BR112018016132B1 - Dispositivo integrado e método para fabricação de um dispositivo integrado - Google Patents

Dispositivo integrado e método para fabricação de um dispositivo integrado Download PDF

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Publication number
BR112018016132B1
BR112018016132B1 BR112018016132-2A BR112018016132A BR112018016132B1 BR 112018016132 B1 BR112018016132 B1 BR 112018016132B1 BR 112018016132 A BR112018016132 A BR 112018016132A BR 112018016132 B1 BR112018016132 B1 BR 112018016132B1
Authority
BR
Brazil
Prior art keywords
dielectric layer
integrated circuit
package
flexible connector
interconnects
Prior art date
Application number
BR112018016132-2A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112018016132A2 (pt
Inventor
Hong Bok We
Jae Sik Lee
Dong Wook Kim
Original Assignee
Qualcomm Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Incorporated filed Critical Qualcomm Incorporated
Publication of BR112018016132A2 publication Critical patent/BR112018016132A2/pt
Publication of BR112018016132B1 publication Critical patent/BR112018016132B1/pt

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/019—Manufacture or treatment using temporary auxiliary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
BR112018016132-2A 2016-02-10 2017-02-07 Dispositivo integrado e método para fabricação de um dispositivo integrado BR112018016132B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/040,881 2016-02-10
US15/040,881 US9633950B1 (en) 2016-02-10 2016-02-10 Integrated device comprising flexible connector between integrated circuit (IC) packages
PCT/US2017/016864 WO2017139285A1 (en) 2016-02-10 2017-02-07 Integrated device comprising flexible connector between integrated circuit (ic) packages

Publications (2)

Publication Number Publication Date
BR112018016132A2 BR112018016132A2 (pt) 2019-01-02
BR112018016132B1 true BR112018016132B1 (pt) 2022-09-20

Family

ID=58057302

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112018016132-2A BR112018016132B1 (pt) 2016-02-10 2017-02-07 Dispositivo integrado e método para fabricação de um dispositivo integrado

Country Status (9)

Country Link
US (1) US9633950B1 (https=)
EP (1) EP3414776B1 (https=)
JP (1) JP6956095B2 (https=)
KR (1) KR20180111840A (https=)
CN (1) CN108604585B (https=)
AU (1) AU2017217375A1 (https=)
BR (1) BR112018016132B1 (https=)
TW (1) TWI601217B (https=)
WO (1) WO2017139285A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11581261B2 (en) * 2018-06-12 2023-02-14 Novatek Microelectronics Corp. Chip on film package
US11342268B2 (en) * 2020-01-29 2022-05-24 Amkor Technology Singapore Holding Pte. Ltd. Semiconductor devices and methods of manufacturing semiconductor devices
US12074077B2 (en) * 2020-11-19 2024-08-27 Apple Inc. Flexible package architecture concept in fanout

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246595A (en) * 1977-03-08 1981-01-20 Matsushita Electric Industrial Co., Ltd. Electronics circuit device and method of making the same
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5527741A (en) * 1994-10-11 1996-06-18 Martin Marietta Corporation Fabrication and structures of circuit modules with flexible interconnect layers
CN1186971C (zh) 1999-04-22 2005-01-26 罗姆股份有限公司 印刷电路板、电池组件和印刷电路板的制造方法
FR2793352B1 (fr) 1999-05-07 2006-09-22 Sagem Composant electrique a nappe souple de conducteurs de raccordement
US6940729B2 (en) 2001-10-26 2005-09-06 Staktek Group L.P. Integrated circuit stacking system and method
CN1711636A (zh) 2002-10-11 2005-12-21 德塞拉股份有限公司 用于多芯片封装的元件、方法和组件
US6862191B1 (en) * 2003-08-19 2005-03-01 Cardiac Pacemakers, Inc. Volumetrically efficient electronic circuit module
US20060033217A1 (en) * 2004-08-10 2006-02-16 Brian Taggart Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same
KR100659826B1 (ko) 2005-12-20 2006-12-19 삼성에스디아이 주식회사 배터리 팩의 회로 기판
DE102006004321A1 (de) * 2006-01-31 2007-08-16 Häusermann GmbH Biegbare Leiterplatte mit zusätzlichem funktionalem Element und einer Kerbfräsung und Herstellverfahren und Anwendung
JP2008034433A (ja) * 2006-07-26 2008-02-14 Cmk Corp リジッドフレックスプリント配線板の製造方法及びリジッドフレックスプリント配線板
WO2008036726A2 (en) 2006-09-19 2008-03-27 Ibiden Co., Ltd. Optical interconnect device and method for manufacturing the same
US8031475B2 (en) * 2007-07-12 2011-10-04 Stats Chippac, Ltd. Integrated circuit package system with flexible substrate and mounded package
TWI365524B (en) * 2007-10-04 2012-06-01 Unimicron Technology Corp Stackable semiconductor device and fabrication method thereof
JP4975584B2 (ja) * 2007-10-26 2012-07-11 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法。
KR20090078124A (ko) * 2008-01-14 2009-07-17 한국광기술원 연성 광전배선을 이용한 시스템 패키지 및 그의 신호 처리방법
FI122216B (fi) * 2009-01-05 2011-10-14 Imbera Electronics Oy Rigid-flex moduuli
US20110194240A1 (en) * 2010-02-05 2011-08-11 Broadcom Corporation Waveguide assembly and applications thereof
KR101078743B1 (ko) 2010-04-14 2011-11-02 주식회사 하이닉스반도체 스택 패키지
US9190380B2 (en) * 2012-12-06 2015-11-17 Intel Corporation High density substrate routing in BBUL package
JP2014192476A (ja) 2013-03-28 2014-10-06 Fujitsu Ltd プリント基板の半田実装方法及び半田実装構造
KR102135415B1 (ko) 2013-06-28 2020-07-17 엘지이노텍 주식회사 회로기판 및 상기 회로기판을 포함하는 조명장치
WO2015166588A1 (ja) * 2014-05-02 2015-11-05 株式会社メイコー 部品内蔵リジッドフレックス基板

Also Published As

Publication number Publication date
BR112018016132A2 (pt) 2019-01-02
US9633950B1 (en) 2017-04-25
AU2017217375A1 (en) 2018-07-26
JP6956095B2 (ja) 2021-10-27
KR20180111840A (ko) 2018-10-11
TW201735193A (zh) 2017-10-01
EP3414776A1 (en) 2018-12-19
EP3414776B1 (en) 2021-06-16
CN108604585A (zh) 2018-09-28
JP2019510368A (ja) 2019-04-11
WO2017139285A1 (en) 2017-08-17
TWI601217B (zh) 2017-10-01
CN108604585B (zh) 2021-09-24

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Legal Events

Date Code Title Description
B350 Update of information on the portal [chapter 15.35 patent gazette]
B06W Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 07/02/2017, OBSERVADAS AS CONDICOES LEGAIS