JP6670063B2 - 導電性部材 - Google Patents
導電性部材 Download PDFInfo
- Publication number
- JP6670063B2 JP6670063B2 JP2015182825A JP2015182825A JP6670063B2 JP 6670063 B2 JP6670063 B2 JP 6670063B2 JP 2015182825 A JP2015182825 A JP 2015182825A JP 2015182825 A JP2015182825 A JP 2015182825A JP 6670063 B2 JP6670063 B2 JP 6670063B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductive
- fabric
- bent portion
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
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- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 1
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- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
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- 230000004913 activation Effects 0.000 description 1
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- 235000005607 chanvre indien Nutrition 0.000 description 1
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000004649 discoloration prevention Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- -1 fluororesin Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006306 polyurethane fiber Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 230000002335 preservative effect Effects 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 108090000623 proteins and genes Proteins 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000001119 stannous chloride Substances 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- 238000010998 test method Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- HRXKRNGNAMMEHJ-UHFFFAOYSA-K trisodium citrate Chemical compound [Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O HRXKRNGNAMMEHJ-UHFFFAOYSA-K 0.000 description 1
- 229940038773 trisodium citrate Drugs 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
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- B32B2262/06—Vegetal fibres
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- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
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-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/46—Electroplating: Baths therefor from solutions of silver
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Textile Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Laminated Bodies (AREA)
- Chemically Coating (AREA)
- Electrochemistry (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Woven Fabrics (AREA)
- Electroplating Methods And Accessories (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Description
サイクル:20,000回
曲げ半径:0.38mm
屈曲速度:175cpm
屈曲角度:±135°
荷重:0kg
試験片サイズ:130mm×15mm
(抵抗値増加率%)={(屈曲試験後の抵抗値Ω)/(屈曲試験前の抵抗値Ω)}×100
経糸:ポリエステル加工糸(33dtex)
緯糸:ポリエステル加工糸(69dtex)
平織り(織り密度:経189本/2.54cm、緯120本/2.54cm)
金属被膜の形成は以下の条件で実施した。
上記の布を常温で30秒間、塩化パラジウム0.3g/L、塩化第一錫30g/L、36%塩酸300ml/Lを含む水溶液に浸漬後、十分に水洗した(触媒付与)。その後40℃で1分間、酸濃度0.1Nのホウ弗化水素酸に浸漬後、十分に水洗した(触媒活性化)。続けて40℃で15分間、塩化第二銅9g/L、37%ホルマリン9ml/L、32%水酸化ナトリウム40ml/L、N,N,N‘,N’−テトラキス(2−ヒドロキシプロピル)エチレンジアミン20g/L及び安定化剤を含む溶液に浸漬し、これにより一様に布上に30g/m2で銅被膜が形成され、更に布を十分に水洗した(無電解銅メッキ)。更に続けて、上記の銅被膜を陰極として、硫酸ニッケル70g/L、クエン酸三ナトリウム30g/L及び防腐剤を含む溶液に浸漬し、陽極に可溶性ニッケル板を使用し、電流密度2A/dm2で、常温で1分間、電気メッキを行った。これにより銅被膜上に5g/m2でニッケル被膜が形成され、更に布を十分に水洗した(電気ニッケルメッキ)。最後に織物を乾燥させ、銀灰色の銅−ニッケルの二層構造の金属被膜が形成された導電性織物を得た。
樹脂によるコーティング被膜の形成を実施しなかったこと以外は試験例1に同じ。
メッキ金属が無電解銅メッキのみであること以外は試験例2に同じ。
銅被膜上の電気ニッケルメッキを電気銀メッキに変更したこと以外は試験例1に同じ。電気銀メッキの条件は以下のとおり。銅被膜が形成された織物を、ダインシルバーACC(大和化成株式会社製)を含む水溶液に常温で30秒間浸漬した後に、十分に水洗した(酸洗浄)。銅被膜を陰極として、ダインシルバーGPE-ST15(大和化成株式会社製)に浸漬し、不溶性陽極を使用し、電流密度2A/dm2で、常温で1.5分間電気メッキした後に、十分に水洗した。これにより一様に銅被膜上に5g/m2で銀被膜が形成された(電気銀メッキ)。続けてダインシルバーACC(大和化成株式会社製)を含む水溶液に常温で30秒間浸漬した後に、十分に水洗した(酸洗浄)。更にニューダインシルバーS1(大和化成株式会社製)を含む水溶液に40℃で1分間浸漬した後に、十分に水洗した(変色防止処理)。最後に乾燥を行い、白色の銅−銀の二層構造を有する金属被膜が形成された導電性織物を得た。
織物を以下のものに変更した以外は試験例1に同じ。
経糸:ポリエステル生糸(55dtex)
緯糸:ポリエステル生糸(33dtex)
平織り(織り密度:経152本/2.54cm、緯130本/2.54cm)
織物を以下のものに変更した以外は試験例1に同じ。
経糸:ポリエステル生糸(55dtex)
緯糸:ポリエステル加工糸(55dtex)
平織り(織り密度:経152本/2.54cm、緯120本/2.54cm)
2 導電性織物
3 支持体
4 直線状屈曲部
5 経糸
6 緯糸
A 緯糸の方向を示す補助線
B 直線状屈曲部の方向を示す補助線
θ 直線状屈曲部と緯糸(経糸)との成す角度
Claims (3)
- 導電性織物と支持体とから構成され、少なくとも一の直線状屈曲部を有しており、前記直線状屈曲部を跨いで導電性を備える導電性部材であって、前記直線状屈曲部と、前記導電性織物の経糸または緯糸のいずれか一方との成す角度が5〜45°であり、前記導電性織物は、合成繊維から成る織物に湿式メッキ法によって形成された金属被膜が積層されている導電性織物であり、前記導電性織物の表面は、ウレタン樹脂、メラミン樹脂、ポリアミン樹脂、ビニルエステル樹脂、フェノール樹脂、フッ素樹脂からなる群より選択される少なくとも1種の樹脂によるコーティング被膜が形成されていることを特徴とする導電性部材。
- 前記コーティング被膜を形成する樹脂はウレタン樹脂であることを特徴とする、請求項1に記載の導電性部材。
- 前記直線状屈曲部において折り曲げられた際の、前記導電性織物の曲げ半径が0.5mm以下となることを特徴とする、請求項1に記載の導電性部材。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015182825A JP6670063B2 (ja) | 2015-09-16 | 2015-09-16 | 導電性部材 |
KR1020187010310A KR102164133B1 (ko) | 2015-09-16 | 2016-08-18 | 도전성 부재 |
PCT/JP2016/074102 WO2017047320A1 (ja) | 2015-09-16 | 2016-08-18 | 導電性部材 |
US15/760,152 US10737461B2 (en) | 2015-09-16 | 2016-08-18 | Conductive member |
CN201680051400.2A CN108025527B (zh) | 2015-09-16 | 2016-08-18 | 导电性部件 |
TW105129776A TWI593843B (zh) | 2015-09-16 | 2016-09-13 | Conductive parts |
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JP2015182825A JP6670063B2 (ja) | 2015-09-16 | 2015-09-16 | 導電性部材 |
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JP6670063B2 true JP6670063B2 (ja) | 2020-03-18 |
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JP (1) | JP6670063B2 (ja) |
KR (1) | KR102164133B1 (ja) |
CN (1) | CN108025527B (ja) |
TW (1) | TWI593843B (ja) |
WO (1) | WO2017047320A1 (ja) |
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JP6670063B2 (ja) | 2015-09-16 | 2020-03-18 | セーレン株式会社 | 導電性部材 |
AU201713007S (en) | 2016-11-21 | 2017-08-01 | Freudenberg Carl Kg | Mopping pad |
JP6868486B2 (ja) * | 2017-06-28 | 2021-05-12 | セーレン株式会社 | 導電性回路布帛、およびその製造方法 |
JP7320361B2 (ja) | 2018-03-30 | 2023-08-03 | セーレン株式会社 | 導電性織物、導電性部材および導電性織物の製造方法 |
CN110911056A (zh) * | 2019-12-12 | 2020-03-24 | 广州琛鑫电子材料有限公司 | 一种导线及其制备方法 |
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JP3426089B2 (ja) * | 1996-06-19 | 2003-07-14 | 昭和飛行機工業株式会社 | 繊維強化プラスチック製のハニカムコア |
US5997983A (en) * | 1997-05-30 | 1999-12-07 | Teledyneindustries, Inc. | Rigid/flex printed circuit board using angled prepreg |
JP2002094290A (ja) * | 2000-09-11 | 2002-03-29 | Toray Ind Inc | 電磁波シールド材およびその製造方法 |
US7048736B2 (en) * | 2002-05-17 | 2006-05-23 | Sdgi Holdings, Inc. | Device for fixation of spinous processes |
JP4423186B2 (ja) * | 2002-05-27 | 2010-03-03 | 関西金網株式会社 | 高粘性流体用フィルターユニット及び紡糸パック |
JP2004011035A (ja) * | 2002-06-04 | 2004-01-15 | Teijin Ltd | 耐屈曲性と柔軟性を有する表面導電性布帛 |
TW200405790A (en) * | 2002-08-08 | 2004-04-01 | Dainippon Printing Co Ltd | Electromagnetic wave shielding sheet |
JP4692815B2 (ja) | 2005-07-13 | 2011-06-01 | 住友ベークライト株式会社 | フレキシブルプリント基板 |
JP2008081011A (ja) * | 2006-09-28 | 2008-04-10 | Seiren Co Ltd | エアバッグの折り畳み方法 |
JP2008135469A (ja) * | 2006-11-27 | 2008-06-12 | Toshiba Corp | プリント配線板および電子機器 |
JP5200565B2 (ja) * | 2007-04-09 | 2013-06-05 | 日立化成株式会社 | プリント配線板及び電子機器 |
WO2009050629A1 (en) | 2007-10-16 | 2009-04-23 | Koninklijke Philips Electronics N.V. | Multi-layer woven fabric display |
JP2009267230A (ja) * | 2008-04-28 | 2009-11-12 | Shinshu Univ | 電磁波遮蔽材 |
CN106332474B (zh) | 2011-04-26 | 2020-08-14 | 株式会社村田制作所 | 刚性柔性基板及其制造方法 |
JP5377588B2 (ja) * | 2011-07-07 | 2013-12-25 | 勝也 広繁 | 開口部のある導電回路基板 |
JP6293407B2 (ja) | 2012-08-24 | 2018-03-14 | セーレン株式会社 | 磁界シールド性電磁波シールド材 |
JP6670063B2 (ja) | 2015-09-16 | 2020-03-18 | セーレン株式会社 | 導電性部材 |
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- 2016-08-18 US US15/760,152 patent/US10737461B2/en active Active
- 2016-09-13 TW TW105129776A patent/TWI593843B/zh active
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CN108025527A (zh) | 2018-05-11 |
TW201712176A (zh) | 2017-04-01 |
JP2017056621A (ja) | 2017-03-23 |
US10737461B2 (en) | 2020-08-11 |
CN108025527B (zh) | 2020-09-18 |
KR102164133B1 (ko) | 2020-10-12 |
US20180250909A1 (en) | 2018-09-06 |
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