KR20190069464A - 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 - Google Patents

밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 Download PDF

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Publication number
KR20190069464A
KR20190069464A KR1020197013177A KR20197013177A KR20190069464A KR 20190069464 A KR20190069464 A KR 20190069464A KR 1020197013177 A KR1020197013177 A KR 1020197013177A KR 20197013177 A KR20197013177 A KR 20197013177A KR 20190069464 A KR20190069464 A KR 20190069464A
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South Korea
Prior art keywords
inorganic filler
resin composition
sealing
mass
average particle
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Ceased
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KR1020197013177A
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English (en)
Korean (ko)
Inventor
유마 다케우치
히사토 다카하시
요시히토 이나바
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히타치가세이가부시끼가이샤
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=61905596&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20190069464(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 히타치가세이가부시끼가이샤 filed Critical 히타치가세이가부시끼가이샤
Priority to KR1020227038211A priority Critical patent/KR102725565B1/ko
Publication of KR20190069464A publication Critical patent/KR20190069464A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • H01L21/56—
    • H01L23/29—
    • H01L23/31—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Epoxy Resins (AREA)
KR1020197013177A 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 Ceased KR20190069464A (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020227038211A KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-202714 2016-10-14
JP2016202714 2016-10-14
PCT/JP2017/034810 WO2018070237A1 (ja) 2016-10-14 2017-09-26 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020227038211A Division KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

Publications (1)

Publication Number Publication Date
KR20190069464A true KR20190069464A (ko) 2019-06-19

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ID=61905596

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KR1020197013177A Ceased KR20190069464A (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법
KR1020227038211A Active KR102725565B1 (ko) 2016-10-14 2017-09-26 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법

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Country Status (6)

Country Link
US (2) US11186742B2 (https=)
JP (2) JP7231821B2 (https=)
KR (2) KR20190069464A (https=)
CN (2) CN109844020A (https=)
TW (1) TWI753021B (https=)
WO (1) WO2018070237A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7231821B2 (ja) 2016-10-14 2023-03-02 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
TWI811215B (zh) * 2018-04-13 2023-08-11 日商力森諾科股份有限公司 密封用樹脂組成物、電子零件裝置及電子零件裝置的製造方法
JP7749318B2 (ja) * 2018-04-13 2025-10-06 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
JP7020343B2 (ja) * 2018-08-21 2022-02-16 昭和電工マテリアルズ株式会社 封止樹脂材料
CN114585684A (zh) * 2019-10-24 2022-06-03 松下知识产权经营株式会社 密封用树脂组合物及半导体装置
KR20230028272A (ko) * 2020-06-23 2023-02-28 나믹스 가부시끼가이샤 액상 컴프레션 몰드재
CN117736550A (zh) * 2022-09-15 2024-03-22 华为技术有限公司 树脂组合物及其制备方法和应用

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JP2010192525A (ja) 2009-02-16 2010-09-02 Namics Corp 半導体装置およびその製造方法
JP2011006618A (ja) 2009-06-26 2011-01-13 Namics Corp 封止用液状樹脂組成物、フリップチップ実装体およびその製造方法
JP2012107149A (ja) 2010-11-19 2012-06-07 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置

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JP4033257B2 (ja) 2002-04-08 2008-01-16 京セラケミカル株式会社 液状封止用樹脂組成物および半導体封止装置
JP4516779B2 (ja) 2004-04-14 2010-08-04 株式会社アドマテックス 金属酸化物表面処理粒子、その製造方法および樹脂組成物の製造方法
JP4460968B2 (ja) * 2004-07-27 2010-05-12 株式会社アドマテックス 樹脂組成物の製造方法
JP5042529B2 (ja) 2005-05-30 2012-10-03 株式会社アドマテックス 微小粒子含有組成物及びその製造方法
JP4967353B2 (ja) * 2006-01-31 2012-07-04 住友ベークライト株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5162160B2 (ja) 2007-06-04 2013-03-13 サンダイヤポリマー株式会社 吸収性樹脂粒子、この製造方法、これを含む吸収体及び吸収性物品
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TWI673318B (zh) 2013-11-29 2019-10-01 日商納美仕股份有限公司 環氧樹脂組成物、半導體密封劑及半導體裝置
JP6196138B2 (ja) * 2013-11-29 2017-09-13 ナミックス株式会社 半導体封止剤および半導体装置
JP6656792B2 (ja) * 2014-03-28 2020-03-04 日立化成株式会社 電子部品用液状樹脂組成物及び電子部品装置
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JP6800140B2 (ja) 2015-03-19 2020-12-16 ナミックス株式会社 フリップチップ実装体の製造方法、フリップチップ実装体、および先供給型アンダーフィル用樹脂組成物
JP7231821B2 (ja) 2016-10-14 2023-03-02 株式会社レゾナック 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010192525A (ja) 2009-02-16 2010-09-02 Namics Corp 半導体装置およびその製造方法
JP2011006618A (ja) 2009-06-26 2011-01-13 Namics Corp 封止用液状樹脂組成物、フリップチップ実装体およびその製造方法
JP2012107149A (ja) 2010-11-19 2012-06-07 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物および半導体装置

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TW201817808A (zh) 2018-05-16
WO2018070237A1 (ja) 2018-04-19
JPWO2018070237A1 (ja) 2019-09-05
JP2023016887A (ja) 2023-02-02
TWI753021B (zh) 2022-01-21
US11186742B2 (en) 2021-11-30
WO2018070237A9 (ja) 2018-06-14
US20210363380A1 (en) 2021-11-25
JP7513074B2 (ja) 2024-07-09
KR20220152583A (ko) 2022-11-16
US11873414B2 (en) 2024-01-16
JP7231821B2 (ja) 2023-03-02
CN109844020A (zh) 2019-06-04
KR102725565B1 (ko) 2024-11-05
US20190233672A1 (en) 2019-08-01
CN120399400A (zh) 2025-08-01

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