KR20190053293A - 코팅 장치 및 방법 - Google Patents

코팅 장치 및 방법 Download PDF

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Publication number
KR20190053293A
KR20190053293A KR1020197013377A KR20197013377A KR20190053293A KR 20190053293 A KR20190053293 A KR 20190053293A KR 1020197013377 A KR1020197013377 A KR 1020197013377A KR 20197013377 A KR20197013377 A KR 20197013377A KR 20190053293 A KR20190053293 A KR 20190053293A
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KR
South Korea
Prior art keywords
chamber
transfer
layer
processing
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020197013377A
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English (en)
Korean (ko)
Inventor
에르칸 코파랄
안드레아스 클뢰펠
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20190053293A publication Critical patent/KR20190053293A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50—Multilayers
    • B05D7/56—Three layers or more
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/18—Metallic material, boron or silicon on other inorganic substrates
    • C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3314—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C13/00—Means for manipulating or holding work, e.g. for separate articles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Inorganic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020197013377A 2011-02-21 2012-02-21 코팅 장치 및 방법 Ceased KR20190053293A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11155238.6A EP2489759B1 (en) 2011-02-21 2011-02-21 System for utilization improvement of process chambers and method of operating thereof
EP11155238.6 2011-02-21
PCT/EP2012/052935 WO2012113792A1 (en) 2011-02-21 2012-02-21 Coating apparatus and method.

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020137024539A Division KR102095717B1 (ko) 2011-02-21 2012-02-21 코팅 장치 및 방법

Publications (1)

Publication Number Publication Date
KR20190053293A true KR20190053293A (ko) 2019-05-17

Family

ID=44243134

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197013377A Ceased KR20190053293A (ko) 2011-02-21 2012-02-21 코팅 장치 및 방법
KR1020137024539A Active KR102095717B1 (ko) 2011-02-21 2012-02-21 코팅 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020137024539A Active KR102095717B1 (ko) 2011-02-21 2012-02-21 코팅 장치 및 방법

Country Status (7)

Country Link
US (2) US20120213938A1 (https=)
EP (2) EP2489759B1 (https=)
JP (1) JP5945553B2 (https=)
KR (2) KR20190053293A (https=)
CN (1) CN102803551B (https=)
TW (1) TWI579952B (https=)
WO (1) WO2012113792A1 (https=)

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TWI468538B (zh) * 2011-10-14 2015-01-11 晟銘電子科技股份有限公司 屏蔽層製造方法
WO2014037058A1 (en) * 2012-09-10 2014-03-13 Applied Materials, Inc. Substrate transfer device and method of moving substrates
TWI582256B (zh) 2013-02-04 2017-05-11 愛發科股份有限公司 薄型基板處理裝置
WO2015149848A1 (en) * 2014-04-02 2015-10-08 Applied Materials, Inc. System for substrate processing, vacuum rotation module for a system for substrate processing and method of operating a substrate processing system
TWI557837B (zh) * 2014-04-10 2016-11-11 Uvat Technology Co Ltd Vacuum equipment multi-vehicle simultaneous multi-processing process
TWI676227B (zh) * 2015-01-23 2019-11-01 美商應用材料股份有限公司 半導體工藝設備
CN208240622U (zh) * 2015-05-22 2018-12-14 应用材料公司 用于装载及卸载基板的负载锁定腔室和直列基板处理系统
US9972740B2 (en) * 2015-06-07 2018-05-15 Tesla, Inc. Chemical vapor deposition tool and process for fabrication of photovoltaic structures
DE102015013799A1 (de) * 2015-10-26 2017-04-27 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zum Beschichten überlanger flächenhafter Substrate, insbesondere Glasscheiben, in einer Vakuum-Beschichtungsanlage
CN105239051B (zh) * 2015-11-17 2018-11-30 广东腾胜真空技术工程有限公司 双向进出交替镀膜装置及方法
US9748434B1 (en) 2016-05-24 2017-08-29 Tesla, Inc. Systems, method and apparatus for curing conductive paste
US9954136B2 (en) 2016-08-03 2018-04-24 Tesla, Inc. Cassette optimized for an inline annealing system
JP6830772B2 (ja) * 2016-08-04 2021-02-17 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
US10115856B2 (en) 2016-10-31 2018-10-30 Tesla, Inc. System and method for curing conductive paste using induction heating
KR20180086715A (ko) * 2017-01-23 2018-08-01 어플라이드 머티어리얼스, 인코포레이티드 반송챔버, 이를 포함하는 기판처리시스템 및 이를 이용한 기판처리시스템의 기판처리방법
US10043693B1 (en) * 2017-06-06 2018-08-07 Applied Materials, Inc. Method and apparatus for handling substrates in a processing system having a buffer chamber
WO2021013361A1 (en) * 2019-07-25 2021-01-28 Applied Materials, Inc. Substrate processing system for processing of a plurality of substrates and method of processing a substrate in an in-line substrate processing system
CN115516657A (zh) 2020-01-22 2022-12-23 应用材料公司 Oled层厚度和掺杂剂浓度的产线内监测
CN115088092A (zh) 2020-01-22 2022-09-20 应用材料公司 Oled层厚度和掺杂剂浓度的产线内监测
KR102866529B1 (ko) 2020-10-28 2025-09-30 삼성전자주식회사 반도체 소자의 제조 장치
CN118742669A (zh) * 2022-03-14 2024-10-01 应用材料公司 真空沉积系统和在真空沉积系统中涂覆基板的方法
TWI843196B (zh) * 2022-09-08 2024-05-21 凌嘉科技股份有限公司 旋轉移載式立式鍍膜設備及雙面多層膜的鍍膜方法
CN117702070A (zh) * 2022-09-08 2024-03-15 凌嘉科技股份有限公司 旋转移载式立式镀膜设备及双面多层膜的镀膜方法
WO2026062408A1 (en) * 2024-09-18 2026-03-26 Applied Materials, Inc. Vacuum deposition system and method of coating substrates in a vacuum deposition system

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IL43325A0 (en) * 1973-05-17 1973-11-28 Globe Amerada Glass Co Process and apparatus for manufacturing metal-coated glass
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JP2008199021A (ja) * 2007-02-09 2008-08-28 Applied Materials Inc 基板を処理するための設備における搬送装置
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CN102057076B (zh) * 2008-06-09 2013-03-06 应用材料公司 涂覆系统以及用于涂覆衬底的方法

Also Published As

Publication number Publication date
WO2012113792A1 (en) 2012-08-30
JP2014507565A (ja) 2014-03-27
KR20140015372A (ko) 2014-02-06
US9211563B2 (en) 2015-12-15
US20120213938A1 (en) 2012-08-23
EP2489759B1 (en) 2014-12-10
CN102803551B (zh) 2016-03-16
EP2489759A1 (en) 2012-08-22
EP2678462A1 (en) 2014-01-01
EP2678462B1 (en) 2017-07-26
TW201248760A (en) 2012-12-01
JP5945553B2 (ja) 2016-07-05
CN102803551A (zh) 2012-11-28
KR102095717B1 (ko) 2020-04-01
US20140044880A1 (en) 2014-02-13
TWI579952B (zh) 2017-04-21

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