TWI801498B - Processing device - Google Patents

Abstract

Provides a solution to reduce process effluents that will not meet drainage standards Processing equipment that may cause drainage.

The processing device of the present invention is provided with: keep the processed A holding means for an object, and a processing means for processing a workpiece held in the holding means. When a workpiece is processed by the processing means, at least a processing fluid containing an oxidizing agent is supplied to the workpiece; a processing waste liquid recovery unit recovers the processing fluid containing the processing fluid supplied to the workpiece by the processing fluid supply means processing waste liquid; a discharge path that discharges the processing waste liquid out of the processing device from the processing waste liquid recovery unit; and a treatment tank that is arranged in the middle of the discharge path and stores the processing waste liquid The liquid recovery unit collects the processing waste liquid and has waste liquid treatment means for decomposing the processing liquid contained in the processing waste liquid.

Description

Processing device

The present invention relates to processing devices such as a cutting device, a grinding device, and a cutting device (bite) cutting device, which perform processing while supplying a processing fluid when processing a workpiece.

If a metal workpiece is cut with a cutting blade, the cutting blade will be clogged and burrs will occur on the metal part. Due to the generated burrs, problems such as short-circuiting between terminals of components formed on the workpiece, and bonding failure due to burrs falling on the bonding pads during processing of the workpiece occur.

In order to solve this problem, Japanese Patent Laid-Open No. 2015-177089 proposes a method of cutting a workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent. According to this cutting method, the metal is modified by the organic acid contained in the cutting fluid and the ductility is suppressed. As a result, the occurrence of burrs is suppressed, and since the cutting fluid contains an oxidizing agent, the quality of the film formed on the metal surface due to the cutting fluid changes, and the metal system loses ductility and is easily removed to promote machinability.

[Prior Art Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open No. 2015-177089

However, according to the drainage standard of the area where the cutting device is used, the cutting waste fluid containing the cutting fluid cannot be directly drained, and the organic matter in the cutting waste fluid is decomposed before being drained by biological treatment using microorganisms.

However, if the cutting fluid contains an oxidizing agent, the microorganisms used in the biological treatment will die due to the oxidizing agent, and the organic matter in the cutting waste liquid will not be decomposed, and the cutting waste liquid that does not meet the drainage standards may be discharged. The problems shown above are not limited to cutting devices, but also occur in other processing devices such as grinding devices using machining fluids, cutting tools and cutting devices.

The present invention was made in view of the circumstances as described above, and an object of the present invention is to provide a processing device capable of reducing the possibility of discharging processing waste liquid that does not meet the discharge standards.

According to the present invention, a processing device is provided, which is provided with: a holding means for holding a workpiece, and a processing means for processing the workpiece held by the holding means, and the processing device is characterized in that: : The machining fluid supply means, which system will be kept in the hold When the processed object of the means is processed by the processing means, at least the processing liquid containing an oxidizing agent is supplied to the processed object; liquid processing waste liquid; discharge path, which is used to discharge the processing waste liquid from the processing waste liquid recovery unit to the outside of the processing device; and treatment tank, which is arranged on the way of the discharge path and stored in the The processing waste liquid recovery unit collects the processing waste liquid and has waste liquid treatment means for decomposing the processing liquid contained in the processing waste liquid.

Preferably, the oxidizing agent is hydrogen peroxide, and the waste liquid treatment means includes ultraviolet irradiation means for irradiating ultraviolet rays to the processing waste liquid.

The processing device of the present invention is equipped with processing waste liquid stored in the processing waste liquid recovery part and is recovered, and has a treatment tank with a waste liquid treatment means for decomposing the processing liquid contained in the processing waste liquid, so it can reduce the amount of unsuitable drainage. There is a risk that the standard processing waste liquid will be drained.

2: Package substrate

4: Metal frame (lead frame)

5: The remaining area of the outer periphery

5a: Non-component area

6a, 6b, 6c: component area

8: Split schedule line

10: Component wafer loading part

12: Electrode

14: Compression molding resin layer

20: Cutting device

22: base

24: water cover

24a: upper plate

24b: side panel

26: Platform base

28: suction port

30: snake belly

32: Pillar

34: guide rail

36: Y-axis moving block

38: Ball screw

40: Y-axis moving mechanism (gradual feeding mechanism)

42: guide rail

44: Z-axis moving block

46: Ball screw

48: Pulse motor

50: Z-axis moving mechanism

52: Cutting unit

54: Cutter

56: Cutting fluid supply nozzle

58: Camera unit

60: water tank

62: Bottom plate

63: Opening

64: inner peripheral wall

66:Peripheral wall

68: Aqueduct department

70: drain port

72: Cutting feed mechanism

74: Ball screw

76: guide rail

78: Movable plate

80: motor

81: Cylindrical member

82: drain pipe

84: waste liquid treatment tank

86:LED

88:Transparent board

1(A) is a plan view of a package substrate, FIG. 1(B) is a rear view of the package substrate, and FIG. 1(C) is a side view of the package substrate.

FIG. 2 is a perspective view of a cutting device suitable for cutting the package substrate shown in FIG. 1 .

Figure 3 is the oblique view of the cutting feed means and the water tank of the cutting device picture.

Fig. 4 is a cross-sectional view of a treatment tank with waste liquid treatment means.

Embodiments of the present invention will be described in detail below with reference to the drawings. Referring to FIG. 1(A), there is shown a plan view of an example of a package substrate 2 suitable for processing by a cutting device according to an embodiment of the present invention. FIG. 1(B) is a rear view of the package substrate 2 , and FIG. 1(C) is a side view of the package substrate 2 .

The package substrate 2 has a rectangular metal frame (lead frame) 4, and in the area surrounded by the remaining peripheral area 5 and the non-component area 5a of the metal frame 4, there are three in the illustrated example. Element regions 6a, 6b, 6c.

In each of the element regions 6a, 6b, and 6c, element wafer mounts 10 are formed in a plurality of regions defined by dividing lines 8 arranged vertically and horizontally perpendicularly to each other, and element wafer mounts 10 are formed along each element wafer mount. Multiple electrodes 12 are formed on four sides of 10 .

The electrodes 12 are insulated from each other by a molded resin layer 14 molded on the metal frame 4 . By cutting the planned dividing line 8 extending in the first direction and the dividing planned line 8 extending in the second direction perpendicular to the first direction, electrodes 12 of each element chip appear on both sides of the cut trench.

An unillustrated element chip is mounted on the back surface of each element chip mounting portion 10 in the element regions 6a, 6b, 6c, and electrodes provided on each element chip are connected to electrodes 12 by bonding wires.

Next, each element wafer in the element regions 6a, 6b, 6c is A stamper resin layer 14 is formed on the back surface of each element region 6a, 6b, 6c so as to be sealed with resin.

Referring to FIG. 2, it shows a perspective view of a cutting device 20 according to an embodiment of the present invention. The cutting device 20 shown in FIG. 2 is a manual type cutting device in which the operator places the workpiece to be cut on the holding means or carries it out from the holding means.

22 is a base of the cutting device 20 , and a table base 26 is disposed on the base 22 so as to be rotatable and reciprocating in the X-axis direction by a cutting feed mechanism not shown. An opening connected to a suction port 28 of a suction source is formed in a roughly central portion of the platform base 26 .

When processing the package substrate 2 , the jig platform disclosed in Japanese Patent Application Laid-Open No. 2011-040542 is mounted on the platform base 26 , and the package substrate 2 is attracted and held through the jig platform. That is, in the cutting device of this embodiment, the holding means is constituted by the platform base and the jig platform.

A water cover 24 is arranged around the platform base 26, and a bellows 30 for protecting the shaft of the cutting feed mechanism is connected between the water cover 24 and the water tank 60 shown in FIG. 3 .

A door-shaped pillar 32 is erected behind the base 22 . A pair of guide rails 34 extending in the Y-axis direction are fixed to the pillar 32 . The support 32 is equipped with a Y-axis moving block 36 that can move in the Y-axis direction along the guide rail 34 by using a Y-axis moving mechanism (step feeding mechanism) 40 composed of a ball screw 38 and a pulse motor not shown in the figure. .

A pair of guide rails 42 extending in the Z-axis direction are fixed to the Y-axis moving block 36 . On the Y-axis moving block 36, the ball screw 46 is used to The Z-axis moving mechanism 50 constituted by the pulse motor 48 is guided by the guide rail 42 to be movable in the Z-axis direction, and the Z-axis moving block 44 is mounted thereon.

A cutting unit 52 as a processing means is installed in the Z-axis moving block 44, and an unillustrated spindle is rotatably accommodated in the spindle housing 53 of the cutting unit 52, and can be installed at the front end of the spindle. A cutter 54 is detachably attached.

On both sides of the cutting blade 54, a pair of cutting fluid supply nozzles 56 are disposed on both sides of the cutting blade 54 as a machining fluid supply means. During cutting of the package substrate 2 held by the holding means, the cutting fluid is fed The cutting fluid is supplied from the supply nozzle 56 , and the package substrate 2 is cut with the cutting blade 54 .

A camera unit 58 having a microscope and a camera is additionally installed on the Z-axis moving block 44 . The imaging unit 58 is provided with an imaging camera for imaging the workpiece with visible light.

When cutting the package substrate 2 sucked and held on the chuck table 26 with the cutting blade 54 while supplying cutting fluid containing an organic acid and an oxidizing agent from the cutting water supply nozzle 56, the cutting fluid and cutting waste fluid containing cutting chips are Both ends of the bellows 30 in the short direction (Y-axis direction) flow down toward the water tank 60 shown in FIG. 3 .

The water tank 60 is arranged under the moving path of the platform base 26, and in order to make the platform base 26 reciprocate in the X-axis direction, a rectangular opening 63 is provided at the center of the bottom plate 62 of the box-shaped member. The water tank 60 includes: a drain pipe 68 formed by a bottom plate 62 , an inner peripheral wall 64 and an outer peripheral wall 66 and receiving the cutting fluid as a processing waste recovery part; and a liquid discharge port 70 formed on the bottom plate 62 . The drain port 70 is connected with a It serves as one end of the discharge pipe 82 of the discharge path.

The water cover 24 is composed of a pair of side plates 24b suspended from both ends of a planar upper plate 24a, and the ends of the upper plate 24a and the two side plates 24b are slidably engaged with the inner peripheral wall 64 constituting the water tank 60. combine.

The cutting feed mechanism 72 is composed of: a ball screw 74 elongated in the X-axis direction; a pair of guide rails 76 arranged in parallel with the ball screw 74; a motor 80 connected to one end of the ball screw 74; and a screw housed inside. The cap is screwed to the ball screw 74 , and the bottom is slidably connected to the movable plate 78 of the guide rail 76 .

When the ball screw 74 is rotated by the motor 80 , the movable plate 78 is guided by the pair of guide rails 76 to reciprocate in the X-axis direction. A cylindrical member 81 is attached to the movable plate 78 , and a rotation mechanism for rotating the stage base 26 is accommodated inside the cylindrical member 81 .

As shown in Figure 2 and Figure 4, in the middle of the drain pipe (drainage path) 82 connected to the drain port 70 of the water tank 60, a treatment tank 84 is arranged, which is stored in the processing waste liquid recovery part. The aqueduct section 68 collects the recovered processing waste liquid and has a waste liquid treatment means for decomposing the processing liquid contained in the processing waste liquid.

In this embodiment, the waste liquid treatment means is constituted by a plurality of LEDs 86 arranged on the bottom wall and side walls of the treatment tank 84 . The wavelength of the ultraviolet light (UV light) irradiated by LED86 is preferably 340 nm or less, more preferably 300 nm or less.

The LED 86 is covered with a transparent plate 88 so that the processing waste liquid stored in the processing tank 84 does not come into contact with the LED 86 . to be stored The processing waste liquid in the processing tank 84 is irradiated with ultraviolet light by the LED 86, and the processing liquid (cutting liquid) contained in the processing waste liquid (cutting waste liquid) is decomposed.

When cutting the package substrate 2 shown in FIG. 1 with the cutting device 2 according to the embodiment of the present invention, the cutting is completed while supplying the cutting fluid containing organic acid and oxidizing agent to the processing point where the cutting blade 54 cuts into the package substrate 2 .

The organic acid contained in the cutting fluid can modify the metal contained in the package substrate 2 to suppress ductility while cutting the package substrate 2 . Therefore, no burrs are generated from the metal due to the cutting. In addition, by using an oxidizing agent, the surface of the metal can be oxidized to reduce the ductility of the metal and improve the workability of the metal surface.

As the organic acid, for example, a compound having at least one carboxyl group and at least one amino group in the molecule can be used. In this case, at least one of the amine groups is preferably a secondary or tertiary amino group. In addition, the compound used as an organic acid may have a substituent.

In terms of amino acids that can be used as organic acids, the series include: glycine, dihydroxyethylglycine, glycylglycine, hydroxyethylglycine, N-methylglycine Acid, β-alanine, L-alanine, L-2-aminobutyric acid, L-norvaline, L-valine, L-leucine, L-norleucine, L-beta - Isoleucine, L-Isoleucine, L-Phenylalanine, L-Proline, Sarcosine, L-Ornithine, L-Lysine, Taurine, L-Serine acid, L-threonine, L-allo-threonine, L-homoserine, L-thyroxine, L-tyrosine, 3,5-diiodo-L-tyrosine, β-(3 ,4-dihydroxyphenyl)-L-alanine, 4-hydroxy-L-proline, L-cysteine, L-methionine, L-ethylthio amino acid, L-lanthionine, L-cystathionine, L-cystine, L-oxidized cysteine, L-glutamic acid, L-aspartic acid, S-(carboxymethyl) -L-cysteine, 4-aminobutyric acid, L-asparagine, L-glutamine, acriserine, L-canavanine, L-citrulline, L-spermine acid, delta-hydroxy-L-lysine, creatine, L-kynurenine, L-histidine, 1-methyl-L-histidine, 3-methyl-L-histidine, L-tryptophan, actinomycin C1, ergothiol, melittin, type I angiotensin, type II angiotensin, and antipain, etc. Among them, glycine, L-alanine, L-proline, L-histidine, L-lysine, and dihydroxyethylglycine are also preferable.

In addition, in terms of amino polyacids that can be used as organic acids, the series include: iminodiacetic acid, cyanotriacetic acid, diethylenetriaminepentaacetic acid, ethylenediaminetetraacetic acid, hydroxyethylimino Diacetic acid, nitrile trimethylene phosphonic acid, ethylenediamine-N,N,N',N'-tetramethylenesulfonic acid, 1,2-diaminopropane tetraacetic acid, glycol ether diamine tetraacetic acid , transcyclohexanediaminetetraacetic acid, ethylenediamine-o-hydroxyphenylacetic acid, ethylenediaminedisuccinic acid (SS isomer), β-alanine diacetic acid, N-(2-carboxylate ethyl base)-L-aspartic acid, N,N'-bis(2-hydroxybenzyl)ethylenediamine-N,N'-diacetic acid, etc.

In addition, in terms of carboxylic acids that can be used as organic acids, formic acid, glycolic acid, propionic acid, acetic acid, butyric acid, isovaleric acid, hexane acid, oxalic acid, malonic acid, glutaric acid, hexanoic acid, etc. Saturated carboxylic acids such as diacid, malic acid, succinic acid, pimelic acid, thioglycolic acid, glyoxylic acid, chlorinated acetic acid, pyruvic acid, acetylacetic acid, glutaric acid; or acrylic acid, methacrylic acid, crotonic acid , fumaric acid, maleic acid, mesaconic acid, citraconic acid, aconitic acid and other unsaturated carboxylic acids; benzoic acids, methylbenzoic acid, phthalic acid Cyclic unsaturated carboxylic acids such as naphthoic acids, pyromellitic acid, naphthalene dicarboxylic acid, etc.

As an oxidizing agent, for example: hydrogen peroxide, peroxide, nitrate, iodate, periodate, hypochlorite, chlorite, chlorate, perchlorate, perchlorate, Sulfate, dichromate, permanganate, cerate, vanadate, ozone water, silver (divalent) salt, iron (trivalent) salt; and organic complex salts, etc.

In addition, anti-corrosion agent can also be mixed in cutting fluid. By mixing the anticorrosion agent, the corrosion (melting out) of the metal contained in the QFN substrate 10 can be prevented. As a corrosion inhibitor, it is preferable to use, for example, a heteroaromatic compound having 3 or more nitrogen atoms in the molecule and having a condensed ring structure, or a heteroaromatic compound having 4 or more nitrogen atoms in the molecule. In addition, the aromatic ring compound preferably contains: carboxyl, sulfonic acid, hydroxyl, and alkoxy. Specifically, tetrazole derivatives, 1,2,3-triazole derivatives, and 1,2,4-triazole derivatives are preferable.

In terms of tetrazole derivatives that can be used as corrosion inhibitors, the series include: no substituent on the nitrogen atom forming the tetrazole ring, and introduced at the 5-position of the tetrazole to be selected from: sulfonic acid group, amine group, Carboxylic acid amido group, carboxylic acid amido group, sulfamoyl group, and substituent group of sulfonamide group, or selected from: hydroxyl, carboxyl, sulfonic acid group, amino group, carboxyl group, carboxyl group An alkyl group substituted with at least one substituent of the group consisting of an acid amide group, an sulfamoyl group, and a sulfonamide group.

In addition, for the 1,2,3-triazole derivatives that can be used as corrosion inhibitors, the series include: there is no substituent on the nitrogen atom forming the 1,2,3-triazole ring, and the 1,2 , the 4- and/or 5-position of 3-triazole is introduced to be selected from A substituent group consisting of: hydroxyl, carboxyl, sulfonic acid, amino, carbamoyl, carboxylic acid amido, sulfamoyl, and sulfonamide, or selected from: hydroxyl, carboxyl, An alkyl or aryl group substituted with at least one substituent from the group consisting of a sulfonic acid group, an amino group, a carbamoyl group, a carboxylic acid amido group, an sulfamoyl group, and a sulfonamide group.

In addition, for the 1,2,4-triazole derivatives that can be used as corrosion inhibitors, the series include: there is no substituent on the nitrogen atom forming the 1,2,4-triazole ring, and the 1,2 , the 2-position and/or 5-position of 4-triazole are introduced to be selected from the group consisting of sulfonic acid group, carbamoyl group, carboxylic acid amido group, sulfamoyl group, and sulfonamide group , or substituted by at least one substituent selected from the group consisting of: hydroxyl, carboxyl, sulfonic acid, amino, carbamoyl, carboxylic acid amido, sulfamoyl, and sulfonamide Alkyl or aryl.

As mentioned above, the cutting fluid supplied from the cutting fluid supply nozzle 56 contains an oxidizing agent. Therefore, due to the oxidizing agent, in the conventional biological treatment using microorganisms, the microorganisms will die, and the organic matter in the cutting waste fluid cannot be decomposed. There is a risk of draining cutting waste fluid that does not meet the drainage criteria.

However, in the present embodiment, since the waste liquid treatment tank 84 having a waste liquid treatment means is provided in the middle of the drain pipe 82, the cutting waste liquid stored in the treatment tank 84 is irradiated with ultraviolet rays by a plurality of LEDs 86, so that Organic matter in the cutting waste fluid is decomposed, so the risk of draining the cutting waste fluid that does not meet the drainage standards can be prevented.

In the above-mentioned embodiment, an example of using the package substrate 2 as the object to be processed was described, but the object to be processed is not limited to the package The substrate can also be a wafer including a conductor film (a multilayer metal film made of Ti, Ni, Au, etc.) laminated with a thickness of several μm as the back electrode, and a dicing line (street) formed on the surface TEG wafers and others.

When the cutting device 20 equipped with the waste liquid treatment tank 84 having the LED 86 as the above-mentioned waste liquid treatment means cuts the package substrate 2 while supplying cutting fluid containing an organic acid and an oxidizing agent, the decomposition of the oxidizing agent utilizes the The light energy of the wavelength is not additive, so that no additive or temperature management is required and the running cost can be kept low.

In the above-mentioned embodiment, the example in which the waste liquid treatment tank 84 irradiated with ultraviolet rays by the LED 86 is used for the waste liquid treatment of the cutting device is described, but the waste liquid treatment tank 84 is not limited to the cutting device, and can be similarly applied to Grinding device, cutting tool cutting device and other processing devices.

82: drain pipe

84: waste liquid treatment tank

86:LED

88:Transparent board

Claims (1)

A processing device comprising: a holding means for holding a workpiece, and a processing means for processing the workpiece held by the holding means, the processing device is characterized by further comprising: a processing fluid supply means , which is to supply at least a processing liquid containing an oxidizing agent to the processed object when the processed object held in the holding means is processed by the processing means; the processing waste liquid recovery part is located at the base of the processing device The interior of the processing liquid is used to recover the processing waste liquid containing the processing liquid supplied to the workpiece by the processing liquid supply means; the discharge path is located inside the base of the processing device, and the processing waste liquid recovery part The processing waste liquid is discharged to the outside of the processing device; and a processing tank, which is arranged in the middle of the discharge path and stores the processing waste liquid recovered in the processing waste liquid recovery part, and has a storage tank for the processing waste liquid The waste liquid treatment means for decomposing the included processing liquid, the oxidizing agent is hydrogen peroxide, and the waste liquid treatment means includes: ultraviolet irradiation means for irradiating ultraviolet rays to the processing waste liquid.

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