KR20180036799A - 저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법 - Google Patents

저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법 Download PDF

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Publication number
KR20180036799A
KR20180036799A KR1020187009140A KR20187009140A KR20180036799A KR 20180036799 A KR20180036799 A KR 20180036799A KR 1020187009140 A KR1020187009140 A KR 1020187009140A KR 20187009140 A KR20187009140 A KR 20187009140A KR 20180036799 A KR20180036799 A KR 20180036799A
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KR
South Korea
Prior art keywords
silver
silver particles
metal paste
particle diameter
particles
Prior art date
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KR1020187009140A
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English (en)
Korean (ko)
Inventor
유이치 마키타
유스케 오시마
준이치 다니우치
히토시 구보
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다나카 기킨조쿠 고교 가부시키가이샤
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Application filed by 다나카 기킨조쿠 고교 가부시키가이샤 filed Critical 다나카 기킨조쿠 고교 가부시키가이샤
Publication of KR20180036799A publication Critical patent/KR20180036799A/ko

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    • B22F1/0059—
    • B22F1/0044—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/054—Nanosized particles
    • B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Inorganic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
KR1020187009140A 2014-02-25 2015-02-20 저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법 KR20180036799A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014034554A JP5795096B2 (ja) 2014-02-25 2014-02-25 低温焼結性に優れる銀ペースト及び該銀ペーストの製造方法
JPJP-P-2014-034554 2014-02-25
PCT/JP2015/054723 WO2015129562A1 (ja) 2014-02-25 2015-02-20 低温焼結性に優れる銀ペースト及び該銀ペーストの製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167023468A Division KR101866111B1 (ko) 2014-02-25 2015-02-20 저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법

Publications (1)

Publication Number Publication Date
KR20180036799A true KR20180036799A (ko) 2018-04-09

Family

ID=54008883

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020187009140A KR20180036799A (ko) 2014-02-25 2015-02-20 저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법
KR1020167023468A KR101866111B1 (ko) 2014-02-25 2015-02-20 저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167023468A KR101866111B1 (ko) 2014-02-25 2015-02-20 저온 소결성이 우수한 은 페이스트 및 당해 은 페이스트의 제조 방법

Country Status (7)

Country Link
JP (1) JP5795096B2 (zh)
KR (2) KR20180036799A (zh)
CN (1) CN106062886B (zh)
DE (1) DE112015000957B4 (zh)
MY (1) MY178751A (zh)
TW (1) TWI542711B (zh)
WO (1) WO2015129562A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6101403B2 (ja) * 2014-11-25 2017-03-22 バンドー化学株式会社 導電性インク
JP2017066501A (ja) * 2015-10-02 2017-04-06 アルプス電気株式会社 被覆銀粒子の製造方法、液状組成物、被覆銀粒子、被覆銀粒子含有組成物、導電部材、導電部材の製造方法、電気・電子部品および電気・電子機器
JP7320515B2 (ja) * 2018-08-30 2023-08-03 田中貴金属工業株式会社 低温焼成用の銀インク
CN112566742B (zh) 2018-09-03 2023-01-06 株式会社大阪曹達 银纳米颗粒
EP4026630A4 (en) 2019-09-02 2023-08-23 Osaka Soda Co., Ltd. SILVER PARTICLES
TWI774439B (zh) 2020-07-03 2022-08-11 日商田中貴金屬工業股份有限公司 耐彎折性優異之金屬配線及導電薄片以及為形成該金屬配線之金屬糊
WO2022045263A1 (ja) 2020-08-31 2022-03-03 株式会社大阪ソーダ 導電性接着剤
JPWO2022070778A1 (zh) 2020-09-30 2022-04-07
EP4296326A1 (en) 2021-02-18 2023-12-27 The School Corporation Kansai University Electrically conductive adhesive, sintered body of electrically conductive adhesive, method for producing sintered body, electronic component, and method for producing electronic component
CN113770370A (zh) * 2021-08-18 2021-12-10 清华大学 银粉及其制备方法、银浆和光伏电池

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100081563A1 (en) * 2008-09-26 2010-04-01 Andrew Edgar-Beltran Adhesion and coating integrity of washcoats and overcoats
JP5574761B2 (ja) 2009-04-17 2014-08-20 国立大学法人山形大学 被覆銀超微粒子とその製造方法
CN101710497B (zh) * 2009-12-08 2011-04-20 华中科技大学 一种纳米银导电浆料
JP5761483B2 (ja) * 2010-05-07 2015-08-12 戸田工業株式会社 銀微粒子とその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
WO2011148520A1 (ja) * 2010-05-26 2011-12-01 第一工業製薬株式会社 分散剤および分散体組成物
WO2011155055A1 (ja) 2010-06-11 2011-12-15 Ｄｏｗａエレクトロニクス株式会社 低温焼結性接合材および該接合材を用いた接合方法
JP2012031478A (ja) * 2010-07-30 2012-02-16 Toda Kogyo Corp 銀微粒子とその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
JP6241908B2 (ja) * 2011-02-04 2017-12-06 国立大学法人山形大学 被覆金属微粒子とその製造方法
US20150231698A1 (en) * 2012-08-02 2015-08-20 National University Corporation Yamagata University Process for producing coated silver fine particles and coated silver fine particles produced by said production process

Also Published As

Publication number Publication date
KR101866111B1 (ko) 2018-06-08
KR20160113266A (ko) 2016-09-28
JP2015159096A (ja) 2015-09-03
CN106062886A (zh) 2016-10-26
MY178751A (en) 2020-10-20
WO2015129562A1 (ja) 2015-09-03
TWI542711B (zh) 2016-07-21
DE112015000957B4 (de) 2023-01-05
JP5795096B2 (ja) 2015-10-14
TW201538753A (zh) 2015-10-16
DE112015000957T5 (de) 2016-11-03
CN106062886B (zh) 2018-12-07

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