KR20200043273A - 전해 Sn 합금 도금액 - Google Patents

전해 Sn 합금 도금액 Download PDF

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Publication number
KR20200043273A
KR20200043273A KR1020190115557A KR20190115557A KR20200043273A KR 20200043273 A KR20200043273 A KR 20200043273A KR 1020190115557 A KR1020190115557 A KR 1020190115557A KR 20190115557 A KR20190115557 A KR 20190115557A KR 20200043273 A KR20200043273 A KR 20200043273A
Authority
KR
South Korea
Prior art keywords
oxide
compound
electrolytic
alloy plating
plating solution
Prior art date
Application number
KR1020190115557A
Other languages
English (en)
Korean (ko)
Inventor
하시모토 다이스케
에노모토 마사토
카와하라 토모히로
키소 마사유키
Original Assignee
우에무라 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 우에무라 고교 가부시키가이샤 filed Critical 우에무라 고교 가부시키가이샤
Publication of KR20200043273A publication Critical patent/KR20200043273A/ko

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020190115557A 2018-10-17 2019-09-19 전해 Sn 합금 도금액 KR20200043273A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-195996 2018-10-17
JP2018195996A JP2020063477A (ja) 2018-10-17 2018-10-17 電解Ｓｎ合金めっき液

Publications (1)

Publication Number Publication Date
KR20200043273A true KR20200043273A (ko) 2020-04-27

Family

ID=70280440

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190115557A KR20200043273A (ko) 2018-10-17 2019-09-19 전해 Sn 합금 도금액

Country Status (5)

Country Link
US (1) US20200123673A1 (ja)
JP (1) JP2020063477A (ja)
KR (1) KR20200043273A (ja)
CN (1) CN111058069A (ja)
TW (1) TW202016361A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2021201100A1 (ja) 2020-03-31 2021-10-07
CN112697948B (zh) * 2020-12-03 2022-07-01 广东志道医药科技有限公司 基于指纹图谱模型建立的清肺排毒汤的质量检测方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016106181A (ja) 2008-12-31 2016-06-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 鉛を含まないスズ合金電気めっき組成物および方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016106181A (ja) 2008-12-31 2016-06-16 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ 鉛を含まないスズ合金電気めっき組成物および方法

Also Published As

Publication number Publication date
CN111058069A (zh) 2020-04-24
JP2020063477A (ja) 2020-04-23
US20200123673A1 (en) 2020-04-23
TW202016361A (zh) 2020-05-01

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