KR20180084877A - 전체 성형된 소형화 반도체 모듈 - Google Patents

전체 성형된 소형화 반도체 모듈 Download PDF

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Publication number
KR20180084877A
KR20180084877A KR1020187016456A KR20187016456A KR20180084877A KR 20180084877 A KR20180084877 A KR 20180084877A KR 1020187016456 A KR1020187016456 A KR 1020187016456A KR 20187016456 A KR20187016456 A KR 20187016456A KR 20180084877 A KR20180084877 A KR 20180084877A
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South Korea
Prior art keywords
semiconductor module
miniaturized semiconductor
whole molded
molded
whole
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KR1020187016456A
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English (en)
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KR102127774B1 (ko
Inventor
크리스토퍼 엠. 스캔른
티모시 엘. 올슨
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데카 테크놀로지 잉크
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Priority claimed from US15/354,447 external-priority patent/US9831170B2/en
Application filed by 데카 테크놀로지 잉크 filed Critical 데카 테크놀로지 잉크
Publication of KR20180084877A publication Critical patent/KR20180084877A/ko
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Publication of KR102127774B1 publication Critical patent/KR102127774B1/ko

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
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KR1020187016456A 2015-11-20 2016-11-18 전체 성형된 소형화 반도체 모듈 KR102127774B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562258040P 2015-11-20 2015-11-20
US62/258,040 2015-11-20
US15/354,447 US9831170B2 (en) 2011-12-30 2016-11-17 Fully molded miniaturized semiconductor module
US15/354,447 2016-11-17
PCT/US2016/062940 WO2017087899A1 (en) 2015-11-20 2016-11-18 Fully molded miniaturized semiconductor module

Publications (2)

Publication Number Publication Date
KR20180084877A true KR20180084877A (ko) 2018-07-25
KR102127774B1 KR102127774B1 (ko) 2020-06-29

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KR1020187016456A KR102127774B1 (ko) 2015-11-20 2016-11-18 전체 성형된 소형화 반도체 모듈

Country Status (5)

Country Link
KR (1) KR102127774B1 (ko)
CN (1) CN108307661B (ko)
HK (1) HK1256963A1 (ko)
TW (1) TWI674658B (ko)
WO (1) WO2017087899A1 (ko)

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WO2023063657A1 (ko) * 2021-10-12 2023-04-20 주식회사 위트코퍼레이션 대면적 측정이 가능한 모니터링 기기

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US9831170B2 (en) * 2011-12-30 2017-11-28 Deca Technologies, Inc. Fully molded miniaturized semiconductor module
KR102563424B1 (ko) * 2017-11-02 2023-08-07 주식회사 아모센스 반도체 패키지 및 모바일용 전자기기
US11114311B2 (en) * 2018-08-30 2021-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chip package structure and method for forming the same
KR102179167B1 (ko) * 2018-11-13 2020-11-16 삼성전자주식회사 반도체 패키지
US11183482B2 (en) 2019-09-17 2021-11-23 Taiwan Semiconductor Manufacturing Company, Ltd. Shift control method in manufacture of semiconductor device
US11515174B2 (en) * 2019-11-12 2022-11-29 Micron Technology, Inc. Semiconductor devices with package-level compartmental shielding and associated systems and methods
CN117525039A (zh) * 2022-07-30 2024-02-06 华为技术有限公司 芯片封装结构及其制作方法

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TWI229433B (en) * 2004-07-02 2005-03-11 Phoenix Prec Technology Corp Direct connection multi-chip semiconductor element structure
US20090170241A1 (en) * 2007-12-26 2009-07-02 Stats Chippac, Ltd. Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier
US8604600B2 (en) * 2011-12-30 2013-12-10 Deca Technologies Inc. Fully molded fan-out
US8268677B1 (en) * 2011-03-08 2012-09-18 Stats Chippac, Ltd. Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer
TWI543307B (zh) * 2012-09-27 2016-07-21 欣興電子股份有限公司 封裝載板與晶片封裝結構
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US5759737A (en) * 1996-09-06 1998-06-02 International Business Machines Corporation Method of making a component carrier
US20130280826A1 (en) * 2010-02-16 2013-10-24 Deca Technologies Inc. Adaptive patterning for panelized packaging
KR20150084287A (ko) * 2014-01-13 2015-07-22 하나 마이크론(주) 반도체 패키지 및 그 제조 방법

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* Cited by examiner, † Cited by third party
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WO2023063657A1 (ko) * 2021-10-12 2023-04-20 주식회사 위트코퍼레이션 대면적 측정이 가능한 모니터링 기기
TWI829379B (zh) * 2021-10-12 2024-01-11 南韓商Ｗｉｔ有限公司 大面積監視設備

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CN108307661B (zh) 2022-07-08
TW201729373A (zh) 2017-08-16
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