KR20200135310A - 수지 시트 및 그 제조 방법 - Google Patents

수지 시트 및 그 제조 방법 Download PDF

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Publication number
KR20200135310A
KR20200135310A KR1020207024355A KR20207024355A KR20200135310A KR 20200135310 A KR20200135310 A KR 20200135310A KR 1020207024355 A KR1020207024355 A KR 1020207024355A KR 20207024355 A KR20207024355 A KR 20207024355A KR 20200135310 A KR20200135310 A KR 20200135310A
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KR
South Korea
Prior art keywords
resin
resin composition
resin sheet
composition layer
less
Prior art date
Application number
KR1020207024355A
Other languages
English (en)
Korean (ko)
Inventor
야스타카 와타나베
유스케 네즈
타카시 스기노
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20200135310A publication Critical patent/KR20200135310A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020207024355A 2018-03-26 2019-03-12 수지 시트 및 그 제조 방법 KR20200135310A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-058958 2018-03-26
JP2018058958 2018-03-26
PCT/JP2019/010018 WO2019188255A1 (ja) 2018-03-26 2019-03-12 樹脂シートおよびその製造方法

Publications (1)

Publication Number Publication Date
KR20200135310A true KR20200135310A (ko) 2020-12-02

Family

ID=68061624

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207024355A KR20200135310A (ko) 2018-03-26 2019-03-12 수지 시트 및 그 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2019188255A1 (zh)
KR (1) KR20200135310A (zh)
CN (1) CN111918931A (zh)
TW (1) TW201940642A (zh)
WO (1) WO2019188255A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011246545A (ja) 2010-05-25 2011-12-08 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6395219A (ja) * 1986-10-13 1988-04-26 Hitachi Chem Co Ltd ウレタン樹脂組成物
US5521236A (en) * 1994-11-01 1996-05-28 Akzo Nobel N.V. Flame retarded stabilized polyester composition
JPH10251377A (ja) * 1997-03-12 1998-09-22 Hitachi Chem Co Ltd 封止用成形材料及び電子部品
JP2000159994A (ja) * 1998-11-25 2000-06-13 Kanegafuchi Chem Ind Co Ltd 難燃性熱可塑性樹脂組成物
EP1081205B1 (en) * 1999-02-08 2004-11-17 The Yokohama Rubber Co., Ltd. Resin compositions
JP4700852B2 (ja) * 2000-07-26 2011-06-15 ポリプラスチックス株式会社 難燃性樹脂組成物
JP2005132925A (ja) * 2003-10-29 2005-05-26 Matsushita Electric Works Ltd エポキシ樹脂組成物、それを用いたプリプレグ、金属箔張積層板、及び金属箔付き樹脂シート
JP4664066B2 (ja) * 2004-12-28 2011-04-06 東レ株式会社 ポリ乳酸樹脂組成物
JP5536332B2 (ja) * 2008-12-25 2014-07-02 帝人株式会社 ポリ乳酸組成物およびその成形品
JP5614280B2 (ja) * 2009-03-25 2014-10-29 東レ株式会社 エポキシ樹脂組成物、プリプレグ、炭素繊維強化複合材料および電子電気部品筐体
JP2011084597A (ja) * 2009-10-13 2011-04-28 Asahi Kasei E-Materials Corp 封止用液状エポキシ樹脂組成物、アンダーフィル材、及びそれらを用いた半導体装置
JP5612329B2 (ja) * 2010-02-09 2014-10-22 帝人株式会社 ポリ乳酸樹脂組成物
EP2712892B1 (en) * 2011-05-20 2017-08-02 Asahi Kasei Kabushiki Kaisha Flame-retardant resin film and solar cell backsheet using same
JP6251575B2 (ja) * 2013-01-23 2017-12-20 日東電工株式会社 シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法
JP6511840B2 (ja) * 2015-02-03 2019-05-15 日立化成株式会社 エポキシ樹脂組成物、フィルム状エポキシ樹脂組成物及び電子部品装置
JP6761251B2 (ja) * 2016-01-26 2020-09-23 テクノＵｍｇ株式会社 強化熱可塑性樹脂組成物およびその製造方法、成形品
JP2017165801A (ja) * 2016-03-14 2017-09-21 コニカミノルタ株式会社 熱可塑性樹脂発泡成形体およびその製造方法
WO2017169912A1 (ja) * 2016-03-30 2017-10-05 ユーエムジー・エービーエス株式会社 強化熱可塑性樹脂組成物およびその成形品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011246545A (ja) 2010-05-25 2011-12-08 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置

Also Published As

Publication number Publication date
WO2019188255A1 (ja) 2019-10-03
TW201940642A (zh) 2019-10-16
CN111918931A (zh) 2020-11-10
JPWO2019188255A1 (ja) 2021-04-01

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