KR20160126020A - 적층형 지지 링을 가지는 웨이퍼 적재기 - Google Patents

적층형 지지 링을 가지는 웨이퍼 적재기 Download PDF

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Publication number
KR20160126020A
KR20160126020A KR1020167026139A KR20167026139A KR20160126020A KR 20160126020 A KR20160126020 A KR 20160126020A KR 1020167026139 A KR1020167026139 A KR 1020167026139A KR 20167026139 A KR20167026139 A KR 20167026139A KR 20160126020 A KR20160126020 A KR 20160126020A
Authority
KR
South Korea
Prior art keywords
wafer
wafer support
support ring
continuous
axial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020167026139A
Other languages
English (en)
Korean (ko)
Inventor
에릭 에이 커클랜드
러셀 브이 라쉬케
Original Assignee
엔테그리스, 아이엔씨.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엔테그리스, 아이엔씨. filed Critical 엔테그리스, 아이엔씨.
Publication of KR20160126020A publication Critical patent/KR20160126020A/ko
Ceased legal-status Critical Current

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Classifications

    • H01L21/67386—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H01L21/67346—
    • H01L21/67369—
    • H01L21/6835—
    • H01L21/68721—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
KR1020167026139A 2014-02-25 2015-02-24 적층형 지지 링을 가지는 웨이퍼 적재기 Ceased KR20160126020A (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201461944455P 2014-02-25 2014-02-25
US61/944,455 2014-02-25
US201462089087P 2014-12-08 2014-12-08
US201462089103P 2014-12-08 2014-12-08
US62/089,103 2014-12-08
US62/089,087 2014-12-08
PCT/US2015/017345 WO2015130690A1 (en) 2014-02-25 2015-02-24 Wafer shipper with stacked support rings

Publications (1)

Publication Number Publication Date
KR20160126020A true KR20160126020A (ko) 2016-11-01

Family

ID=54009550

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167026139A Ceased KR20160126020A (ko) 2014-02-25 2015-02-24 적층형 지지 링을 가지는 웨이퍼 적재기

Country Status (8)

Country Link
US (1) US10896834B2 (https=)
EP (1) EP3111472B1 (https=)
JP (1) JP2017508291A (https=)
KR (1) KR20160126020A (https=)
CN (1) CN106463437B (https=)
SG (1) SG11201607061WA (https=)
TW (1) TWI733648B (https=)
WO (1) WO2015130690A1 (https=)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2018062951A2 (ko) 2016-09-30 2018-04-05 주식회사 녹십초 알로에 전동칫솔

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SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
US10658212B2 (en) 2014-11-27 2020-05-19 Achilles Corporation Ring spacer
USD799825S1 (en) * 2015-08-31 2017-10-17 Entegris, Inc. Container
USD801046S1 (en) * 2015-08-31 2017-10-31 Entegris, Inc. Container
US10832927B2 (en) * 2015-12-18 2020-11-10 Texas Instruments Incorporated Interlocking nest wafer protector
DE102016113924B4 (de) 2016-07-28 2024-06-13 Infineon Technologies Ag Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox
USD812907S1 (en) * 2017-01-16 2018-03-20 Endural, Llc Container
WO2019046477A1 (en) 2017-08-29 2019-03-07 Daewon Semiconductor Packaging Industrial Company SEPARATORS FOR HANDLING, TRANSPORTING OR STORING SEMICONDUCTOR WAFERS
DE202019101793U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
KR102421675B1 (ko) 2018-08-01 2022-07-15 히라따기꼬오 가부시키가이샤 반송 장치 및 제어 방법
US10811292B2 (en) * 2018-09-12 2020-10-20 Texas Instruments Incorporated Transport packaging and method for expanded wafers
US12165905B2 (en) * 2019-05-20 2024-12-10 Applied Materials, Inc. Process kit enclosure system
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
JP7330081B2 (ja) * 2019-12-03 2023-08-21 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
US12159795B2 (en) 2021-03-08 2024-12-03 Applied Materials, Inc. Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall
US11664257B2 (en) * 2021-09-21 2023-05-30 Intel Corporation Contactless wafer separator
US12159799B2 (en) * 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer
US12614052B2 (en) 2024-05-28 2026-04-28 Globalfoundries U.S. Inc. Fixture for radio frequency identification tag

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JPS61291336A (ja) 1985-06-20 1986-12-22 Matsushita Electric Ind Co Ltd 送出装置
JP2688664B2 (ja) * 1994-09-07 1997-12-10 シノン電気産業株式会社 半導体デバイス用トレー
JP2910684B2 (ja) 1996-07-31 1999-06-23 日本電気株式会社 ウエハー容器
JP3054701U (ja) * 1998-06-05 1998-12-18 株式会社倉元製作所 膜付きガラス基板のスペーサ
DE60044028D1 (de) * 1999-07-23 2010-04-29 Ray G Brooks Sicherungssystem für wafer mit integriertem schaltkreis (ic)
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7040487B2 (en) 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
JP4261170B2 (ja) * 2002-11-08 2009-04-30 株式会社ヴァンテック 半導体ウェハ搬送容器
US6926150B2 (en) * 2003-02-05 2005-08-09 Texas Instruments Incorporated Protective interleaf for stacked wafer shipping
JP4150963B2 (ja) * 2003-02-07 2008-09-17 株式会社ダイフク 被支持体積層支持装置
JP4329536B2 (ja) 2003-12-26 2009-09-09 アキレス株式会社 半導体ウェハーの収納具
US7225929B2 (en) * 2004-12-30 2007-06-05 Illinois Tool Works Inc. Adjustable height wafer box
TW200746349A (en) 2006-02-08 2007-12-16 Entegris Inc Stacking rings for wafers
FR2901543B1 (fr) * 2006-05-23 2009-02-27 Mezrag Mohamed Seiffeddine Bou Recipient modulaire pour contenir des denrees sensibles a leur mise a l'air.
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
JP2008044636A (ja) * 2006-08-11 2008-02-28 Sanyu Kikaku:Kk 収納用トレー
JP3130509U (ja) * 2007-01-16 2007-03-29 山汰科技企業有限公司 基板搬送装置
JP5043475B2 (ja) 2007-03-05 2012-10-10 ミライアル株式会社 半導体ウエハ収納容器
JP2009076646A (ja) * 2007-09-20 2009-04-09 Shin Etsu Polymer Co Ltd 基板保持具
CN101888957B (zh) * 2007-10-12 2013-01-02 大元半导体包装产业有限公司 带有交错壁结构的晶圆容器
JP4825771B2 (ja) * 2007-10-22 2011-11-30 信越ポリマー株式会社 ウェーハ収納容器およびウェーハのハンドリング方法
US20100224517A1 (en) * 2009-03-03 2010-09-09 Haggard Clifton C Disk separator device
US9224627B2 (en) * 2011-02-16 2015-12-29 Texchem Advanced Products Incorporated Sdn Bhd Single and dual stage wafer cushion and wafer separator
JP5712058B2 (ja) 2011-06-03 2015-05-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20140076774A1 (en) * 2012-09-18 2014-03-20 Kurt F. Kaashoek Automated Wafer Container with Equipment Interface
SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
JP6427674B2 (ja) 2014-12-08 2018-11-21 インテグリス・インコーポレーテッド 基板格納用の一体型コーナースプリングを備える水平基板コンテナ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018062951A2 (ko) 2016-09-30 2018-04-05 주식회사 녹십초 알로에 전동칫솔

Also Published As

Publication number Publication date
CN106463437A (zh) 2017-02-22
EP3111472A1 (en) 2017-01-04
SG11201607061WA (en) 2016-09-29
JP2017508291A (ja) 2017-03-23
TWI733648B (zh) 2021-07-21
TW201539641A (zh) 2015-10-16
EP3111472B1 (en) 2018-09-26
US20160365265A1 (en) 2016-12-15
WO2015130690A1 (en) 2015-09-03
US10896834B2 (en) 2021-01-19
CN106463437B (zh) 2019-09-06
EP3111472A4 (en) 2017-07-12

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PE0601 Decision on rejection of patent

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