JP7223318B2 - Holding member, positioning sheet, transfer member with positioned light emitting diode chip, method for manufacturing transfer member with positioned light emitting diode chip, method for manufacturing light emitting substrate, and light emitting substrate - Google Patents

Description

TECHNICAL FIELD The present invention relates to a holder, a positioning sheet, a transfer member with positioned light emitting diode chips, a method for manufacturing the transfer member with positioned light emitting diode chips, a method for manufacturing a light emitting substrate, and a light emitting substrate.

2. Description of the Related Art In recent years, a so-called micro LED display, which uses a light emitting substrate having a plurality of light emitting diode (LED) chips arranged on a circuit board having a circuit, has been developed. LED displays are superior to liquid crystal displays and the like in terms of brightness, power consumption, response speed, reliability, etc., and are attracting attention as next-generation lightweight and thin displays.

2. Description of the Related Art Conventionally, a method using an adhesive stamp having a plurality of protrusions is known as a method of arranging light-emitting diode chips on a circuit board. In this method, a plurality of light-emitting diode chips formed by dicing a wafer and an adhesive stamp face each other, and the light-emitting diode chips are attached to the tip surfaces of the protrusions of the adhesive stamp. Next, the adhesive stamp to which the plurality of light-emitting diode chips are attached faces the circuit board, and the light-emitting diode chips on the projecting portion are pressed against the circuit board to be bonded. The pitch of the protrusions of the adhesive stamp corresponds to the pitch of the light emitting diode chips on the circuit board. Therefore, a plurality of light emitting diode chips can be arranged on the circuit board at a time at a predetermined pitch.

Japanese Patent Application Publication No. 2017-531915

However, the above method requires designing and dicing the wafer such that the pitch of the plurality of light emitting diode chips on the wafer is a divisor of the pitch of the plurality of light emitting diode chips on the circuit board. Further, when the adhesive stamp and the wafer face each other and a plurality of light-emitting diode chips are attached to the adhesive stamp, each projecting portion of the adhesive stamp faces one of the plurality of light-emitting diode chips on the wafer. A stamp must be positioned relative to the wafer. Furthermore, the light emitting diode chips attached to the adhesive stamp at one time are limited to the light emitting diode chips on one wafer. This means that a plurality of types of light-emitting diode chips that are formed on different wafers and emit light of different colors cannot be attached to the adhesive stamp. It means that it cannot be placed on a circuit board. These factors impair the productivity of the light-emitting substrate.

SUMMARY OF THE INVENTION It is an object of the present invention to improve the productivity of light-emitting substrates having light-emitting diode chips.

The holding member of the present invention is
a holding surface in which a plurality of holes each accommodating at least a portion of one light-emitting diode chip are arranged in a two-dimensional array;
Each hole forms a rotationally asymmetric accommodation space.

In the holding member of the present invention, the shape of each hole in a cross section perpendicular to the depth direction may be constant in the depth direction.

Alternatively, in the holding member of the present invention, the shape of each hole in a cross section perpendicular to the depth direction may decrease toward the bottom in the depth direction.

Moreover, in the holding member of the present invention, the plurality of holes may be arranged regularly.

Further, in the holding member of the present invention,
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The opening shape of the first hole may be larger than the opening shape of the second hole.

Moreover, in the holding member of the present invention, the plurality of first holes may be regularly arranged two-dimensionally, and the plurality of second holes may be arranged regularly two-dimensionally.

Alternatively, the holding member of the present invention is
a holding surface in which a plurality of holes each forming an accommodation space for accommodating at least a portion of one light-emitting diode chip are arranged two-dimensionally;
The shape of each hole in a cross section perpendicular to the depth direction becomes smaller toward the bottom in the depth direction.

In the holding member of the present invention, the plurality of holes may be arranged regularly.

Further, in the holding member of the present invention,
a side surface defining each hole includes an inclined surface that is inclined with respect to the retaining surface;
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
An inclination angle of the inclined surface of the first hole with respect to the holding surface may be greater than an inclination angle of the inclined surface of the second hole with respect to the holding surface.

Further, in the holding member of the present invention,
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The shape of the bottom of the first hole may be larger than the shape of the bottom of the second hole.

Moreover, in the holding member of the present invention, the plurality of first holes may be regularly arranged two-dimensionally, and the plurality of second holes may be arranged regularly two-dimensionally.

Further, in the holding member of the present invention, each hole may have adhesiveness at the bottom.

Further, the holding member of the present invention is
a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
An adhesive layer having adhesiveness may be provided, which is laminated with the positioning sheet and closes the through hole from one side.

Further, in the holding member of the present invention, the positioning sheet may be made of metal having a coefficient of linear expansion of 30×10 ⁻⁵ /K or less, more preferably 10×10 ⁻⁵ /K or less.

Moreover, in the holding member of the present invention, the adhesiveness may be reduced by heating, cooling, or ultraviolet irradiation.

The positioning sheet of the present invention is
a metal sheet having a two-dimensional array of through-holes each accommodating at least a portion of one light-emitting diode chip;
Each through-hole forms a rotationally asymmetric accommodation space.

In the positioning sheet of the present invention, the shape of each through-hole in a cross section perpendicular to the depth direction may be constant in the depth direction.

Alternatively, in the positioning sheet of the present invention, the shape of each through-hole in a cross section orthogonal to the depth direction may decrease toward one side in the depth direction.

Moreover, in the positioning sheet of the present invention, the plurality of through holes may be arranged regularly.

Further, in the positioning sheet of the present invention,
The plurality of through-holes includes a plurality of first through-holes forming accommodation spaces of the same shape, and a plurality of second through-holes forming accommodation spaces of the same shape,
The opening shape of the first through-hole may be larger than the opening shape of the second through-hole.

Further, in the positioning sheet of the present invention, the plurality of first through-holes may be regularly arranged two-dimensionally, and the plurality of second through-holes may be arranged regularly two-dimensionally.

Alternatively, the positioning sheet of the present invention is
A metal sheet having a two-dimensional array of through-holes each forming a housing space for housing at least a portion of one light-emitting diode chip,
The shape of each through-hole in a cross section perpendicular to the depth direction becomes smaller toward one side in the depth direction.

In the positioning sheet of the present invention, the plurality of through holes may be arranged regularly.

Further, in the positioning sheet of the present invention,
A side surface defining each through hole includes an inclined surface that is inclined with respect to one surface of the metal sheet,
The plurality of through-holes includes a plurality of first through-holes forming accommodation spaces of the same shape, and a plurality of second through-holes forming accommodation spaces of the same shape,
An inclination angle of the inclined surface of the first through hole with respect to the one surface may be larger than an inclination angle of the inclined surface of the second through hole with respect to the one surface.

Further, in the positioning sheet of the present invention,
The plurality of through-holes includes a plurality of first through-holes forming accommodation spaces of the same shape, and a plurality of second through-holes forming accommodation spaces of the same shape,
On one side of the metal sheet in the depth direction, the opening shape of the first through-hole may be larger than the opening shape of the second through-hole.

Further, in the positioning sheet of the present invention,
The plurality of first through-holes may be regularly arranged two-dimensionally, and the plurality of second through-holes may be arranged regularly two-dimensionally.

Further, in the positioning sheet of the present invention, the metal sheet may be made of metal having a coefficient of linear expansion of 30×10 ⁻⁵ /K or less, more preferably 10×10 ⁻⁵ /K or less.

The transfer member with positioned light-emitting diode chips of the present invention comprises:
a holding member having a holding surface in which a plurality of holes are arranged two-dimensionally;
and a plurality of light emitting diode chips respectively housed in rotationally asymmetric housing spaces formed by the holes.

In the transfer member with positioned light-emitting diode chips of the present invention, the shape of each hole in a cross section orthogonal to the depth direction may be constant in the depth direction.

Alternatively, in the transfer member with positioned light-emitting diode chips of the present invention, the shape of each hole in a cross section perpendicular to the depth direction may decrease toward the bottom in the depth direction.

Moreover, in the transfer member with positioned light-emitting diode chips of the present invention, the plurality of holes may be arranged regularly.

Further, in the transfer member with positioned light-emitting diode chips of the present invention,
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The opening shape of the first hole may be larger than the opening shape of the second hole.

Further, in the transfer member with positioned light-emitting diode chips of the present invention, the plurality of first holes may be regularly arranged two-dimensionally, and the plurality of second holes may be arranged regularly two-dimensionally. .

Alternatively, the transfer member with positioned light-emitting diode chips of the present invention comprises:
a holding member having a holding surface in which a plurality of holes are arranged two-dimensionally;
a plurality of light-emitting diode chips respectively housed in housing spaces formed by the holes,
The shape of each hole in a cross section perpendicular to the depth direction becomes smaller toward the bottom in the depth direction.

In the transfer member with positioned light-emitting diode chips of the present invention, the plurality of holes may be arranged regularly.

Further, in the transfer member with positioned light-emitting diode chips of the present invention,
a side surface defining each hole includes an inclined surface that is inclined with respect to the retaining surface;
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
An inclination angle of the inclined surface of the first hole with respect to the holding surface may be greater than an inclination angle of the inclined surface of the second hole with respect to the holding surface.

Further, in the transfer member with positioned light-emitting diode chips of the present invention,
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The shape of the bottom of the first hole may be larger than the shape of the bottom of the second hole.

Further, in the transfer member with positioned light-emitting diode chips of the present invention,
The plurality of first holes may be regularly arranged two-dimensionally, and the plurality of second holes may be arranged regularly two-dimensionally.

In addition, in the transfer member with positioned light-emitting diode chips of the present invention, each hole may have adhesive at the bottom.

Further, in the transfer member with positioned light-emitting diode chips of the present invention,
a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
An adhesive layer having adhesiveness may be provided, which is laminated with the positioning sheet and closes the through hole from one side.

Further, in the transfer member with positioned light-emitting diode chips of the present invention, the positioning sheet is made of a metal having a linear expansion coefficient of 30×10 ⁻⁵ /K or less, more preferably 10×10 ⁻⁵ /K or less. may be

Further, in the transfer member with positioned light-emitting diode chips of the present invention, the adhesiveness may be reduced by heating, cooling, or ultraviolet irradiation.

The manufacturing method of the transfer member with positioned light-emitting diode chips of the present invention comprises:
providing a plurality of light emitting diode chips onto the holding surface of the holding member;
and moving a plurality of light emitting diode chips on the holding surface to guide each light emitting diode chip into the receiving space of one hole.

Alternatively, the method of manufacturing a transfer member with positioned light-emitting diode chips of the present invention comprises:
supplying a plurality of first light emitting diode chips out of a plurality of light emitting diode chips onto the holding surface of the holding member;
moving a plurality of first light emitting diode chips on the holding surface to guide each first light emitting diode chip into the accommodating space of one first hole;
supplying a plurality of second light emitting diode chips among the plurality of light emitting diode chips onto the holding surface of the holding member;
moving a plurality of second light emitting diode chips on the holding surface to guide each second light emitting diode chip into the accommodating space of one second hole;
The first light-emitting diode chip can be accommodated in the first hole and has a shape larger than the opening shape of the second hole,
The second light emitting diode chip is smaller than the first light emitting diode chip and can be accommodated in the second hole.

Alternatively, the method of manufacturing a transfer member with positioned light-emitting diode chips of the present invention comprises:
supplying a plurality of first light emitting diode chips out of a plurality of light emitting diode chips onto the holding surface of the holding member;
moving a plurality of first light emitting diode chips on the holding surface to guide each first light emitting diode chip into the accommodating space of one first hole;
supplying a plurality of second light emitting diode chips among the plurality of light emitting diode chips onto the holding surface of the holding member;
moving a plurality of second light emitting diode chips on the holding surface to guide each second light emitting diode chip into the accommodating space of one second hole;
The first light-emitting diode chip can be accommodated in the first hole, and the planar shape of the top portion of the first light-emitting diode chip located on the side opposite to the surface on which the electrodes are provided has the shape of the second light-emitting diode chip. larger than the shape of the bottom of the hole,
The planar shape of the top portion of the second light emitting diode chip located on the side opposite to the surface on which the electrodes are provided is smaller than the planar shape of the top portion of the first light emitting diode chip, and the second light emitting diode chip is: It can be accommodated in the second hole.

In the method of manufacturing a transfer member with positioned light-emitting diode chips of the present invention, the plurality of light-emitting diode chips may be moved on the holding surface by vibrating the holding member.

Further, the method of manufacturing the transfer member with the positioned light-emitting diode chips of the present invention includes:
further comprising a step of aligning the front and back sides and the orientation of the plurality of light emitting diode chips using a parts feeder;
The light-emitting diode chips may be sequentially supplied onto the holding surface from a parts feeder capable of aligning the front and back sides and the orientation of a plurality of light-emitting diode chips by vibrating them.

Alternatively, the method of manufacturing a transfer member with positioned light-emitting diode chips of the present invention comprises:
a step of supplying a plurality of light-emitting diode chips onto the surface of the positioning sheet placed on the adsorption substrate having the adsorption paths formed thereon, on the side opposite to the adsorption substrate;
a step of accommodating each light-emitting diode chip in the accommodation space of one through-hole by sucking the inside of the through-hole of the positioning sheet from the suction path;
and laminating an adhesive layer from the opposite side of the positioning sheet to the adsorption substrate.

The method for manufacturing a light-emitting substrate of the present invention comprises:
placing the positioned transfer member with light-emitting diode chips on a circuit board via an anisotropic conductive adhesive layer to bring the light-emitting diode chips into contact with the anisotropic conductive adhesive layer;
The transfer member with the positioned light-emitting diode chips is pressed toward the circuit board to join each light-emitting diode chip and the circuit board and electrically connect each light-emitting diode chip and the circuit formed on the circuit board. and connecting.

Alternatively, the method for manufacturing a light-emitting substrate of the present invention includes
placing the positioned transfer member with light-emitting diode chips on a circuit board via an anisotropic conductive adhesive layer to bring the light-emitting diode chips into contact with the anisotropic conductive adhesive layer;
The transfer member with the positioned light-emitting diode chips is pressed toward the circuit board to join each light-emitting diode chip and the circuit board through the anisotropic conductive adhesive layer, and each light-emitting diode chip and the circuit. a step of electrically connecting the circuit formed on the substrate;
a step of peeling off the light-emitting diode chip bonded to the circuit board from the adhesive layer and removing the holding member;
Prior to the step of removing the holding member, the stickiness is reduced by heating, cooling, or ultraviolet irradiation.

In the method for manufacturing a light-emitting substrate of the present invention, in the step of electrically connecting each light-emitting diode chip and the circuit, even if the transfer member with the positioned light-emitting diode chip attached is pressed toward the circuit substrate while being heated, good.

The light-emitting substrate of the present invention is
a circuit board;
a plurality of light emitting diode chips arranged on the circuit board,
Each light-emitting diode chip has a protrusion on the side opposite to the circuit board.

In the light-emitting substrate of the present invention, the convex portion may be rotationally asymmetric.

Further, in the light-emitting substrate of the present invention,
The plurality of light emitting diode chips includes a first light emitting diode chip having convex portions of the same shape and a second light emitting diode chip having convex portions of the same shape,
The planar shape of the top of the protrusion of the first light emitting diode chip may be larger than the planar shape of the top of the protrusion of the second light emitting diode chip.

Moreover, the light-emitting substrate of the present invention may further include a covering layer laminated on the circuit board so as to cover the plurality of light-emitting diode chips.

Advantageous Effects of Invention According to the present invention, productivity of light-emitting substrates having light-emitting diode chips can be improved.

FIG. 1 is an exploded perspective view showing a display device using a light-emitting substrate having light-emitting diode chips. 2 is a longitudinal sectional view of the display device shown in FIG. 1. FIG. 3 is a plan view of a light-emitting substrate used in the display device shown in FIG. 1. FIG. 4 is an enlarged view of a part of the light emitting substrate of FIG. 3. FIG. FIG. 5 is a longitudinal sectional view showing the structure of a light emitting diode chip. FIG. 6 is a plan view of the transfer member. FIG. 7 is a longitudinal sectional view of the transfer member. FIG. 8 is a plan view of the holding member. FIG. 9 is a vertical cross-sectional view of the holding member. FIG. 10 is a diagram showing another example of the opening shape of the hole and the planar shape of the light-emitting diode chip. FIG. 11 is a diagram showing still another example of the opening shape of the hole and the planar shape of the light-emitting diode chip. 12A and 12B are diagrams for explaining a step of accommodating the diced first light-emitting diode chips in the first holes of the holding member. FIG. 13A and 13B are diagrams for explaining a step of accommodating the diced second light-emitting diode chips in the second holes of the holding member. FIG. 14A and 14B are diagrams for explaining a step of accommodating the diced third light-emitting diode chips in the third holes of the holding member. FIG. FIG. 15 is a diagram for explaining the process of placing the transfer member on the circuit board. FIG. 16 is a diagram for explaining the process of bonding the light emitting diode chip of the transfer member to the circuit board. FIG. 17 is a diagram for explaining the process of removing the holding member. FIG. 18 is a diagram for explaining a step of laminating a covering layer on a circuit board. FIG. 19 is a plan view showing the circuit board and the transfer member positioned in the first region of the circuit board, for explaining the method of arranging the light emitting diode chips over the entire circuit board. FIG. 20 is a perspective view of a parts feeder. FIG. 21 is a plan view of a positioning sheet arranged on the adsorption substrate, for explaining the transfer member manufacturing method according to the modification. FIG. 22 is a vertical cross-sectional view of a positioning sheet placed on an adsorption substrate. FIG. 23 is a diagram for explaining a method of manufacturing a transfer member using an adsorption substrate. FIG. 24 is a diagram for explaining a method of manufacturing a transfer member using an adsorption substrate. FIG. 25 is a vertical cross-sectional view of a display device having a light-emitting substrate according to still another modification. 26 is a plan view of a transfer member used to manufacture the light emitting substrate shown in FIG. 25. FIG. 27 is a longitudinal sectional view of the transfer member shown in FIG. 26. FIG. 28A is a vertical cross-sectional view of a light-emitting diode chip used in the transfer member shown in FIGS. 26 and 27; FIG. FIG. 28B is a front view of the light emitting diode chip shown in FIG. 28A. 28C is a plan view of the light emitting diode chip shown in FIG. 28A. 29 is a plan view of a holding member used in the transfer member shown in FIG. 26. FIG. 30 is a longitudinal sectional view of the holding member shown in FIG. 29; FIG. 31A is a diagram showing a state in which the light-emitting diode chip has fallen into the hole of the holding member shown in FIG. 30 with the front and back sides wrong. 31B is a diagram showing a state in which the light-emitting diode chip is dropped into the hole of the holding member shown in FIG. 30 with the wrong orientation. 31C is a view showing a state in which the light emitting diode chip has fallen into a non-corresponding hole of the holding member shown in FIG. 30; FIG. FIG. 32 is a plan view of a transfer member according to still another modification. 33 is a longitudinal sectional view of the transfer member shown in FIG. 32. FIG. 34 is a longitudinal sectional view of a light-emitting diode chip used in the transfer member shown in FIGS. 32 and 33. FIG. 35 is a plan view of a holding member used in the transfer member shown in FIG. 32. FIG. 36 is a longitudinal sectional view of the holding member shown in FIG. 35; FIG. 37 is a diagram showing a state in which the light emitting diode chip has fallen into the non-corresponding hole of the holding member shown in FIG. 36; FIG. FIG. 38 is a vertical cross-sectional view of a display device having a light-emitting substrate according to still another modification. 39 is a longitudinal sectional view of the transfer member according to the modification shown in FIG. 38. FIG. 40 is a longitudinal sectional view of a light-emitting diode chip used in the transfer member shown in FIG. 39. FIG. 41 is a plan view of a holding member used in the transfer member shown in FIG. 38. FIG. 42 is a diagram showing a state in which the light-emitting diode chip has fallen into a non-corresponding hole of the holding member shown in FIG. 38. FIG.

An embodiment of the present invention will be described below with reference to the drawings. In the drawings attached to this specification, for the convenience of illustration and ease of understanding, the scale and the ratio of vertical and horizontal dimensions are changed and exaggerated from those of the real thing.

In addition, "sheet surface (plate surface, film surface)" refers to the target sheet-shaped member (plate-shaped, film-shaped) when viewed as a whole and broadly. member, film-like member).

Furthermore, the terms used herein to specify shapes and geometric conditions and their degrees, such as "parallel", "perpendicular", "identical", length and angle values, etc., are not strictly defined. It shall be interpreted to include the extent to which similar functions can be expected without being bound by the meaning.

FIG. 1 is an exploded perspective view schematically showing a display device 1 having a display surface 5. FIG. FIG. 2 is a vertical cross-sectional view of the display device 1 shown in FIG. 1 along a direction perpendicular to the display surface 5. As shown in FIG. In FIG. 1, illustration of a coating layer 8, which will be described later, is omitted for clarity of illustration.

The display device 1 displays an image or the like on the display surface 5 . In the example shown in FIGS. 1 and 2, the display device 1 includes a light-emitting substrate 10, a diffusion layer 7 arranged to face the light-emitting substrate 10, and a diffusion layer 7 arranged between the light-emitting substrate 10 and the diffusion layer 7. and a covering layer 8 . The surface of the diffusion layer 7 opposite to the side facing the light emitting substrate 10 is the display surface 5 of the display device 1 . The display device 1 is a so-called micro LED display that uses light emitted from one or more light emitting diodes as one pixel. The diffusion layer 7 diffuses the light emitted by the light emitting substrate 10 with the diffusion layer 7 . However, the configuration of the display device 1 is not limited to that shown in FIG. For example, the display device 1 may not have the diffusion layer 7 .

The light emitting substrate 10 emits light forming an image displayed on the display surface 5 . The light emitting substrate 10 will be described in more detail below with reference to FIGS. 1 to 5. FIG. FIG. 3 is a plan view showing part of the light emitting substrate 10. FIG. 4 is a plan view showing an enlarged part of the light emitting substrate 10 of FIG. 3. FIG. FIG. 5 is a diagram for explaining the structure of the light-emitting diode chip 50 arranged on the light-emitting substrate 10, and is a diagram showing a cross section along line II in FIG. 4, for example.

As shown in FIGS. 1 and 2, the light-emitting substrate 10 includes a circuit board 11 and a plurality of micro light-emitting diode chips 50 (hereinafter simply referred to as "light-emitting diode chips") regularly arranged two-dimensionally on the circuit board 11. ) and .

As shown in FIG. 3, the circuit board 11 has positioning means for positioning the holding member 30 in the step of joining the circuit board 11 to each light-emitting diode chip 50 held by the holding member 30, which will be described later. ing. In the example shown in FIG. 3, the positioning means are a plurality of cross-shaped positioning marks M1. However, the shape of the positioning mark M1 is not limited to this, and various shapes such as a square, triangle, and circle can be adopted. A plurality of positioning marks M1 are provided on the surface of the circuit board 11 on which the light-emitting diode chips 50 are arranged for each of regions R1, R2, R3, . is provided. Moreover, as shown in FIG. 4, the circuit board 11 has a circuit 13 . As shown in FIG. 2, an anisotropic conductive adhesive layer 12 for adhering the light emitting diode chip 50 to the circuit board 11 is formed at the position of the circuit board 11 where the light emitting diode chip 50 is arranged.

As shown in FIG. 5, each light-emitting diode chip 50 includes a base portion 51 made of silicon, sapphire, or the like, two electrode pads 52, a light-emitting portion 53 disposed between the base portion 51 and the electrode pads 52, including. The two electrode pads 52 include a positive electrode pad 52a with positive polarity and a negative electrode pad 52b with negative polarity. The light emitting portion 53 includes layers and circuits formed of a semiconductor material, and is electrically connected to the circuit 13 via the electrode pads 52 . By controlling the current flowing through the circuit 13 and applying a voltage between the two electrode pads 52a and 52b, the light-emitting portion 53 of any light-emitting diode chip 50 can be caused to emit light. An image displayed by the display device 1 can be formed by combining the light emitted by the light emitting diode chips 50 . Below, the base portion 51 and the light emitting portion 53 are collectively referred to as a chip body portion 55 . Note that the configuration of the chip body portion 55 is not limited to that described above. For example, the tip body 55 may not include the base 51 .

The wavelength of the light emitted from the light emitting portion 53 of the light emitting diode chip 50 is determined by the semiconductor material or the like included in the light emitting portion 53 . The light emitting part 53 contains, for example, a GaAs-based compound semiconductor, an InP-based compound semiconductor, or a GaN-based compound semiconductor.

In the illustrated example, the light emitting diode chips 50 include a first light emitting diode chip 50R that emits red light with a wavelength range of 620 nm to 680 nm, and a second light emitting diode chip 50G that emits green light with a wavelength range of 530 nm to 570 nm. and a third light emitting diode chip 50B that emits blue light with a wavelength range of 440 nm to 480 nm. The first light-emitting diode chip 50R, the second light-emitting diode chip 50G, and the third light-emitting diode chip 50B arranged near each other form one pixel of the display device 1. FIG. Therefore, the light emitting substrate 10 can emit light for forming an image displayed in full color.

When the planar shape of the chip main body 55 is rectangular, the length of one side thereof can be, for example, 3 μm or more and 1000 μm or less. Also, the thickness of the chip main body portion 55 can be, for example, 10 μm or more and 500 μm or less.

The light-emitting substrate 10 is manufactured by arranging the light-emitting diode chips 50 on the circuit board 11 where the circuit 13 is formed. In the example shown in FIG. 4, each light-emitting diode chip 50 has its two electrode pads 52 aligned in the first direction d1 of the circuit board 11, more specifically, the positive electrode pad 52a is aligned in the first direction d1. Positioned on one side, the negative electrode pad 52b is positioned on the other side in the first direction and electrically connected to the circuit 13 . Thereby, a voltage is appropriately applied between the two electrode pads 52a and 52b, and the light emitting diode chip 50 emits light.

As shown in FIG. 2 , the covering layer 8 is laminated on the circuit board 11 on which the plurality of light emitting diode chips 50 are arranged so as to cover the plurality of light emitting diode chips 50 . In other words, the multiple light-emitting diode chips 50 on the circuit board 11 are sealed by the covering layer 8 . By sealing the plurality of light-emitting diode chips 50 on the circuit board 11 with the coating layer 8 , the light-emitting diode chips 50 can be prevented from coming off the circuit board 11 . The coating layer 8 is made of resin, plastic, or the like, for example. The thickness of the coating layer 8 is, for example, about 1 μm to 200 μm.

By the way, it is desired to improve the productivity of the light-emitting substrate 10 on which the plurality of light-emitting diode chips 50 are arranged. Therefore, in the present embodiment, a plurality of light-emitting diode chips 50 are collectively transferred onto the circuit board 11 using a light-emitting diode chip-equipped transfer member 20 (hereinafter simply referred to as a "transfer member"), which will be described below. The productivity of the light emitting substrate 10 is improved.

The transfer member 20 will be described below with reference to FIGS. 6 and 7. FIG. FIG. 6 is a plan view of the transfer member 20. FIG. FIG. 7 is a cross-sectional view of the transfer member shown in FIG. 5 along line II-II.

As shown in FIGS. 6 and 7 , the transfer member 20 includes a holding member 30 and a light emitting diode chip 50 held by the holding member 30 . The holding member 30 has a flat plate shape as a whole, and has a holding surface 31 and a back surface 32 opposite to the holding surface 31 . A plurality of light-emitting diode chips 50 are regularly arranged two-dimensionally and held on the holding surface 31 .

In the illustrated example, the holding member 30 holds a plurality of light emitting diode chips 50 . Each light-emitting diode chip 50 is held by the holding member 30 so that its electrode pad 52 faces the side of an observer observing the holding surface 31 . As can be understood by comparing FIG. 6 and FIG. 3 , the arrangement interval and arrangement pattern of the plurality of light emitting diode chips 50 on the holding member 30 are such that the plurality of light emitting diode chips 50 are arranged from the rear surface 32 of the holding member 30 . When viewed in the direction toward the holding surface 31 , the plurality of light emitting diode chips 50 match the array spacing and array pattern at which the plurality of light emitting diode chips 50 should be arrayed on the circuit board 11 . Therefore, by arranging the transfer member 20 on the circuit board 11 with the holding surface 31 of the transfer member 20 facing the circuit board 11, the plurality of light emitting diode chips 50 of the transfer member 20 can be transferred to the plurality of light emitting diodes. The chips 50 can be arranged on the circuit board 11 with an arrangement interval and an arrangement pattern that match the arrangement interval and arrangement pattern to be arranged on the circuit board 11 . Thereby, the productivity of the light emitting substrate 10 can be improved.

8 and 9, transfer member 20 and holding member 30 will be described in more detail. 8 is a plan view of the holding member 30. FIG. FIG. 9 is a cross-sectional view of the holding member 30 shown in FIG. 8 along line III-III.

The holding member 30 has a plurality of holes 33 forming a housing space for housing at least a portion of the light emitting diode chip 50 . A plurality of holes 33 are formed on the holding surface 31 side and are regularly arranged two-dimensionally. The chip body portions 55 of the light emitting diode chips 50 are respectively accommodated in the accommodation spaces formed by the plurality of holes 33 . The opening shape of each hole 33 matches the planar shape of the chip body portion 55 of the light-emitting diode chip 50 accommodated in the accommodation space. Each hole 33 is sticky at the bottom 34 . This allows the holding member 30 to adhere the light emitting diode chip 50 to the bottom 34 of each hole 33 . Here, tackiness is a sticky property, and is not distinguished from adhesiveness in this specification.

Since the plurality of light-emitting diode chips 50 are accommodated in the plurality of holes 33 formed in the holding member 30, when the transfer member 20 is transferred, the arrangement interval and the arrangement of the plurality of light-emitting diode chips 50 are reduced. Easy to maintain pattern. Moreover, since each hole 33 has adhesiveness at the bottom 34 , the light-emitting diode chip 50 accommodated in each hole 33 can be adhered to the bottom 34 . Therefore, it is possible to prevent the light-emitting diode chips 50 accommodated in the respective holes 33 from dropping out of the holes 33 when the transfer member 20 is transferred or placed on the circuit board 11 .

In the example shown in FIGS. 8 and 9, the holding member 30 includes a positioning sheet 40 having a plurality of through holes 41 regularly arranged two-dimensionally, an adhesive layer 45 having adhesiveness, and a plate-shaped base material 48. and have The adhesive layer 45 is laminated on the positioning sheet 40 and closes the through holes 41 of the positioning sheet 40 from one side. The base material 48 is laminated on the side of the adhesive layer 45 opposite to the side of the positioning sheet 40 to hold the adhesive layer 45 between itself and the positioning sheet 40 . Each of the plurality of through holes 41 forms a side wall of the hole 33 of the holding member 30 and forms a housing space for housing the light emitting diode chip 50 . Also, the adhesive layer 45 forms the bottom portion 34 of the hole 33 of the holding member 30 . Therefore, the holes 33 of the holding member 30 are defined by the through holes 41 of the positioning sheet 40 and the adhesive layer 45 .

The positioning sheet 40 is made of metal in the illustrated example. More specifically, the positioning sheet 40 is preferably made of a metal having a coefficient of linear expansion of 30×10 ⁻⁵ /K or less, and is made of a metal of 10×10 ⁻⁵ /K or less. is more preferred. In this case, it is prevented that the positioning sheet 40 expands due to heat and the arrangement intervals of the plurality of light emitting diode chips 50 arranged in the plurality of through holes 41 of the positioning sheet 40 are changed. Of course, the material forming the positioning sheet 40 is not limited to metal, and other materials can be used. For example, the positioning sheet 40 may be made of glass or resin.

The adhesive layer 45 is made of a material whose adhesiveness can be reduced by heating in the illustrated example. The material of the adhesive layer 45 is not limited to this, and for example, a material whose adhesiveness can be reduced by cooling or ultraviolet irradiation may be used. Examples of materials whose adhesiveness can be reduced by heating, cooling, or ultraviolet irradiation include acrylic adhesives. The thickness of the adhesive layer 45 is, for example, 0.1 μm or more and 100 μm or less.

The base material 48 is made of resin, glass, or the like, for example. The thickness of the base material 48 is preferably 0.05 mm or more and 5 mm or less in consideration of appropriate supportability of the positioning sheet 40 and the light emitting diode chips 50 .

The holding member 30 has positioning means for positioning the transfer member 20 with respect to the circuit board 11 when the transfer member 20 is arranged on the circuit board 11 . In the example shown in FIG. 8, the positioning means is a cross-shaped positioning mark M2, which is superimposed on the positioning mark M1 of the circuit board 11 so that the transfer member 20 can be positioned with respect to the circuit board 11. It's becoming In the illustrated example, the positioning mark M2 is provided on the base material 48 . The base material 48 is transparent so that the overlapping of the positioning marks M2 and the positioning marks M1 can be observed through the base material 48, and the positioning sheet 40 and the adhesive layer 45 do not overlap the base material when the holding member 30 is viewed from above. The area overlapping the positioning mark M2 of 48 is not covered.

The shape of the positioning mark M2 is not limited to a cross shape, and various shapes such as a square, triangle, circle, etc. can be adopted.

In addition, the term "transparent" means having transparency to the extent that one side of the base material 48 can be seen through the other side of the base material 48 through the base material 48, for example, 30% or more. , more preferably having a visible light transmittance of 70% or more. The visible light transmittance is the transmittance at each wavelength when measured within the measurement wavelength range of 380 nm to 780 nm using a spectrophotometer ("UV-3100PC" manufactured by Shimadzu Corporation, compliant with JIS K 0115). is specified as the mean of

The transfer member 20 shown in FIGS. 6 and 7 holds a plurality of first light emitting diode chips 50R, a plurality of second light emitting diode chips 50G, and a plurality of third light emitting diode chips 50B. By using such a transfer member 20, it is possible to efficiently produce the light-emitting substrate 10 that emits light for forming an image displayed in full color.

Correspondingly, the holding surface 31 of the holding member 30 has a plurality of first holes 33B each forming a housing space for housing the first light emitting diode chip 50B and each housing a second light emitting diode chip 50G. A plurality of second holes 33G that form housing spaces for housing, and a plurality of third holes 33R that form housing spaces for housing the third light emitting diode chips 50R are formed. The plurality of first holes 33B are regularly two-dimensionally arranged, the plurality of second holes 33G are regularly two-dimensionally arranged, and the plurality of third holes 33R are regularly two-dimensionally arranged.

Therefore, the plurality of through holes 41 of the positioning sheet are composed of a plurality of first through holes 41B each forming a housing space for housing the first light emitting diode chip 50B and a plurality of housing spaces for each housing the second light emitting diode chip 50G. It includes a plurality of second through holes 41G forming spaces, and a plurality of third through holes 41R each forming a housing space for housing the third light emitting diode chip 50R. The plurality of first through-holes 41B are regularly arranged two-dimensionally, the plurality of second through-holes 41G are regularly arranged two-dimensionally, and the plurality of third through-holes 41R are regularly arranged two-dimensionally. ing.

The regular two-dimensional arrangement of holes 33 and through-holes 41 corresponds to a plurality of light-emitting diode chips 50 regularly arranged two-dimensionally on circuit board 11 . In other words, when viewed in the direction from the rear surface 32 side of the holding member 30 toward the holding surface 31 side, the arrangement intervals and arrangement pattern of the plurality of first holes 33B and the first through holes 41B are The plurality of first light emitting diode chips 50B accommodated in one hole 33B and first through hole 41B are arranged at the same intervals and arranged in the same pattern on the circuit board 11. As shown in FIG. Similarly, when viewed in the direction from the rear surface 32 side of the holding member 30 toward the holding surface 31 side, the arrangement intervals and arrangement pattern of the plurality of second holes 33G and the second through holes 41G are the same as those of the plurality of second holes 33G. The plurality of second light emitting diode chips 50G accommodated in the second holes 33G and the second through holes 41G are arranged at the same intervals and arranged in the same pattern on the circuit board 11. As shown in FIG. Also, when viewed in the direction from the rear surface 32 side of the holding member 30 toward the holding surface 31 side, the arrangement intervals and arrangement pattern of the plurality of third holes 33R and the third through holes 41R are The plurality of third light emitting diode chips 50R accommodated in the holes 33R and the third through holes 41R are arranged at the same intervals and in the arrangement pattern on the circuit board 11. As shown in FIG.

Specifically, the first hole 33B and the first through-hole 41B, the second hole 33G and the second through-hole 41G, and the third hole 33R and the third through-hole 41R are each a holding hole. The members 30 or positioning sheets 40 are arranged at a pitch p1 in the first direction e1, and arranged at a pitch p2 in a second direction e2 non-parallel to the first direction e1. In the illustrated example, the first direction e1 and the second direction e2 are orthogonal to each other. The pitches p1 and p2 are, for example, 50 μm or more and 870 μm or less.

The depths of the holes 33 and the through holes 41 are preferably about the same as the thickness of the light-emitting diode chip 50 , and more preferably about the same as the thickness of the chip main body 55 . The depths of the holes 33 and the through holes 41 are, for example, 1 μm or more and 200 μm or less.

Here, in the transfer member 20 described above, the plurality of light-emitting diode chips 50 need to be accommodated in the respective holes of the holding member 30 with their front and back surfaces and orientations aligned. If the front and back of the light-emitting diode chip 50 are not aligned, more specifically, if the electrode pads 52 of the light-emitting diode chip 50 are not facing the side of the observer who observes the holding surface 31, the manufacturing process of the light-emitting substrate 10, which will be described later. 3, when the transfer member 20 is placed on the circuit board 11, the electrode pads 52 of the light emitting diode chips 50 and the circuits 13 of the circuit board 11 cannot be electrically connected to each other. Also, if the directions of the light emitting diode chips 50 are not aligned, the light emitting diode chips 50 cannot be properly connected to the circuit 13, and even if a voltage is applied to the electrode pads 52, the light emitting diode chips 50 will not emit light. Can not. In the illustrated example, the positive electrode pads 52a and the negative electrode pads 52b of each light-emitting diode chip 50 are transferred so that they can be arranged on one side and the other side of the circuit board 11 in the first direction d1, respectively. It is necessary to align the directions of the plurality of light emitting diode chips 50 on the member 20 .

In addition, when the transfer member 20 has a plurality of light emitting diode chips 50R, 50G, 50B that emit lights of different colors, each of the light emitting diode chips 50R, 50G, 50B has a plurality of holes 33 of the holding member 30. The light emitting diode chips 50R, 50G, and 50B need to be accommodated in holes corresponding to the colors of light emitted. For example, in the illustrated example, the light emitting diode chip 50B that emits blue light needs to be accommodated in the first hole 33B, and the light emitting diode chip 50G that emits green light needs to be accommodated in the second hole 33G. The light emitting diode chip 50R emitting red light needs to be accommodated in the third hole 33R. If the respective light-emitting diode chips 50R, 50G, 50B are not accommodated in the holes 33B, 33G, 33R of the holding member 30 corresponding to the color of the light emitted by the corresponding light-emitting diode chips 50R, 50G, 50B, the transfer member 20 is used. This is because the manufactured light-emitting substrate 10 cannot display in a plurality of colors as desired.

In consideration of the circumstances described above, the holding member 30, the positioning sheet 40, and the respective light emitting diode chips 50 are devised as follows.

First, the holes 33 of the holding member 30 and the through-holes 41 of the positioning sheet are rotationally asymmetric so that the plurality of light-emitting diode chips 50 are accommodated in the holes 33 of the holding member 30 with their front and back sides aligned. forming a containment space. In the illustrated example, the opening shape of each hole 33 of the holding member 30 is set in the depth direction t1 of the hole 33 so that the hole 33 of the holding member 30 and the through hole 41 of the positioning sheet 40 form a rotationally asymmetric accommodation space. It is a shape that is rotationally asymmetric with respect to any axis along the . Specifically, the opening shape of each hole 33 of the holding member 30 is a pentagonal shape obtained by cutting one corner of a rectangle. The shape of each hole 33 of the holding member 30 in a cross section perpendicular to the depth direction s1 is constant in the depth direction s1. Correspondingly, the opening shape of each through hole 41 of the positioning sheet 40 is a shape that is rotationally asymmetric with respect to an arbitrary axis along the depth direction s1. Specifically, the opening shape of each through-hole 41 of the positioning sheet 40 is a pentagonal shape obtained by cutting one corner of a rectangle. The shape of each through-hole 41 of the positioning sheet 40 in a cross section orthogonal to the depth direction s1 is constant in the depth direction.

Further, the chip body portion 55 of each light-emitting diode chip 50 has a shape corresponding to the above-described shape of the hole 33 of the holding member 30 and the through hole 41 of the positioning sheet 40 . That is, the chip body portion 55 of each light emitting diode chip 50 has a rotationally asymmetric shape. In the illustrated example, the planar shape of the chip body portion 55 of the light-emitting diode chip 50 is a pentagonal shape obtained by cutting one corner of a rectangle. Further, the shape of the chip main body portion 55 of each light-emitting diode chip 50 in a cross section orthogonal to the thickness direction t1 is constant in the thickness direction t1.

Each hole 33 of the holding member 30, thus each through hole 41 of the positioning sheet 40, is formed to form a rotationally asymmetric accommodation space. With such a shape, it is possible to prevent the plurality of light emitting diode chips 50 from being accommodated in the holes of the holding member 30 in a state in which the front and back sides and the directions thereof are not aligned.

Furthermore, each of the first to third light-emitting diode chips 50B, 50G, 50R has a hole 33B corresponding to the color of the light emitted by each of the plurality of holes 33 of the holding member 30. , 33G, 33R or the through holes 41B, 41G, 41R, the opening sizes of the first to third holes 33B, 33G, 33R of the holding member 30 are different from each other. Therefore, the sizes of the opening shapes of the first to third through holes 41B, 41G, 41R of the positioning sheet 40 are different from each other.

In the illustrated example, the opening shape of the first hole 33B is larger than the opening shape of the second hole 33G, and the opening shape of the second hole 33G is larger than the opening shape of the third hole 33R. Therefore, the opening shape of the first through-hole 41B is larger than the opening shape of the second through-hole 41G, and the opening shape of the second through-hole 41G is larger than the opening shape of the third through-hole 41R.

Correspondingly, the planar shape of the chip main body portion 55 of the first light emitting diode chip 50R is larger than the planar shape of the chip main body portion 55 of the second light emitting diode chip 50G. The planar shape of 55 is larger than the planar shape of the chip body portion 55 of the third light emitting diode chip 50B.

The sizes of the opening shapes of the first to third holes 33B, 33G, 33R or the through holes 41B, 41G, 41R are different from each other, and the chip bodies of the first to third light emitting diode chips 50R, 50G, 50B Since the sizes of the planar shapes of the portions 55 are different from each other, the first to third light emitting diode chips 50B and 50G are formed in the first to third holes 33B, 33G and 33R or the through holes 41B, 41G and 41R, respectively. , 50R can be prevented from being arranged.

In the illustrated example, the accommodation spaces formed by the plurality of first holes 33B and the plurality of first through holes 41B are the same. Thereby, the first light-emitting diode chip 50B can be accommodated in an arbitrary hole 33B or through-hole 41B among the plurality of first holes 33B or through-holes 41B. Similarly, the accommodation spaces formed by the plurality of second holes 33G and the plurality of second through holes 41G are the same. Thereby, the second light emitting diode chip 50G can be accommodated in an arbitrary hole 33G or through hole 41G among the plurality of second holes 33G or through holes 41G. Further, the accommodating spaces formed by the plurality of third holes 33R and the plurality of third through holes 41R are the same. Thereby, the third light emitting diode chip 50R can be accommodated in an arbitrary hole 33R or through hole 41R among the plurality of third holes 33R or through holes 41R.

Furthermore, in the illustrated example, the planar shapes of the first to third holes 33B, 33G, 33R or the through holes 41B, 41G, 41R are similar to each other, but the sizes of the opening shapes are different. The light emitting diode chips 50 other than the first to third light emitting diode chips 50B, 50G and 50R are prevented from being arranged in the first to third holes 33B, 33G and 33R or the through holes 41B, 41G and 41R, respectively. there is However, not limited to this, by making the planar shapes of the first to third holes 33B, 33G, 33R or the through holes 41B, 41G, 41R non-similar to each other, the first to third holes 33B, 33G , 33R or the through holes 41B, 41G, 41R, respectively, the light emitting diode chips 50 other than the first to third light emitting diode chips 50R, 50G, 50B may be prevented from being arranged.

Further, in the example shown in FIG. 6, the opening shapes of the first to third holes 33B, 33G, 33R or the through holes 41B, 41G, 41R are the same as those of the first to third holes 33B, 33G, 33R or the through hole 41B. , 41G, and 41R so as to be rotationally asymmetric with respect to an arbitrary axis perpendicular to the apertures of 41G and 41R. However, the first to third holes 33B, 33G, 33R or the through holes 33B, 33G, 33R or the through holes 33B, 33G, 33R or the through holes 41B, 41G, 41R are rotationally asymmetric with respect to any axis perpendicular to the opening of the through holes 41B, 41G, 41R. The opening shape of the holes 41B, 41G, and 41R is not limited to the pentagonal shape, and various shapes can be adopted. For example, the shapes shown in FIGS. 10 and 11 can also be adopted.

Next, a method of manufacturing such a transfer member 20 will be described with reference to FIGS. 7, 9 and 12 to 14. FIG.

First, the holding member 30 shown in FIG. 9 is prepared.

Next, as shown in FIG. 12, among the first to third light emitting diode chips 50R, 50G, and 50B, the first light emitting diode chip 50B having the largest planar shape of the chip body portion 55 is placed on the holding surface of the holding member 30. 31. Then, the plurality of first light-emitting diode chips 50B are moved on the holding surface 31 to guide each of the first light-emitting diode chips 50B into one of the plurality of first holes 33B of the holding member 30 . Specifically, the plurality of first light emitting diode chips 50B on the holding surface 31 are moved by vibrating the holding member 30 and dropped into the accommodation space of the first hole 33B. At this time, since the planar shape of the chip main body portion 55 of the first light emitting diode chip 50B is larger than the opening shapes of the second and third holes 33G and 33R, the entire chip main body portion 55 of the first light emitting diode chip 50B is is prevented from falling into the second and third holes 33G and 33R. In addition, since the first hole 33B has a rotationally asymmetric shape, the entire chip body portion 55 is positioned in the first hole 33B even when the first light emitting diode chip 50B is turned upside down and in the wrong direction. It is prevented from being accommodated in the accommodation space. Specifically, the chip main body 55 of the first light emitting diode chip 50B is housed in the housing space of the first hole 33B so that the electrode pads 52 of the first light emitting diode chip 50B face the side of the observer observing the holding surface 31. be. Each first light emitting diode chip 50B has its positive electrode pad 52a and negative electrode pad 52b arranged in this order from one side of the holding member 30 in the first direction e1 to the other side. , the chip main body 55 is accommodated in the accommodation space of the first hole 33B. The first light emitting diode chip 50B with the chip main body 55 properly accommodated in the accommodation space of the first hole 33B adheres to the adhesive layer 45 forming the bottom 34 of the first hole 33B. After vibrating the holding member 30 for a while, remove from the holding member 30 the first light emitting diode chip 50B in which the chip body portion 55 is not accommodated in the first hole 33B while the front, back, and orientation are appropriate. After that, a plurality of first light emitting diode chips 50B are newly supplied onto the holding surface 31, and the holding member 30 is vibrated. This process is repeated until the first light emitting diode chips 50B are accommodated in the accommodation spaces of all the first holes 33B.

Next, as shown in FIG. 13, of the second to third light emitting diode chips 50G and 50R, the second light emitting diode chip 50G having the largest planar shape of the chip body portion 55 is placed on the holding surface 31 of the holding member 30. supply to Then, the plurality of second light emitting diode chips 50G are moved on the holding surface 31 to guide each of the second light emitting diode chips 50G into one accommodation space of the plurality of second holes 33G of the holding member 30 . Specifically, the plurality of second light emitting diode chips 50G on the holding surface 31 are moved by vibrating the holding member 30 and dropped into the accommodation space of the second hole 33G. At this time, since the planar shape of the chip main body portion 55 of the second light emitting diode chip 50G is larger than the opening shape of the third hole 33R, the entire chip main body portion 55 of the second light emitting diode chip 50G becomes the third hole. Falling into 33R is prevented. In addition, since the first light emitting diode chip 50B is accommodated in the accommodation space of the first hole 33B whose opening shape is larger than the planar shape of the chip body portion 55 of the second light emitting diode chip 50G, the second light emitting diode chip 50G The tip 50G is prevented from falling into the first hole 33B. In addition, since the second hole 33G has a rotationally asymmetric shape, the entire chip body portion 55 can be positioned in the second hole 33G even when the second light emitting diode chip 50G is turned upside down and in the wrong direction. It is prevented from being accommodated in the accommodation space. Specifically, the second light-emitting diode chip 50G has its chip body portion 55 housed in the housing space of the second hole 33G so that the electrode pads 52 of the second light-emitting diode chip 50G face the side of the observer observing the holding surface 31. be. Each second light emitting diode chip 50G has its positive electrode pad 52a and negative electrode pad 52b arranged in this order from one side of the holding member 30 in the first direction e1 to the other side. , the chip main body 55 is accommodated in the accommodation space of the second hole 33G. The second light-emitting diode chip 50G with the chip main body 55 appropriately accommodated in the accommodation space of the second hole 33G adheres to the adhesive layer 45 forming the bottom 34 of the second hole 33G. After vibrating the holding member 30 for a while, remove from the holding member 30 the second light emitting diode chip 50G in which the chip main body portion 55 is not accommodated in the second hole 33G while the front/back and orientation are appropriate. After that, a plurality of second light emitting diode chips 50G are newly supplied onto the holding surface 31, and the holding member 30 is vibrated. This process is repeated until the second light emitting diode chips 50G are accommodated in the accommodation spaces of all the second holes 33G.

Finally, as shown in FIG. 14, the third light emitting diode chip 50R is supplied onto the holding surface 31 of the holding member 30. Then, as shown in FIG. Then, the plurality of third light-emitting diode chips 50R are moved on the holding surface 31 to guide each third light-emitting diode chip 50R into one accommodation space of the plurality of third holes 33R of the holding member 30 . Specifically, the plurality of third light emitting diode chips 50R on the holding surface 31 are moved by vibrating the holding member 30 and dropped into the accommodation space of the third hole 33R. At this time, the first and second light emitting diode chips 50B and 50G are placed in the accommodating spaces of the first and second holes 33B and 33G having openings larger than the planar shape of the chip body portion 55 of the third light emitting diode chip 50R. The accommodation prevents the third light emitting diode chip 50R from falling into the first and second holes 33B and 33G. Further, since the third hole 33R has a rotationally asymmetric shape, the entire chip main body portion 55 is positioned in the third hole 33R even when the third light emitting diode chip 50R is turned upside down and in the wrong direction. It is prevented from being accommodated in the accommodation space. Specifically, the chip body portion 55 of the third light emitting diode chip 50R is housed in the housing space of the third hole 33R so that the electrode pads 52 of the third light emitting diode chip 50R face the side of the observer observing the holding surface 31. be. Each third light emitting diode chip 50R has its positive electrode pad 52a and its negative electrode pad 52b arranged in this order from one side of the holding member 30 in the first direction e1 to the other side. , and its chip body portion 55 is accommodated in the accommodation space of the third hole 33R. The third light emitting diode chip 50R with the chip main body 55 appropriately accommodated in the accommodation space of the third hole 33R adheres to the adhesive layer 45 forming the bottom 34 of the third hole 33R. After vibrating the holding member 30 for a while, remove from the holding member 30 the third light emitting diode chip 50R in which the chip body portion 55 is not accommodated in the third hole 33R while the front and back sides and orientation are proper. After that, a plurality of third light emitting diode chips 50R are newly supplied onto the holding surface 31, and the holding member 30 is vibrated. This process is repeated until the third light emitting diode chips 50R are accommodated in the accommodation spaces of all the third holes 33R.

When supplying the plurality of light emitting diode chips 50 onto the holding surface 31 of the holding member 30, the first light emitting diode chips 50B can be uniformly supplied onto the holding surface 31 by using a funnel 60, for example. Also, the light-emitting diode chip 50 whose front and back sides and orientation are not properly accommodated in the holes 33 corresponding to the chip body portions 55 of the holding member 30 does not fall into the holes 33 and stays on the holding surface 31, or Even if it falls into the hole 33, part of the chip main body 55 protrudes from the accommodation space of the hole 33. - 特許庁Therefore, such a light-emitting diode chip 50 can be easily removed from the holding member 30 by, for example, blowing air against the holding surface 31 or applying an adhesive roller to the holding surface 31 .

Thus, the transfer member 20 with positioned light-emitting diode chips as shown in FIGS. 6 and 7 is manufactured.

Next, a method for manufacturing the light emitting substrate 10 using the transfer member 20 described above will be described with reference to FIGS. 15 to 19. FIG.

First, as shown in FIG. 15, the surface of the transfer member 20 on the side of the holding surface 31 and the surface of the circuit board 11 on the side of the circuit 13 are made to face each other. By aligning the front and back surfaces of the plurality of light emitting diode chips 50 of the transfer member 20, the electrode pads 52 of the plurality of light emitting diode chips 50 and the circuits 13 of the circuit board 11 can face each other. Then, the direction from one side to the other side of the first direction e1 of the holding member 30 and the direction from one side to the other side of the first direction d1 (see FIG. 4) of the circuit board 11 are matched. After that, the transfer member 20 is positioned with respect to the first region R1 of the circuit board 11 . Positioning is performed based on the positioning means of the circuit board 11 and the positioning means of the holding member 30 of the transfer member 20 . As a specific example, positioning is performed by aligning the positioning mark M1 of the circuit board 11 with the positioning mark M2 of the holding member 30 . The alignment of the positioning marks M1 and M2 can be confirmed, for example, by a camera 80 arranged on the side of the rear surface 32 of the holding member 30 . Since the base material 48 of the holding member 30 is transparent and the positioning sheet 40 and the adhesive layer 45 do not overlap the area of the base material 48 where the positioning marks M2 are provided, it can be seen from the rear surface 32 side of the holding member 30 . Through the substrate 48, it can be confirmed that the alignment marks M1 and M2 are aligned.

The positioning of the transfer member 20 with respect to the circuit board 11 may be performed by only one of the positioning means of the holding member 30 of the transfer member 20 and the positioning means of the circuit board 11 .

Next, the transfer member 20 is brought closer to the circuit board 11 . Then, the transfer member 20 is placed on the circuit board 11 with the anisotropic conductive adhesive layer 12 interposed therebetween, and the light emitting diode chips 50 of the transfer member 20 are brought into contact with the anisotropic conductive adhesive layer 12 of the circuit board 11. . Thereafter, as shown in FIG. 16 , the transfer member 20 is pressed against the circuit board 11 to bond the light emitting diode chips 50 of the transfer member 20 to the circuit board 11 . Since the transfer member 20 is positioned with respect to the circuit board 11, the light emitting diode chip 50 is bonded to the circuit board 11 at the position where the circuit 13 is provided, and the circuit 13 and the light emitting diode chip 50 are electrically connected. can be connected. Also, since the directions of the plurality of light emitting diode chips 50 of the transfer member 20 are aligned, the positive and negative electrode pads 52a and 52b of each light emitting diode chip 50 can be appropriately connected to the circuit 13. FIG.

Next, while the transfer member 20 is pressed against the circuit board 11, the anisotropic conductive adhesive layer 12 is heated. The circuit board 11 and the light emitting diode chip 50 are adhered by heating the anisotropic conductive adhesive layer 12 . Further, according to the anisotropic conductive adhesive layer 12, conductivity can be exhibited in the pressing direction. Therefore, each electrode pad 52 of the light emitting diode chip 50 can be electrically connected to the circuit 13 facing the pressing direction.

At this time, the holding member 30 of the transfer member 20 is also heated, and the adhesiveness of the adhesive layer 45 is lowered. Thereby, the adhesiveness of the anisotropic conductive adhesive layer 12 is superior to the adhesiveness of the adhesive layer 45 of the holding member 30 , and the light-emitting diode chip 50 can be easily peeled off from the adhesive layer 45 of the holding member 30 . The step of reducing the adhesiveness of the adhesive 456 may be a separate step from the step of heating the anisotropic conductive adhesive layer 12 . That is, the heat source for heating the adhesive layer 45 may be a heat source different from the heat source for heating the anisotropic conductive adhesive layer 12 . Moreover, when the adhesiveness of the adhesive layer 45 is reduced by ultraviolet irradiation, the adhesiveness of the adhesive layer 45 may be reduced by irradiating the adhesive layer 45 with ultraviolet rays. Furthermore, when the adhesiveness of the adhesive layer 45 is lowered by cooling, the adhesiveness of the adhesive layer 45 may be lowered by cooling the adhesive layer 45 .

After that, as shown in FIG. 17, the light-emitting diode chip 50 is peeled off from the adhesive layer 45, and the holding member 30 is separated from the circuit board 11 and removed. As described above, the plurality of light emitting diode chips 50 of the transfer member 20 are collectively arranged in the first region R1 of the circuit board 11 .

Further, a new transfer member 20 similar to the transfer member 20 shown in FIG. 6 is prepared, and this new transfer member 20 is applied to the second region R2 of the circuit board 11 by the same steps as those shown in FIG. position and press. 16 and 17, the plurality of light emitting diode chips 50 of the new transfer member 20 are bonded to the circuit board 11, and the holding member 30 of the new transfer member 20 is removed. By repeating the above steps for each region R3, .

Finally, as shown in FIG. 18, the covering layer 8 is laminated on the circuit board 11 to cover the light emitting diode chips 50 on the circuit board 11 with the covering layer 8 . As described above, the light emitting substrate 10 shown in FIG. 3 is manufactured.

As described above, the holding member 30 of the present embodiment has a holding surface 31 in which a plurality of holes 33 each accommodating at least a portion of one light-emitting diode chip 50 are arranged two-dimensionally. Each hole 33 forms a rotationally asymmetric accommodation space.

By having the plurality of holes 33 arranged two-dimensionally, the holding member 30 can hold the plurality of light-emitting diode chips 50 in a two-dimensional arrangement. Therefore, the plurality of light emitting diode chips 50 held by the holding member 30 can be collectively arranged two-dimensionally on the circuit board 11 . In addition, since each hole 33 forms a rotationally asymmetric accommodation space, a plurality of light emitting diode chips 50 are supplied on the holding surface 31 of the holding member 30, and the light emitting diode chips 50 on the holding surface 31 are placed in each hole. A plurality of light-emitting diode chips 50 can be accommodated in the holes 33 with their front and back surfaces and orientations aligned, simply by guiding them to 33 using vibration, suction force, or the like. In other words, the light-emitting diode chip 50 whose front and back sides and orientation are not appropriate stays on the holding surface 31 or is not properly accommodated and part of it protrudes from the accommodation space, so that it can be easily removed from the holding member 30. . Then, if the holding member 30 holds the plurality of light emitting diode chips 50 with the front and back sides aligned and the directions aligned, the plurality of light emitting diode chips 50 can be collectively and appropriately electrically connected to the circuit 13 of the circuit board 11. can be connected to

In the holding member 30 of the present embodiment, the shape of each hole 33 in a cross section perpendicular to the depth direction s1 is constant in the depth direction s1. As a result, the shape of the light-emitting diode chip 50 accommodated in the accommodation space of each hole 33 is such that the cross-sectional shape of the light-emitting diode chip 50 perpendicular to the thickness direction t1 is constant in the thickness direction t1. can be done. The light-emitting diode chip 50 having such a shape can be arranged on the holding surface 31 of the holding member 30 with its front and back surfaces stable. Therefore, if such light-emitting diode chips 50 are fed onto the holding surface 31 of the holding member 30 with their front and back sides aligned using a parts feeder or the like, which will be described later, the light-emitting diode chips 50 can be placed in the holes 33 with their front and back sides properly aligned. can be induced to Therefore, the light-emitting diode chip 50 can be efficiently and appropriately accommodated in the accommodation space of the hole 33 .

Moreover, in the holding member 30 of the present embodiment, the plurality of holes 33 are arranged regularly. Thereby, the plurality of light emitting diode chips 50 accommodated in the plurality of holes 33 of the holding member 30 can be arranged regularly. Therefore, by matching the regular arrangement of the plurality of holes 33 with the regular arrangement of the light emitting diode chips 50 on the circuit board 11, the plurality of light emitting diode chips 50 accommodated in the plurality of holes 33 can be collectively assembled. can be placed at appropriate positions on the circuit board 11. As shown in FIG.

In addition, in the holding member 30 of the present embodiment, the plurality of holes 33 includes a plurality of first holes 33B forming accommodation spaces having the same shape, and a plurality of second holes 33B forming accommodation spaces having the same shape. and holes 33G. The opening shape of the first hole 33B is larger than the opening shape of the second hole 33G. Therefore, if the planar shape of the first light emitting diode chip 50B to be accommodated in the first hole 33B is made larger than the planar shape of the second light emitting diode chip 50G to be accommodated in the second hole 33G, the first This prevents the light emitting diode chip 50B from being accommodated in the second hole 33G. If the first light emitting diode chip 50B is accommodated in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first hole 33B. That is, the holding member 30 can efficiently accommodate, for example, two types of light-emitting diode chips 50 emitting light of different colors in the corresponding holes 33 and hold them in an appropriately arranged state. Then, the held two types of light-emitting diode chips 50 can be collectively arranged at respective appropriate positions on the circuit board 11 .

Moreover, in the holding member 30 of the present embodiment, the plurality of first holes 33B are regularly arranged two-dimensionally, and the plurality of second holes 33G are arranged regularly two-dimensionally. The regular arrangement of the plurality of first holes 33B is matched with the regular arrangement of the first light emitting diode chips 50B on the circuit board 11, and the regular arrangement of the plurality of second holes 33G is matched. , the plurality of first light emitting diode chips 50B accommodated in the plurality of first holes 33B and the plurality of second holes 33B are aligned with the regular arrangement of the second light emitting diode chips 50G on the circuit board 11. The plurality of second light emitting diode chips 50G accommodated in 33G can be collectively arranged in an appropriate arrangement on the circuit board 11 respectively.

Further, in the holding member 30 of the present embodiment, each hole 33 has adhesiveness at the bottom portion 34 . As a result, the light-emitting diode chips 50 accommodated in the holes 33 can be adhered to the bottom portion 34 to prevent the light-emitting diode chips 50 from falling out of the holes 33 .

The holding member 30 of the present embodiment includes a metallic positioning sheet 40 in which a plurality of through holes 41 each forming an accommodation space are arranged two-dimensionally, and an adhesive layer 45 having adhesiveness. and an adhesive layer 45 that is laminated to block the through hole 41 from one side. This makes it possible to easily form the hole 33 with the adhesive bottom 34 .

Further, in the holding member 30 of the present embodiment, the positioning sheet 40 is made of metal having a coefficient of linear expansion of 30×10 ⁻⁵ /K or less, more preferably 10×10 ⁻⁵ /K or less. As a result, even if the holding member 30 is heated when the light-emitting diode chip 50 held by the holding member 30 is bonded to the circuit board 11, thermal expansion of the positioning sheet 40 is suppressed. As a result, it is possible to prevent the positional relationship of the plurality of light emitting diode chips 50 accommodated in the plurality of through holes 41 of the positioning sheet 40 from being changed due to the holding member 30 being heated. Each of the light-emitting diode chips 50 can be arranged at an appropriate position on the circuit board 11 .

Moreover, in the holding member 30 of the present embodiment, the adhesiveness is reduced by heating, cooling, or ultraviolet irradiation. As a result, after bonding the light-emitting diode chip 50 housed in the hole 33 of the holding member 30 to the circuit board 11 , the light-emitting diode chip 50 can be removed from the hole 33 of the holding member 30 simply by heating, cooling, or irradiating the holding member 30 with ultraviolet rays. 33 can be peeled off from the bottom 34 .

Further, the positioning sheet 40 of this embodiment includes a metal sheet in which a plurality of through-holes 41 each accommodating at least a portion of one light-emitting diode chip 50 are arranged two-dimensionally. Each through hole 41 forms a rotationally asymmetric accommodation space.

By having the plurality of through holes 41 arranged two-dimensionally, the positioning sheet 40 can arrange the plurality of light-emitting diode chips 50 two-dimensionally. In addition, since each through-hole 41 forms a rotationally asymmetric accommodation space, a plurality of light-emitting diode chips 50 are supplied on one surface of the positioning sheet 40, and the light-emitting diode chips 50 on the one surface are A plurality of light-emitting diode chips 50 can be accommodated in the through-holes 41 in a two-dimensional arrangement by aligning the front, back, and orientation of the light-emitting diode chips 50 simply by guiding them to the through-holes 41 using vibration, suction force, or the like. can. That is, the light-emitting diode chip 50 whose front and back sides and orientation are not appropriate remains on the one surface of the positioning sheet 40, or is not properly accommodated and part of it protrudes from the accommodation space. 40.

Further, in the positioning sheet 40 of the present embodiment, the cross-sectional shape of each through-hole 41 perpendicular to the depth direction is constant in the depth direction. As a result, the shape of the light-emitting diode chip 50 accommodated in the accommodation space of each through-hole 41 is such that the cross-sectional shape of the light-emitting diode chip 50 perpendicular to the thickness direction t1 is constant in the thickness direction t1. be able to. The light-emitting diode chip 50 having such a shape can be placed on the positioning sheet 40 with its front and back surfaces stable. Therefore, if such light-emitting diode chips 50 are fed onto the positioning sheet 40 with their front and back sides aligned using a parts feeder or the like, which will be described later, the light-emitting diode chips 50 are guided to the through holes 41 with their front and back sides properly aligned. be able to. Therefore, the light-emitting diode chip 50 can be efficiently and appropriately accommodated in the accommodation space of the through hole 41 .

Moreover, in the positioning sheet 40 of the present embodiment, the plurality of through holes 41 are arranged regularly. If the regular arrangement of the plurality of through holes 41 is matched with the regular arrangement of the light emitting diode chips 50 on the circuit board 11, the plurality of light emitting diode chips 50 can be arranged as the light emitting diode chips on the circuit board 11. It can be arranged in accordance with 50 regular arrangements.

Further, in the positioning sheet 40 of the present embodiment, the plurality of through holes 41 includes a plurality of first through holes 41B forming accommodation spaces of the same shape and a plurality of second through holes 41B forming accommodation spaces of the same shape. 2 through holes 41G. The opening shape of the first through-hole 41B is larger than the opening shape of the second through-hole 41G. Therefore, if the planar shape of the first light emitting diode chip 50B to be accommodated in the first through hole 41B is made larger than the planar shape of the second light emitting diode chip 50G to be accommodated in the second through hole 41G, This prevents the first light emitting diode chip 50B from being accommodated in the second through hole 41G. If the first light emitting diode chip 50B is accommodated in the first through hole 41B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first through hole 41B. That is, for example, two types of light-emitting diode chips 50 emitting light of different colors can be accommodated in the corresponding through holes 41 and arranged.

Further, in the positioning sheet 40 of the present embodiment, the plurality of first through holes 41B are regularly arranged two-dimensionally, and the plurality of second through holes 41G are regularly arranged two-dimensionally. The regular arrangement of the plurality of first through holes 41B is matched with the regular arrangement of the first light emitting diode chips 50B on the circuit board 11, and the regular arrangement of the plurality of second through holes 41G is matched. If the arrangement matches the regular arrangement of the second light emitting diode chips 50G on the circuit board 11, the plurality of first light emitting diode chips 50B are accommodated in the plurality of first through holes 41B, and the plurality of second light emitting diode chips 50B are accommodated in the plurality of first through holes 41B. By accommodating the two light emitting diode chips 50G in the plurality of second through holes 41G, the plurality of first light emitting diode chips 50B and the plurality of second light emitting diode chips 50G can be arranged as the first light emitting diode chips on the circuit board 11. It can be two-dimensionally arranged according to the regular arrangement of 50B and the second light emitting diode chips 50G.

Further, in the positioning sheet 40 of the present embodiment, the metal sheet is made of metal having a coefficient of linear expansion of 30×10 ⁻⁵ /K or less, more preferably 10×10 ⁻⁵ /K or less. Thereby, the thermal expansion of the positioning sheet 40 is suppressed. As a result, it is suppressed that the positioning sheet 40 is heated and the positional relationship of the plurality of light emitting diode chips 50 accommodated in the plurality of through holes 41 of the positioning sheet 40 is changed.

The transfer member 20 with positioned light-emitting diode chips according to the present embodiment includes a holding member 30 having a holding surface 31 in which a plurality of holes 33 are arranged two-dimensionally, and a rotationally asymmetric accommodation space formed by each hole 33. a plurality of light emitting diode chips 50 housed respectively.

By accommodating the plurality of light emitting diode chips 50 in the accommodation space formed by the plurality of holes 33 arranged two-dimensionally, the transfer member 20 holds the plurality of light emitting diode chips 50 in a two-dimensional arrangement. are doing. Therefore, the plurality of light emitting diode chips 50 being held can be collectively arranged two-dimensionally on the circuit board 11 . In addition, since each hole 33 forms a rotationally asymmetric accommodation space, a plurality of light emitting diode chips 50 are supplied on the holding surface 31 of the holding member 30, and the light emitting diode chips 50 on the holding surface 31 are placed in each hole. The transfer member 20 can be manufactured to house and hold a plurality of light-emitting diode chips 50 in the holes 33 in a state where the front and back sides and orientations are aligned, simply by guiding the chips 50 to the holes 33 using vibration, suction force, or the like. . In other words, the light-emitting diode chip 50 whose front and back sides and orientation are not appropriate stays on the holding surface 31 or is not properly accommodated and part of it protrudes from the accommodation space, so that it is easily removed from the holding member 30. . This means that a highly productive transfer member 20 is provided. Since the plurality of light-emitting diode chips 50 are held in a state in which the front and back sides and the directions thereof are aligned, the transfer member 20 collectively appropriately transfers the plurality of light-emitting diode chips 50 to the circuit 13 of the circuit board 11. can be electrically connected to

Further, in the transfer member 20 with positioned light-emitting diode chips of the present embodiment, the shape of each hole 33 in a cross section perpendicular to the depth direction s1 is constant in the depth direction s1. As a result, the shape of the light-emitting diode chip 50 accommodated in the accommodation space of each hole 33 is such that the cross-sectional shape of the light-emitting diode chip 50 perpendicular to the thickness direction t1 is constant in the thickness direction t1. can be done. The light-emitting diode chip 50 having such a shape can be placed on the holding surface 31 of the holding member 30 with its front and back surfaces stable. Therefore, if such light-emitting diode chips 50 are fed onto the holding surface 31 of the holding member 30 with their front and back sides aligned using a parts feeder or the like, which will be described later, the light-emitting diode chips 50 are placed in the holes 33 with their front and back sides properly aligned. can be induced to Therefore, the light-emitting diode chip 50 can be efficiently and appropriately accommodated in the accommodation space of the hole 33, and the productivity of the transfer member 20 is improved.

In addition, in the transfer member 20 with positioned light-emitting diode chips of the present embodiment, the plurality of holes 33 are regularly arranged. Thereby, the arrangement of the plurality of light emitting diode chips 50 held by the transfer member 20 becomes regular. Therefore, by matching the regular arrangement of the plurality of holes 33 with the regular arrangement of the light emitting diode chips 50 on the circuit board 11, the plurality of light emitting diode chips 50 held on the transfer member 20 can be collectively transferred. can be arranged on the circuit board 11 in a suitable arrangement.

In addition, in the transfer member 20 with the positioned light-emitting diode chips of the present embodiment, the plurality of holes 33 form a plurality of first holes 33B forming housing spaces of the same shape and the housing spaces of the same shape. and a plurality of second holes 33G. The opening shape of the first hole 33B is larger than the opening shape of the second hole 33G. The plurality of first holes 33B form accommodation spaces having the same shape, so that the first light emitting diode chip 50B can be accommodated in any one of the first holes 33B. In addition, since the plurality of second holes 33G form accommodation spaces having the same shape, the second light emitting diode chip 50G can be accommodated in any second hole 33G. That is, the first light emitting diode chip 50B and the second light emitting diode chip 50G do not have to be accommodated in a specific one of the plurality of first holes 33B or the plurality of second holes 33G. This leads to improved productivity of the transfer member 20 . In addition, since the opening shape of the first hole 33B is larger than the opening shape of the second hole 33G, the planar shape of the first light emitting diode chip 50B to be housed in the first hole 33B is adjusted to the shape of the second hole 33G. If it is made larger than the planar shape of the second light emitting diode chip 50G to be accommodated in the second hole 33G, it is possible to prevent the first light emitting diode chip 50B from being accommodated in the second hole 33G. If the first light emitting diode chip 50B is first accommodated in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first hole 33B. That is, the transfer member 20 can efficiently and appropriately arrange and hold, for example, two types of light-emitting diode chips 50 emitting light of different colors. Then, the held two types of light-emitting diode chips 50 can be collectively arranged on the circuit board 11 in an appropriate arrangement.

In addition, in the transfer member 20 with positioned light-emitting diode chips of the present embodiment, the plurality of first holes 33B are regularly two-dimensionally arranged, and the plurality of second holes 33G are regularly two-dimensionally arranged. there is As a result, the plurality of first and second light emitting diode chips 50B and 50G held by the transfer member 20 are arranged regularly. Therefore, the regular arrangement of the plurality of first holes 33B is matched with the regular arrangement of the first light emitting diode chips 50B on the circuit board 11, and the regular arrangement of the plurality of second holes 33G is matched. If the arrangement is matched to the regular arrangement of the second light emitting diode chips 50G on the circuit board 11, the plurality of first to second light emitting diode chips 50B and 50G held on the transfer member 20 can be grouped together. can be arranged on the circuit board 11 in any suitable arrangement.

Further, in the transfer member 20 with positioned light-emitting diode chips of the present embodiment, each hole 33 has adhesiveness at the bottom 34 . As a result, the light-emitting diode chips 50 accommodated in the holes 33 can be adhered to the bottom portion 34 to prevent the light-emitting diode chips 50 from falling out of the holes 33 .

Further, the transfer member 20 with the positioned light-emitting diode chips of the present embodiment includes a metallic positioning sheet 40 in which a plurality of through holes 41 each forming an accommodation space are two-dimensionally arranged, and an adhesive layer having adhesiveness. 45, and an adhesive layer 45 that is laminated with the positioning sheet 40 and closes the through hole 41 from one side. This makes it possible to easily form the hole 33 with the adhesive bottom 34 .

Further, in the transfer member 20 with positioned light-emitting diode chips of the present embodiment, the positioning sheet 40 is made of metal having a linear expansion coefficient of 30×10 ⁻⁵ /K or less, more preferably 10×10 ⁻⁵ /K or less. is formed by As a result, even if the transfer member 20 is heated when the light emitting diode chip 50 held by the transfer member 20 is bonded to the circuit board 11, the thermal expansion of the positioning sheet 40 is suppressed. As a result, it is possible to prevent the positional relationship of the plurality of light emitting diode chips 50 accommodated in the plurality of through holes 41 of the positioning sheet 40 from changing due to the transfer member 20 being heated. Each of the light-emitting diode chips 50 can be arranged at an appropriate position on the circuit board 11 .

In addition, in the transfer member 20 with positioned light-emitting diode chips of the present embodiment, the adhesiveness is reduced by heating, cooling, or ultraviolet irradiation. As a result, after bonding the light-emitting diode chip 50 housed in the hole 33 of the holding member 30 to the circuit board 11 , the light-emitting diode chip 50 can be removed from the hole 33 of the holding member 30 simply by heating, cooling, or irradiating the holding member 30 with ultraviolet rays. 33 can be peeled off from the bottom 34 .

The manufacturing method of the transfer member 20 with positioned light-emitting diode chips according to the present embodiment includes the steps of supplying a plurality of light-emitting diode chips 50 onto the holding surface 31 of the holding member 30 described above, and and moving the light emitting diode chips 50 to guide each light emitting diode chip 50 into the receiving space of one hole 33 .

According to the method for manufacturing the transfer member 20 with the positioned light-emitting diode chips, the plurality of light-emitting diode chips 50 can be efficiently two-dimensionally arranged with their front and back surfaces aligned and their orientations aligned, thereby improving the productivity of the transfer member 20. can be improved.

In the manufacturing method of the transfer member 20 with positioned light-emitting diode chips according to the present embodiment, on the holding surface 31 of the holding member 30 having the first and second holes 33B and 33G, among the plurality of light-emitting diode chips 50, and moving the plurality of first light emitting diode chips 50B on the holding surface 31 so that each of the first light emitting diode chips 50B is placed in the accommodation space of one first hole 33B. supplying a plurality of second light-emitting diode chips 50G among the plurality of light-emitting diode chips 50 onto the holding surface 31 of the holding member 30; and moving the diode chips 50G to guide each second light emitting diode chip 50G into the receiving space of one second hole 33G. The first light emitting diode chip 50B can be accommodated in the first hole 33B and has a larger shape than the opening shape of the second hole 33G. It is smaller than the chip 50B and can be accommodated in the second hole 33G.

According to the manufacturing method of the transfer member 20 with the positioned light-emitting diode chips, it is possible to prevent the first light-emitting diode chips 50B from being accommodated in the second holes 33G. If the first light emitting diode chip 50B is first accommodated in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first hole 33B. That is, the two types of light-emitting diode chips 50 emitting light of different colors can be efficiently accommodated in the corresponding holes 33, and the productivity of the transfer member 20 is improved.

In the manufacturing method of the transfer member 20 with positioned light-emitting diode chips according to the present embodiment, the plurality of light-emitting diode chips 50 are moved on the holding surface 31 by vibrating the holding member 30 . According to such a manufacturing method, it is easy to move the plurality of light-emitting diode chips 50 on the holding surface 31 .

In the method for manufacturing the light emitting substrate 10 of the present embodiment, the transfer member 20 with the positioned light emitting diode chips is placed on the circuit board 11 with the anisotropic conductive adhesive layer 12 interposed therebetween, and the light emitting diode chips 50 are attached. a step of contacting the anisotropic conductive adhesive layer 12; and a step of electrically connecting the chip 50 and the circuit 13 formed on the circuit board 11 .

According to the method for manufacturing the light emitting substrate 10 as described above, the transfer member 20 holds the plurality of light emitting diode chips 50 in a two-dimensional array with the front and back surfaces aligned and the directions aligned. , collectively, can be two-dimensionally arranged on the circuit board 11 and electrically connected to the circuit 13 of the circuit board 11 appropriately. Therefore, the productivity of the light emitting substrate 10 is improved.

In the method for manufacturing the light emitting substrate 10 of the present embodiment, the transfer member 20 with the positioned light emitting diode chips, whose adhesiveness is lowered by heating, cooling, or ultraviolet irradiation, is placed on the circuit board 11 by the anisotropic conductive adhesive layer 12 . and placing the light-emitting diode chip 50 in contact with the anisotropic conductive adhesive layer 12; bonding each light emitting diode chip 50 and the circuit board 11 via the adhesive layer 12 and electrically connecting each light emitting diode chip 50 and the circuit 13 formed on the circuit board 11; and removing the holding member 30 by peeling the light-emitting diode chip 50 bonded to the adhesive layer 45, and before the step of removing the holding member 30, the adhesiveness is reduced by heating, cooling, or ultraviolet irradiation. Let

According to the method for manufacturing the light emitting substrate 10 as described above, after the light emitting diode chip 50 housed in the hole 33 of the holding member 30 is joined to the circuit board 11 , the light emitting diode chip 50 is attached to the bottom portion 34 of the hole 33 of the holding member 30 . Easy to peel from.

In the method of manufacturing the light-emitting substrate 10 of the present embodiment, in the step of electrically connecting each light-emitting diode chip 50 and the circuit 13, while the transfer member 20 with the positioned light-emitting diode chip is directed toward the circuit substrate 11, press. Thereby, the adhesiveness of the adhesive layer 45 can be reduced while electrically connecting each light emitting diode chip 50 and the circuit 13 .

The light-emitting substrate 10 of this embodiment further includes a covering layer 8 laminated on the circuit board 11 so as to cover the plurality of light-emitting diode chips 50 . Thereby, it is possible to prevent the light emitting diode chip 50 from falling off from the circuit board 11 .

<Modification 1>
12 to 14, when the light emitting diode chips 50 are supplied to the holding surface 31 of the holding member 30, the light emitting diode chips 50 are scattered on the holding surface 31 using the funnel 60. Although an example is shown, it is not limited to this.

For example, the light-emitting diode chips 50 may be supplied using supply means (apparatus) 65 (hereinafter referred to as parts feeder) shown in FIG.

The parts feeder 65 will be described below with reference to FIG. FIG. 20 is a perspective view showing a schematic configuration of the parts feeder 65. As shown in FIG.

The parts feeder 65 includes a housing body 66 for housing the light-emitting diode chips 50 , a passage 67 connected to the housing body 66 and for aligning the light-emitting diode chips 50 , and a space between the housing body 66 and the passage 67 . and a vibration device 68 for applying vibration in a predetermined direction.

Although the accommodation portion main body 66 has a substantially circular shape in FIG. 20, it may have a rectangular shape. A groove 69 extending along the vibration direction of the vibrating device 68 is formed in the housing portion main body 66 . For example, when the accommodation portion main body 66 is circular, the groove 69 is provided so as to draw a circle (spiral shape) from the center of the accommodation portion main body 66 toward the outer circumference. The grooves 69 are also provided for aligning the light emitting diode chips 50 by vibration. In addition, a large number of light-emitting diode chips 50 separated from the wafer are accommodated in the accommodation portion main body 66 .

For example, a plurality of vibrating devices 68 are arranged at a predetermined portion of the housing portion main body 66 so as to vibrate in a circular manner along the groove 69 from the center of the housing portion main body 66 toward the outer periphery. In this way, the light emitting diode chips 50 also move while vibrating in the vibrating direction, so that the overlapping light emitting diode chips 50 are separated during the movement. Further, since the groove 69 is provided in the vibration direction, the light emitting diode chip 50 moves while being fitted in the groove 69 . The passage 67 is vibrated in the longitudinal direction (the direction of the thick arrow in FIG. 20) by a vibration device 68 . As a result, the light-emitting diode chips 50 on the passage 67 are sequentially moved to the tip side of the passage 67 .

By using such a parts feeder 65, a plurality of light-emitting diode chips 50 can be sequentially supplied onto the holding surface 31 of the holding member 30 in a state in which the front and back surfaces and the orientations of the chips are aligned. Therefore, the light-emitting diode chips 50 supplied onto the holding surface 31 can be more efficiently guided into the accommodation space formed by the holes 33 of the holding member 30 . As a result, the productivity of the transfer member 20 is improved.

That is, the manufacturing method of the transfer member 20 with the positioned light-emitting diode chips according to Modification 1 further includes a step of aligning the front and back sides and the orientation of the plurality of light-emitting diode chips 50 using the parts feeder 65. The light-emitting diode chips 50 are sequentially supplied onto the holding surface 31 from the parts feeder 65 that can align the front and back and the orientation by vibrating.

According to the method of manufacturing the transfer member 20 with the positioned light-emitting diode chips, the light-emitting diode chips 50 supplied onto the holding surface 31 are placed in the holes 33 of the holding member 30 in a more appropriate state of front, back, and orientation. It can be guided to the accommodation space to be formed. As a result, the productivity of the transfer member 20 is improved.

<Modification 2>
As a method of manufacturing the transfer member 20 shown in FIGS. 12 to 14, the light emitting diode chip 50 is placed in the accommodation space of the hole 33 of the holding member 30 formed by laminating the positioning sheet 40, the adhesive layer 45, and the base material 48. Although an example of manufacturing the transfer member 20 by housing the chip 50 has been shown, the present invention is not limited to this.

For example, in the modification shown in FIGS. 21 to 24, first, a plurality of light emitting diode chips 50 are accommodated in the accommodation spaces of the through holes 41 of the positioning sheet 40, and then the adhesive layer 45 and the base material 48 are laminated on the positioning sheet 40. Then, the transfer member 20 is manufactured.

Hereinafter, the manufacturing method of the transfer member 20 of Modification 2 will be described in more detail with reference to FIGS. 21 and 22 are a longitudinal sectional view and a plan view, respectively, of the positioning sheet 40 placed on the adsorption substrate 70. FIG. 23 is a longitudinal sectional view showing how the light emitting diode chip 50 is accommodated in the accommodation space of the through hole 41 of the positioning sheet 40 shown in FIG. 21, and FIG. 4 is a vertical cross-sectional view showing a state in which an adhesive layer 45 and a base material 48 are laminated on.

First, the adsorption base material 70 will be described. The adsorption base material 70 is a flat plate-like member as a whole. Adsorption paths 71 are formed in the adsorption base material 70 . In the illustrated example, the adsorption path 71 has a large number of ventilation holes 72 passing through the adsorption substrate 70 from one surface 70a to the other surface 70b.

Next, a method of manufacturing the transfer member 20 according to Modification 2 using such an adsorption base material 70 will be described.

First, as shown in FIGS. 21 and 22, the positioning sheet 40 is arranged on one surface 70a of the adsorption base material 70. As shown in FIG. At this time, as can be understood from FIG. 21 , the positioning sheet 40 is arranged so that the surface 40 a serving as the holding surface 31 of the transfer member 20 faces the adsorption substrate 70 .

In this state, a plurality of first light emitting diode chips 50B are provided on the surface 40b of the positioning sheet 40 opposite to the surface 40a. After that, the air in the through holes 41 of the positioning sheet 40 is sucked from the side of the other surface 40 b of the adsorption base material 70 through the adsorption paths 71 . As a result, the first light emitting diode chip 50B is guided toward the through hole 41 provided in the positioning sheet 40 and accommodated in one accommodation space of the first through hole 41B. When the first light emitting diode chips 50B are housed in the housing spaces of all the first through holes 41B, the suction of air inside the through holes 41 through the suction paths 71 is stopped.

Next, a plurality of second light emitting diode chips 50G are provided on the surface 40b of the positioning sheet 40 opposite to the above. After that, the air in the through holes 41 of the positioning sheet 40 is sucked from the side of the other surface 70 b of the adsorption base material 70 through the adsorption paths 71 . As a result, the second light emitting diode chip 50G is guided toward the through hole 41 provided in the positioning sheet 40 and accommodated in one accommodation space of the second through hole 41G. When the second light emitting diode chips 50G are housed in the housing spaces of all the second through holes 41G, the suction of air inside the through holes 41 through the suction paths 71 is stopped.

Next, a plurality of third light emitting diode chips 50R are provided on the surface 40b of the positioning sheet 40 on the opposite side. After that, the air in the through holes 41 of the positioning sheet 40 is sucked from the side of the other surface 70 b of the adsorption base material 70 through the adsorption paths 71 . As a result, the third light emitting diode chip 50R is guided toward the through hole 41 provided in the positioning sheet 40 and accommodated in one accommodation space of the third through hole 41R. When the third light emitting diode chips 50R are accommodated in the accommodation spaces of all the third through holes 41R, the suction of air inside the through holes 41 through the suction paths 71 is stopped. As described above, the light-emitting diode chips 50 are accommodated in the accommodating spaces of all the through holes 41 of the positioning sheet 40, as shown in FIG.

Since the surface 40 a of the positioning sheet 40 on the side of the holding surface 31 faces the adsorption substrate 70 , the electrode pads 52 of the light-emitting diode chips 50 in the through holes 41 are attached to the adsorption substrate 70 . Housed facing sideways.

In this state, as shown in FIG. 24, the adhesive layer 45 is laminated on the surface 40b of the positioning sheet 40 opposite to the adsorption base material 70. As shown in FIG. As a result, the positioning sheet 40 and the light-emitting diode chips 50 in the through-holes 41 of the positioning sheet 40 adhere to the adhesive layer 45 . Furthermore, when the base material 48 is laminated on the adhesive layer 45 and the adsorption base material 70 is removed, the transfer member 20 having the positioned light emitting diode chips 50 shown in FIG. 7 is completed.

As described above, the manufacturing method of the transfer member 20 with the positioned light-emitting diode chips according to Modification 2 is different from the adsorption substrate 70 of the positioning sheet 40 arranged on the adsorption substrate 70 on which the adsorption paths 71 are formed. By supplying a plurality of light emitting diode chips 50 on the opposite surface 40 b and sucking the inside of the through holes 41 of the positioning sheet 40 from the suction path 71 , each of the light emitting diode chips 50 is placed in one through hole 41 . It includes a step of housing in the housing space and a step of laminating the adhesive layer 45 from the side of the positioning sheet 40 opposite to the adsorption base material 70 .

According to the method of manufacturing the transfer member 20 with the positioned light-emitting diode chips, the plurality of light-emitting diode chips 50 can be efficiently two-dimensionally arranged with the front and back sides aligned and the directions aligned. Therefore, the productivity of the transfer member 20 holding the positioned light-emitting diode chips 50 is improved.

<Modification 3>
Next, modifications of the light emitting substrate 10, the holding member 30, and the positioning sheet 40 in the above embodiment will be described with reference to FIGS. 25 to 31C. Modification 3 shown in FIGS. 25 to 31C differs from the light emitting substrate 10 of the display device 1 shown in FIGS. 1 and 2 in that the light emitting diode chip 50 has a convex portion 56 . In addition, compared to the holding member 30 shown in FIGS. 6 and 7, the shape of the hole 33 of the holding member 30 in the cross section orthogonal to the depth direction s1 becomes smaller toward the bottom 34 in the depth direction. are different. Further, compared to the positioning sheet 40 shown in FIGS. 8 and 9, the shape of the through hole 41 of the positioning sheet 40 in the cross section perpendicular to the depth direction s1 becomes smaller toward one side in the depth direction s1. different in that there are Other configurations are substantially the same as the embodiment shown in FIGS. 25 to 31C, parts similar to those of the embodiment shown in FIGS. 1 to 19 are denoted by the same reference numerals, and detailed description thereof will be omitted.

Hereinafter, the light emitting substrate 10, the transfer member 20, the holding member 30, the positioning sheet 40 and the light emitting diode chip 50 according to Modification 3 will be described with reference to FIGS. 25 to 28C. FIG. 25 is a longitudinal sectional view showing the display device 1 according to Modification 3. As shown in FIG.

As can be understood from FIG. 25 , the chip body portion 55 of the light-emitting diode chip 50 is provided with a convex portion 56 on the surface opposite to the electrode pads 52 . In the illustrated example, the convex portion 56 is provided on the base portion 51 of the chip body portion 55 shown in FIG. 5 using, for example, transparent resin. Such convex portions 56 can be formed using a photolithography technique or a nanoimprint technique. Note that the convex portion 56 may be directly provided on the light emitting portion 53 after removing the base portion 51 on the light emitting portion 53 . Also, the convex portion 56 may be formed by cutting or etching the base portion 51 . Since the light-emitting diode chip 50 has the protrusions 56, the adhesion with the coating layer 8 is improved.

Next, a transfer member 20 for manufacturing the light emitting substrate 10 of such a display device 1 will be described with reference to FIGS. 26 to 31C. 26 and 27 are respectively a plan view and a vertical cross-sectional view showing a transfer member 20 used for manufacturing the light emitting substrate 10 of the display device 1 shown in FIG. 25. FIG. FIG. 27 shows a cross section of the transfer member 20 shown in FIG. 26 along line VV. 28A to 28C are a longitudinal sectional view, a front view, and a plan view of the light emitting diode chip 50 used in the transfer member 20 shown in FIGS. 26 and 27, as viewed from the projection 56 side. FIG. 28A shows a cross-section along line VI-VI of FIG. 28B and a cross-section along line VII-VII of FIG. 28C. 29 and 30 are plan and longitudinal sectional views, respectively, of a holding member 30 used to fabricate the transfer member 20 shown in FIGS. 27 and 28. FIG. FIG. 30 shows a cross section of the holding member 30 shown in FIG. 29 along line VIII-VIII. 31A to 31C are diagrams showing a state in which the light emitting diode chips 50 shown in FIGS. 28A to 28C are not properly accommodated in the corresponding holes 33. FIG.

As shown in FIGS. 26 and 27, the transfer member 20 includes a holding member 30 having a holding surface 31 in which a plurality of holes 33 are regularly arranged two-dimensionally, and a storage space for the plurality of holes 33 of the holding member 30. and a plurality of light emitting diode chips 50 housed therein. The multiple holes 33 include first to third holes 33B, 33G, and 33R, and the multiple light emitting diode chips 50 include first to third light emitting diode chips 50B, 50G, and 50R.

As shown in FIG. 29, the opening shape of the hole 33 of the holding member 30 is rotationally symmetrical. On the other hand, as can be understood from FIGS. 29 and 30, the hole 33 of the holding member 30 has a rotationally asymmetric cross-sectional shape along the depth direction s1. In the illustrated example, the shape of each hole 33 in a cross section perpendicular to the depth direction s1 decreases toward the bottom 34 in the depth direction s1. Correspondingly, the opening shape of the through hole 41 of the positioning sheet 40 is rotationally symmetrical. On the other hand, as understood from FIGS. 29 and 30, the through hole 41 of the positioning sheet 40 has a rotationally asymmetric cross-sectional shape along the depth direction s1. In the illustrated example, the shape of each through-hole 41 in a cross section perpendicular to the depth direction s1 decreases toward the adhesive layer 45 side in the depth direction s1.

More specifically, each hole 33 of the holding member 30 has a square opening 35, a square bottom 34, and corresponding sides of the opening 35 and the bottom 34, as shown in FIG. It has four connecting sides 36a-36e. The bottom 34 of each hole 33 is smaller than the opening 35 of the hole 33 , and the center thereof is positioned away from the center of the opening 35 to the other side of the holding member 30 in the first direction e<b>1 . Correspondingly, of the four side surfaces 36a to 36e, the side surface 36a connecting one side of the opening 35 of the hole 33 in the first direction e1 of the holding member 30 and one side of the bottom 34 is , and is inclined with respect to the holding surface 31 of the holding member 30 .

Also, in the illustrated example, as can be understood from FIG. 30, the sizes of the accommodation spaces formed by the first to third holes 33B, 33G, and 33R are different from each other. Specifically, the shapes of the opening 35 and the bottom 34 of the second hole 33G are smaller than the shapes of the opening 35 and the bottom 34 of the first hole 33B, respectively. The dimension of the second hole 33G of the holding member 30 along the first direction e1 is generally smaller than the dimension of the first hole 33B of the holding member 30 along the first direction e1. Also, the shapes of the opening 35 and the bottom 34 of the third hole 33R are smaller than the shapes of the opening 35 and the bottom 34 of the second hole 33G. The dimension of the third hole 33R of the holding member 30 along the first direction e1 is generally smaller than the dimension of the second hole 33G of the holding member 30 along the first direction e1.

Correspondingly, the through hole 41 of the positioning sheet 40 has, as shown in FIG. It has an opening 43 and four side surfaces 44 a to 44 d connecting each side of the first opening 42 and the corresponding side of the second opening 43 . The second opening 43 of each through-hole 41 is smaller than the first opening 42 of the through-hole 41, and the center thereof is off the center of the first opening 42 to the other side of the positioning sheet 40 in the first direction e1. position. Correspondingly, one side of the first opening 42 of the through-hole 41 in the first direction e1 of the positioning sheet 40 and one side of the second opening 43 of the four side surfaces 44a to 44d A side surface 44a connecting the .

Also, in the illustrated example, as can be understood from FIG. 30, the sizes of the accommodation spaces formed by the first to third through holes 41B, 41G, and 41R are different from each other. Specifically, the shapes of the first opening 42 and the second opening 43 of the second through hole 41G are different from the shapes of the first opening 42 and the second opening 43 of the first through hole 41B, respectively. is also small. The dimension of the second through holes 41G along the first direction e1 of the positioning sheet 40 is generally smaller than the dimension of the first through holes 41B of the positioning sheet 40 along the first direction e1. Also, the shapes of the first opening 42 and the second opening 43 of the third through-hole 41R are smaller than the shapes of the first opening 42 and the second opening 43 of the second through-hole 41G. The dimension of the third through holes 41R along the first direction e1 of the positioning sheet 40 is generally smaller than the dimension of the second through holes 41G of the positioning sheet 40 along the first direction e1.

As shown in FIGS. 28A to 28C, the light-emitting diode chip 50 accommodated in the accommodation space formed by the hole 33 of the holding member 30 and the through hole 41 of the positioning sheet 40 has a rotationally symmetrical chip main body 55. example is a cuboid. On the other hand, the convex portion 56 of the light emitting diode chip 50 is formed rotationally asymmetric. In the illustrated example, as shown in FIG. 28A, the projection 56 has a rotationally asymmetric shape in a cross section perpendicular to the extending direction q1 of the electrode pad 52 of the light-emitting diode chip 50 having the projection 56 .

More specifically, the convex portion 56 has a stepped shape, and the shape of the cross section perpendicular to the thickness direction t1 of the chip body portion 55 is the top portion of the convex portion 56 in the thickness direction t1 of the chip body portion 55. is getting smaller towards More specifically, the convex portion 56 includes a first step portion 56a protruding from the chip body portion 55, a second step portion 56b protruding from the first step portion 56a, and a convex portion 56b protruding from the second step portion 56b. and a third stepped portion 56c forming the top of 56 . The planar shape of the second stepped portion 56b is smaller than the planar shape of the first stepped portion 56a, and the planar shape of the third stepped portion 56c is smaller than the planar shape of the second stepped portion 56b.

As shown in FIG. 28C, in plan view, the second step portion 56b is positioned inside the contour of the first step portion 56a. The center of the second stepped portion 56b is positioned away from the center of the first stepped portion 56a toward the negative electrode pad 52b in the direction q2 in which the electrode pads 52 are arranged. Also, the third stepped portion 56c is positioned inside the contour of the second stepped portion 56b. The center of the third stepped portion 56c is positioned away from the center of the second stepped portion 56b toward the negative electrode pad 52b in the direction q2 in which the electrode pads 52 are arranged.

Further, as can be understood from FIGS. 26 and 27, in the illustrated example, the planar shape sizes of the chip body portion 55 and the convex portion 56 of the first to third light-emitting diode chips 50B, 50G, and 50R are different from each other. different. Specifically, the planar shapes of the chip main body 55 and the top of the projections 56 of the second light emitting diode chip 50G are different from the planar shapes of the chip main body 55 and the top of the projections 56 of the first light emitting diode chip 50B. is also small. The dimension of the second light emitting diode chip 50G along the direction q2 in which the electrode pads 52 are arranged is generally smaller than the dimension of the first light emitting diode chip 50B along the direction q2 in which the electrode pads 52 are arranged. Further, the planar shapes of the chip main body portion 55 and the top portions of the convex portions 56 of the third light emitting diode chip 50R are smaller than the planar shapes of the chip main body portion 55 and the top portions of the convex portions 56 of the second light emitting diode chip 50G. is. The dimension of the third light emitting diode chip 50R along the direction q2 in which the electrode pads 52 are arranged is generally smaller than the dimension of the second light emitting diode chip 50G along the direction q2 in which the electrode pads 52 are arranged.

As described above, the shape of the hole 33 of the holding member 30 in the cross section orthogonal to the depth direction s1 is smaller toward the bottom 34 in the depth direction s1, and the projection 56 of the light emitting diode chip 50 is smaller. , the shape of the chip main body 55 in a cross section orthogonal to the thickness direction t1 decreases toward the top in the thickness direction t1, so that the front and back of the light emitting diode chip 50 accommodated in the hole 33 of the holding member 30 can be aligned. For example, as shown in FIG. 31A, when the light-emitting diode chip 50 falls into the hole 33 of the holding member 30 so that the electrode pad 52 of the light-emitting diode chip 50 faces the adhesive layer 45 of the holding member 30, the light emitting diode chip 50 is removed from the accommodation space of the hole 33. A protrusion 56 protrudes.

Similarly, the shape of the through-hole 41 of the positioning sheet 40 in the cross section orthogonal to the depth direction s1 becomes smaller toward one side in the depth direction s1, and the projection 56 of the light-emitting diode chip 50 becomes smaller. , the shape of the chip main body 55 in a cross section orthogonal to the thickness direction t1 decreases toward the top in the thickness direction t1. can be aligned. For example, as shown in FIG. 31A, when the light-emitting diode chip 50 falls into the through-hole 41 of the positioning sheet 40 so that the electrode pad 52 of the light-emitting diode chip 50 faces the adhesive layer 45 laminated on the positioning sheet 40, the through-hole A convex portion 56 protrudes from the housing space of 41 .

Further, the center of the cross section perpendicular to the depth direction s1 of the hole 33 of the holding member 30 is displaced toward the bottom portion 34 in the depth direction s1, and the shape of the convex portion 56 of the light emitting diode chip 50 conforms to the shape of the chip body. By displacing the portion 55 toward the top portion in the thickness direction t1, the orientation of the light-emitting diode chips 50 accommodated in the holes 33 of the holding member 30 can be aligned. For example, as shown in FIG. 31B , if the light emitting diode chip 50 falls into the hole 33 of the holding member 30 in the wrong direction, part of the main body 55 and the protrusion 56 will protrude from the accommodation space of the hole 33 . .

Similarly, the center of the cross section perpendicular to the depth direction s1 of the through hole 41 of the positioning sheet 40 is displaced toward one side in the depth direction s1, and the shape of the convex portion 56 of the light emitting diode chip 50 is By displacing the chip main body portion 55 toward the top portion in the thickness direction t1, the orientation of the light emitting diode chips 50 accommodated in the through holes 41 of the positioning sheet 40 can be aligned. For example, as shown in FIG. 31B, when the light-emitting diode chip 50 falls into the through-hole 41 of the positioning sheet 40 in the wrong direction, the body portion 55 and the convex portion 56 are partly removed from the accommodation space of the through-hole 41. protrude.

Also, the sizes of the accommodation spaces formed by the first to third holes 33B, 33G, and 33R are different from each other, and correspondingly, the chip body portions of the first to third light emitting diode chips 50B, 50G, and 50R are different. To prevent the light-emitting diode chip 50 from being accommodated in a hole other than the hole 33 corresponding to the color of the light emitted by the light-emitting diode chip 50, because the sizes of the 55 and the protrusion 56 are different from each other. can be done. For example, as shown in FIG. 31C , when the light-emitting diode chip 50 falls into the hole 33 forming an accommodation space smaller than the size of the chip main body 55 and the projection 56, the chip main body 55 of the light-emitting diode chip 50 and/or part of the protrusion 56 protrudes from the accommodation space of the hole 33 . Therefore, when the light emitting diode chips 50 are supplied to the holding surface 31 of the holding member 30 and accommodated in the holes 33 of the holding member 30 in the process of manufacturing the transfer member 20, the first to third light emitting diode chips 50B, 50G, 50R Among the light emitting diode chips 50, the light emitting diode chips 50 having the largest chip main body portion 55 and convex portion 56 are sequentially supplied to the holding surface 31 and housed in the holes 33, so that the light emitting diode chips 50 emit light. Therefore, it can be prevented from being accommodated in a hole other than the hole 33 corresponding to the color of the . In the illustrated example, first, the first light emitting diode chip 50B is supplied to the holding surface 31 and accommodated in the first hole 33B, and then the second light emitting diode chip 50G is supplied to the holding surface 31 to accommodate the second light emitting diode chip 50B. is accommodated in the hole 33G. Finally, the third light emitting diode chip 50R is supplied to the holding surface 31 and accommodated in the third hole 33R. This prevents the second light emitting diode chip 50G from being accommodated in the third hole 33R and the first light emitting diode chip 50B from being accommodated in the second and third holes 33G and 33R.

Similarly, the sizes of the accommodation spaces formed by the first to third through holes 41B, 41G, and 41R are different from each other, and correspondingly, the chips of the first to third light emitting diode chips 50B, 50G, and 50R Since the body portion 55 and the convex portion 56 have different sizes, the light-emitting diode chip 50 can be accommodated in a through-hole other than the through-hole 41 corresponding to the color of the light emitted by the light-emitting diode chip 50. can be prevented. For example, as shown in FIG. 31C, when the light-emitting diode chip 50 falls into the through-hole 41 forming an accommodation space smaller than the size of the chip body 55 and the projection 56, the chip body of the light-emitting diode chip 50 A portion of 55 and/or protrusion 56 protrudes from the accommodation space of through-hole 41 . Therefore, when the light-emitting diode chips 50 are supplied to the surface 40a of the positioning sheet 40 to be the holding surface 31 in the process of manufacturing the transfer member 20 and housed in the through-holes 41 of the positioning sheet 40, the first to third light-emitting diode chips Among 50B, 50G, and 50R, the light-emitting diode chip 50 having the largest chip body portion 55 and convex portion 56 is sequentially supplied to the surface 40a serving as the holding surface 31 and housed in the through hole 41, whereby the light-emitting diode chip 50 is , it is possible to prevent the light-emitting diode chip 50 from being accommodated in a through-hole other than the through-hole 41 corresponding to the color of the light emitted. In the illustrated example, first, the first light-emitting diode chip 50B is supplied to the surface 40a to be the holding surface 31 and accommodated in the first through hole 41B, and then the second light-emitting diode chip 50G is placed on the holding surface 31. It is supplied to the other surface 40a and accommodated in the second through hole 41G. Finally, the third light-emitting diode chip 50R is supplied to the surface 40a serving as the holding surface 31 and accommodated in the third through hole 41R. This prevents the second light emitting diode chip 50G from being accommodated in the third through hole 41R and the first light emitting diode chip 50B from being accommodated in the second and third through holes 41G and 41R.

Furthermore, since the hole 33 of the holding member 30 has the inclined surface 36a, after the light emitting diode chip 50 of the transfer member 20 is joined to the circuit board 11 in the manufacturing process of the light emitting substrate 10, the light emitting diode chip 50 is attached. When removing the holding member 30 by peeling it from the adhesive layer 45 of the holding member 30 , it is easy to remove the light emitting diode chip 50 from the hole 33 of the holding member 30 .

Similarly, since the through hole 41 of the positioning sheet 40 has the inclined surface 44a, after the light emitting diode chip 50 of the transfer member 20 is joined to the circuit board 11 in the manufacturing process of the light emitting board 10, the light emitting diode chip When removing the holding member 30 by peeling the light emitting diode chip 50 from the adhesive layer 45 of the holding member 30 , it is easy to remove the light emitting diode chip 50 from the through hole 41 of the positioning sheet 40 .

As described above, in the holding member 30 according to Modification 3, the shape of each hole 33 in a cross section perpendicular to the depth direction s1 becomes smaller toward the bottom portion 34 in the depth direction s1. As a result, the front and back surfaces of the light-emitting diode chips 50 can be efficiently aligned. Also, it is easy to remove the light-emitting diode chip 50 from the hole 33 of the holding member 30 .

Further, in the positioning sheet 40 of Modification 3, the shape of each through-hole 41 in a cross section perpendicular to the depth direction s1 becomes smaller toward one side in the depth direction s1. As a result, the front and back surfaces of the light-emitting diode chips 50 can be efficiently aligned. It is easy to remove the light emitting diode chip 50 from the through hole 41 of the positioning sheet 40 .

In addition, in the transfer member 20 with positioned light-emitting diode chips of Modification 3, the shape of each hole 33 in a cross section perpendicular to the depth direction s1 becomes smaller toward the bottom 34 in the depth direction s1. As a result, the transfer member 20 can efficiently align and hold the front and back surfaces of the light emitting diode chips 50 . Also, it is easy to remove the light-emitting diode chip 50 from the hole 33 .

Further, the light-emitting board 10 of Modification 3 includes a circuit board 11 and a plurality of light-emitting diode chips 50 arranged on the circuit board 11. Each light-emitting diode chip 50 is arranged on the opposite side of the circuit board 11. , and a convex portion 56 . With such a light-emitting substrate 10, it is easy to align the front and back surfaces of the plurality of light-emitting diode chips 50 on the circuit substrate 11. FIG. Also, the adhesion between the light emitting diode chip 50 and the material on the circuit board 11, for example, the coating layer 8 is improved.

Further, in the light-emitting substrate 10 of Modified Example 3, the convex portion 56 is rotationally asymmetric. With such a light-emitting substrate 10, it is easy to align the directions of the plurality of light-emitting diode chips 50 on the circuit substrate 11. FIG. For example, if a positioning sheet 40 having rotationally asymmetric through holes 41 corresponding to the shape of the projections 56 is used, the directions of the plurality of light emitting diode chips 50 can be aligned.

<Modification 4>
Next, modified examples of the transfer member 20, the holding member 30, and the positioning sheet 40 in the third modified example described above will be described with reference to FIGS. 32 to 38C. Modification 4 shown in FIGS. 32 to 37 differs from Modification 3 shown in FIGS. 25 to 31C in that the size of the chip main body 55 of the light-emitting diode chip 50 is the same in plan view. Moreover, the opening shape of the plurality of holes 33 of the holding member 30 and the opening shape of the plurality of through holes 41 of the positioning sheet 40 are different in that they are equal to each other. Other configurations are substantially the same as those of Modification 3 shown in FIGS. 25 to 31C. In Modification 4 shown in FIGS. 32 to 37, portions similar to Modification 3 shown in FIGS. 25 to 31C are assigned the same reference numerals, and detailed description thereof is omitted.

32 and 33 are a plan view and a vertical cross-sectional view, respectively, showing the transfer member 20. FIG. FIG. 33 shows a cross section of the transfer member 20 shown in FIG. 32 along line IX-IX. FIG. 34 is a view corresponding to FIG. 28A and a vertical cross-sectional view of the light-emitting diode chip 50 used in the transfer member 20 shown in FIGS. 32 and 33. FIG. 35 and 36 are plan and longitudinal sectional views, respectively, of a holding member 30 used to fabricate the transfer member 20 shown in FIGS. 32 and 33. FIG. FIG. 36 shows a cross section of the holding member 30 shown in FIG. 35 along line XX. FIG. 37 is a diagram showing a state in which the light emitting diode chip 50 shown in FIG. 34 has fallen into the hole 33 that does not correspond.

As shown in FIGS. 32 and 33, the transfer member 20 includes a holding member 30 having a holding surface 31 in which a plurality of holes 33 are regularly arranged two-dimensionally, and a storage space for the plurality of holes 33 of the holding member 30. and a plurality of light emitting diode chips 50 housed therein. The multiple holes 33 include first to third holes 33B, 33G, and 33R, and the multiple light emitting diode chips 50 include first to third light emitting diode chips 50B, 50G, and 50R.

As shown in FIG. 35, the first to third holes 33B, 33G, 33R of the holding member 30 have the same opening size. On the other hand, as shown in FIG. 36, the angles θa of the inclined surfaces 36a with respect to the holding surface 31 are different from each other.

Similarly, the first to third through holes 41B, 41G, and 41R of the positioning sheet 40 have the same opening shape size on the surface 40a serving as the holding surface 31. As shown in FIG. On the other hand, as shown in FIG. 36, the angles θa of the inclined surfaces 44a with respect to the surface 40a serving as the holding surface 31 are different from each other.

Specifically, the angle θa1 of the inclined surface 36a of the first hole 33B with respect to the holding surface 31 is smaller than the angle θa2 of the inclined surface 36a of the second hole 33G with respect to the holding surface 31 . The angle θa2 of the inclined surface 36a of the second hole 33G with respect to the holding surface 31 is smaller than the angle θa3 of the inclined surface 36a of the third hole 33R with respect to the holding surface 31.

Similarly, the angle θa1 of the inclined surface 44a of the first through hole 41B with respect to the surface 40a serving as the holding surface 31 is smaller than the angle θa2 of the inclined surface 44a of the second through hole 41G with respect to the surface 40a serving as the holding surface 31. . The angle θa2 of the inclined surface 44a of the second through-hole 41G with respect to the surface 40a serving as the holding surface 31 is smaller than the angle θa3 of the inclined surface 44a of the third through-hole 41R with respect to the surface 40a serving as the holding surface 31.

Further, as shown in FIG. 32, the first to third light emitting diode chips 50B, 50G and 50R have the same planar size. On the other hand, as shown in FIGS. 33 and 34, the tip body portion 55 of the virtual plane S abutting on the corner portions 56d, 56e, and 56f of the first to third step portions 56a, 56b, and 56c of the convex portion 56. with respect to the electrode pad 52 side are different from each other.

Specifically, the inclination angle θs1 of the virtual plane S1 of the convex portion 56 of the first light emitting diode chip 50B with respect to the surface on the side of the electrode pad 52 is It is smaller than the inclination angle θs2 with respect to the surface on the electrode pad 52 side. In addition, the inclination angle θs2 of the virtual plane S2 of the convex portion 56 of the second light emitting diode chip 50G with respect to the surface on the side of the electrode pad 52 is the same as that of the electrode pad 52 of the virtual plane S3 of the convex portion 56 of the third light emitting diode chip 50R. smaller than the inclination angle θs3 with respect to the side surface.

Furthermore, the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B is equal to the inclination angle θa1 of the inclined surface 36a1 of the first hole 33B. Also, the inclination angle θs2 of the virtual plane S2 of the projection 56 of the second light emitting diode chip 50G is equal to the inclination angle θa2 of the inclined surface 36a2 of the second hole 33G. Also, the inclination angle θs3 of the virtual plane S3 of the protrusion 56 of the third light emitting diode chip 50R is equal to the inclination angle θa3 of the inclined surface 36a3 of the third hole 33R.

Similarly, the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B is equal to the inclination angle θa1 of the inclined surface 44a1 of the first through hole 41B. Also, the inclination angle θs2 of the virtual plane S2 of the protrusion 56 of the second light emitting diode chip 50G is equal to the inclination angle θa2 of the inclined surface 44a2 of the second through hole 41G. Also, the inclination angle θs3 of the virtual plane S3 of the protrusion 56 of the third light emitting diode chip 50R is equal to the inclination angle θa3 of the inclined surface 44a3 of the third through hole 41R.

The inclination angles θa1, θa2, θa3 of the inclined surface 36a of the first to third holes 33B, 33G, 33R are different from each other. Since the inclination angles θs1, θs2, and θs3 of the virtual planes S1, S2, and S3 of the portion 56 are different, the light-emitting diode chip 50 is accommodated in a hole other than the hole 33 corresponding to the light-emitting diode chip 50. can be prevented. For example, as shown in FIG. 37, when the light-emitting diode chip 50 falls into the hole 33 having the inclined surface 36a with the inclination angle θa smaller than the inclination angle θs of the virtual plane S of the projection 56, the light-emitting diode chip 50 A part of the chip main body part 55 and the convex part 56 protrude from the accommodation space of the hole 33 . Therefore, when the light emitting diode chips 50 are supplied to the holding surface 31 of the holding member 30 and accommodated in the holes 33 of the holding member 30 in the process of manufacturing the transfer member 20, the first to third light emitting diode chips 50B, 50G, 50R Among the light emitting diode chips 50, the light emitting diode chips 50 having the largest inclination angle θs of the virtual plane S of the convex portion 56 are sequentially supplied to the holding surface 31 and accommodated in the holes 33. It is possible to prevent it from being accommodated in a hole other than the hole 33 corresponding to the color of the emitted light. In the illustrated example, first, the third light emitting diode chip 50R is supplied to the holding surface 31 and accommodated in the third hole 33R, and then the second light emitting diode chip 50G is supplied to the holding surface 31 to accommodate the second light emitting diode chip 50R. is accommodated in the hole 33G. Finally, the first light emitting diode chip 50B is supplied to the holding surface 31 and accommodated in the first hole 33B. This prevents the second light emitting diode chip 50G from being accommodated in the third hole 33R and the first light emitting diode chip 50B from being accommodated in the second and third holes 33G and 33R.

Similarly, the inclination angles θa1, θa2, θa3 of the inclined surfaces 44a of the first to third through holes 41B, 41G, 41R are different from each other, and correspondingly, the first to third light emitting diode chips 50B, 50G , 50R of the projections 56 have different inclination angles θs1, θs2, θs3 of the virtual planes S1, S2, S3. can be prevented from being housed in For example, as shown in FIG. 37, when the light emitting diode chip 50 falls into the through hole 44 having the inclined surface 44a with the inclination angle θa smaller than the inclination angle θs of the imaginary plane S of the projection 56, the light emitting diode chip 50 A part of the chip body portion 55 and the convex portion 56 of 1 protrude from the accommodation space of the through hole 41 . Therefore, when the light-emitting diode chips 50 are supplied to the surface 40a of the positioning sheet 40 to be the holding surface 31 in the process of manufacturing the transfer member 20 and housed in the through-holes 41 of the positioning sheet 40, the first to third light-emitting diode chips Among 50B, 50G, and 50R, the light-emitting diode chips 50 having the largest inclination angle θs of the virtual plane S of the convex portion 56 are sequentially supplied to the surface 40a serving as the holding surface 31 and housed in the through hole 41. It is possible to prevent the chip 50 from being accommodated in a through hole other than the through hole 41 corresponding to the color of the light emitted by the light emitting diode chip 50 . In the illustrated example, first, the third light emitting diode chip 50R is supplied to the surface 40a serving as the holding surface 31 and accommodated in the third through hole 41R, and then the second light emitting diode chip 50G is placed on the holding surface 31. It is supplied to the other surface 40a and accommodated in the second through hole 41G. Finally, the first light-emitting diode chip 50B is supplied to the surface 40a serving as the holding surface 31 and accommodated in the first through hole 41B. This prevents the second light emitting diode chip 50G from being accommodated in the third through hole 41R and the first light emitting diode chip 50B from being accommodated in the second and third through holes 41G and 41R.

<Modification 5>
Next, other modifications of the transfer member 20, the holding member 30, and the positioning sheet 40 in the fourth modification will be described with reference to FIGS. 38 to 42. FIG. 38 to 42, in comparison with the fourth modification shown in FIGS. 32 to 38C, each hole 33 of the holding member 30 and each through hole 41 of the positioning sheet 40 form a rotationally symmetric accommodation space. Correspondingly, the chip body portion 55 or the convex portion 56 of each light emitting diode chip 50 has a rotationally symmetrical shape. Other configurations are substantially the same as Modification 4 shown in FIGS. 32 to 38C. In modification 5 shown in FIGS. 38 to 42, the same reference numerals are given to the same parts as in modification 4 shown in FIGS.

38 and 39 correspond to FIGS. 25 and 33, respectively, and are vertical cross-sectional views showing the light emitting substrate 10 and the transfer member 20 according to Modification 5. FIG. FIG. 40 corresponds to FIG. 34 and is a longitudinal sectional view showing the light-emitting diode chip 50 shown in FIGS. 38 and 39. As shown in FIG. 41 is a plan view corresponding to FIG. 35 and showing a holding member 30 used for manufacturing the transfer member 20 shown in FIG. 42 is a diagram corresponding to FIG. 37, showing a state in which the light-emitting diode chip 50 shown in FIG.

As shown in FIGS. 39 and 41, the light-emitting diode chip 50 housed in the housing space formed by the hole 33 of the holding member 30 and the through hole 41 of the positioning sheet 40 has a rotationally symmetrical chip body 55. example is a cuboid. Further, the convex portion 56 of the light emitting diode chip 50 is formed rotationally symmetrical. In the illustrated example, as shown in FIG. 40, the chip body portion 55 and the convex portion 56 have two-fold symmetry in cross section perpendicular to the direction q1 in which the electrode pads 52 of the chip body portion 55 extend.

More specifically, the convex portion 56 has a stepped shape, and the shape of the cross section perpendicular to the thickness direction t1 of the chip body portion 55 is the top portion of the convex portion 56 in the thickness direction t1 of the chip body portion 55. is getting smaller towards More specifically, the convex portion 56 has a first stepped portion 56a protruding from the chip body portion 55 and a second stepped portion 56b protruding from the center of the first stepped portion 56a. The planar shape of the second stepped portion 56b is smaller than the planar shape of the first stepped portion 56a. In addition, the second stepped portion 56b includes a surface that forms the top of the convex portion 56.

Further, in the examples shown in FIGS. 38 and 39, the sizes of the planar shapes of the tops of the projections 56 of the first to third light emitting diode chips 50B, 50G, and 50R are different from each other. Specifically, the planar shape of the top of the convex portion 56 of the second light emitting diode chip 50G is smaller than the planar shape of the top of the convex portion 56 of the first light emitting diode chip 50B. In addition, the planar shape of the top of the convex portion 56 of the third light emitting diode chip 50R is smaller than the planar shape of the top of the convex portion 56 of the second light emitting diode chip 50G.

Further, as shown in FIG. 39, the first to third light-emitting diode chips 50B, 50G, 50R are placed on a virtual plane S abutting on the corners 56d, 56e of the first to second stepped portions 56a, 56b of the convex portion 56. , the angle θs with respect to the surface of the chip main body 55 on the side of the electrode pad 52 is different from each other.

Specifically, the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B with respect to the surface of the electrode pad 52 side is It is larger than the tilt angle θs2. Further, the inclination angle θs2 of the virtual plane S2 of the second light emitting diode chip 50G with respect to the electrode pad 52 side surface is greater than the inclination angle θs3 of the virtual plane S3 of the third light emitting diode chip 50R with respect to the electrode pad 52 side surface. is also big.

As shown in FIG. 41, the opening shape of the hole 33 of the holding member 30 is rotationally symmetrical. Further, as can be understood from FIGS. 39 and 41, the hole 33 of the holding member 30 has a rotationally symmetric cross-sectional shape along the depth direction s1. In the illustrated example, the hole 33 of the holding member 30 has two-fold symmetry in any cross-sectional shape along the depth direction s1. Also, in the illustrated example, the shape of each hole 33 in a cross section perpendicular to the depth direction s1 decreases toward the bottom 34 in the depth direction s1. Corresponding to this, the opening shape of the through hole 41 of the positioning sheet 40 is rotationally symmetrical. Further, the through hole 41 of the positioning sheet 40 has a rotationally symmetric cross-sectional shape along the depth direction s1. In the illustrated example, the through hole 41 of the positioning sheet 40 has two-fold symmetry in the shape of an arbitrary cross section along the depth direction s1. In addition, in the illustrated example, the shape of each through-hole 41 in a cross section orthogonal to the depth direction s1 decreases toward the adhesive layer 45 side in the depth direction s1.

More specifically, each hole 33 of the holding member 30 has a rectangular opening 35, a rectangular bottom 34, and corresponding sides of the opening 35 and the bottom 34, as shown in FIG. It has four connecting sides 36a-36d. The bottom 34 of each hole 33 is smaller than the opening 35 of the hole 33 and is located in the center of the opening 35 when viewed in the direction from the holding surface 31 side to the back surface 32 side. Correspondingly, among the four side surfaces 36a to 36d, the side surface 36a connecting one side of the opening 35 of the hole 33 in the first direction e1 of the holding member 30 and one side of the bottom 34 , and a side surface 36b facing the side surface 36a are inclined surfaces that are inclined with respect to the holding surface 31 of the holding member 30. As shown in FIG.

Similarly, each through-hole 41 of the positioning sheet 40 has, as shown in FIG. 43 and four side surfaces 44 a to 44 d connecting each side of the first opening 42 and the corresponding side of the second opening 43 . The second opening 43 of each through-hole 41 is smaller than the first opening 42 of the through-hole 41, and is the first opening when viewed in a direction perpendicular to the surface 40a of the positioning sheet 40 on the holding surface 31 side. It is located in the center of the portion 42 . Correspondingly, one side of the first opening 42 of the through-hole 41 in the first direction e1 of the positioning sheet 40 and one side of the second opening 43 of the four side surfaces 44a to 44d and a side surface 44b facing the side surface 44a form an inclined surface that is inclined with respect to the surface 40a serving as the holding surface 31 of the positioning sheet 40. As shown in FIG.

Furthermore, the inclination angle θa1 of the inclined surfaces 36a1 and 36b1 of the first hole 33B is equal to the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B. Also, the inclination angle θa2 of the inclined surfaces 36a2 and 36b2 of the second hole 33G is equal to the inclination angle θs2 of the virtual plane S2 of the second light emitting diode chip 50G. Also, the inclination angle θa3 of the inclined surfaces 36a3 and 36b3 of the third hole 33R is equal to the inclination angle θs3 of the virtual plane S3 of the third light emitting diode chip 50R. That is, the inclination angles θa1, θa2, θa3 of the inclined surfaces 36a, 36b of the first to third holes 33B, 33G, 33R are different from each other. The inclination angle θa1 of the inclined surfaces 36a1 and 36b1 of the first hole 33B with respect to the holding surface 31 is greater than the inclination angle θa2 of the inclined surfaces 36a2 and 36b2 of the second hole 33G with respect to the holding surface 31. The inclination angle θa2 of the inclined surfaces 36a2 and 36b2 of the second hole 33G with respect to the holding surface 31 is larger than the inclination angle θa3 of the inclined surfaces 36a3 and 36b3 of the third hole 33R with respect to the holding surface 31. Furthermore, the shape of the bottom 34 of the first hole 33B is larger than the shape of the bottom 34 of the second hole 33G. Also, the shape of the bottom portion 34 of the second hole 33G is larger than the shape of the bottom portion 34 of the third hole 33R.

Similarly, the inclination angle θa1 of the inclined surfaces 44a1 and 44b1 of the first through hole 41B is equal to the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B. Also, the inclination angle θa2 of the inclined surfaces 44a2 and 44b2 of the second through hole 41G is equal to the inclination angle θs2 of the virtual plane S2 of the second light emitting diode chip 50G. Also, the inclination angle θa3 of the inclined surfaces 44a3 and 44b3 of the third through hole 41R is equal to the inclination angle θs3 of the virtual plane S3 of the third light emitting diode chip 50R. That is, the inclination angles θa1, θa2, θa3 of the inclined surfaces 44a, 44b of the first to third through holes 41B, 41G, 41R are different from each other. The inclination angle θa1 of the inclined surfaces 44a1 and 44b1 of the first through hole 41B with respect to the surface 40a on the holding surface 31 side is the inclination angle θa2 of the inclined surfaces 44a2 and 44b2 of the second through hole 41G with respect to the surface 40a. bigger than In addition, the inclination angle θa2 of the inclined surfaces 44a2 and 44b2 of the second through hole 41G with respect to the surface 40a on the side of the holding surface 31 is bigger than Furthermore, the shape of the second opening 43 of the first through hole 41B is larger than the shape of the second opening 43 of the second through hole 41G. Also, the shape of the second opening 43 of the second through hole 41G is larger than the shape of the second opening 43 of the third through hole 41R.

The inclination angles θa1, θa2, θa3 of the inclined surfaces 36a, 36b of the first to third holes 33B, 33G, 33R are different from each other. The inclination angles θs1, θs2, and θs3 of the virtual planes S1, S2, and S3 are different from each other, thereby preventing the light-emitting diode chip 50 from being accommodated in a hole other than the hole 33 corresponding to the light-emitting diode chip 50. be able to. For example, as shown in FIG. 42, when the light-emitting diode chip 50 falls into the hole 33 having the inclined surfaces 36a and 36b with the inclination angle θa smaller than the inclination angle θs of the virtual plane S, the chip body of the light-emitting diode chip 50 Part of the portion 55 and the protrusion 56 protrude from the accommodation space of the hole 33 . Therefore, when the light emitting diode chips 50 are supplied to the holding surface 31 of the holding member 30 and housed in the holes 33 of the holding member 30 in the process of manufacturing the transfer member 20, the first to third light emitting diode chips 50B, 50G, 50R Among them, the light-emitting diode chips 50 having the largest inclination angle θs of the virtual plane S are sequentially supplied to the holding surface 31 and accommodated in the holes 33 , so that the light-emitting diode chips 50 emit light from the light-emitting diode chips 50 . It is possible to prevent it from being accommodated in a hole other than the hole 33 corresponding to the color. In the illustrated example, first, the first light emitting diode chip 50B is supplied to the holding surface 31 and accommodated in the first hole 33B, and then the second light emitting diode chip 50G is supplied to the holding surface 31 to accommodate the second light emitting diode chip 50B. is accommodated in the hole 33G. Finally, the third light emitting diode chip 50R is supplied to the holding surface 31 and accommodated in the third hole 33R. This prevents the second light emitting diode chip 50G from being accommodated in the first hole 33B and the third light emitting diode chip 50R from being accommodated in the first and second holes 33B and 33G.

Alternatively, the sizes of the bottom portions 34 of the first to third holes 33B, 33G, and 33R are different from each other, and correspondingly, the top portions of the convex portions 56 of the first to third light emitting diode chips 50B, 50G, and 50R are different. Since the sizes are different from each other, it is possible to prevent the light-emitting diode chip 50 from being accommodated in a hole other than the hole 33 corresponding to the light-emitting diode chip 50 . For example, as shown in FIG. 42, when the light emitting diode chip 50 falls into the hole 33 having the bottom portion 34 smaller than the planar size of the top portion of the projection 56, the chip body portion 55 of the light emitting diode chip 50 and the A part of the projection 56 protrudes from the accommodation space of the hole 33 . Therefore, when the light emitting diode chips 50 are supplied to the holding surface 31 of the holding member 30 and housed in the holes 33 of the holding member 30 in the process of manufacturing the transfer member 20, the first to third light emitting diode chips 50B, 50G, 50R By supplying the light emitting diode chips 50 to the holding surface 31 in order from the light emitting diode chip 50 having the largest planar shape of the top of the convex portion 56 and accommodating the light emitting diode chip 50 in the hole 33, the light emitting diode chip 50 emits light. Therefore, it can be prevented from being accommodated in a hole other than the hole 33 corresponding to the color of the . In the illustrated example, first, the first light emitting diode chip 50B is supplied to the holding surface 31 and accommodated in the first hole 33B, and then the second light emitting diode chip 50G is supplied to the holding surface 31 to accommodate the second light emitting diode chip 50B. is accommodated in the hole 33G. Finally, the third light emitting diode chip 50R is supplied to the holding surface 31 and accommodated in the third hole 33R. This prevents the second light emitting diode chip 50G from being accommodated in the first hole 33B and the third light emitting diode chip 50R from being accommodated in the first and second holes 33B and 33G.

Also, the inclination angles θa1, θa2, θa3 of the inclined surfaces 44a, 44b of the first to third through holes 41B, 41G, 41R are different from each other. Since the inclination angles θs1, θs2, and θs3 of the virtual planes S1, S2, and S3 of 50G and 50R are different, the light-emitting diode chip 50 is accommodated in the through-hole other than the through-hole 41 corresponding to the light-emitting diode chip 50. can be prevented. For example, as shown in FIG. 42, when the light-emitting diode chip 50 falls into the through hole 41 having the inclined surface 36a with the inclination angle θa smaller than the inclination angle θs of the virtual plane S, the chip main body of the light-emitting diode chip 50 55 and a part of the protrusion 56 protrude from the accommodation space of the through hole 41 . Therefore, when the light-emitting diode chips 50 are supplied to the holding surface 31 side surface 40a of the positioning sheet 40 in the process of manufacturing the transfer member 20 and accommodated in the through-holes 41 of the positioning sheet 40, the first to third light emission Among the diode chips 50B, 50G, and 50R, the light-emitting diode chips 50 having the largest inclination angle θs of the virtual plane S are sequentially supplied to the surface 40a on the side of the holding surface 31 and accommodated in the through hole 41, whereby the light-emitting diode chips 50B, 50G, and 50R It is possible to prevent the chip 50 from being accommodated in a through hole other than the through hole 41 corresponding to the color of the light emitted by the light emitting diode chip 50 . In the illustrated example, first, the first light emitting diode chip 50B is supplied to the surface 40a on the side of the holding surface 31 and accommodated in the first through hole 41B, and then the second light emitting diode chip 50G is placed on the surface. 40a and accommodated in the second through hole 41G. Finally, the third light emitting diode chip 50R is supplied to the surface 40a on the side of the holding surface 31 and accommodated in the third through hole 41R. This prevents the second light emitting diode chip 50G from being accommodated in the first through hole 41B and the third light emitting diode chip 50R from being accommodated in the first and second through holes 41B and 41G.

Alternatively, the sizes of the opening shapes of the second openings 43 of the first to third through holes 41B, 41G, and 41R of the positioning sheet 40 are different from each other, and correspondingly, the first to third light emitting diode chips Since the sizes of the top portions of the projections 50B, 50G, and 50R are different from each other, the light-emitting diode chip 50 is prevented from being accommodated in a through-hole other than the through-hole 41 corresponding to the light-emitting diode chip 50. can do. For example, as shown in FIG. 42, the light-emitting diode chip 50 has the second opening 43 among the first to third through holes 41B, 41G, and 41R whose opening shape is the top of the projection 56 of the light-emitting diode chip 50. When the light-emitting diode chip 50 falls into the through-hole 41 smaller than the size of the planar shape of the light-emitting diode chip 50 , part of the chip main body 55 and the projection 56 protrude from the accommodation space of the through-hole 41 . Therefore, when the light-emitting diode chips 50 are supplied to the surface 40a of the positioning sheet 40 to be the holding surface 31 in the process of manufacturing the transfer member 20 and housed in the through-holes 41 of the positioning sheet 40, the first to third light-emitting diode chips Among 50B, 50G, and 50R, the light emitting diode chip 50 having the largest planar shape of the top of the convex portion 56 is supplied to the surface 40a serving as the holding surface 31 and housed in the through hole 41, whereby the light emitting diode chip 50 is , it is possible to prevent the light-emitting diode chip 50 from being accommodated in a through-hole other than the through-hole 41 corresponding to the color of the light emitted. In the illustrated example, first, the first light-emitting diode chip 50B is supplied to the surface 40a that becomes the holding surface 31 and accommodated in the first through hole 41B, and then the second light-emitting diode chip 50G is placed on the surface 40a. It is supplied and accommodated in the second through hole 41G. Finally, the third light-emitting diode chip 50R is supplied to the surface 40a serving as the holding surface 31 and accommodated in the third through hole 41R. This prevents the second light emitting diode chip 50G from being accommodated in the first through hole 41B and the third light emitting diode chip 50R from being accommodated in the first and second through holes 41B and 41G.

As described above, according to the light emitting diode chip 50, the holding member 30 and the positioning sheet 40, the light emitting diode chips 50 can be efficiently accommodated in the corresponding holes 33 or through holes 41 with their front and back sides aligned. can be done. Therefore, using a parts feeder 65 or the like shown in FIG. 20, the light-emitting diode chips 50 are fed onto the holding surface 31 of the holding member 30 or onto the surface 40a of the positioning sheet 40, which will be the holding surface 31, in a state in which the directions are aligned. Then, the two types of light-emitting diode chips 50 emitting light of different colors can be efficiently and appropriately accommodated in the corresponding holes 33 or through-holes 41 with their front and back surfaces aligned and their orientations aligned.

As described above, the holding member 30 according to Modification 5 has a holding surface 31 in which a plurality of holes 33 are two-dimensionally arranged, each forming a housing space for housing at least a portion of one light-emitting diode chip 50. . The shape of each hole 33 in a cross section perpendicular to the depth direction s1 becomes smaller toward the bottom 34 in the depth direction s1. With such a holding member 30, the front and back surfaces of the light-emitting diode chips 50 can be efficiently aligned. Also, it is easy to remove the light-emitting diode chip 50 from the hole 33 of the holding member 30 .

Further, in the holding member 30 according to Modification 5, the side surfaces 36a to 36e that define each hole 33 include inclined surfaces 36a and 36b that are inclined with respect to the holding surface 31. As shown in FIG. Further, the plurality of holes 33 includes a plurality of first holes 33B forming accommodation spaces of the same shape, and a plurality of second holes 33G forming accommodation spaces of the same shape. The inclination angle θa1 of the inclined surfaces 36a and 36b of the first hole 33B with respect to the holding surface 31 is larger than the inclination angle θa2 of the inclined surfaces 36a and 36b of the second hole 33G with respect to the holding surface 31. Therefore, if the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B to be accommodated in the first hole 33B is made larger than the inclination angle θa2 of the inclined surfaces 36a and 36b of the second hole 33G, It is possible to prevent the first light emitting diode chip 50B from being accommodated in the second hole 33G. If the first light emitting diode chip 50B is accommodated in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first hole 33B. That is, the holding member 30 can efficiently accommodate, for example, two types of light-emitting diode chips 50 emitting light of different colors in the corresponding holes 33 and hold them in an appropriately arranged state. Then, the held two types of light-emitting diode chips 50 can be collectively arranged at respective appropriate positions on the circuit board 11 .

Alternatively, in the holding member 30 according to Modified Example 5, the plurality of holes 33 are composed of a plurality of first holes 33B forming accommodation spaces of the same shape, and a plurality of second holes 33B forming accommodation spaces of the same shape. 33G, and the shape of the bottom 34 of the first hole 33B is larger than the shape of the bottom 34 of the second hole 33G. Therefore, the planar shape of the top of the first light emitting diode chip 50B to be housed in the first hole 33B, which is located on the side opposite to the surface on which the electrodes 52 are provided, is determined from the shape of the bottom 34 of the second hole 33G. By increasing the size of the first light emitting diode chip 50B, it is possible to prevent the first light emitting diode chip 50B from being accommodated in the second hole 33G. If the first light emitting diode chip 50B is accommodated in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first hole 33B. That is, the holding member 30 can efficiently accommodate, for example, two types of light-emitting diode chips 50 emitting light of different colors in the corresponding holes 33 and hold them in an appropriately arranged state. Then, the held two types of light-emitting diode chips 50 can be collectively arranged at respective appropriate positions on the circuit board 11 .

Further, the positioning sheet 40 of Modification 5 includes a metal sheet in which a plurality of through holes 41 each forming an accommodation space for accommodating at least a portion of one light emitting diode chip 50 are arranged two-dimensionally. The shape of each through-hole 41 in a cross section perpendicular to the depth direction s1 becomes smaller toward one side in the depth direction s1. As a result, the front and back surfaces of the light-emitting diode chips 50 can be efficiently aligned. It is easy to remove the light emitting diode chip 50 from the through hole 41 of the positioning sheet 40 .

Further, in the positioning sheet 40 of Modification 5, the side surfaces 44a to 44d defining each through hole 41 include inclined surfaces 44a and 44b inclined with respect to one surface of the metal sheet. In addition, the plurality of through holes 41 includes a plurality of first through holes 41B that form accommodation spaces of the same shape, and a plurality of second through holes 41G that form accommodation spaces of the same shape, The inclination angle θa1 of the inclined surfaces 44a and 44b of the first through-hole 41B with respect to the one surface 40a is larger than the inclination angle θa2 of the inclined surfaces 44a and 44b of the second through-hole 41G with respect to the one surface 40a. Therefore, if the inclination angle θs1 of the virtual plane S1 of the first light emitting diode chip 50B to be accommodated in the first through hole 41B is larger than the inclination angle θa2 of the inclined surfaces 44a and 44b of the second through hole 41G, Thus, it is possible to prevent the first light emitting diode chip 50B from being accommodated in the second through hole 41G. If the first light emitting diode chip 50B is accommodated in the first through hole 41B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first through hole 41B. That is, for example, two types of light-emitting diode chips 50 emitting light of different colors can be accommodated in the corresponding through holes 41 and arranged.

In addition, in the positioning sheet 40 of Modified Example 5, the plurality of through holes 41 includes a plurality of first through holes 41B forming accommodation spaces having the same shape, and a plurality of second through holes 41B forming accommodation spaces having the same shape. and a through hole 41G. On one side of the metal sheet in the depth direction s1, the opening shape of the first through-hole 41B is larger than the opening shape of the second through-hole 41G. Therefore, the planar shape of the top of the first light emitting diode chip 50B to be housed in the first through hole 41B, which is located on the side opposite to the surface on which the electrode 52 is provided, is the same as that of the second through hole 41G on the one side. , it is possible to prevent the first light emitting diode chip 50B from being accommodated in the second through hole 41G. If the first light emitting diode chip 50B is accommodated in the first through hole 41B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first through hole 41B. That is, for example, two types of light-emitting diode chips 50 emitting light of different colors can be accommodated in the corresponding through holes 41 and arranged.

Further, the transfer member 20 with the positioned light-emitting diode chips of Modification 5 is accommodated in the holding member 30 having the holding surface 31 in which a plurality of holes 33 are arranged two-dimensionally, and the accommodation space formed by each hole 33. and a plurality of light-emitting diode chips 50 . The shape of each hole 33 in a cross section orthogonal to the depth direction s1 becomes smaller toward the bottom 34 in the depth direction s1. Such a transfer member 20 can be manufactured by efficiently aligning the front and back surfaces of the light emitting diode chips 50 . Also, it is easy to remove the light-emitting diode chip 50 from the hole 33 .

Further, in the transfer member 20 with positioned light-emitting diode chips of Modification 5, the side surfaces 36a to 36e defining each hole 33 include inclined surfaces 36a and 36b that are inclined with respect to the holding surface 31. FIG. In addition, the plurality of holes 33 includes a plurality of first holes 33B forming accommodation spaces of the same shape, and a plurality of second holes 33G forming accommodation spaces of the same shape. The inclination angle θa1 of the inclined surfaces 36a and 36b of the first hole 33B with respect to the holding surface 31 is larger than the inclination angle θa2 of the inclined surfaces 36a and 36b of the second hole 33G with respect to the holding surface 31. The plurality of first holes 33B form accommodation spaces having the same shape, so that the first light emitting diode chip 50B can be accommodated in any one of the first holes 33B. In addition, since the plurality of second holes 33G form accommodation spaces having the same shape, the second light emitting diode chip 50G can be accommodated in any second hole 33G. That is, the first light emitting diode chip 50B and the second light emitting diode chip 50G do not have to be accommodated in a specific one of the plurality of first holes 33B or the plurality of second holes 33G. This leads to improved productivity of the transfer member 20 . In addition, since the inclination angle θa1 of the inclined surfaces 36a and 36b of the first hole 33B is larger than the inclination angle θa2 of the inclined surfaces 36a and 36b of the second hole 33G, it should be accommodated in the first hole 33B. If the inclination angle θs1 of the virtual plane S1 of the first light-emitting diode chip 50B is made larger than the inclination angle θa2 of the inclined surfaces 36a and 36b of the second hole 33G, the first light-emitting diode chip 50B becomes the second hole. 33G can be prevented. If the first light emitting diode chip 50B is first received in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being received in the first hole 33B. That is, the transfer member 20 can efficiently and appropriately arrange and hold, for example, two types of light-emitting diode chips 50 emitting light of different colors. Then, the held two types of light-emitting diode chips 50 can be collectively arranged on the circuit board 11 in an appropriate arrangement.

In addition, in the transfer member 20 with positioned light-emitting diode chips according to the modified example 5, the plurality of holes 33 form the same shaped accommodating spaces as the plurality of first holes 33B forming the same shaped accommodating spaces. and a plurality of second holes 33G. The shape of the bottom portion 34 of the first hole 33B is larger than the shape of the bottom portion 34 of the second hole 33G. The plurality of first holes 33B form accommodation spaces having the same shape, so that the first light emitting diode chip 50B can be accommodated in any one of the first holes 33B. In addition, since the plurality of second holes 33G form accommodation spaces having the same shape, the second light emitting diode chip 50G can be accommodated in any second hole 33G. That is, the first light emitting diode chip 50B and the second light emitting diode chip 50G do not have to be accommodated in a specific one of the plurality of first holes 33B or the plurality of second holes 33G. This leads to improved productivity of the transfer member 20 . Also, since the shape of the bottom portion 34 of the first hole 33B is larger than the shape of the bottom portion 34 of the second hole 33G, the electrode 52 of the first light emitting diode chip 50B to be accommodated in the first hole 33B is provided. By making the planar shape of the top located on the opposite side to the surface of the second hole 33G larger than the shape of the bottom 34 of the second hole 33G, it is possible to prevent the first light emitting diode chip 50B from being accommodated in the second hole 33G. can do. If the first light emitting diode chip 50B is first received in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being received in the first hole 33B. That is, the transfer member 20 can efficiently and appropriately arrange and hold, for example, two types of light-emitting diode chips 50 emitting light of different colors. Then, the held two types of light-emitting diode chips 50 can be collectively arranged on the circuit board 11 in an appropriate arrangement.

Further, in the light-emitting substrate 10 of Modification 5, the plurality of light-emitting diode chips 50 includes a first light-emitting diode chip 50B having convex portions 56 of the same shape and a second light-emitting diode chip 50B having convex portions 56 of the same shape. 50G, and the planar shape of the top of the convex portion 56 of the first light emitting diode chip 50B is larger than the planar shape of the top of the convex portion 56 of the second light emitting diode chip 50G. According to such a light-emitting substrate 10, when manufacturing the light-emitting substrate 10, the front and back surfaces of the plurality of light-emitting diode chips 50 can be aligned and arranged on the circuit substrate 11 efficiently. The first light emitting diode chips 50B and the second light emitting diode chips 50G can be arranged efficiently and appropriately. Also, the adhesion between the light emitting diode chip 50 and the material on the circuit board 11, for example, the coating layer 8 is improved.

Further, in the manufacturing method of the transfer member 20 with positioned light-emitting diode chips according to Modification 5, the plurality of first light-emitting diode chips 50B out of the plurality of light-emitting diode chips 50 are supplied onto the holding surface 31 of the holding member 30. a step of moving the plurality of first light emitting diode chips 50B on the holding surface 31 to guide each first light emitting diode chip 50B into the accommodation space of one first hole 33B; a step of supplying a plurality of second light emitting diode chips 50G out of the plurality of light emitting diode chips 50 onto the holding surface 31; and a step of guiding the diode chip 50G into the accommodation space of one second hole 33G. The first light emitting diode chip 50B can be accommodated in the first hole 33B. The planar shape of the top of the second light emitting diode chip 50G, which is larger than the shape of the bottom 34 of the hole 33G in No. 2 and located on the side opposite to the surface on which the electrodes 52 of the second light emitting diode chip 50G are provided, is the planar shape of the top of the first light emitting diode chip 50B. Smaller than the shape, the second light emitting diode chip 50G can be accommodated in the second hole 33G.

According to the manufacturing method of the transfer member 20 with the positioned light-emitting diode chips, it is possible to prevent the first light-emitting diode chips 50B from being accommodated in the second holes 33G. If the first light emitting diode chip 50B is first accommodated in the first hole 33B, it is possible to prevent the second light emitting diode chip 50G from being accommodated in the first hole 33B. That is, two types of light-emitting diode chips 50 emitting light of different colors can be efficiently accommodated in the corresponding holes 33, and the productivity of the transfer member 20 is improved.

Note that the above-described light-emitting substrate 10 may be used, for example, in a lighting device other than the display device 1 . Further, the light-emitting substrate 10 and the transfer member 20 may include only one or two of the first to third light-emitting diode chips 50R, 50G, and 50B.

1 display device 5 display surface 7 diffusion layer 10 light emitting substrate 11 circuit substrate 12 anisotropic conductive adhesive layer 13 circuit 20 transfer member 30 holding member 31 holding surface 33 hole 40 positioning sheet 41 through hole 45 adhesive layer 50 light emitting diode chip 50R First light-emitting diode chip 50G Second light-emitting diode chip 50B Third light-emitting diode chip 52 Electrode pad 56 Projection R1 First region R2 Second region R3 Third regions M1, M2 Positioning marks

Claims (65)

a holding surface in which a plurality of holes each accommodating at least a portion of one light-emitting diode chip are arranged in a two-dimensional array;
Each hole forms a rotationally asymmetric accommodation space ,
The holding member , wherein the shape of each hole in a cross section orthogonal to the depth direction is constant in the depth direction . The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The holding member according to claim 1 , wherein the opening shape of the first hole is larger than the opening shape of the second hole. 3. The holding member according to claim 2 , wherein the plurality of first holes are regularly arranged two-dimensionally, and the plurality of second holes are regularly arranged two-dimensionally. a holding surface in which a plurality of holes each accommodating at least a portion of one light-emitting diode chip are arranged in a two-dimensional array;
Each hole forms a rotationally asymmetric accommodation space,
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The holding member, wherein the opening shape of the first hole is larger than the opening shape of the second hole. 5. The holding member according to claim 4, wherein the plurality of first holes are regularly arranged two-dimensionally and the plurality of second holes are regularly arranged two-dimensionally. 6. The holding member according to claim 4 , wherein the shape of each hole in a cross section perpendicular to the depth direction decreases toward the bottom in the depth direction. Retaining member according to any one of the preceding claims, wherein each hole is adhesive at the bottom. a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
The holding member according to any one of claims 1 to 7 , further comprising an adhesive layer having adhesiveness, the adhesive layer being laminated with the positioning sheet and covering the through hole from one side. 9. The holding member according to claim 8 , wherein said positioning sheet is made of metal having a coefficient of linear expansion of 30×10 ⁻⁵ /K or less. 10. The holding member according to any one of claims 7 to 9 , wherein said adhesiveness is reduced by heating, cooling or ultraviolet irradiation. a holding surface in which a plurality of holes each accommodating at least a portion of one light-emitting diode chip are arranged in a two-dimensional array;
Each hole forms a rotationally asymmetric accommodation space,
a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
A holding member comprising an adhesive layer having adhesiveness, wherein the adhesive layer is laminated with the positioning sheet and closes the through hole from one side. The positioning sheet is 30×10 ^-5 12. The holding member according to claim 11, which is made of a metal having a coefficient of linear expansion of /K or less. 13. The holding member according to claim 11 or 12 , wherein said adhesiveness is reduced by heating, cooling or ultraviolet irradiation. 14. The holding member according to any one of claims 11 to 13, wherein the shape of each hole in a cross section orthogonal to the depth direction decreases toward the bottom in the depth direction. The holding member according to any one of claims 1 to 14 , wherein the plurality of holes are arranged regularly. a holding surface in which a plurality of holes each forming an accommodation space for accommodating at least a portion of one light-emitting diode chip are arranged two-dimensionally;
The shape of each hole in a cross section orthogonal to the depth direction decreases toward the bottom in the depth direction,
a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
A holding member comprising an adhesive layer having adhesiveness, wherein the adhesive layer is laminated with the positioning sheet and closes the through hole from one side. The positioning sheet is 30×10 ^-5 17. The holding member according to claim 16, made of a metal having a coefficient of linear expansion of /K or less. 15. The holding member according to claim 13 or 14, wherein said adhesiveness is reduced by heating, cooling or ultraviolet irradiation. The holding member according to any one of claims 16 to 18 , wherein the plurality of holes are arranged regularly. a side surface defining each hole includes an inclined surface that is inclined with respect to the retaining surface;
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The inclination angle of the inclined surface of the first hole with respect to the holding surface is larger than the inclination angle of the inclined surface of the second hole with respect to the holding surface, according to any one of claims 16 to 19. holding member. The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The retaining member according to any one of claims 16 to 20 , wherein the shape of the bottom of the first hole is larger than the shape of the bottom of the second hole. The holding member according to claim 20 or 21 , wherein the plurality of first holes are regularly arranged two-dimensionally and the plurality of second holes are regularly arranged two-dimensionally. a metal sheet having a two-dimensional array of through-holes each accommodating at least a portion of one light-emitting diode chip;
A positioning sheet in which each through-hole forms a rotationally asymmetric accommodation space. 24. The positioning sheet according to claim 23 , wherein the shape of each through-hole in a cross section perpendicular to the depth direction is constant in the depth direction. 24. The positioning sheet according to claim 23 , wherein the shape of each through-hole in a cross section perpendicular to the depth direction becomes smaller toward one side in the depth direction. The positioning sheet according to any one of claims 23 to 25 , wherein said plurality of through holes are arranged regularly. The plurality of through-holes includes a plurality of first through-holes forming accommodation spaces of the same shape, and a plurality of second through-holes forming accommodation spaces of the same shape,
The positioning sheet according to any one of claims 23 to 26 , wherein the opening shape of said first through-hole is larger than the opening shape of said second through-hole. 28. The positioning sheet according to claim 27, wherein said plurality of first through-holes are regularly arranged two-dimensionally, and said plurality of second through-holes are arranged regularly two-dimensionally. A metal sheet having a two-dimensional array of through-holes each forming a housing space for housing at least a portion of one light-emitting diode chip,
The positioning sheet, wherein the shape of each through-hole in a cross section orthogonal to the depth direction decreases toward one side in the depth direction. 30. The positioning sheet according to claim 29 , wherein said plurality of through holes are arranged regularly. A side surface defining each through hole includes an inclined surface that is inclined with respect to one surface of the metal sheet,
The plurality of through-holes includes a plurality of first through-holes forming accommodation spaces of the same shape, and a plurality of second through-holes forming accommodation spaces of the same shape,
The inclination angle of the inclined surface of the first through hole with respect to the one surface is larger than the inclination angle of the inclined surface of the second through hole with respect to the one surface, according to claim 29 or 30. positioning sheet. The plurality of through-holes includes a plurality of first through-holes forming accommodation spaces of the same shape, and a plurality of second through-holes forming accommodation spaces of the same shape,
The opening shape of the first through-hole is larger than the opening shape of the second through-hole on one side of the metal sheet in the depth direction, according to any one of claims 29 to 31 . positioning sheet. 33. The positioning sheet according to claim 31 or 32 , wherein said plurality of first through-holes are regularly two-dimensionally arranged, and said plurality of second through-holes are regularly arranged two-dimensionally. The positioning sheet according to any one of claims 23 to 33 , wherein said metal sheet is made of metal having a linear expansion coefficient of 30 × 10 ^-5 /K or less. a holding member having a holding surface in which a plurality of holes are arranged two-dimensionally;
a plurality of light-emitting diode chips each housed in a rotationally asymmetric housing space formed by each hole ,
A transfer member with positioned light-emitting diode chips , wherein the shape of each hole in a cross section perpendicular to the depth direction is constant in the depth direction . The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
36. The transfer member with positioned light emitting diode chips according to claim 35 , wherein the opening shape of said first hole is larger than the opening shape of said second hole. 37. The transfer member with positioned light-emitting diode chips according to claim 36 , wherein the plurality of first holes are regularly arranged in a two-dimensional array and the plurality of second holes are regularly arranged in a two-dimensional array. a holding member having a holding surface in which a plurality of holes are arranged two-dimensionally;
a plurality of light-emitting diode chips each housed in a rotationally asymmetric housing space formed by each hole,
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The transfer member with positioned light-emitting diode chips , wherein the opening shape of the first hole is larger than the opening shape of the second hole . 39. The transfer member with positioned light emitting diode chips according to claim 38, wherein said plurality of first holes are regularly arranged in a two-dimensional array and said plurality of second holes are arranged in a regular two-dimensional array. 40. The transfer member with positioned light emitting diode chips according to any one of claims 35 to 39 , wherein each hole has adhesive at the bottom. a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
41. The positioned light-emitting diode chip with according to any one of claims 35 to 40 , further comprising an adhesive layer having adhesiveness, wherein the adhesive layer is laminated with the positioning sheet and closes the through-hole from one side. transfer member. 42. The transfer member with positioned light-emitting diode chips according to claim 41 , wherein said positioning sheet is made of metal having a linear expansion coefficient of 30×10 ⁻⁵ /K or less. 43. The transfer member with positioned light emitting diode chips according to any one of claims 40 to 42 , wherein said stickiness is reduced by heating, cooling or UV irradiation. a holding member having a holding surface in which a plurality of holes are arranged two-dimensionally;
a plurality of light-emitting diode chips each housed in a rotationally asymmetric housing space formed by each hole,
a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
A transfer member with positioned light-emitting diode chips, comprising an adhesive layer having adhesiveness, the adhesive layer being laminated with the positioning sheet to close the through-hole from one side. The positioning sheet is 30×10 ^-5 45. The transfer member with positioned light emitting diode chips according to claim 44, made of a metal having a coefficient of linear expansion of /K or less. 46. The transfer member with positioned light emitting diode chips according to claim 44 or 45, wherein the adhesiveness is reduced by heating, cooling or UV irradiation. 47. The transfer member with positioned light-emitting diode chips according to any one of claims 44 to 46, wherein the shape of each hole in a cross section perpendicular to the depth direction is constant in the depth direction. 48. The transfer member with positioned light-emitting diode chips according to any one of claims 38 to 47, wherein the shape of each hole in a cross section orthogonal to the depth direction decreases toward the bottom in the depth direction. 49. The transfer member with positioned light emitting diode chips according to any one of claims 35 to 48 , wherein said plurality of holes are regularly arranged. a holding member having a holding surface in which a plurality of holes are arranged two-dimensionally;
a plurality of light-emitting diode chips respectively housed in housing spaces formed by the holes,
The shape of each hole in a cross section orthogonal to the depth direction decreases toward the bottom in the depth direction,
a metallic positioning sheet in which a plurality of through holes each forming the accommodation space are arranged two-dimensionally;
A transfer member with positioned light-emitting diode chips, comprising an adhesive layer having adhesiveness, the adhesive layer being laminated with the positioning sheet to close the through-hole from one side. The positioning sheet is 30×10 ^-5 51. The transfer member with positioned light-emitting diode chips according to claim 50, made of a metal having a coefficient of linear expansion of /K or less. 52. The transfer member with positioned light emitting diode chips according to claim 50 or 51, wherein said stickiness is reduced by heating, cooling or UV irradiation. The transfer member with positioned light-emitting diode chips according to any one of claims 50 to 52 , wherein the plurality of holes are regularly arranged. a side surface defining each hole includes an inclined surface that is inclined with respect to the retaining surface;
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The inclination angle of the inclined surface of the first hole with respect to the holding surface is greater than the inclination angle of the inclined surface of the second hole with respect to the holding surface. transfer member with positioned light emitting diode chips. The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
55. The transfer member with positioned light emitting diode chips according to any one of claims 50 to 54 , wherein the shape of the bottom of said first holes is larger than the shape of the bottom of said second holes. 56. The transfer member with positioned light-emitting diode chips according to claim 54 or 55 , wherein the plurality of first holes are regularly arranged two-dimensionally and the plurality of second holes are regularly arranged two-dimensionally. . providing a plurality of light-emitting diode chips on the holding surface of the holding member according to any one of claims 1 to 22 ;
moving a plurality of light emitting diode chips on the holding surface and guiding each light emitting diode chip into the accommodating space of one hole. a step of supplying a plurality of first light emitting diode chips out of a plurality of light emitting diode chips onto the holding surface of the holding member according to any one of claims 2 to 6 ;
moving a plurality of first light emitting diode chips on the holding surface to guide each first light emitting diode chip into the accommodating space of one first hole;
supplying a plurality of second light emitting diode chips among the plurality of light emitting diode chips onto the holding surface of the holding member;
moving a plurality of second light emitting diode chips on the holding surface to guide each second light emitting diode chip into the accommodating space of one second hole;
The first light-emitting diode chip can be accommodated in the first hole and has a shape larger than the opening shape of the second hole,
A method of manufacturing a transfer member with positioned light-emitting diode chips, wherein the second light-emitting diode chips are smaller than the first light-emitting diode chips and can be accommodated in the second holes. A holding member having a holding surface in which a plurality of holes each forming an accommodation space for accommodating at least a portion of one light-emitting diode chip are arranged two-dimensionally, the cross-section perpendicular to the depth direction of each hole providing a plurality of first light-emitting diode chips out of the plurality of light-emitting diode chips onto the holding surface of the holding member whose shape decreases toward the bottom in the depth direction ;
moving a plurality of first light emitting diode chips on the holding surface to guide each first light emitting diode chip into the accommodating space of one first hole;
supplying a plurality of second light emitting diode chips among the plurality of light emitting diode chips onto the holding surface of the holding member;
moving a plurality of second light emitting diode chips on the holding surface to guide each second light emitting diode chip into the accommodating space of one second hole;
The plurality of holes includes a plurality of first holes forming accommodation spaces of the same shape, and a plurality of second holes forming accommodation spaces of the same shape,
The shape of the bottom of the first hole is larger than the shape of the bottom of the second hole,
The first light-emitting diode chip can be accommodated in the first hole, and the planar shape of the top portion of the first light-emitting diode chip located on the side opposite to the surface on which the electrodes are provided has the shape of the second light-emitting diode chip. larger than the shape of the bottom of the hole,
The planar shape of the top portion of the second light emitting diode chip located on the side opposite to the surface on which the electrodes are provided is smaller than the planar shape of the top portion of the first light emitting diode chip, and the second light emitting diode chip is: A method of manufacturing a transfer member with positioned light emitting diode chips that can be accommodated in the second holes. 59. The manufacturing method of a transfer member with positioned light emitting diode chips according to claim 57 or 58 , wherein a plurality of light emitting diode chips are moved on said holding surface by vibrating said holding member. further comprising a step of aligning the front and back sides and the orientation of the plurality of light emitting diode chips using a parts feeder;
61. The light emitting diode chips according to any one of claims 57 to 60 , wherein the light emitting diode chips are sequentially supplied onto the holding surface from a parts feeder capable of aligning the front and back sides and orientations of a plurality of light emitting diode chips by vibrating them. A method of manufacturing a transfer member with positioned light emitting diode chips. A plurality of light-emitting diode chips are mounted on the surface of the positioning sheet according to any one of claims 23 to 33 , which is arranged on an adsorption substrate having an adsorption path, on the side opposite to the adsorption substrate. a step of supplying;
a step of accommodating each light-emitting diode chip in the accommodation space of one through-hole by sucking the inside of the through-hole of the positioning sheet from the suction path;
and laminating an adhesive layer on the side of the positioning sheet opposite to the adsorption base material. The transfer member with the positioned light-emitting diode chips according to any one of claims 35 to 56 is arranged on a circuit board via an anisotropic conductive adhesive layer, and the light-emitting diode chips are attached to the anisotropic contacting the conductive adhesive layer;
The transfer member with the positioned light-emitting diode chips is pressed toward the circuit board to join each light-emitting diode chip and the circuit board and electrically connect each light-emitting diode chip and the circuit formed on the circuit board. A method for manufacturing a light-emitting substrate, comprising a step of connecting. The transfer member with positioned light emitting diode chips according to any one of claims 41, 42, 44 to 47, and 50 to 56 is arranged on a circuit board via an anisotropic conductive adhesive layer, contacting a light emitting diode chip with the anisotropic conductive adhesive layer;
The transfer member with the positioned light-emitting diode chips is pressed toward the circuit board to join each light-emitting diode chip and the circuit board through the anisotropic conductive adhesive layer, and each light-emitting diode chip and the circuit. a step of electrically connecting the circuit formed on the substrate;
a step of peeling off the light-emitting diode chip bonded to the circuit board from the adhesive layer and removing the holding member;
A method for manufacturing a light-emitting substrate, wherein adhesiveness is reduced by heating, cooling, or ultraviolet irradiation before the step of removing the holding member. 65. The light-emitting substrate according to claim 63 or 64 , wherein in the step of electrically connecting each light-emitting diode chip and the circuit, the transfer member with the positioned light-emitting diode chips is pressed toward the circuit substrate while being heated. Production method.

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