KR20180053704A - 도전성 부재 - Google Patents

도전성 부재 Download PDF

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Publication number
KR20180053704A
KR20180053704A KR1020187010310A KR20187010310A KR20180053704A KR 20180053704 A KR20180053704 A KR 20180053704A KR 1020187010310 A KR1020187010310 A KR 1020187010310A KR 20187010310 A KR20187010310 A KR 20187010310A KR 20180053704 A KR20180053704 A KR 20180053704A
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South Korea
Prior art keywords
bent portion
fabric
conductive
conductive fabric
conductive member
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KR1020187010310A
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English (en)
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KR102164133B1 (ko
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타카유키 사사키
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세렌가부시키가이샤
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Publication of KR20180053704A publication Critical patent/KR20180053704A/ko
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/01—Dielectrics
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/072—Electroless plating, e.g. finish plating or initial plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

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Abstract

날실 및 씨실을 포함하는 도전성 직물과 지지체로 구성되고, 적어도 1개의 직선형 굴곡부를 구비하고 있고, 상기 직선형 굴곡부를 걸치고 전기 통전성을 구비하는 도전성 부재이고, 상기 직선형 굴곡부와 상기 날실 또는 상기 씨실 중의 어느 하나가 이루는 각도가 5~45°인 것을 특징으로 하는 도전성 부재이다. 도전성 직물이, 합성 섬유로 이루어지는 직물에 습식 도금법에 의해 형성된 금속 피막이 적층된 것이 바람직하다.

Description

도전성 부재
본 발명은 도전성 부재에 관한 것이다. 특히 직선장의 굴곡부가 마련되고, 이 굴곡부를 걸치고 도전성을 구비하고 있고, 반복적으로 굴곡된 경우에도 양호한 도전성을 유지할 수 있는 도전성 부재에 관한 것이다.
전자기기의 소형화에 따라, 내부에 사용되는 도전성 부재에 대해서도 소형화, 박형화가 요구되고 있다. 나아가 노트북 컴퓨터나 태블릿, 휴대용 게임기 등에 있어서는 접이식의 구조를 구비하는 기기도 많다. 이 경우, 접이 구조에 대응한 도전성 부재가 사용되지만, 반복적으로 굴곡된 경우에는 도전성을 확보하기 곤란했다. 특히 기기가 소형화, 박형화되는 것에 의해, 굴곡의 굽힘 반경이 작아질수록 도전성의 확보가 곤란해진다.
종래, 굴곡부를 걸치고 도전성을 구비하는 기기에는 FPC(flexible printed circuit)가 사용되어 왔다. 하지만, 굽힘 반경이 0.5mm 이하이고 예각으로 굴곡되는 경우에는 기재인 수지 필름이 파탄되는 문제가 있다.
특허문헌 1에는 FPC의 굴곡부의 내측에, 굴곡부의 곡률 반경이 작아지는 것을 규제하는 규제 필름을 마련하는 것이 기재되어 있다. 이 방법에서는 부분적으로 FPC의 두께가 증대하여, 기기의 소형화, 박형화의 방해가 된다. 더욱이 굴곡 반경이 작아지는 것을 규제하기 때문에, 굴곡했을 때 굴곡부 주변이 부피가 커지는 문제가 있다.
일본국 특허공개공보 2007-27221호 공보
본 발명은, 굽힘 반경이 작은 굴곡부를 구비하면서, 반복적인 굴곡을 견딜 수 있는 양호한 도전성을 구비하는 도전성 부재를 제공한다.
날실 및 씨실을 포함하는 도전성 직물과 지지체로 구성되고, 적어도 1개의 직선형 굴곡부를 구비하고 있고, 상기 직선형 굴곡부를 걸치고 도전성을 구비하는 도전성 부재이고, 상기 직선형 굴곡부와, 상기 날실 또는 상기 씨실 중의 어느 하나가 이루는 각도가 5~45°인 것을 특징으로 하는 도전성 부재이다.
상기 도전성 직물이, 합성 섬유로 이루어지는 직물에 습식 도금법에 의해 형성된 금속 피막이 적층되어 있는 도전성 직물인 것이 바람직하다.
상기 직선형 굴곡부에 있어서 굽혀졌을 때의, 상기 도전성 직물의 굽힘 반경이 0.5mm 이하인 것이 바람직하다.
본 발명에 의하면, 굽힘 반경이 작은 굴곡부에 있어서, 반복적인 굴곡을 견딜 수 있는 양호한 도전성을 갖춘 도전성 부재를 제공할 수 있다.
도 1은 본 발명의 도전성 부재를 나타내는 개략도이다.
본 발명의 도전성 부재는, 날실 및 씨실을 포함하는 도전성 직물과 지지체로 이루어진다. 지지체는 금속, 세라믹, 수지, 종이 등 특히 재질은 한정되지 않는다. 또한 복수의 재질이 조합된 복합체여도 좋다. 지지체에는 적어도 1개의 직선형 굴곡부가 마련된다. 직선형 굴곡부는 경첩 구조 등 기계적인 구조여도 좋고, 부분적으로 유연한 수지 소재를 사용한 구조여도 좋다.
본 발명에 사용되는 도전성 직물로서는, 천연 섬유나 재생 섬유, 반합성 섬유, 합성 섬유 등으로 이루어지는 직물에 금속 피막을 형성한 것을 들 수 있다. 금속 피막은 습식 도금법(무전해 도금, 전기 도금) 등의 수법을 사용하여 형성되는 것이 바람직하다.
금속 피막을 구성하는 금속으로서는, 구리, 니켈, 은, 금, 아연, 주석, 또는 이들의 합금 등을 들 수 있고, 이중에서도, 도전성과 제조 비용을 고려하여 구리, 니켈 및 은이 바람직하다. 이들의 금속에 의해 형성되는 금속 피막은, 1층만이어도 좋고, 2층 이상의 다층 구조여도 좋다.
천연 섬유로서는, 면, 마, 실크 등을 들 수 있고, 재생 섬유로서는 레이온, 큐프라 레이온, 폴리노직 레이온 등을 들 수 있다. 반합성 섬유로서는 아세테이트 섬유, 단백질계 반합성 섬유 등, 합성 섬유로서는, 폴리에스테르계 섬유, 폴리아미드계 섬유, 아크릴 섬유, 비닐론 섬유, 폴리올레핀 섬유, 폴리우레탄 섬유 등을 들 수 있다. 이들중에서도 강도의 점에서 합성 섬유가 바람직하고, 특히 폴리에스테르계 섬유, 폴리아미드계 섬유가 더욱 바람직하다.
도전성 직물을 형성하는 직물로서, 상기 섬유 소재로 이루어지는 날실 및 씨실을 사용하여 직물이 형성된다. 날실 및 씨실의 섬도는 11~167dtex인 것이 바람직하고, 더욱 바람직하게는 33~111dtex이다. 섬도가 11dtex 이상이면 강도 및 습식 도금법에서의 가공성이 우수하다. 167dtex 이하이면 직물의 감촉이 단단해지지 않아 바람직하다. 직물의 조직으로서는, 평직, 능직, 주자직 등 특히 한정되지 않지만, 강도의 관점에서 평직인 것이 바람직하다.
도전성 직물로서는 합성 섬유로 이루어지는 직물에 습식 도금법에 의한 금속 피막이 형성된 것이 바람직하다. 습식 도금법에 의하면 균일하면서 충분한 두께를 구비하는 금속 피막을 형성할 수 있다. 더욱이 습식 도금법에 의하면, 직물 전체뿐만 아니라, 부분적으로 금속 피막을 형성하는 것도 용이하고, 도전성의 패턴을 자유롭게 형성할 수 있다. 한편, 습식 도금법에 의한 금속 피막의 형성은, 직물을 형성한 후에 실시되어도 좋고, 제직 전의 실의 상태에서 실시되어도 좋다.
습식 도금법에 의한 금속 피막은 단일 금속에 의한 단일층의 피막이어도 좋고, 단일 혹은 복수 종류의 금속에 의한 복수층의 피막이 적층된 것이어도 좋다. 바람직한 금속의 조합으로서는, 구리-니켈, 구리-주석, 구리-은 등을 들 수 있다. 단일층의 경우에는 습식 도금법으로서 무전해 도금이 적용된다. 복수층의 피막이 적층된 것인 경우에도, 합성 섬유의 표면에 형성되는 제1의 금속 피막은 무전해 도금에 의해 형성된다. 두번째층 이후의 피막은, 무전해 도금에 의한 피막이어도 좋고, 무전해 도금에 의한 제1의 피막을 음극으로 한 전기 도금에 의한 피막이어도 좋다.
도전성 직물은 그 자체, FPC에 비해 유연성이 높고, 반복적인 굴곡에 대해 높은 내구성을 갖는 도전성을 구비하고 있다. 하지만, 더욱 굴곡 내성을 향상시키기 위해, 본 발명의 도전성 부재에서는 도전성 직물을 지지체에 고정할 때, 도전성 직물의 날실 또는 씨실 중의 어느 하나에 착안한 경우, 실(날실 또는 씨실)과 도전성 부재에 마련된 직선형 굴곡부가 이루는 각도가 5~45°가 되도록 배치된다.
도전성 부재의 직선형 굴곡부에 있어서, 굴곡시의 도전성 직물의 굽힘 반경은 0.5mm 이하인 것이 바람직하다. 굽힘 반경이 0.5mm 이하인 경우, 본 발명의 도전성 부재의 굴곡에 대한 도전성의 내구성이 더욱 우위가 된다. 또한, 본 발명의 도전성 부재가 더욱 콤팩트하게 접어지게 되어 바람직하다.
금속 피막이 형성된 도전성 직물의 표면에는, 수지에 의한 코팅 피막이 형성되어 있는 것이 바람직하다. 코팅 피막을 형성하는 수지로서는, 예를 들면, 아크릴 수지, 우레탄 수지, 멜라민 수지, 에폭시 수지, 폴리에스테르 수지, 폴리아민 수지, 비닐 에스테르 수지, 페놀 수지, 불소 수지, 실리콘 수지 등을 들 수 있고, 유연성의 관점에서 우레탄 수지가 특히 바람직하다.
수지에 의한 피막을 형성하는 방법으로서는, 코팅, 라미네이트, 함침, 딥-라미네이트(dip laminate) 등 공지 기술을 사용할 수 있다. 수지 도포량 조정의 용이함이나 이물(돌기물) 혼입시의 영향을 적게 하는 관점에서, 나이프 코팅이 가장 바람직하다.
(실시예)
굴곡 시험 방법: MIT 내절 강도 시험기(Toyo Seiki Seisaku-sho, Ltd. 제조)를 사용하여 이하의 조건으로 굴곡 시험을 했다. 굴곡부와 도전성 직물의 씨실이 이루는 각도는, 0°, 5°, 10°, 30°, 45°로 했다.
사이클: 20, 000회
굽힘 반경: 0.38mm
굴곡 속도: 175cpm
굴곡 각도: ±135°
하중: 0kg
시험편 사이즈: 130mm×15mm
도전성의 평가는, 밀리옴 하이테스터(HIOKI E.E. CORPORATION 제조)의 클립형 프로브에 의해 굴곡부를 끼운 위치에서 시험편을 집어 저항값을 측정한다. 굴곡 시험 후의 저항값 측정에 관해서는, 굴곡부를 20회 앞뒤로 구부리면서 측정하고, 최대 저항값을 판독한다. 굴곡 시험 전에 대한 굴곡 시험 후의 저항값 증가율을 이하의 방법으로 산출하여 평가했다.
(저항값 증가율%)={(굴곡 시험 후의 저항값Ω)/(굴곡 시험 전의 저항값Ω)}×100
[시험예 1]
날실: 폴리에스테르 가공실(33dtex)
씨실: 폴리에스테르 가공실(69dtex)
평직(편직 밀도: 날실 189가닥/2.54cm, 씨실 120가닥/2.54cm)
금속 피막의 형성은 이하의 조건으로 실시했다.
상기 천을 상온에서 30초간, 염화 팔라듐 0.3g/L, 염화 제1주석 30g/L, 36% 염산 300ml/L을 포함하는 수용액에 침지한 후, 충분히 수세했다(촉매 부여). 그 후 40℃에서 1분간, 산 농도 0.1N의 붕불화수소산에 침지한 후, 충분히 수세했다(촉매 활성화). 이어서 40℃에서 15분간, 염화 제2구리 9g/L, 37% 포르말린 9ml/L, 32% 수산화 나트륨 40ml/L, N,N,N',N'-Tetrakis(2-하이드록시프로필) 에틸렌디아민 20g/L 및 안정화제를 포함하는 용액에 침지하고, 이에 의해 균일하게 천 위에 30g/㎡로 구리 피막이 형성되고, 나아가 천을 충분히 수세했다(무전해 구리 도금). 계속하여, 상기 구리 피막을 음극으로 하여, 황산니켈 70g/L, 구연산 삼나트륨 30g/L 및 방부제를 포함하는 용액에 침지하고, 양극에 가용성 니켈판을 사용하고, 전류 밀도 2A/d㎡로, 상온에서 1분간, 전기 도금을 진행했다. 이에 의해 구리 피막 위에 5g/㎡로 니켈 피막이 형성되고, 나아가 천을 충분히 수세했다(전기 니켈 도금). 마지막으로 직물을 건조시켜, 은회색의 구리-니켈에 2층 구조의 금속 피막이 형성된 도전성 직물을 얻었다.
이어서 나이프 코팅법에 의해 코팅 피막의 형성을 실시했다. 코팅의 조건은 다음과 같다. 수성 폴리우레탄 수지(DIC CORPORATION 제조: HYDRAN WLS-202) 100중량부, 증점제(SENKA CORPORATION 제조: SENKA ACTGEL NS100) 3중량부로 혼합한 수지액을 나이프 코팅법에 의해 직물 표면에 고형분으로 5g/㎡ 코팅하고, 120℃에서 1분간 건조했다. 직물 이면에 관해서도 표면과 동일하게 코팅 건조를 하여 코팅 피막의 형성을 실시했다.
[시험예 2]
수지에 의한 코팅 피막의 형성을 실시하지 않은 것 이외에는 시험예 1과 동일하다.
[시험예 3]
도금 금속이 무전해 구리 도금만인 것 이외에는 시험예 2와 동일하다.
[시험예 4]
구리 피막 상의 전기 니켈 도금을 전기 은 도금으로 변경한 것 이외에는 시험예 1과 동일하다. 전기 은 도금의 조건은 아래와 같다. 구리 피막이 형성된 직물을, Dain Silver ACC(Daiwa Fine Chemicals Co,. Ltd. 제조)를 포함하는 수용액에 상온에서 30초간 침지한 후에, 충분히 수세했다(산 세정). 구리 피막을 음극으로 하여, Dain Silver GPE-ST15(Daiwa Fine Chemicals Co,. Ltd. 제조)에 침지하고, 불용성 양극을 사용하고, 전류 밀도 2A/d㎡로, 상온에서 1.5분간 전기 도금한 후에, 충분히 수세했다. 이에 의해 균일하게 구리 피막 위에 5g/㎡로 은 피막이 형성되었다(전기 은 도금). 이어서 Dain Silver ACC(Daiwa Fine Chemicals Co,. Ltd. 제조)를 포함하는 수용액에 상온에서 30초간 침지한 후에, 충분히 수세했다(산 세정). 나아가 New Dain Silver S1(Daiwa Fine Chemicals Co,. Ltd. 제조)을 포함하는 수용액에 40℃에서 1분간 침지한 후에, 충분히 수세했다(변색 방지 처리). 마지막으로 건조를 하여, 백색의 구리-은에 2층 구조를 구비하는 금속 피막이 형성된 도전성 직물을 얻었다.
[시험예 5]
직물을 이하의 것으로 변경한 이외에는 시험예 1과 동일하다.
날실: 폴리에스테르 생사(55dtex)
씨실: 폴리에스테르 생사(33dtex)
평직(편직 밀도: 날실 152가닥/2.54cm, 씨실 130가닥/2.54cm)
[시험예 6]
직물을 이하의 것으로 변경한 이외에는 시험예 1과 동일하다.
날실: 폴리에스테르 생사(55dtex)
씨실: 폴리에스테르 가공실(55dtex)
평직(편직 밀도: 날실 152가닥/2.54cm, 씨실 120가닥/2.54cm)
상기 각 시험예에서 얻어진 도전성 직물을 사용하여 굴곡 시험을 실시하고, 도전성을 평가한 결과를 표 1에 나타낸다.
씨실과 굴곡부가 이루는 각도(°) 저항값 증가율(%)
시험예 1 시험예 2 시험예 3 시험예 4 시험예 5 시험예 6
0 2124 147312 27943 2240 219048 217778
5 255 970 870 440 361 912
10 180 252 294 281 260 159
30 148 157 134 194 205 138
45 127 204 129 196 263 224
본 발명은, 본 발명의 광의의 정신과 범위 내에서, 다양한 실시예 및 변형이 가능하다. 또한, 상술한 실시예는, 본 발명을 설명하기 위한 것이고, 본 발명의 범위를 한정하는 것이 아니다. 즉, 본 발명의 범위는, 실시예가 아니고, 특허청구범위에 의해 규정된다. 그리고, 특허청구범위 내 및 그와 동등한 발명의 의의 범위 내에서 실시되는 다양한 변형은 본 발명의 범위 내에 포함된다.
본 출원은, 2015년 9월 16일에 출원된 일본국 특허출원 특원2015-182825호를 기초로 한다. 본 명세서에 일본국 특허출원 특원2015-182825호의 명세서, 특허청구범위, 도면 전체를 참조로 원용된다.
1: 도전성 부재
2: 도전성 직물
3: 지지체
4: 직선형 굴곡부
5: 날실
6: 씨실
A: 씨실의 방향을 나타내는 보조선
B: 직선형 굴곡부의 방향을 나타내는 보조선
θ: 직선형 굴곡부와 씨실(날실)이 이루는 각도

Claims (3)

  1. 날실 및 씨실을 포함하는 도전성 직물과 지지체로 구성되고, 적어도 1개의 직선형 굴곡부를 구비하고 있고, 상기 직선형 굴곡부를 걸치고 전기 통전성을 구비하는 도전성 부재이고, 상기 직선형 굴곡부와 상기 날실 또는 상기 씨실 중의 어느 하나가 이루는 각도가 5~45°인 것을 특징으로 하는 도전성 부재.
  2. 제1항에 있어서,
    상기 도전성 직물이, 합성 섬유로 이루어지는 직물에 습식 도금법에 의해 형성된 금속 피막이 적층되어 있는 도전성 직물인 것을 특징으로 하는 도전성 부재.
  3. 제1항에 있어서,
    상기 직선형 굴곡부에 있어서 굽혀졌을 때의, 상기 도전성 직물의 굽힘 반경이 0.5mm 이하가 되는 것을 특징으로 하는 도전성 부재.
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