KR20200129037A - 감방사선성 조성물, 표시 장치용 절연막, 표시 장치, 표시 장치용 절연막의 형성 방법 및, 실세스퀴옥산 - Google Patents

감방사선성 조성물, 표시 장치용 절연막, 표시 장치, 표시 장치용 절연막의 형성 방법 및, 실세스퀴옥산 Download PDF

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KR20200129037A
KR20200129037A KR1020200049882A KR20200049882A KR20200129037A KR 20200129037 A KR20200129037 A KR 20200129037A KR 1020200049882 A KR1020200049882 A KR 1020200049882A KR 20200049882 A KR20200049882 A KR 20200049882A KR 20200129037 A KR20200129037 A KR 20200129037A
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South Korea
Prior art keywords
radiation
group
sensitive composition
silsesquioxane
display device
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KR1020200049882A
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English (en)
Korean (ko)
Inventor
토시유키 아키이케
타이치 다자키
요시히사 오쿠무라
윤창식
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제이에스알 가부시끼가이샤
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Application filed by 제이에스알 가부시끼가이샤 filed Critical 제이에스알 가부시끼가이샤
Publication of KR20200129037A publication Critical patent/KR20200129037A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/28—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen sulfur-containing groups
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H01L27/323—
    • H01L51/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
KR1020200049882A 2019-05-07 2020-04-24 감방사선성 조성물, 표시 장치용 절연막, 표시 장치, 표시 장치용 절연막의 형성 방법 및, 실세스퀴옥산 KR20200129037A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019087746A JP7247736B2 (ja) 2019-05-07 2019-05-07 感放射線性組成物、表示装置用絶縁膜、表示装置、表示装置用絶縁膜の形成方法、及びシルセスキオキサン
JPJP-P-2019-087746 2019-05-07

Publications (1)

Publication Number Publication Date
KR20200129037A true KR20200129037A (ko) 2020-11-17

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JP (1) JP7247736B2 (ja)
KR (1) KR20200129037A (ja)
CN (1) CN111913356A (ja)

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WO2023276864A1 (ja) * 2021-06-29 2023-01-05 東洋紡株式会社 シルセスキオキサン化合物及びその製造方法
WO2023074804A1 (ja) 2021-10-29 2023-05-04 ダウ・東レ株式会社 アルカリ可溶性の紫外線硬化性オルガノポリシロキサン、それを含む紫外線硬化性組成物およびその用途
WO2023218889A1 (ja) * 2022-05-13 2023-11-16 Ａｇｃ株式会社 組成物、化合物、表面処理剤、物品、及び物品の製造方法
WO2024063066A1 (ja) * 2022-09-22 2024-03-28 ダウ・東レ株式会社 硬化性分岐状オルガノポリシロキサン、それを含む高エネルギー線硬化性組成物およびその用途
WO2024063067A1 (ja) * 2022-09-22 2024-03-28 ダウ・東レ株式会社 硬化性分岐状オルガノポリシロキサン、それを含む高エネルギー線硬化性組成物およびその用途

Citations (1)

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JP2015161806A (ja) 2014-02-27 2015-09-07 大日本印刷株式会社 タッチパネル付立体視有機エレクトロルミネッセンス表示装置

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JP2981567B2 (ja) * 1990-06-12 1999-11-22 関西ペイント株式会社 腐食防止性樹脂
JPH06145510A (ja) * 1992-11-11 1994-05-24 Showa Denko Kk ポリアミド樹脂組成物
JP5729329B2 (ja) * 2011-03-31 2015-06-03 Jsr株式会社 感放射線性組成物、並びに硬化膜及びその形成方法
JP5866897B2 (ja) * 2011-09-08 2016-02-24 Jsr株式会社 液晶配向剤、液晶配向膜、液晶表示素子及び液晶表示素子の製造方法
JP6083557B2 (ja) * 2012-12-13 2017-02-22 ナガセケムテックス株式会社 シルセスキオキサン誘導体、それを用いたネガ型感光性樹脂組成物
TWI489212B (zh) * 2013-03-29 2015-06-21 Chi Mei Corp Photosensitive resin composition and its application
JP6853057B2 (ja) * 2017-01-31 2021-03-31 東京応化工業株式会社 重合性組成物、硬化膜の製造方法、及び硬化膜
US10234763B2 (en) * 2017-05-11 2019-03-19 Eastman Kodak Company Method of providing photopatterned functional surfaces
CN107570124A (zh) * 2017-09-07 2018-01-12 华南师范大学 用于制备双酚a印迹介孔材料的功能单体及其制备方法

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JP2015161806A (ja) 2014-02-27 2015-09-07 大日本印刷株式会社 タッチパネル付立体視有機エレクトロルミネッセンス表示装置

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CN111913356A (zh) 2020-11-10
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