KR20190098697A - Processing apparatus - Google Patents

Abstract

An objective of the present invention is to provide a machining apparatus capable of reducing concern for draining and discarding machining waste liquid which does not satisfy a drainage standard. The machining apparatus comprises: a retaining means to retain a workpiece; and a machining means to machine the workpiece retained on the retaining means. The machining apparatus further comprises: a machining liquid supply means to supply machining liquid including an oxidizer to at least the workpiece when machining the workpiece retained on the retaining means by the machining means; a machining waste liquid collection unit to collect machining waste liquid including the machining liquid supplied to the workpiece from the machining liquid supply means; a discharge path to discharge the machining waste liquid out of the machining apparatus from the machining waste liquid collection unit; and a treatment layer which stores the machining waste liquid collected by the machining waste liquid collection unit arranged in the middle of the discharge path, and has a waste liquid treating means to decompose machining liquid included in the machining waste liquid.

Description

Processing device {PROCESSING APPARATUS}

TECHNICAL FIELD This invention relates to processing apparatuses, such as a cutting apparatus, a grinding apparatus, and a bite cutting apparatus, which process while supplying a processing liquid, when processing a to-be-processed object.

Cutting a workpiece with metal with a cutting blade causes clogging of the cutting blade and burrs in the metal portion. Problems such as short-circuit between terminals of the device formed in the workpiece due to the generated burrs, or the occurrence of bonding defects due to the burrs falling on the bonding pads during the handling of the workpiece, are caused.

In order to solve this problem, Japanese Unexamined Patent Application Publication No. 2015-177089 discloses a method of cutting a workpiece while supplying a cutting liquid containing an organic acid and an oxidizing agent. According to this cutting method, the metal is modified by the organic acid contained in the cutting liquid, and ductility is suppressed. As a result, the generation of burrs is suppressed, and the cutting fluid contains an oxidizing agent, and the film quality formed on the metal surface with the cutting fluid changes, and the metal loses ductility and is easily removed, and workability is promoted.

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2015-177089

However, according to the drainage standard of the use area of the cutting device, the cutting waste liquid containing the cutting liquid cannot be drained as it is, and the organic matter in the cutting waste liquid is decomposed by the biological treatment using microorganisms and then drained.

By the way, if the cutting fluid contains an oxidizing agent, the oxidizing agent may cause the microorganisms used in the biological treatment to be killed, and the organic waste in the cutting waste liquid may not be decomposed and the cutting waste liquid which does not meet the drainage standard may be discharged. . Such a problem is not limited to a cutting device but also occurs in other processing devices such as a grinding device and a bite cutting device using a processing liquid.

This invention is made | formed in view of such a point, Comprising: It aims at providing the processing apparatus which can reduce the possibility of draining the processing waste liquid which does not satisfy a drainage standard.

According to the present invention, there is provided a processing apparatus comprising a holding means for holding a workpiece and a processing means for processing a workpiece held by the holding means, when the workpiece held by the holding means is processed by the processing means. At least a processing liquid supply means for supplying a processing liquid containing an oxidizing agent to the workpiece, a processing waste liquid recovery unit for recovering a processing waste liquid including the processing liquid supplied from the processing liquid supply means to the workpiece, and the processing waste liquid A discharge path for discharging the processing waste liquid from the recovery unit out of the processing apparatus, and a processing waste liquid recovered by the processing waste liquid recovery unit disposed in the middle of the discharge path to decompose the processing liquid contained in the processing waste liquid; A processing apparatus is further provided, further comprising a treatment layer having a waste liquid treatment means.

Preferably, the oxidant is hydrogen peroxide, and the waste liquid treatment means includes ultraviolet irradiation means for irradiating ultraviolet light to the processing waste liquid.

The processing apparatus of the present invention includes a processing layer having waste liquid processing means for storing the processing waste liquid recovered by the processing waste liquid recovery unit and decomposing the processing liquid contained in the processing waste liquid, so that the processing does not meet the drainage standard. We can reduce fear that we drain waste liquid.

1A is a plan view of the package substrate, FIG. 1B is a rear view of the package substrate, and FIG. 1C is a side view of the package substrate.
FIG. 2 is a perspective view of a cutting device suitable for cutting the package substrate shown in FIG. 1. FIG.
3 is a perspective view of a cutting feed means and a water casing portion of the cutting device.
4 is a sectional view of a treatment layer with waste liquid treatment means.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1A, a plan view of an example of a package substrate 2 suitable for processing by the cutting device of the embodiment of the present invention is shown. FIG. 1B is a rear view of the package substrate 2, and FIG. 1C is a side view of the package substrate 2.

The package board | substrate 2 has the rectangular metal frame (lead frame) 4, and is shown in the area | region enclosed by the outer periphery excess area | region 5 and the non-device area | region 5a of the metal frame 4 in figure. In one example, there are three device regions 6a, 6b, 6c.

In each device region 6a, 6b, 6c, the device chip mounting portion 10 is determined in a plurality of regions partitioned by the division scheduled lines 8 arranged vertically and horizontally so as to be perpendicular to each other, and the individual device chip mounting portions 10 A plurality of electrodes 12 are formed along the four sides of).

Each electrode 12 is insulated by the mold resin layer 14 molded in the metal frame 4. By cutting the division scheduled line 8 extending in the first direction and the division scheduled line 8 extending in the second direction orthogonal to the first direction, the electrodes 12 of the respective device chips are exposed on both sides of the cutting groove. .

A device chip (not shown) is mounted on the back surface of each device chip mounting portion 10 in the device regions 6a, 6b, and 6c, and an electrode and an electrode 12 included in each device chip are connected by bonding wires.

And the mold resin layer 14 is formed in the back surface of each device area | region 6a, 6b, 6c so that each device chip of the device area | region 6a, 6b, 6c may be sealed by resin.

2, a perspective view of a cutting device 20 of an embodiment of the present invention is shown. The cutting device 20 shown in FIG. 2 is a manual type cutting device in which a worker arranges a workpiece to be cut on a holding means or is carried out from the holding means.

Reference numeral 22 is a base of the cutting device 20, and the table base 26 is disposed on the base 22 so as to be rotatable and reciprocating in the X-axis direction by a cutting feed mechanism (not shown). The suction port 28 connected to the suction source is opened in the substantially center portion of the table base 26.

When processing the package board | substrate 2, the jig table as disclosed in Unexamined-Japanese-Patent No. 2011-040542 is mounted in the table base 26, and the package board | substrate 20 is suction-held through the jig table. That is, in the cutting device of this embodiment, a holding means is comprised by a table base and a jig table.

A water cover 24 is disposed around the table base 26, and a bellows 30 for protecting the axis of the cutting feed mechanism is provided between the water cover 24 and the water case 60 shown in FIG. 3. It is connected.

At the rear of the base 22, a columnar column 32 is erected. A pair of guide rails 34 extending in the Y-axis direction are fixed to the column 32. In the column 32, the Y-axis moving block 36 is moved along the guide rail 34 in the Y-axis direction by a Y-axis moving mechanism (indexing mechanism) 40 formed of a ball screw 38 and a pulse motor (not shown). It is mounted to be movable.

A pair of guide rails 42 extending in the Z-axis direction are fixed to the Y-axis moving block 36. On the Y-axis moving block 36, the Z-axis moving block 44 is guided to the guide rail 42 by the Z-axis moving mechanism 50 consisting of the ball screw 46 and the pulse motor 48, and the Z-axis. It is mounted to be movable in the direction.

A cutting unit 52 as a processing means is attached to the Z-axis moving block 44, and a spindle (not shown) is rotatably housed in the spindle housing 53 of the cutting unit 52, and at the tip of the spindle. The cutting blade 54 is detachably attached.

On both sides of the cutting blade 54, a pair of cutting liquid supply nozzles 56 as the processing liquid supply means are arranged with the cutting blade 54 therebetween, and during cutting of the package substrate 2 held by the holding means. The package substrate 2 is cut by the cutting blade 54 while supplying cutting liquid from the cutting liquid supply nozzle 56.

The Z-axis moving block 44 is further attached with an imaging unit 58 having a microscope and a camera. The imaging unit 58 is equipped with the imaging camera which picks up a to-be-processed object with visible light.

When the package substrate 2 sucked and held by the chuck table 26 is cut by the cutting blade 54 while supplying cutting fluid containing an organic acid and an oxidant from the cutting water supply nozzle 56, cutting fluid and cutting chips are included. Cutting waste fluid flows from the both ends of the bellows 30 in the width direction (Y-axis direction) to the water case 60 shown in FIG. 3.

The water case 60 is disposed under the movement path of the table base 26, and in the center portion of the bottom plate 62 of the box-shaped member to enable the table base 26 to reciprocate in the X-axis direction. A rectangular opening portion 63 is formed, and is formed by the bottom plate 62, the inner circumferential wall 64 and the outer circumferential wall 66, and a groove portion 68 as a processing waste liquid recovery portion for receiving cutting fluid, The drain port 70 formed in the bottom plate 62 is included. One end of the drain pipe 82 as a discharge path extending out of the water case 60 is connected to the drain port 70.

The water cover 24 is configured by dropping a pair of side plates 24b from both ends of the top plate 24a formed in a planar shape, and an end of the top plate 24a and two side plates 24b are formed. It is slidably engaged with the inner circumferential wall 64 constituting the water case 60.

The cutting feed mechanism 72 is connected to a ball screw 74 extending in the X-axis direction, a pair of guide rails 76 disposed in parallel with the ball screw 74, and one end of the ball screw 74. The motor 80 and the nut housed therein are screwed to the ball screw 74 and the bottom portion is constituted by a movable plate 78 in sliding contact with the guide rail 76.

When the ball screw 74 rotates by the motor 80, the movable plate 78 is guided to a pair of guide rails 76, and it is set as the structure which reciprocates in an X-axis direction. The cylindrical member 82 is affixed on the movable plate 78, and the rotating mechanism which rotates the table base 26 is accommodated in this cylindrical member 82. As shown in FIG.

As shown in FIG.2 and FIG.4, it collect | recovered by the groove part 68 as a processing waste liquid collection part in the middle of the drainage pipe (drainage path) 82 connected to the drain opening 70 of the water case 60. As shown in FIG. The processing layer 84 which has the waste liquid processing means which stores a process waste liquid and decomposes the process liquid contained in the said process waste liquid is arrange | positioned.

In the present embodiment, the drainage processing means is composed of a plurality of LEDs 86 arranged on the bottom wall and sidewall of the processing layer 84. The wavelength of the ultraviolet light (UV light) irradiated from the LED 86 is preferably 340 nm or less, more preferably 300 nm or less.

The LED 86 is covered by the transparent plate 88 so that the processing waste liquid stored in the processing layer 84 does not contact the LED 86. The processing waste liquid stored in the processing layer 84 is irradiated with ultraviolet rays from the LED 86 to decompose the processing liquid (cutting liquid) contained in the processing waste liquid (cutting waste liquid).

When cutting the package substrate 2 as shown in FIG. 1 with the cutting device 2 of the embodiment of the present invention, the cutting blade 54 cuts the cutting liquid containing the organic acid and the oxidant into the package substrate 2. Cutting while feeding to the finished machining point.

The organic acid contained in the cutting liquid can cut the package substrate 2 while modifying the metal contained in the package substrate 2 to suppress ductility. Therefore, burr does not generate | occur | produce from a metal by this cutting. In addition, by using the oxidizing agent, the surface of the metal can be oxidized to lower the ductility of the metal and improve the workability of the metal surface.

As the organic acid, for example, a compound having at least one carboxyl group and at least one amino group in a molecule can be used. In this case, at least one of the amino groups is preferably a secondary or tertiary amino group. In addition, the compound used as an organic acid may have a substituent.

Examples of amino acids that can be used as the organic acid include glycine, dihydroxyethylglycine, glycylglycine, hydroxyethylglycine, N-methylglycine, β-alanine, L-alanine, L-2-aminobutyric acid and L-norvaline , L-valine, L-leucine, L-norleucine, L-alloisoleucine, L-isoleucine, L-phenylalanine, L-proline, sarcosine, L-ornithine, L-lysine, taurine, L-serine, L Threonine, L-allothreonine, L-homoserine, L-thyroxine, L-tyrosine, 3,5-diiodine-L-tyrosine, β- (3,4-dihydroxyphenyl) -L-alanine, 4 -Hydroxy-L-proline, L-cystine, L-methionine, L-ethionine, L-lanthionine, L-cystionine, L-cystine, L-cystine acid, L-glutamic acid, L-aspartic acid , S- (carboxymethyl) -L-cystine, 4-aminobutyric acid, L-asparagine, L-glutamine, azaserine, L-canavavanine, L-citrulline, L-arginine, δ-hydroxy-L-lysine, Creatine, L-kinyurenine, L-histidine, 1-methyl-L-histidine, 3- Methyl-L-histidine, L-tryptophan, actinomycin C1, ergothioneine, apamin, angiotensin I, angiotensin II, antipine and the like. Among them, glycine, L-alanine, L-proline, L-histidine, L-lysine and dihydroxyethylglycine are preferable.

Moreover, as amino polyacid which can be used as an organic acid, imino diacetic acid, nitrilo triacetic acid, diethylene triamine pentacetic acid, ethylenediamine tetraacetic acid, hydroxyethyl imino diacetic acid, nitrilo tris methylene phosphonic acid, ethylenediamine- N, N, N ', N'-tetramethylenesulfonic acid, 1,2-diaminopropaneacetic acid, glycol etherdiamine tetraacetic acid, transcyclohexanediamine tetraacetic acid, ethylenediamineorthohydroxyphenylacetic acid, ethylenediaminedihobacic acid ( SS body), β-alanine diacetic acid, N- (2-carboxylate ethyl) -L-aspartic acid, N, N'-bis (2-hydroxybenzyl) ethylenediamine-N, N'-diacetic acid, etc. Can be mentioned.

Moreover, as carboxylic acid which can be used as organic acid, formic acid, glycolic acid, propionic acid, acetic acid, butyric acid, valeric acid, hexanoic acid, oxalic acid, malonic acid, glutaric acid, adipic acid, malic acid, succinic acid, pimelic acid Saturated carboxylic acids such as mercaptoacetic acid, glyoxylic acid, chloroacetic acid, pyruvic acid, acetoacetic acid, glutaric acid, acrylic acid, methacrylic acid, crotonic acid, fumaric acid, maleic acid, mesaconic acid, citraconic acid, aco And cyclic unsaturated carboxylic acids such as unsaturated carboxylic acids such as nitric acid, benzoic acid, toluic acid, phthalic acid, naphthoic acid, pyromellitic acid and naphthalic acid.

As the oxidizing agent, for example, hydrogen peroxide, peroxide, nitrate, iodide, periodate, hypochlorite, chlorite, chlorate, perchlorate, persulfate, dichromate, permanganate, cerium, vanadate, ozonated water and silver ( II) salt, iron (III) salt, its organic complex salt, etc. can be used.

In addition, an anticorrosive may be mixed with the cutting liquid. By mixing the anticorrosive, it is possible to prevent corrosion (elution) of the metal contained in the QFN substrate 10. As the anticorrosive, for example, a heteroaromatic compound having three or more nitrogen atoms in the molecule and having a condensed ring structure, or a heteroaromatic compound having four or more nitrogen atoms in the molecule is preferably used. Moreover, it is preferable that an aromatic ring compound contains a carboxyl group, a sulfo group, a hydroxyl group, and an alkoxy group. Specifically, it is preferable that they are a tetrazole derivative, a 1,2,3-triazole derivative, and a 1,2,4-triazole derivative.

As a tetrazole derivative which can be used as an anticorrosive agent, it does not have a substituent on the nitrogen atom which forms a tetrazole ring, and has a sulfo group, an amino group, a carbamoyl group, a carbonamide group, A substituent selected from the group consisting of a sulfamoyl group, and a sulfonamide group, or at least one substituent selected from the group consisting of a hydroxy group, a carboxy group, a sulfo group, an amino group, a carbamoyl group, a carbonamide group, a sulfamoyl group, and a sulfonamide group The alkyl group substituted by the is introduced.

In addition, the 1,2,3-triazole derivative which can be used as an anticorrosive agent does not have a substituent on the nitrogen atom which forms a 1,2,3-triazole ring, and 1,2,3-tria At the 4 and / or 5 position of the sol, a substituent selected from the group consisting of a hydroxyl group, a carboxyl group, a sulfo group, an amino group, a carbamoyl group, a carbonamide group, a sulfamoyl group, and a sulfonamide group, or a hydroxy group, a carboxyl group, a sulfonate group An alkyl group or an aryl group substituted with at least one substituent selected from the group consisting of aeration, amino group, carbamoyl group, carbonamide group, sulfamoyl group, and sulfonamide group is mentioned.

In addition, the 1,2,4-triazole derivative which can be used as an anticorrosive agent does not have a substituent on the nitrogen atom which forms a 1,2,4-triazole ring, and is a 1,2,4-tria Substituent selected from the group consisting of a sulfo group, a carbamoyl group, a carbonamide group, a sulfamoyl group, and a sulfonamide group at the 2-position and / or 5-position of the sol, or a hydroxy group, a carboxy group, a sulfo group, an amino group, a carbamo And an alkyl or aryl group substituted with at least one substituent selected from the group consisting of a diary, a carbonamide group, a sulfamoyl group, and a sulfonamide group.

As described above, since the cutting liquid supplied from the cutting liquid supply nozzle 56 contains an oxidizing agent, the microorganisms are killed in the biological treatment using conventional microorganisms by the oxidizing agent, and the organic matter in the cutting waste liquid is decomposed. There is a fear that the cutting waste liquid which does not meet the drainage standard cannot be drained.

However, in this embodiment, since the waste liquid processing layer 84 which has a waste liquid processing means is provided in the middle of the drainage pipe 82, the cutting waste liquid stored in the process layer 84 is irradiated with the ultraviolet-ray from the some LED 86. Since the organic matter in the cutting waste liquid can be decomposed, the possibility of draining the cutting waste liquid which does not satisfy the drainage standard can be prevented.

In the above-described embodiment, an example in which the package substrate 2 is employed as the workpiece is described. However, the workpiece is not limited to the package substrate, and the conductor film (Ti, Ni, Au, etc.) having a thickness of several μm as the back electrode is described. And a wafer having a TEG formed on a street of a surface thereof, and the like.

When cutting the package substrate 2 while supplying a cutting liquid containing an organic acid and an oxidizing agent to the cutting device 20 having the waste liquid processing layer 84 having the LEDs 86 as waste liquid processing means described above, By using light energy having a decomposition wavelength rather than an additive for decomposition, no additives or temperature management are required, and it is possible to suppress the running cost low.

Although the above-mentioned embodiment demonstrated the example which used the waste liquid processing layer 84 which irradiates an ultraviolet-ray from the LED 86 for the waste liquid processing of a cutting apparatus, the waste liquid processing layer 84 is not limited to a cutting apparatus, The same applies to other processing devices such as a grinding device and a bite cutting device.

2: package substrate 4: metal frame (lead frame)
6a, 6b, and 6c: device area 8: line to be divided
10: device chip mounting portion 12: electrode
14 mold resin layer 24 water cover
26: table base 30: bellows
54: cutting blade 60: water case
70: drain hole 72: cutting feed mechanism
82: drainage tube 84: waste liquid treatment layer
86: LED

Claims (2)

A processing apparatus comprising a holding means for holding a workpiece and a processing means for processing a workpiece held by the holding means,
Processing liquid supply means for supplying a processing liquid containing an oxidizing agent to at least the workpiece when processing the workpiece held by the holding means with the processing means;
A processing waste liquid recovery unit for recovering a processing waste liquid including the processing liquid supplied from the processing liquid supply means to the workpiece;
A discharge path for discharging the processing waste liquid out of the processing apparatus from the processing waste liquid recovery unit;
And a processing layer having waste liquid processing means for storing the processing waste liquid recovered by the processing waste liquid recovery unit arranged in the middle of the discharge path and decomposing the processing liquid contained in the processing waste liquid. . The processing apparatus according to claim 1, wherein the oxidant is hydrogen peroxide, and the waste liquid treatment means includes ultraviolet irradiation means for irradiating ultraviolet light to the processing waste liquid.

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