KR20200140808A - 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체 - Google Patents
절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체 Download PDFInfo
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- KR20200140808A KR20200140808A KR1020207027727A KR20207027727A KR20200140808A KR 20200140808 A KR20200140808 A KR 20200140808A KR 1020207027727 A KR1020207027727 A KR 1020207027727A KR 20207027727 A KR20207027727 A KR 20207027727A KR 20200140808 A KR20200140808 A KR 20200140808A
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- particles
- conductive
- insulating particles
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- insulating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
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- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Non-Insulated Conductors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JPJP-P-2018-072521 | 2018-04-04 | ||
JP2018072521 | 2018-04-04 | ||
PCT/JP2019/014484 WO2019194134A1 (ja) | 2018-04-04 | 2019-04-01 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
Publications (1)
Publication Number | Publication Date |
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KR20200140808A true KR20200140808A (ko) | 2020-12-16 |
Family
ID=68100262
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207027727A KR20200140808A (ko) | 2018-04-04 | 2019-04-01 | 절연성 입자를 갖는 도전성 입자, 절연성 입자를 갖는 도전성 입자의 제조 방법, 도전 재료 및 접속 구조체 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7312109B2 (ja) |
KR (1) | KR20200140808A (ja) |
CN (1) | CN111902884B (ja) |
TW (1) | TWI808149B (ja) |
WO (1) | WO2019194134A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010086665A (ja) | 2008-09-29 | 2010-04-15 | Sekisui Chem Co Ltd | 絶縁被覆導電性粒子、異方性導電材料及び接続構造体 |
JP2012072324A (ja) | 2010-09-29 | 2012-04-12 | Nippon Shokubai Co Ltd | 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101390174A (zh) * | 2006-02-27 | 2009-03-18 | 日立化成工业株式会社 | 电路连接材料、使用其的电路部件的连接结构及其制造方法 |
TW200739612A (en) * | 2006-02-27 | 2007-10-16 | Hitachi Chemical Co Ltd | Circuit connecting material, connection structure for circuit member using the same, and method for producing such connection structure |
KR101130377B1 (ko) * | 2007-10-18 | 2012-03-27 | 히다치 가세고교 가부시끼가이샤 | 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체 |
JP5151920B2 (ja) * | 2008-02-05 | 2013-02-27 | 日立化成工業株式会社 | 導電粒子及び導電粒子の製造方法 |
JP5549069B2 (ja) * | 2008-04-22 | 2014-07-16 | 日立化成株式会社 | 異方性導電接着剤用粒子状導電材料及びその製造方法、並びに異方性導電接着剤 |
JP5548053B2 (ja) * | 2010-07-02 | 2014-07-16 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 |
JP5927862B2 (ja) | 2011-11-24 | 2016-06-01 | 日立化成株式会社 | サブミクロン重合体粒子及びこれを備えた絶縁被覆導電粒子の製造方法 |
CN104380392B (zh) * | 2012-07-03 | 2016-11-23 | 积水化学工业株式会社 | 带绝缘性粒子的导电性粒子、导电材料及连接结构体 |
JP6212374B2 (ja) * | 2012-12-05 | 2017-10-11 | 積水化学工業株式会社 | 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体 |
US20150299408A1 (en) * | 2012-12-27 | 2015-10-22 | Toray Industries, Inc. | Conductive fiber reinforced polymer composite and multifunctional composite |
JP6306970B2 (ja) * | 2013-08-02 | 2018-04-04 | 積水化学工業株式会社 | 基材粒子、導電性粒子、導電材料及び接続構造体 |
JP2016089153A (ja) * | 2014-10-29 | 2016-05-23 | デクセリアルズ株式会社 | 導電材料 |
JP6739988B2 (ja) * | 2015-04-30 | 2020-08-12 | 積水化学工業株式会社 | 基材粒子、基材粒子の製造方法、導電性粒子、導電材料及び接続構造体 |
CN108604480B (zh) * | 2016-02-10 | 2020-03-24 | 日立化成株式会社 | 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂、连接结构体和导电粒子的制造方法 |
JP7028641B2 (ja) * | 2016-05-19 | 2022-03-02 | 積水化学工業株式会社 | 導電材料及び接続構造体 |
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2019
- 2019-04-01 CN CN201980021514.6A patent/CN111902884B/zh active Active
- 2019-04-01 KR KR1020207027727A patent/KR20200140808A/ko not_active Application Discontinuation
- 2019-04-01 JP JP2019528593A patent/JP7312109B2/ja active Active
- 2019-04-01 WO PCT/JP2019/014484 patent/WO2019194134A1/ja active Application Filing
- 2019-04-03 TW TW108111869A patent/TWI808149B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010086665A (ja) | 2008-09-29 | 2010-04-15 | Sekisui Chem Co Ltd | 絶縁被覆導電性粒子、異方性導電材料及び接続構造体 |
JP2012072324A (ja) | 2010-09-29 | 2012-04-12 | Nippon Shokubai Co Ltd | 樹脂粒子およびこれを用いた絶縁化導電性粒子並びに異方性導電材料 |
Also Published As
Publication number | Publication date |
---|---|
CN111902884A (zh) | 2020-11-06 |
TW201942295A (zh) | 2019-11-01 |
WO2019194134A1 (ja) | 2019-10-10 |
JPWO2019194134A1 (ja) | 2021-02-18 |
CN111902884B (zh) | 2023-03-14 |
JP7312109B2 (ja) | 2023-07-20 |
TWI808149B (zh) | 2023-07-11 |
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