TW201934252A - Processing apparatus comprising a processing layer arranged in a draining passage to hold a processing waste liquid that contains a processing liquid and having means for decomposing the processing liquid - Google Patents

Abstract

The object of the present invention provide a processing apparatus that reduces the risk of draining processing waste liquid that does not meet the drainage standard. The solution of the present invention is a processing apparatus, which, according to the present invention, comprises: a holding means for holding a workpiece and a processing means for processing the workpiece held by the holding means. The processing apparatus is characterized by further comprising: a processing liquid supplying means, which supplies a processing liquid that contains an oxidant to at least the workpiece being processed when the workpiece is held by the holding means to be processed by the processing means; a processing waste liquid collecting section that collects a processing waste liquid containing the processing liquid supplied from the processing liquid supplying means to the workpiece that is being processed; a draining passageway that drains the processing waste liquid from the processing waste liquid collecting section to outside of the processing apparatus; and a processing layer that is arranged midway in the draining passageway and holds the processing waste liquid collected in the processing waste liquid collecting section and comprises a waste liquid processing means for decomposing the processing liquid contained in the processing waste liquid.

Description

Processing device

The present invention relates to a processing device such as a cutting device, a grinding device, and a cutting tool (bite) that performs processing while supplying a processing fluid while processing a workpiece.

When a workpiece with metal is cut with a cutter, the cutter is clogged, and burrs are formed on the metal part. The occurrence of burrs may cause short-circuits between the terminals of the elements formed in the workpiece, or during processing of the workpiece, the burrs may fall on the bonding pads and cause problems such as poor bonding.

To solve this problem, Japanese Patent Application Laid-Open No. 2015-177089 proposes a method of cutting a workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent. With this cutting method, the metal is modified and the ductility is suppressed by the organic acid contained in the cutting fluid. As a result, the occurrence of burrs is suppressed, and because the cutting fluid contains an oxidizing agent, the film quality formed on the metal surface is changed due to the cutting fluid, and the metal system loses ductility and is easily removed to promote processability.
[Prior technical literature]
[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-177089

(Problems to be solved by the invention)

However, according to the drainage standard of the area where the cutting device is used, the cutting waste liquid containing the cutting fluid cannot be directly drained, and the organic matter in the cutting waste liquid is decomposed and then drained by biological treatment using microorganisms.

However, if an oxidant is contained in the cutting fluid, microorganisms used in the biological treatment will be killed due to the oxidant, and the organic matter in the cutting waste fluid cannot be decomposed, and the cutting waste fluid that does not meet the drainage standard may be discharged. The problems shown above are not limited to cutting devices, but may occur in other processing devices such as grinding devices using cutting fluids, cutting tool cutting devices, and the like.

The present invention has been made in view of the circumstances as described above, and an object thereof is to provide a processing device that can reduce the risk of draining processing waste liquid that does not meet the drainage standards.

(Means for solving problems)

According to the present invention, there is provided a processing apparatus including: a holding means for holding a workpiece; and a processing means for processing a workpiece to be held by the holding means. The processing apparatus is further provided with: : A processing fluid supply means for supplying a processing fluid containing at least an oxidizing agent to a processed object when the processed object held by the holding means is processed by the processing means; a processing waste liquid recovery section for recovering and containing A processing waste liquid of the processing liquid supplied to the workpiece by the processing liquid supply means; a discharge path for discharging the processing waste liquid out of the processing device by the processing waste liquid recovery section; and a processing layer, The processing waste liquid is disposed in the middle of the discharge path and stored in the processing waste liquid recovery part and recovered in the processing waste liquid recovery unit, and has a waste liquid processing means for decomposing the processing liquid contained in the processing waste liquid.

The oxidant is preferably hydrogen peroxide, and the waste liquid treatment means includes an ultraviolet irradiation means for irradiating the processing waste liquid with ultraviolet rays.

(Effect of the invention)

The processing device of the present invention is provided with a processing layer that stores the processing waste liquid recovered in the processing waste liquid recovery section, and has a processing layer for waste liquid processing means that decomposes the processing liquid contained in the processing waste liquid, thereby reducing unqualified drainage The standard processing waste liquid may be drained.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Referring to FIG. 1 (A), a plan view showing an example of a package substrate 2 suitable for processing by a cutting apparatus according to an embodiment of the present invention. FIG. 1 (B) is a rear view of the package substrate 2, and FIG. 1 (C) is a side view of the package substrate 2.

The package substrate 2 has a rectangular metal frame (lead frame) 4. There are three areas in the metal frame 4 surrounded by the remaining peripheral area 5 and the non-element area 5 a in the example shown in the figure. Element regions 6a, 6b, and 6c.

In each of the element regions 6a, 6b, and 6c, a component wafer loading portion 10 is formed by dividing a plurality of regions divided by predetermined division lines 8 arranged vertically and horizontally so as to be orthogonal to each other. A plurality of electrodes 12 are formed on four sides of 10.

The electrodes 12 are insulated from each other by a stamper resin layer 14 that is stamped on the metal frame 4. By cutting the planned division line 8 extending in the first direction and the planned division line 8 extending in the second direction orthogonal to the first direction, the electrodes 12 of each element wafer appear on both sides of the cutting groove.

A component wafer (not shown) is mounted on the back surface of each component wafer mounting portion 10 in the component regions 6a, 6b, and 6c, and electrodes provided on each component wafer are connected to the electrode 12 by bonding wires.

Next, each element wafer of the element regions 6a, 6b, and 6c is sealed with a resin, and a stamper resin layer 14 is formed on the back surface of each element region 6a, 6b, and 6c.

Referring to Fig. 2, a perspective view of a cutting device 20 according to an embodiment of the present invention is shown. The cutting device 20 shown in FIG. 2 is a manual type cutting device in which an operator places a workpiece to be cut on a holding means or removes a workpiece to be cut by the holding means.

The base of the 22-series cutting device 20 is provided with a platform base 26 that is rotatable and capable of reciprocating in the X-axis direction by a cutting feed mechanism (not shown). An opening of a suction port 28 connected to a suction source is formed in a roughly central portion of the platform base 26.

When processing the package substrate 2, the jig platform disclosed in Japanese Patent Application Laid-Open No. 2011-040542 is mounted on the platform base 26, and the package substrate 20 is sucked and held through the jig platform. That is, in the cutting device of this embodiment, the holding means is constituted by a platform base and a jig platform.

A water cover 24 is provided around the platform base 26, and a bellows 30 for protecting the shaft of the cutting feed mechanism is connected between the water cover 24 and the water tank 60 shown in FIG.

A gate-shaped pillar 32 is erected behind the base 22. A pair of guide rails 34 extending in the Y-axis direction are fixed to the pillar 32. A Y-axis moving mechanism (step feed mechanism) 40 formed by a ball screw 38 and a pulse motor (not shown) can be used for the pillar 32, and a Y-axis moving block 36 is mounted to move along the guide rail 34 in the Y-axis direction. .

A pair of guide rails 42 extending in the Z-axis direction are fixed to the Y-axis moving block 36. A Z-axis moving block 44 is mounted on the Y-axis moving block 36 using a Z-axis moving mechanism 50 formed by a ball screw 46 and a pulse motor 48 and guided by a guide rail 42 to move in the Z-axis direction.

A cutting unit 52 as a processing means is attached to the Z-axis moving block 44. A spindle (not shown) is rotatably accommodated in a spindle housing 53 of the cutting unit 52, and can be attached to a front end of the spindle. A cutter 54 is detachably mounted.

A pair of cutting fluid supply nozzles 56 are provided on both sides of the cutting blade 54 as cutting fluid supply means. The cutting fluid is supplied by the cutting fluid while cutting the package substrate 2 held by the holding means. The supply nozzle 56 supplies cutting fluid, and cuts the package substrate 2 with a cutting blade 54.

An imaging unit 58 including a microscope and a camera is additionally mounted on the Z-axis moving block 44. The imaging unit 58 is provided with an imaging camera which images an object to be processed in visible light.

When the cutting fluid containing the organic acid and the oxidant is supplied from the cutting water supply nozzle 56 and the package substrate 2 attracted and held on the chuck table 26 is cut by the cutting blade 54, the cutting fluid and the cutting waste liquid containing the cutting chips are caused by Both ends in the short-side direction (Y-axis direction) of the bellows 30 flow down toward the water tank 60 shown in FIG. 3.

The water tank 60 is arranged under the movement path of the platform base 26, and in order to make the platform base 26 move back and forth in the X-axis direction, a rectangular opening 63 is provided at the center of the bottom plate 62 of the box-shaped member. The water tank 60 includes: a water guide pipe portion 68 as a processing waste liquid recovery portion formed by the bottom plate 62, the inner peripheral wall 64, and the outer peripheral wall 66 and receiving cutting fluid; and a drain port 70 formed on the bottom plate 62. The liquid discharge port 70 is connected to one end of a liquid discharge pipe 82 as a discharge path extending to the outside of the water tank 60.

The water cover 24 is formed by suspending a pair of side plates 24b from both ends of the upper plate 24a formed in a flat shape. The end portion of the upper plate 24a and the two side plates 24b are slidably connected to the inner peripheral wall 64 constituting the water tank 60. Together.

The cutting feed mechanism 72 is composed of: a ball screw 74 extending in the X-axis direction; a pair of guide rails 76 arranged in parallel with the ball screw 74; a motor 80 connected to one end of the ball screw 74; and a screw housed inside The cap is screwed to the ball screw 74, and the bottom is slidably connected to the movable plate 78 of the guide rail 76.

When the ball screw 74 is rotated by the motor 80, the movable plate 78 is guided by a pair of guide rails 76 and moves back and forth in the X-axis direction. A cylindrical member 82 is attached to the movable plate 78, and a rotating mechanism that rotates the platform base 26 is housed inside the cylindrical member 82.

As shown in FIGS. 2 and 4, a treatment layer 84 is disposed in the middle of the drainage pipe (drainage path) 82 connected to the drainage port 70 of the water tank 60, and is stored in a processing waste liquid recovery section. The drain pipe part 68 has a processing waste liquid recovered, and has a waste liquid processing means for decomposing the processing liquid included in the processing waste liquid.

In this embodiment, the waste liquid treatment means is constituted by a plurality of LEDs 86 arranged on the bottom wall and the side wall of the treatment layer 84. The wavelength of ultraviolet light (UV light) irradiated by the LED 86 is preferably 340 nm or less, and more preferably 300 nm or less.

The LED 86 is covered with a transparent plate 88 so that the processing waste liquid stored in the processing layer 84 does not contact the LED 86. The processing waste liquid stored in the processing layer 84 is irradiated with ultraviolet rays by the LED 86, and the processing liquid (cutting liquid) contained in the processing waste liquid (cutting waste liquid) is decomposed.

When the package substrate 2 shown in FIG. 1 is cut by the cutting device 2 according to the embodiment of the present invention, cutting is completed while supplying a cutting fluid containing an organic acid and an oxidizing agent to a processing point where the cutting blade 54 cuts into the package substrate 2.

The organic acid contained in the cutting fluid can cut the package substrate 2 while modifying the metal contained in the package substrate 2 while suppressing ductility. Therefore, there is no case where a burr is generated from the metal due to the cutting. In addition, by using an oxidizing agent, the surface of the metal can be oxidized to reduce the ductility of the metal and improve the workability of the metal surface.

As the organic acid, for example, a compound having at least one carboxyl group and at least one amine group in the molecule can be used. In this case, it is preferable that at least one of the amine groups is a secondary or tertiary amine group. The compound used as an organic acid may have a substituent.

In terms of amino acids that can be used as organic acids, a series of examples are: glycine, dihydroxyethylglycine, glycine methylglycine, hydroxyethylglycine, N-methylglycine Acid, β-alanine, L-alanine, L-2-aminobutyric acid, L-n-valine, L-valine, L-leucine, L-n-leucine, L-other -Isoleucine, L-isoleucine, L-phenylalanine, L-proline, sarcosine, L-guanine, L-lysine, taurine, L-serine Acid, L-threonine, L-be-threonine, L-homoserine, L-thyroxine, L-tyrosine, 3,5-diiodo-L-tyrosine, β- (3 , 4-Dihydroxyphenyl) -L-alanine, 4-hydroxy-L-proline, L-cysteine, L-methionine, L-ethionine, L-lanthionine Acid, L-cysteine, L-cysteine, L-cysteine, L-glutamic acid, L-aspartic acid, S- (carboxymethyl) -L-cysteine, 4-aminobutyric acid, L-asparagine, L-glutamine, acrylamine, L-cananosine, L-citrulline, L-arginine, δ-hydroxy-L- Lysine, creatine, L-kynurenine, L-histidine, 1-methyl-L-histidine, 3-methyl-L-histidine, L-tryptamine , Actinomycetes neomycin C1, ergot thiol, apamin, angiotensin type, type II angiotensin, and pain hormone (antipain) and the like. Among them, glycine, L-alanine, L-proline, L-histidine, L-lysine, and dihydroxyethylglycine are also preferred.

In addition, the amino polyacids that can be used as organic acids include: imino diacetic acid, nitrile triacetic acid, diethylene triamine pentaacetic acid, ethylene diamine tetraacetic acid, and hydroxyethylimine. Diacetic acid, nitriletrimethylenephosphonic acid, ethylenediamine-N, N, N ', N'-tetramethylenesulfonic acid, 1,2-diaminopropanetetraacetic acid, glycol ether diaminetetraacetic acid , Transcyclohexanediamine tetraacetic acid, ethylenediamine-o-hydroxyphenylacetic acid, ethylenediamine disuccinic acid (SS isomer), β-alanine diacetic acid, N- (2-carboxylic acid ester E Group) -L-aspartic acid, N, N'-bis (2-hydroxybenzyl) ethylenediamine-N, N'-diacetic acid, and the like.

In addition, as the carboxylic acid that can be used as an organic acid, a series of examples include formic acid, glycolic acid, propionic acid, acetic acid, butyric acid, isovaleric acid, hexane acid, oxalic acid, malonic acid, glutaric acid, and hexane. Saturated carboxylic acids such as diacid, malic acid, succinic acid, pimelic acid, thioglycolic acid, glyoxylic acid, chlorinated acetic acid, pyruvate, acetic acid, glutaric acid; or acrylic acid, methacrylic acid, butenoic acid Unsaturated acids such as fumaric acid, maleic acid, mesaconic acid, citraconic acid, aconitic acid; benzoic acid, methylbenzoic acid, phthalic acid, naphthoic acid, pyromellitic acid Cyclic unsaturated carboxylic acids such as formic acid and naphthalenedicarboxylic acid.

As the oxidant, for example, hydrogen peroxide, peroxide, nitrate, iodate, periodate, hypochlorite, chlorite, chlorate, perchlorate, perchlorate can be used. Sulfate, dichromate, permanganate, cerate, vanadate, ozone water and silver (divalent) salt, iron (trivalent) salt; and its organic complex salt and the like.

In addition, an anticorrosive agent may be mixed with the cutting fluid. By mixing the corrosion inhibitor, the metal contained in the QFN substrate 10 can be prevented from being corroded (deposited out). As the corrosion inhibitor, for example, a heteroaryl ring compound having three or more nitrogen atoms in the molecule and a condensed ring structure or a heteroaromatic ring compound having four or more nitrogen atoms in the molecule is preferably used. The aromatic ring compound preferably contains a carboxyl group, a sulfonic acid group, a hydroxyl group, and an alkoxy group. Specifically, a tetrazole derivative, a 1,2,3-triazole derivative, and a 1,2,4-triazole derivative are preferable.

For a tetrazole derivative that can be used as an anticorrosive agent, a series of examples are: there is no substituent on the nitrogen atom forming the tetrazole ring, and it is introduced at the 5-position of the tetrazole to be selected from the group consisting of: sulfonic acid group, amine group, Substituted groups consisting of carbamate, carboxylic acid amine, sulfazone, and sulfazone, or selected from the group consisting of: hydroxyl, carboxyl, sulfonate, amine, carbamoyl, carboxy An alkyl group substituted with at least one substituent in a group of acid sulfonylamino, sulfanilino, and sulfanilino.

In addition, in the case of 1,2,3-triazole derivatives that can be used as corrosion inhibitors, a series of examples: there is no substituent on the nitrogen atom forming the 1,2,3-triazole ring, and The 4- and / or 5-positions of 3,3-triazole are introduced to be selected from the group consisting of: hydroxyl, carboxyl, sulfonic acid, amine, carbamoyl, carboxylic acid amine, sulfamonium, and sulfamonium The substituents of the group formed, or at least one selected from the group consisting of: hydroxyl, carboxyl, sulfonic acid, amine, carbamoyl, carboxylic acid amine, sulfamoyl, and sulfamoyl Alkyl or aryl substituted with one substituent.

In addition, in the case of 1,2,4-triazole derivatives that can be used as corrosion inhibitors, a series of examples: there is no substituent on the nitrogen atom forming the 1,2,4-triazole ring, and The 2- and / or 5-positions of 4,4-triazole are introduced to be selected from the group consisting of a sulfonic acid group, a carbamoyl group, a carboxylic acid amine group, an amine sulfonyl group, and a sulfonyl amine group. , Or selected from at least one substituent substituted by a group consisting of: hydroxyl, carboxyl, sulfonic acid, amine, carbamoyl, carboxylic acid amine, sulfamonium, and sulfamolamido Alkyl or aryl.

As described above, the cutting fluid supplied from the cutting fluid supply nozzle 56 contains an oxidizing agent. Therefore, in the conventional biological treatment using microorganisms, the oxidizing agent may destroy the microorganisms, and the organic matter in the cutting waste liquid cannot be decomposed. Drain the cutting waste liquid that does not meet the drainage standards.

However, in the present embodiment, since a waste liquid treatment layer 84 having a waste liquid treatment means is provided in the middle of the drain pipe 82, the cutting waste liquid stored in the treatment layer 84 is irradiated with ultraviolet rays by a plurality of LEDs 86, so that Since the organic matter in the cutting waste liquid is decomposed, it is possible to prevent the cutting waste liquid that does not meet the drainage standard from being drained.

In the above-mentioned embodiment, the case where the package substrate 2 is used as the object to be processed is explained. However, the object to be processed is not limited to the package substrate, and may be a conductor having a thickness of several μm as a back electrode. Films (multi-layer metal films made of Ti, Ni, Au, etc.), wafers, and wafers on which TEGs are formed on streets on the surface.

When a cutting device 20 having a waste liquid treatment layer 84 having an LED 86 as the waste liquid treatment means is used to cut the package substrate 2 while supplying a cutting liquid containing an organic acid and an oxidizing agent, the oxidizing agent is decomposed to use the Wavelength of light energy, rather than additives, thereby eliminating the need for additives or temperature management and reducing operating costs.

In the above-mentioned embodiment, an example is described in which the waste liquid treatment layer 84 irradiated with ultraviolet rays from the LED 86 is used for the waste liquid treatment of the cutting device. Grinding equipment, cutting tool cutting equipment and other processing equipment.

2‧‧‧ package substrate

4‧‧‧ metal frame (lead frame)

5‧‧‧ Outer peripheral area

5a‧‧‧ non-component area

6a, 6b, 6c ‧‧‧ component area

8‧‧‧ divided scheduled line

10‧‧‧Component wafer loading section

12‧‧‧ electrode

14‧‧‧Compression resin layer

20‧‧‧ cutting device

22‧‧‧ base

24‧‧‧ Water cover

24a‧‧‧on board

24b‧‧‧Side

26‧‧‧Platform base

28‧‧‧ Attraction

30‧‧‧Snake belly

32‧‧‧ Pillar

34‧‧‧rail

36‧‧‧Y-axis moving block

38‧‧‧ball screw

40‧‧‧Y-axis moving mechanism (step feed mechanism)

42‧‧‧rail

44‧‧‧Z axis moving block

46‧‧‧ball screw

48‧‧‧Pulse motor

50‧‧‧Z-axis moving mechanism

52‧‧‧cutting unit

54‧‧‧Cutter

56‧‧‧ cutting fluid supply nozzle

58‧‧‧ camera unit

60‧‧‧Water tank

62‧‧‧ floor

63‧‧‧ opening

64‧‧‧Inner peripheral wall

66‧‧‧outer wall

68‧‧‧Aqueduct Department

70‧‧‧ drain port

72‧‧‧ cutting feed mechanism

74‧‧‧ball screw

76‧‧‧rail

78‧‧‧ movable plate

80‧‧‧ Motor

82‧‧‧ cylindrical member

82‧‧‧Drain tube

84‧‧‧Waste liquid treatment layer

86‧‧‧LED

88‧‧‧Transparent board

FIG. 1 (A) is a plan view of a package substrate, FIG. 1 (B) is a back view of the package substrate, and FIG. 1 (C) is a side view of the package substrate.

FIG. 2 is a perspective view of a cutting device suitable for cutting the package substrate shown in FIG. 1. FIG.

Fig. 3 is a perspective view of a cutting feed means and a water tank of a cutting device.

4 is a cross-sectional view of a treatment layer having a waste liquid treatment means.

Claims (2)

A processing device includes: a holding means for holding a workpiece; and a processing means for processing a workpiece to be held by the holding means. The processing device is characterized in that: It also has: A processing fluid supply means is to supply at least a processing fluid containing an oxidant to the processed object when the processed object held by the holding means is processed by the processing method; A processing waste liquid recovery unit for recovering a processing waste liquid containing the processing liquid supplied to the workpiece by the processing liquid supply means; A discharge path for the processing waste liquid recovery part to discharge the processing waste liquid out of the processing device; and The treatment layer is a waste liquid treatment means that is disposed in the middle of the discharge path and stores the processing waste liquid recovered in the processing waste liquid recovery unit and decomposes the processing liquid included in the processing waste liquid. For example, the processing device of the scope of application for a patent, wherein the oxidant is hydrogen peroxide, and the waste liquid treatment means includes an ultraviolet irradiation means for irradiating the processing waste liquid with ultraviolet rays.