KR20180111840A - 집적 회로(ic) 패키지들 사이의 플렉시블 커넥터를 포함하는 통합 디바이스 - Google Patents

집적 회로(ic) 패키지들 사이의 플렉시블 커넥터를 포함하는 통합 디바이스 Download PDF

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Publication number
KR20180111840A
KR20180111840A KR1020187022909A KR20187022909A KR20180111840A KR 20180111840 A KR20180111840 A KR 20180111840A KR 1020187022909 A KR1020187022909 A KR 1020187022909A KR 20187022909 A KR20187022909 A KR 20187022909A KR 20180111840 A KR20180111840 A KR 20180111840A
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KR
South Korea
Prior art keywords
package
dielectric layer
integrated circuit
integrated
die
Prior art date
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Ceased
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KR1020187022909A
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English (en)
Korean (ko)
Inventor
홍복 위
재식 이
동욱 김
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퀄컴 인코포레이티드
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Publication of KR20180111840A publication Critical patent/KR20180111840A/ko
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H01L23/49833—
    • H01L21/4853—
    • H01L21/561—
    • H01L21/565—
    • H01L23/293—
    • H01L23/5387—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
KR1020187022909A 2016-02-10 2017-02-07 집적 회로(ic) 패키지들 사이의 플렉시블 커넥터를 포함하는 통합 디바이스 Ceased KR20180111840A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/040,881 2016-02-10
US15/040,881 US9633950B1 (en) 2016-02-10 2016-02-10 Integrated device comprising flexible connector between integrated circuit (IC) packages
PCT/US2017/016864 WO2017139285A1 (en) 2016-02-10 2017-02-07 Integrated device comprising flexible connector between integrated circuit (ic) packages

Publications (1)

Publication Number Publication Date
KR20180111840A true KR20180111840A (ko) 2018-10-11

Family

ID=58057302

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187022909A Ceased KR20180111840A (ko) 2016-02-10 2017-02-07 집적 회로(ic) 패키지들 사이의 플렉시블 커넥터를 포함하는 통합 디바이스

Country Status (9)

Country Link
US (1) US9633950B1 (https=)
EP (1) EP3414776B1 (https=)
JP (1) JP6956095B2 (https=)
KR (1) KR20180111840A (https=)
CN (1) CN108604585B (https=)
AU (1) AU2017217375A1 (https=)
BR (1) BR112018016132B1 (https=)
TW (1) TWI601217B (https=)
WO (1) WO2017139285A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11581261B2 (en) * 2018-06-12 2023-02-14 Novatek Microelectronics Corp. Chip on film package
US11342268B2 (en) * 2020-01-29 2022-05-24 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US12074077B2 (en) * 2020-11-19 2024-08-27 Apple Inc. Flexible package architecture concept in fanout

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US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
CN1186971C (zh) 1999-04-22 2005-01-26 罗姆股份有限公司 印刷电路板、电池组件和印刷电路板的制造方法
FR2793352B1 (fr) 1999-05-07 2006-09-22 Sagem Composant electrique a nappe souple de conducteurs de raccordement
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
CN1711636A (zh) 2002-10-11 2005-12-21 德塞拉股份有限公司 用于多芯片封装的元件、方法和组件
US6862191B1 (en) * 2003-08-19 2005-03-01 Cardiac Pacemakers, Inc. Volumetrically efficient electronic circuit module
US20060033217A1 (en) * 2004-08-10 2006-02-16 Brian Taggart Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same
KR100659826B1 (ko) 2005-12-20 2006-12-19 삼성에스디아이 주식회사 배터리 팩의 회로 기판
DE102006004321A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
JP2008034433A (ja) * 2006-07-26 2008-02-14 Cmk Corp リジッドフレックスプリント配線板の製造方法及びリジッドフレックスプリント配線板
WO2008036726A2 (en) 2006-09-19 2008-03-27 Ibiden Co., Ltd. Optical interconnect device and method for manufacturing the same
US8031475B2 (en) * 2007-07-12 2011-10-04 Stats Chippac, Ltd. Integrated circuit package system with flexible substrate and mounded package
TWI365524B (en) * 2007-10-04 2012-06-01 Unimicron Technology Corp Stackable semiconductor device and fabrication method thereof
JP4975584B2 (ja) * 2007-10-26 2012-07-11 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法。
KR20090078124A (ko) * 2008-01-14 2009-07-17 한국광기술원 연성 광전배선을 이용한 시스템 패키지 및 그의 신호 처리방법
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KR101078743B1 (ko) 2010-04-14 2011-11-02 주식회사 하이닉스반도체 스택 패키지
US9190380B2 (en) * 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
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WO2015166588A1 (ja) * 2014-05-02 2015-11-05 株式会社メイコー 部品内蔵リジッドフレックス基板

Also Published As

Publication number Publication date
BR112018016132A2 (pt) 2019-01-02
US9633950B1 (en) 2017-04-25
AU2017217375A1 (en) 2018-07-26
JP6956095B2 (ja) 2021-10-27
BR112018016132B1 (pt) 2022-09-20
TW201735193A (zh) 2017-10-01
EP3414776A1 (en) 2018-12-19
EP3414776B1 (en) 2021-06-16
CN108604585A (zh) 2018-09-28
JP2019510368A (ja) 2019-04-11
WO2017139285A1 (en) 2017-08-17
TWI601217B (zh) 2017-10-01
CN108604585B (zh) 2021-09-24

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