KR20180029052A - 금속 나노입자의 포토닉 소결에 기초한 자가-정렬 금속 패터닝 - Google Patents

금속 나노입자의 포토닉 소결에 기초한 자가-정렬 금속 패터닝 Download PDF

Info

Publication number
KR20180029052A
KR20180029052A KR1020187003057A KR20187003057A KR20180029052A KR 20180029052 A KR20180029052 A KR 20180029052A KR 1020187003057 A KR1020187003057 A KR 1020187003057A KR 20187003057 A KR20187003057 A KR 20187003057A KR 20180029052 A KR20180029052 A KR 20180029052A
Authority
KR
South Korea
Prior art keywords
metal
particles
substrate
layer
functional layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020187003057A
Other languages
English (en)
Korean (ko)
Inventor
즈이 장
예 타오
타-야 츄
가오즈 샤오
Original Assignee
내셔날 리서치 카운실 오브 캐나다
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 내셔날 리서치 카운실 오브 캐나다 filed Critical 내셔날 리서치 카운실 오브 캐나다
Publication of KR20180029052A publication Critical patent/KR20180029052A/ko
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
    • G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/247—Removing material: carving, cleaning, grinding, hobbing, honing, lapping, polishing, milling, shaving, skiving, turning the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/24—After-treatment of workpieces or articles
    • B22F2003/248—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/05—Light metals
    • B22F2301/052—Aluminium
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/25—Noble metals, i.e. Ag Au, Ir, Os, Pd, Pt, Rh, Ru
    • B22F2301/255—Silver or gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/464—Lateral top-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40—Organic transistors
    • H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462—Insulated gate field-effect transistors [IGFETs]
    • H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Optics & Photonics (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Thin Film Transistor (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
KR1020187003057A 2015-07-03 2016-06-30 금속 나노입자의 포토닉 소결에 기초한 자가-정렬 금속 패터닝 Withdrawn KR20180029052A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562188553P 2015-07-03 2015-07-03
US62/188,553 2015-07-03
PCT/CA2016/050769 WO2017004704A1 (en) 2015-07-03 2016-06-30 Self-aligning metal patterning based on photonic sintering of metal nanoparticles

Publications (1)

Publication Number Publication Date
KR20180029052A true KR20180029052A (ko) 2018-03-19

Family

ID=57684612

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187003057A Withdrawn KR20180029052A (ko) 2015-07-03 2016-06-30 금속 나노입자의 포토닉 소결에 기초한 자가-정렬 금속 패터닝

Country Status (8)

Country Link
US (1) US11185918B2 (https=)
EP (1) EP3317724B1 (https=)
JP (1) JP2018528454A (https=)
KR (1) KR20180029052A (https=)
CN (1) CN107850834A (https=)
CA (1) CA2990283C (https=)
TW (1) TWI719032B (https=)
WO (1) WO2017004704A1 (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220045719A (ko) * 2020-10-06 2022-04-13 재단법인대구경북과학기술원 광원을 통해 유도되는 연소반응 공정방법
KR20230039556A (ko) * 2021-09-14 2023-03-21 한국화학연구원 동박 적층판용 적층체, 이의 제조방법 및 미세 패턴 형성방법
WO2023043140A1 (ko) * 2021-09-14 2023-03-23 한국화학연구원 동박 적층판용 적층체, 이의 제조방법 및 미세 패턴 형성방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102169064B1 (ko) * 2019-03-18 2020-10-22 서울시립대학교 산학협력단 빛-유도 광열 대류를 통한 콜로이드성 금속 나노입자 조립체 제조방법
CN112578605A (zh) * 2020-11-23 2021-03-30 义乌清越光电科技有限公司 一种电子纸封装结构、封装方法及电子器件
WO2023091324A1 (en) * 2021-11-22 2023-05-25 Corning Incorporated Pulsed-laser sintering of ink-based electronics
KR102892843B1 (ko) * 2023-12-07 2025-12-02 위아코퍼레이션 주식회사 반도체 마이크로 소자 패키징 방법

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2019046C (en) 1989-06-16 1998-05-12 Satoshi Okazaki Method of printing fine patterns
JPH07273009A (ja) 1994-03-31 1995-10-20 Toppan Printing Co Ltd 厚膜パターンの製造方法
JP3246189B2 (ja) * 1994-06-28 2002-01-15 株式会社日立製作所 半導体表示装置
US5602047A (en) 1996-06-13 1997-02-11 Industrial Technology Research Institute Process for polysilicon thin film transistors using backside irradiation and plasma doping
KR100229676B1 (ko) 1996-08-30 1999-11-15 구자홍 셀프얼라인 박막트랜지스터 제조방법
CN1404627A (zh) * 2000-10-10 2003-03-19 纽约市哥伦比亚大学托管会 处理薄金属层的方法与设备
US6972261B2 (en) 2002-06-27 2005-12-06 Xerox Corporation Method for fabricating fine features by jet-printing and surface treatment
JP4482631B2 (ja) 2004-02-20 2010-06-16 株式会社Ｅｍ研究機構 発酵技術を応用した洗浄剤及びその製造方法
US7309225B2 (en) 2004-08-13 2007-12-18 Molecular Imprints, Inc. Moat system for an imprint lithography template
US7408187B2 (en) * 2004-11-19 2008-08-05 Massachusetts Institute Of Technology Low-voltage organic transistors on flexible substrates using high-gate dielectric insulators by room temperature process
US20090020215A1 (en) 2005-04-15 2009-01-22 Hood Thomas G Optical Coatings With Narrow Conductive Lines
JP2007129007A (ja) * 2005-11-02 2007-05-24 Hitachi Ltd 有機半導体膜を有する半導体装置の製造方法
GB0523437D0 (en) * 2005-11-17 2005-12-28 Imp College Innovations Ltd A method of patterning a thin film
KR100718152B1 (ko) 2006-02-11 2007-05-14 삼성전자주식회사 유기발광다이오드 및 그 제조방법
US7749396B2 (en) 2006-03-24 2010-07-06 Palo Alto Research Center Incorporated Method of manufacturing fine features for thin film transistors
US7745101B2 (en) 2006-06-02 2010-06-29 Eastman Kodak Company Nanoparticle patterning process
US7491646B2 (en) * 2006-07-20 2009-02-17 Xerox Corporation Electrically conductive feature fabrication process
TWI308800B (en) * 2006-10-26 2009-04-11 Ind Tech Res Inst Method for making thin film transistor and structure of the same
EP1933393A1 (en) 2006-12-13 2008-06-18 Samsung SDI Co., Ltd. Method of manufacturing a substrate for an electronic device
US7615483B2 (en) 2006-12-22 2009-11-10 Palo Alto Research Center Incorporated Printed metal mask for UV, e-beam, ion-beam and X-ray patterning
US8404160B2 (en) 2007-05-18 2013-03-26 Applied Nanotech Holdings, Inc. Metallic ink
US7722422B2 (en) * 2007-05-21 2010-05-25 Global Oled Technology Llc Device and method for improved power distribution for a transparent electrode
KR100882023B1 (ko) 2007-05-25 2009-02-05 한국생산기술연구원 표면에너지 제어를 이용한 패터닝 방법
US20090181172A1 (en) 2007-10-15 2009-07-16 Nanoink, Inc. Lithography of nanoparticle based inks
JP4867904B2 (ja) 2007-12-10 2012-02-01 セイコーエプソン株式会社 導体パターン形成用インク、導体パターン、導体パターンの形成方法および配線基板
CN102017071B (zh) * 2008-02-28 2013-12-18 3M创新有限公司 图案化基底上的导体的方法
WO2010034815A1 (en) * 2008-09-25 2010-04-01 Imec Method for forming self-aligned electrodes
US8647979B2 (en) * 2009-03-27 2014-02-11 Applied Nanotech Holdings, Inc. Buffer layer to enhance photo and/or laser sintering
KR100984256B1 (ko) 2009-08-17 2010-09-30 (주) 파루 자기 정렬 그라비어인쇄를 이용한 중첩정밀도 제어 방법
KR101295888B1 (ko) 2010-05-10 2013-08-12 한국전자통신연구원 저항형 메모리 장치 및 그 제조 방법
US8465905B2 (en) 2011-04-04 2013-06-18 Eastman Kodak Company Printing conductive lines
JP2013065633A (ja) 2011-09-15 2013-04-11 Ricoh Co Ltd 電気機械変換膜の製造方法、電気機械変換素子の製造方法、該製造方法により製造した電気機械変換素子、液滴吐出ヘッド及び液滴吐出装置
KR20130045225A (ko) * 2011-10-25 2013-05-03 헤레우스 프레셔스 메탈즈 노스 아메리카 콘쇼호켄 엘엘씨 금속 나노입자를 함유한 전도성 페이스트
US9096759B2 (en) 2011-12-21 2015-08-04 E I Du Pont De Nemours And Company Printing form and process for preparing the printing form with curable composition having solvent-free epoxy resin
TW201335969A (zh) 2012-02-17 2013-09-01 Nat Univ Tsing Hua 微縮奈微米線寬之方法
EP2917948A1 (en) 2012-11-08 2015-09-16 Merck Patent GmbH Method for producing organic electronic devices with bank structures, bank structures and electronic devices produced therewith
KR102026165B1 (ko) * 2013-04-26 2019-09-27 쇼와 덴코 가부시키가이샤 도전 패턴의 제조방법 및 도전 패턴 형성 기판
US9310685B2 (en) * 2013-05-13 2016-04-12 Nokia Technologies Oy Method and apparatus for the formation of conductive films on a substrate
JP2015111563A (ja) 2013-11-06 2015-06-18 Ｄｏｗａエレクトロニクス株式会社 銅粒子分散液およびそれを用いた導電膜の製造方法
CN104750311B (zh) 2015-03-16 2018-02-13 深圳市宇顺电子股份有限公司 金属网格导电膜的制作方法、金属网格导电膜及触控面板
EP3514822B1 (en) * 2016-09-16 2023-04-26 Toray Industries, Inc. Method for manufacturing field effect transistor and method for manufacturing wireless communication device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20220045719A (ko) * 2020-10-06 2022-04-13 재단법인대구경북과학기술원 광원을 통해 유도되는 연소반응 공정방법
KR20230039556A (ko) * 2021-09-14 2023-03-21 한국화학연구원 동박 적층판용 적층체, 이의 제조방법 및 미세 패턴 형성방법
WO2023043140A1 (ko) * 2021-09-14 2023-03-23 한국화학연구원 동박 적층판용 적층체, 이의 제조방법 및 미세 패턴 형성방법

Also Published As

Publication number Publication date
US20180185922A1 (en) 2018-07-05
US11185918B2 (en) 2021-11-30
JP2018528454A (ja) 2018-09-27
CA2990283C (en) 2023-02-28
TWI719032B (zh) 2021-02-21
EP3317724A1 (en) 2018-05-09
TW201708939A (zh) 2017-03-01
WO2017004704A1 (en) 2017-01-12
CA2990283A1 (en) 2017-01-12
EP3317724A4 (en) 2019-02-27
EP3317724B1 (en) 2022-10-26
CN107850834A (zh) 2018-03-27

Similar Documents

Publication Publication Date Title
KR20180029052A (ko) 금속 나노입자의 포토닉 소결에 기초한 자가-정렬 금속 패터닝
Kang et al. Microelectrode fabrication by laser direct curing of tiny nanoparticle self-generated from organometallic ink
US9159925B2 (en) Process for imprint patterning materials in thin-film devices
JP2012094855A (ja) パターン転写方法及びパターン転写装置、これを適用したフレキシブルディスプレイパネル、フレキシブル太陽電池、電子本、薄膜トランジスター、電磁波遮蔽シート、フレキシブル印刷回路基板
JP6115008B2 (ja) 配線部材、および、電子素子の製造方法と、それを用いた配線部材、積層配線、電子素子、電子素子アレイ及び表示装置。
Lee et al. High-resolution conductive patterns fabricated by inkjet printing and spin coating on wettability-controlled surfaces
CN111686828B (zh) 电浸润微流控背板及其制备方法
Liang et al. Femtosecond laser patterning wettability‐assisted PDMS for fabrication of flexible silver nanowires electrodes
KR101226086B1 (ko) 패턴 제조 방법 및 패턴 전사 장치
CN113005433B (zh) 光致材料沉积方法及相应的设备
CN107850958A (zh) 图案化外覆层
Aminuzzaman et al. Fabrication of conductive silver micropatterns on an organic–inorganic hybrid film by laser direct writing
KR100984256B1 (ko) 자기 정렬 그라비어인쇄를 이용한 중첩정밀도 제어 방법
US10423065B2 (en) Pattern forming method and pattern structural body
US11284521B2 (en) Electronic devices comprising a via and methods of forming such electronic devices
JP2008016756A (ja) バンク構造、電子回路、電子デバイス、およびそれらの製造方法、並びにパターン形成方法
JP5343115B2 (ja) 透明導電回路基板及びその製造方法
CN116437580A (zh) 一种精细导电线路及其制备方法和应用
CN101317281B (zh) 在有机导体基材上获得图案的方法和所获得的有机材料
Richman et al. Ultrafast laser ablation of graphene under water immersion
KR101189682B1 (ko) 패턴 전사방법 및 패턴 전사장치
Ko et al. Fabrication of multilayer passive electric components using inkjet printing and low temperature laser processing on polymer
CN115094374A (zh) 用于制备图案化金属氧化物薄膜的材料和方法
KR20180018512A (ko) 배선 패턴의 제조 방법, 트랜지스터의 제조 방법, 및 전사용 부재
CN116344334A (zh) 一种激光直写图形化聚合物膜掩模版制备电极的方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20180131

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination