KR20180115253A - 수지 밀봉 장치 및 수지 밀봉 방법 및 수지 밀봉용의 성형형 - Google Patents

수지 밀봉 장치 및 수지 밀봉 방법 및 수지 밀봉용의 성형형 Download PDF

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Publication number
KR20180115253A
KR20180115253A KR1020187015482A KR20187015482A KR20180115253A KR 20180115253 A KR20180115253 A KR 20180115253A KR 1020187015482 A KR1020187015482 A KR 1020187015482A KR 20187015482 A KR20187015482 A KR 20187015482A KR 20180115253 A KR20180115253 A KR 20180115253A
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KR
South Korea
Prior art keywords
mold
resin
film
substrate
functional member
Prior art date
Application number
KR1020187015482A
Other languages
English (en)
Korean (ko)
Inventor
다카시 다무라
나오키 다카다
히토시 기타
요시히사 가와모토
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20180115253A publication Critical patent/KR20180115253A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/34—Feeding the material to the mould or the compression means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020187015482A 2016-02-13 2017-01-30 수지 밀봉 장치 및 수지 밀봉 방법 및 수지 밀봉용의 성형형 KR20180115253A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016025379A JP6491120B2 (ja) 2016-02-13 2016-02-13 樹脂封止装置、樹脂封止方法及び樹脂成形品の製造方法
JPJP-P-2016-025379 2016-02-13
PCT/JP2017/003171 WO2017138386A1 (ja) 2016-02-13 2017-01-30 樹脂封止装置及び樹脂封止方法並びに樹脂封止用の成形型

Publications (1)

Publication Number Publication Date
KR20180115253A true KR20180115253A (ko) 2018-10-22

Family

ID=59563126

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187015482A KR20180115253A (ko) 2016-02-13 2017-01-30 수지 밀봉 장치 및 수지 밀봉 방법 및 수지 밀봉용의 성형형

Country Status (5)

Country Link
JP (1) JP6491120B2 (zh)
KR (1) KR20180115253A (zh)
CN (1) CN108352331A (zh)
TW (1) TW201801886A (zh)
WO (1) WO2017138386A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102504837B1 (ko) 2018-07-23 2023-02-28 삼성전자 주식회사 이형 필름 공급 장치를 포함하는 수지 성형 장치
WO2020129982A1 (ja) * 2018-12-21 2020-06-25 第一精工株式会社 樹脂封止方法、樹脂封止金型及び樹脂封止装置
CN112248339B (zh) * 2019-07-22 2022-09-09 Oppo广东移动通信有限公司 壳体、壳体的制造方法和电子设备
CN111314838B (zh) * 2020-02-25 2021-08-27 绍兴中芯集成电路制造股份有限公司 Mems麦克风器件的检测方法
CN113497174B (zh) * 2020-03-20 2023-05-23 东莞市中麒光电技术有限公司 小间距led显示屏模组及其制作方法
JP7498596B2 (ja) * 2020-05-25 2024-06-12 Ｔｏｗａ株式会社 樹脂成形装置、カバープレート及び樹脂成形品の製造方法
CN111799961B (zh) * 2020-06-19 2023-09-19 重庆金康动力新能源有限公司 电机转子及其端环铸造设备和方法
CN112060448A (zh) * 2020-08-28 2020-12-11 北京辉德商贸有限公司 一种板面品成型模具
JP7360407B2 (ja) * 2021-02-10 2023-10-12 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形品の製造方法
JP7073551B1 (ja) * 2021-02-12 2022-05-23 株式会社日本製鋼所 積層成形システムおよび積層成形方法
WO2024111255A1 (ja) * 2022-11-21 2024-05-30 株式会社村田製作所 圧縮樹脂封止成形装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6071216B2 (ja) * 2012-02-28 2017-02-01 Ｔｏｗａ株式会社 樹脂封止用材料の製造方法及び樹脂封止装置
JP5627619B2 (ja) * 2012-02-28 2014-11-19 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止体の製造方法
JP2014231185A (ja) * 2013-05-29 2014-12-11 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
WO2014192456A1 (ja) * 2013-05-29 2014-12-04 アピックヤマダ株式会社 樹脂モールド装置および樹脂モールド方法
JP6218666B2 (ja) * 2014-04-25 2017-10-25 Ｔｏｗａ株式会社 樹脂成形装置及び樹脂成形方法
JP6307374B2 (ja) * 2014-07-22 2018-04-04 アピックヤマダ株式会社 成形金型、成形装置および成形品の製造方法

Also Published As

Publication number Publication date
JP6491120B2 (ja) 2019-03-27
JP2017143232A (ja) 2017-08-17
CN108352331A (zh) 2018-07-31
TW201801886A (zh) 2018-01-16
WO2017138386A1 (ja) 2017-08-17

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