will remain stuck.

In this way, the micro light emitting diode chips 50 are adhered to the adhesive layer 35 of the protruding holding portions 32, so that the plurality of protruding holding portions 32 hold the micro light emitting diode chips 50. That is, the micro light emitting diode chip 50 is held from the chip substrate 40 on a plurality of protruding holding portions 32 in the first region R1 of the holding member 30.

Next, as shown in FIGS. 15D and 14, the holding member 30 is relatively moved with respect to the chip substrate 40, and the surface of the chip substrate 40 on the side where the micro light emitting diode chip 50 is arranged is arranged. , The second region R2 of the surface on which the protruding holding portion 32 of the base material 31 of the holding member 30 is arranged faces. After that, the micro light emitting diode chip 50 is held on the plurality of projecting holding portions 32 in the second region R2 by repeating the same process as the step in the first region R1. After that, the same steps as those in the first region R1 are repeated for all the regions (third region R3 to 15th region R15) of the holding member 30, and the micro light emitting diode chips 50 are placed on the plurality of protruding holding portions 32. Keep going.

As shown in FIG. 9, in the first region R1 of the holding member 30 after the step of holding the first light emitting diode chip 50R in the first region R1 of the holding member 30, all the protruding holding portions 32 are microscopic. It is in a state of holding the light emitting diode chip 50.

Since the chip substrate 40 and the holding member 30 are positioned and the dimensions of the protruding holding portion 32 in the plan view are equal to the dimensions of the micro light emitting diode chip 50, micro light emission is performed in the first region R1. One micro light emitting diode chip 50 can be held by one of the protruding holding portions 32 for holding the diode chip 50.

Further, as described above, the pitch pa1 of the arrangement in the first direction d1 of the protruding holding portion 32 of the holding member 30 is an integral multiple of the pitch pb1 of the arrangement in the first direction d1 of the micro light emitting diode chip 50R of the chip substrate 40 (not shown). In the example, it is 9 times), so that one first light emitting diode chip 50R can be held for all of the first protruding holding portions 32R in the first region R1 in the first direction d1.

Similarly, the pitch pa2 of the arrangement in the second direction d2 of the plurality of protruding holding portions 32 of the holding member 30 is an integral multiple of the pitch pb2 of the arrangement in the second direction d2 of the micro light emitting diode chip 50 of the chip substrate 40 (illustrated). Since it is 9 times in the example), one micro light emitting diode chip 50 can be held for all of the first protruding holding portions 32R in the first region R1 in the second direction d2.

FIG. 16A is a plan view showing a chip substrate 40 after undergoing a step of holding the first light emitting diode chip 50R in the first region R1 of the holding member 30. FIG. 16B is a plan view showing a chip substrate 40 after undergoing a step of holding the first light emitting diode chip 50R in the second region R2 of the holding member 30.

As shown in FIG. 16A, the chip substrate 40 after undergoing the step of holding the first light emitting diode chip 50R in the first region R1 of the holding member 30 is held by the holding member 30 through the step. It is in a state of having an empty area 45 which is an area where the first light emitting diode chip 50R is removed. The arrangement pattern of the empty area 45 of the chip substrate 40 corresponds to the arrangement pattern of the protruding holding portion 32 of the holding member 30.

The micro light emitting diode chip 50 that contacts the adhesive layer 35 of the protruding holding portion 32 in the second region R2 following the first region R1 of the holding member 30 is held by the adhesive layer 35 of the protruding holding portion 32 in the first region R1. It is different from the micro light emitting diode chip 50.

The chip substrate 40 and the holding member 30 are positioned, the dimensions of the protruding holding portion 32 in a plan view are equal to the dimensions of the micro light emitting diode chip 50, and the protruding holding portion 32 of the holding member 30. Since the pitches pa1 and pa2 of the arrangement are integral multiples of the pitches pb1 and pb2 of the arrangement of the micro light emitting diode chips 50R of the chip substrate 40, the protruding holding portion for holding the first light emitting diode chips 50R in the second region R2. One first light emitting diode chip 50R can be held for each of the 32.

Therefore, as shown in FIG. 16B, the chip substrate 40 after the step of holding the first light emitting diode chip 50R in the second region R2 of the holding member 30 holds the micro light emitting diode chip 50 in the first region R1. A new free area 45 will be provided in a region different from the free area 45 generated by the process.

As described above, by repeating the step of moving the holding member 30 relative to the chip substrate 40 and the step of holding the micro light emitting diode chip 50 in the protruding holding portion 32 in a certain region, a plurality of holding members 30 are formed. The micro light emitting diode chip 50 can be held in each of the projecting holding portions 32 in the region. As shown in FIG. 14, by moving the holding member 30 relative to the chip substrate 40 in the first direction d1 and the second direction d2, the protruding holding portion 32 emits micro light emission over the entire region of the holding member 30. The diode chip 50 can be held.

Through the above steps, a transfer member 20 having a holding member 30 and a plurality of micro light emitting diode chips 50 as shown in FIGS. 9 and 10 is manufactured.

In the above example, a method of holding the first light emitting diode chip 50R on the holding member 30 as the micro light emitting diode chip 50 has been described, but the second light emitting diode chip 50G and the third light emitting diode chip 50B are also subjected to the same step. Each can be held by different holding members 30.

FIG. 17 is a schematic view schematically showing an example of the manufacturing apparatus 90 of the transfer member 20 of the present embodiment.

The manufacturing apparatus 90 of the transfer member 20 of the present embodiment includes, for example, a control unit 91, a holding member holding unit 92 for holding the holding member 30, a chip substrate holding unit 93 for holding the chip substrate 40, a camera 80, and the like. Has.

The holding member holding portion 92 and the chip substrate holding portion 93 hold the holding member 30 or the chip substrate 40 so that their plate surfaces are parallel to the first direction d1 and the second direction d2, and are independent of each other. Therefore, it is configured to be able to move in the first direction d1, the second direction d2, and the third direction d3. The camera 80 uses the holding member 30 and the chip substrate 40 held by the holding member holding portion 92 and the chip substrate holding portion 93, or their positioning marks M2 to M3 for positioning the holding member 30 and the chip substrate 40. It is a camera for observing, and is configured to be movable in the first direction d1 and the second direction d2.

The control unit 91 controls the holding member holding unit 92, the chip substrate holding unit 93, and the camera 80 so as to perform each step in the manufacturing method of the transfer member 20 of the present embodiment described above. Further, the control unit 91 positions the holding member 30 and the chip substrate 40 by using the observation results of the holding member 30 and the chip substrate 40 by the camera 80.

With the above-mentioned manufacturing apparatus 90 of the transfer member 20, the productivity of the transfer member 20 can be increased.

Next, a method of arranging the micro light emitting diode chip 50 on the circuit board 11 using the transfer member 20, that is, a method of manufacturing the light emitting board 10 will be described with reference to FIGS. 18A, 18B, and 18C.

18A, 18B, and 18C are vertical cross-sectional views for explaining a process of transferring the micro light emitting diode chip 50 from the transfer member 20 to the circuit board 11.

First, as shown in FIG. 18A, the surface of the circuit board 11 on which the circuit 13 is formed and the surface of the transfer member 20 on which the micro light emitting diode chip 50 is held are made to face each other. After that, the circuit board 11 and the transfer member 20 are positioned. Positioning is performed based on, for example, a positioning means included in the circuit board 11 and a positioning means included in the transfer member 20. As a specific example, positioning is performed by matching the positioning mark M1 of the circuit board 11 with the positioning mark M2 of the base material 31 of the transfer member 20. The coincidence of the positioning marks M1 and M2 can be confirmed by the camera 80 arranged on the side opposite to the surface on which the micro light emitting diode chip 50 of the transfer member 20 is held. Since the base material 31 is transparent, the positioning marks M1 and M2 can be confirmed via the base material 31 from the side opposite to the surface of the transfer member 20 where the micro light emitting diode chip 50 is held.

The positioning mark M2 included in the base material 31 used for positioning the circuit board 11 and the transfer member 20 may be the same as the positioning mark used for positioning the chip substrate 40 and the holding member 30. The positioning mark may be different from the positioning mark used for positioning the chip substrate 40 and the holding member 30.

Next, as shown in FIG. 18B, the transfer member 20 is pressed against the circuit board 11. Since the circuit board 11 and the transfer member 20 are positioned, the micro light emitting diode chip 50 is pressed at the position where the circuit 13 of the circuit board 11 is provided, and the micro light emitting diode chip 50 is inserted into the circuit 13 of the circuit board 11. Can be electrically connected. An anisotropic conductive adhesive layer (not shown) for adhering the micro light emitting diode chip 50 to the circuit board 11 is formed at a position on the circuit board 11 where the micro light emitting diode chip 50 is arranged.

Here, since the protruding structure 33, which is the main body of the protruding holding portion 32, has a certain degree of flexibility, when the transfer member 20 is pressed against the circuit board 11, the protruding holding portion 32 of the holding member 30 becomes the circuit board 11. And the protrusion holding portion 32 can be deformed in a direction perpendicular to the pressing surface. Therefore, the pressure for pressing the transfer member 20 against the circuit board 11 is uniformly applied to the protruding holding portions 32 pressed against the circuit board 11. In other words, it is possible to prevent the micro light emitting diode chip 50 held by a part of the protrusion holding portion 32 from being pressed against the circuit board 11 with a high pressure. When the micro light emitting diode chip 50 held by a part of the protrusion holding portion 32 is pressed against the circuit board 11 with a high pressure, the micro light emitting diode chip 50 may be destroyed by the high pressure. Therefore, it is preferable that the micro light emitting diode chip 50 held by a part of the protruding holding portion 32 is not pressed against the circuit board 11 with a high pressure.

The anisotropic conductive adhesive layer is heated while the transfer member 20 is pressed against the circuit board 11. By heating the anisotropic conductive adhesive layer, the circuit board 11 and the micro light emitting diode chip 50 are adhered to each other. Further, according to the anisotropic conductive adhesive layer, conductivity can be exhibited in the pressing direction. Therefore, each electrode 51 of the micro light emitting diode chip 50 can be electrically connected to the circuit 13 facing the pressing direction.

Here, since the base material 31 of the transfer member 20 is not easily deformed by heat, specifically, the linear expansion coefficient of the base material 31 is 10 × ^10-5 / K or less, more preferably 5 × ^10-5 / K or less. Therefore, even if the transfer member 20 is heated when the anisotropic conductive adhesive layer is heated, the positioning of the circuit board 11 and the transfer member 20 is unlikely to shift. That is, the micro light emitting diode chip 50 can be accurately transferred from the transfer member 20 to the circuit board 11.

Further, the adhesiveness of the adhesive layer 35 is reduced while the transfer member 20 is pressed against the circuit board 11. That is, the adhesive layer 35 is heated, cooled, or irradiated with ultraviolet rays. When the adhesiveness of the adhesive layer 35 is lowered by heating, the heat generated when the above-mentioned anisotropic conductive adhesive layer is heated may be used. By reducing the adhesiveness of the adhesive layer 35, the micro light emitting diode chip 50 can be easily peeled off from the adhesive layer 35.

After that, as shown in FIG. 18C, the holding member 30 is separated from the circuit board 11 to remove the holding member 30. Through the above steps, the plurality of micro light emitting diode chips 50 held by the holding member 30 of the transfer member 20 are electrically connected to the circuit 13 of the circuit board 11, and the holding member 30 of the transfer member 20 is connected to the circuit board. Transferred to 11 at once, that is, transferred collectively.

In the method for manufacturing the light emitting substrate 10 of the present embodiment, an anisotropic conductive adhesive layer is used to bond the micro light emitting diode chip 50 to the circuit board 10. However, the method for manufacturing the light emitting substrate 10 of the present invention is not limited to this, and a conductive adhesive layer such as solder or a conductive adhesive may be used. The bonding method is not limited to pressing and heating, and may be bonding only, depending on the type of the conductive adhesive layer. Further, the timing of pressing or heating is also held depending on the type of the conductive adhesive layer, for example, when the conductive adhesive layer has sufficient adhesiveness to hold the micro light emitting diode chip 50. The conductive adhesive layer may be pressed or heated after the member 30 is separated from the circuit board 10.

In the above-mentioned example, a method of collectively transferring the first light emitting diode chip 50R to the circuit board 11 as the micro light emitting diode chip 50 has been described. By performing the same step as this step for another holding member 30 for holding the second light emitting diode chip 50G and another holding member 30 for holding the third light emitting diode chip 50B, three types are applied to the circuit board 11. A light emitting substrate 10 on which the micro light emitting diode chip 50 of the above is arranged is manufactured. That is, it is possible to obtain a light emitting substrate 10 capable of emitting light in full color.

By the way, as described above, the adhesive stamp of Patent Document 1 is repeatedly used in the pick-and-place process from the wafer to the circuit board in the manufacturing process of the light emitting substrate, so that the adhesiveness is lowered. It is difficult to increase the productivity of manufacturing a light emitting board by arranging the light emitting diode chip on the circuit board. On the other hand, according to the holding member 30 of the present embodiment, the micro light emitting diode chip 50 is held in a plurality of regions of the holding member 30 from the chip substrate 40 which is a substrate obtained by temporarily transferring the micro light emitting diode chip from the wafer. Can be done. Then, by pressing the transfer member 20 having the micro light emitting diode chip 50 held by the holding member 30 against the circuit board 11, the micro light emitting diode chip 50 can be transferred to the circuit board 11. As described above, in the manufacturing process of the light emitting substrate 10, the holding and peeling of the micro light emitting diode chip 50 via the adhesive layer 35 of the holding member is performed only once. Therefore, since the adhesiveness of the adhesive layer 35 does not decrease during the production of the light emitting substrate, the light emitting substrate 10 can be manufactured with high productivity. Furthermore, since the micro light emitting diode chips 50 can be collectively transferred to the circuit board 11, the light emitting board 10 can be easily manufactured, and the productivity of the light emitting board 10 can be increased.

Further, repeating the pick-and-place process using the adhesive stamp of Patent Document 1 causes the adhesive stamp to reciprocate between the wafer and the circuit board, so that it takes time to produce the light emitting substrate and the productivity is improved. It will be low. On the other hand, according to the method for manufacturing the transfer member 20 and the method for manufacturing the light emitting substrate 10 of the present embodiment, the holding member 30 is made to hold the micro light emitting diode chip 50 by moving the holding member 30 relative to the chip substrate 40. The light emitting board 10 can be manufactured by pressing the transfer member 20 holding the micro light emitting diode chip 50 against the circuit board 11. The relative movement of the holding member 30 with respect to the chip substrate 40 is smaller than the reciprocation between the wafer of the adhesive stamp and the circuit board. Therefore, according to the method for manufacturing the transfer member 20 and the method for manufacturing the light emitting substrate 10 of the present embodiment, the time for manufacturing the light emitting substrate 10 can be shortened. That is, the light emitting substrate 10 can be manufactured with high productivity.

Further, in the holding member 30 of the present embodiment, the base material 31 has a positioning mark M2. The positioning mark M2 and the positioning mark M3 included in the chip substrate 40 allow the holding member 30 to hold the micro light emitting diode chip 50 with high accuracy. Further, the positioning mark M2 and the positioning mark M1 included in the circuit board 11 can transfer the micro light emitting diode chip 50 from the transfer member 20 to the circuit board 11 with high accuracy. That is, the light emitting substrate 10 can be manufactured with high productivity.

Further, in the present embodiment, the pitches pa1 and pa2 of the arrangement of the protruding holding portions 32 of the holding member 30 are integral multiples of the pitches pb1 and pb2 of the arrangement of the micro light emitting diode chips 50 of the chip substrate 40. Therefore, by positioning the chip substrate 40 and the holding member 30, it is possible to manufacture the transfer member 20 in which one micro light emitting diode chip 50 is arranged with high accuracy on each protruding holding portion 32 of the holding member 30. .. By using the transfer member 20, the light emitting substrate 10 can be manufactured with high productivity.

Further, in the holding member 30 of the present embodiment, the linear expansion coefficient of the base material 31 is 10 × 10 ^-5 / K or less, more preferably 5 × 10 ^-5 / K or less. Since the base material 31 is less likely to be deformed by heat, the circuit board 11 and the transfer member 20 are less likely to be misaligned even if the transfer member 20 is heated in the manufacturing process of the light emitting substrate 10. The micro light emitting diode chip 50 can be accurately transferred from the transfer member 20 to the circuit board 11. That is, the light emitting substrate 10 can be manufactured with high productivity.

Further, in the holding member 30 of the present embodiment, the Young's modulus of the protruding structure, which is the main body of the protruding holding portion 32, is 10 GPa or less, more preferably 5 GPa or less. Since the protruding structure 33 has flexibility, when the chip substrate 40 comes into contact with the protruding holding portion 32 in the manufacturing process of the transfer member 20, a part of the protruding holding portion 32 is a micro light emitting diode chip with a high contact pressure. It is possible to prevent the micro light emitting diode chip 50 from being destroyed due to contact with the 50. Further, when the transfer member 20 is pressed against the circuit board 11 in the manufacturing process of the light emitting substrate 10, a part of the protruding holding portion 32 is pressed by the micro light emitting diode chip 50 with high pressure, and the micro light emitting diode chip 50 is destroyed. It is possible to avoid being done. That is, the transfer member 20 and the light emitting substrate 10 can be manufactured with high productivity.

As described above, the holding member 30 of the present embodiment is a holding member that holds a plurality of micro light emitting diode chips 50, and is regularly two-dimensionally placed on one surface of the base material 31 and the base material 31. The protrusion holding portion 32 is provided with a plurality of arranged protrusion holding portions 32, and the protrusion holding portion 32 has an adhesive layer 35 having adhesiveness. According to such a holding member 30, in the manufacturing process of the transfer member 20, the adhesive layer 35 of each protruding holding portion 32 holds the micro light emitting diode chip 50 only once. Further, in the manufacturing process of the light emitting substrate 10, the adhesive layer 35 of each protrusion holding portion 32 is peeled off from the micro light emitting diode chip 50 only once. Therefore, the adhesiveness of the adhesive layer 35 is unlikely to decrease during the production of the transfer member 20 and the light emitting substrate 10, and the productivity of the transfer member 20 and the productivity of the light emitting substrate 10 are unlikely to decrease. That is, the transfer member 20 in which the micro light emitting diode chip 50 is arranged on the holding member 30 can be manufactured with high productivity, and the light emitting substrate 10 in which the micro light emitting diode chip 50 is arranged on the circuit board 11 can be manufactured with high productivity. Can be manufactured by sex.

It is possible to make various changes to the above-described embodiment.

The light emitting substrate 10 of the present embodiment has three types of micro light emitting diode chips 50, that is, a first light emitting diode chip 50R, a second light emitting diode chip 50G, and a third light emitting diode chip 50B. 10 is not limited to this, and may have two or less types or four or more types of micro light emitting diode chips 50.

Further, as shown in FIG. 19, the protruding structure 33 of the protruding holding portion 32 of the holding member 30 may include a base portion 33a and a plurality of fine extending portions 33b supported on the base portion 33a. .. As shown, each fine extending portion 33b is finer than the base portion 33a. The fine extending portions 33b are two-dimensionally arranged on the base portion 33a. Since each fine extending portion 33b can be bent, the fine extending portion 33b has higher flexibility than the base portion 33a. By having the projecting structure 33 having such a configuration, the projecting structure 33 can have higher flexibility. Therefore, when the holding member 30 holds the micro light emitting diode chip 50, it is more effectively prevented that a part of the protruding holding portion 32 comes into contact with the micro light emitting diode chip 50 of the chip substrate 40 at a high contact pressure. can do. Further, when the micro light emitting diode chip 50 is arranged on the circuit board 11 by using the transfer member 20, the micro light emitting diode chip 50 held by a part of the protrusion holding portion 32 is pressed against the circuit board 11 with a high pressure. This can be avoided more effectively. That is, the destruction of the micro light emitting diode chip 50 is more effectively avoided.

Further, in the above-described embodiment, the protruding structure 33 is formed on the base material 31 by using a photolithography technique or an imprint technique. However, the protruding structure 33 may be integrally formed with the base material 31. The protruding structure 33 can be integrally formed with the base material 31 by dry etching the material forming the base material 31 or imprinting the same material as the base material 31 on the base material 31. it can. When the projecting structure 33 is integrally formed with the base material 31, an interface is not formed between the projecting structure 33 and the base material 31, so that the protruding structure 33 and the base material 31 can be effectively separated from each other. It can be suppressed. Further, since the protruding structure 33 can be formed together with the base material 31, the cost of forming the protruding structure 33 can be reduced.

Further, the adhesive layer 35 may be provided not only at the tip of the protruding structure 33 but also between the protruding structures 33. Further, the adhesive layer 35 may be provided on the entire surface of the holding member 30 on the side where the protruding structure 33 is formed. In this case, the adhesive layer 35 can be easily provided, for example, by coating the surface of the holding member 30 on the side where the protruding structure 33 is formed.

The light emitting substrate 10 described above may be used not only for the display device 1 but also for, for example, a lighting device.

1 Display device 5 Display surface 7 Diffusion layer 10 Light emitting board 11 Circuit board 13 Circuit 20 Transfer member 30 Holding member 31 Base material 32 Protruding holding part 33 Protruding structure 35 Adhesive layer (first adhesive layer)
40 Chip substrate 41 Chip substrate 42 Adhesive layer (second adhesive layer)
45 Free space 50 Micro light emitting diode chip 50R 1st light emitting diode chip 50G 2nd light emitting diode chip 50B 3rd light emitting diode chip 51 Electrode 80 Camera 90 Transfer member manufacturing equipment 91 Control unit 92 Holding member holding unit 93 Chip substrate holding unit R1 ~ R15 1st area ~ 15th area M1, M2, M3 Positioning marks Pa1, Pa2, Pb1, Pb2 Pitch

Claims (9)

A plate-shaped base material and a plurality of plates regularly arranged two-dimensionally on one surface of the base material and each provided with a first adhesive layer at the tip for holding one light emitting diode chip. A process of preparing a holding member having a protruding holding portion, and
A plate-shaped chip base material, a second adhesive layer laminated on one surface of the chip base material and having a lower adhesiveness than the first adhesive layer, and two regularly on the second adhesive layer. A process of preparing a chip substrate having a plurality of three-dimensionally arranged light emitting diode chips, and
After the light emitting diode chip of the chip substrate is brought into contact with the protruding holding portion of the holding member, the chip substrate and the holding member are separated from each other to hold the light emitting diode chip in the protruding holding portion. A method for manufacturing a transfer member, comprising a step of making the transfer member. A plate-shaped base material and a plurality of plates regularly arranged two-dimensionally on one surface of the base material and each provided with a first adhesive layer at the tip for holding one light emitting diode chip. A process of preparing a holding member having a protruding holding portion, and
A plate-shaped chip base material, a second adhesive layer laminated on one surface of the chip base material, and having a lower adhesiveness than the first adhesive layer by ultraviolet irradiation, heating, or cooling, and the second adhesive layer. A process of preparing a chip substrate having a plurality of light emitting diode chips regularly arranged two-dimensionally on a layer, and
A step of lowering the adhesiveness of the second adhesive layer of the chip substrate to be lower than that of the first adhesive layer by ultraviolet irradiation, heating or cooling.
After the light emitting diode chip of the chip substrate is brought into contact with the protruding holding portion of the holding member, the chip substrate and the holding member are separated from each other to hold the light emitting diode chip in the protruding holding portion. A method for manufacturing a transfer member, comprising a step of making the transfer member. The method for manufacturing a transfer member according to claim 1 or 2.
A step of holding the plurality of the light emitting diode chips by the plurality of protruding holding portions in the first region of the holding member, and
The step of moving the holding member relative to the chip substrate and
The step includes a step of holding a plurality of other light emitting diode chips different from the plurality of light emitting diode chips by a plurality of the protruding holding portions in a second region different from the first region of the holding member.
Manufacturing method of transfer member. The method for manufacturing a transfer member according to any one of claims 1 to 3.
A method for manufacturing a transfer member, wherein an integral multiple of the pitch of the arrangement of the light emitting diode chips on the chip substrate is the pitch of the arrangement of the protruding holding portions of the holding member. A plate-shaped base material and a plurality of plates regularly arranged two-dimensionally on one surface of the base material and each provided with a first adhesive layer at the tip for holding one light emitting diode chip. A holding member holding portion that holds a holding member having a protruding holding portion,
A plate-shaped chip base material, a second adhesive layer laminated on one surface of the chip base material and having a lower adhesiveness than the first adhesive layer, and two regularly on the second adhesive layer. A chip substrate holding portion that holds a plurality of the light emitting diode chips arranged in a dimension, and a chip substrate having the light emitting diode chips.
A camera for observing the holding member and the chip substrate held by the holding member holding portion and the chip substrate holding portion, and a camera for observing the holding member and the chip substrate.
A holding member holding unit, a chip substrate holding unit, and a control unit for controlling the camera are provided.
The control unit controls the holding member holding portion and the chip substrate holding portion by using the observation results of the holding member and the chip substrate by the camera, and positions the holding member and the chip substrate. Parts manufacturing equipment. A plurality of plate-shaped substrates and a plurality of plates regularly arranged two-dimensionally on one surface of the substrate, each of which is provided with a first adhesive layer at the tip for holding one light emitting diode chip. A chip substrate used to hold the light emitting diode chip in a holding member having a protruding holding portion.
Plate-shaped chip base material and
A second adhesive layer laminated on one surface of the chip base material and
A plurality of the light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer are provided.
The second adhesive layer is a chip substrate having a lower adhesiveness than the first adhesive layer of the holding member. A plurality of plate-shaped substrates and a plurality of plates regularly arranged two-dimensionally on one surface of the substrate, each of which is provided with a first adhesive layer at the tip for holding one light emitting diode chip. A chip substrate used to hold the light emitting diode chip in a holding member having a protruding holding portion.
Plate-shaped chip base material and
A second adhesive layer laminated on one surface of the chip base material and
A plurality of the light emitting diode chips regularly arranged two-dimensionally on the second adhesive layer are provided.
The second adhesive layer is a chip substrate whose adhesiveness becomes lower than that of the first adhesive layer of the holding member by irradiation with ultraviolet rays, heating or cooling. The chip substrate according to claim 6 or 7.
A chip substrate in which an integral multiple of the pitch of the arrangement of the light emitting diode chips of the chip substrate is the pitch of the arrangement of the protruding holding portions of the holding member. A step of collectively transferring a plurality of the light emitting diode chips of the transfer member manufactured by the method for manufacturing a transfer member according to any one of claims 1 to 4 from the holding member of the transfer member to the circuit board. A method for manufacturing a light emitting substrate having a light emitting substrate.