CN106463437B - 具有堆叠式支撑环的晶片运送装置 - Google Patents

具有堆叠式支撑环的晶片运送装置 Download PDF

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Publication number
CN106463437B
CN106463437B CN201580019500.2A CN201580019500A CN106463437B CN 106463437 B CN106463437 B CN 106463437B CN 201580019500 A CN201580019500 A CN 201580019500A CN 106463437 B CN106463437 B CN 106463437B
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CN
China
Prior art keywords
wafer
wafer support
support ring
continuous
tab
Prior art date
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Active
Application number
CN201580019500.2A
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English (en)
Chinese (zh)
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CN106463437A (zh
Inventor
埃里克·A·柯克兰
鲁塞尔·V·拉施克
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Entegris Inc
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Entegris Inc
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Publication date
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Publication of CN106463437A publication Critical patent/CN106463437A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
    • H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1922—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7606—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
CN201580019500.2A 2014-02-25 2015-02-24 具有堆叠式支撑环的晶片运送装置 Active CN106463437B (zh)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201461944455P 2014-02-25 2014-02-25
US61/944,455 2014-02-25
US201462089087P 2014-12-08 2014-12-08
US201462089103P 2014-12-08 2014-12-08
US62/089,103 2014-12-08
US62/089,087 2014-12-08
PCT/US2015/017345 WO2015130690A1 (en) 2014-02-25 2015-02-24 Wafer shipper with stacked support rings

Publications (2)

Publication Number Publication Date
CN106463437A CN106463437A (zh) 2017-02-22
CN106463437B true CN106463437B (zh) 2019-09-06

Family

ID=54009550

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580019500.2A Active CN106463437B (zh) 2014-02-25 2015-02-24 具有堆叠式支撑环的晶片运送装置

Country Status (8)

Country Link
US (1) US10896834B2 (https=)
EP (1) EP3111472B1 (https=)
JP (1) JP2017508291A (https=)
KR (1) KR20160126020A (https=)
CN (1) CN106463437B (https=)
SG (1) SG11201607061WA (https=)
TW (1) TWI733648B (https=)
WO (1) WO2015130690A1 (https=)

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SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
US10658212B2 (en) 2014-11-27 2020-05-19 Achilles Corporation Ring spacer
USD799825S1 (en) * 2015-08-31 2017-10-17 Entegris, Inc. Container
USD801046S1 (en) * 2015-08-31 2017-10-31 Entegris, Inc. Container
US10832927B2 (en) * 2015-12-18 2020-11-10 Texas Instruments Incorporated Interlocking nest wafer protector
DE102016113924B4 (de) 2016-07-28 2024-06-13 Infineon Technologies Ag Waferbox und Verfahren zum Anordnen von Wafern in einer Waferbox
JP6966541B2 (ja) 2016-09-30 2021-11-17 チェ, チェ ソンCHOI, Jae Seung 電動歯ブラシ
USD812907S1 (en) * 2017-01-16 2018-03-20 Endural, Llc Container
WO2019046477A1 (en) 2017-08-29 2019-03-07 Daewon Semiconductor Packaging Industrial Company SEPARATORS FOR HANDLING, TRANSPORTING OR STORING SEMICONDUCTOR WAFERS
DE202019101793U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
KR102421675B1 (ko) 2018-08-01 2022-07-15 히라따기꼬오 가부시키가이샤 반송 장치 및 제어 방법
US10811292B2 (en) * 2018-09-12 2020-10-20 Texas Instruments Incorporated Transport packaging and method for expanded wafers
US12165905B2 (en) * 2019-05-20 2024-12-10 Applied Materials, Inc. Process kit enclosure system
USD917825S1 (en) 2019-07-16 2021-04-27 Entegris, Inc. Wafer support ring
JP7330081B2 (ja) * 2019-12-03 2023-08-21 三菱電機株式会社 キャリアスペーサおよび半導体装置の製造方法
US12159795B2 (en) 2021-03-08 2024-12-03 Applied Materials, Inc. Enclosure system having walls comprising sidewalls and radio-frequency identifier holder coupled to rear wall
US11664257B2 (en) * 2021-09-21 2023-05-30 Intel Corporation Contactless wafer separator
US12159799B2 (en) * 2022-03-30 2024-12-03 Achilles Corporation Container for transporting semiconductor wafer
US12614052B2 (en) 2024-05-28 2026-04-28 Globalfoundries U.S. Inc. Fixture for radio frequency identification tag

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US6286684B1 (en) * 1999-07-23 2001-09-11 Ray G. Brooks Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment
JP2004207260A (ja) * 2002-11-08 2004-07-22 Vantec Co Ltd 半導体ウェハ搬送容器
WO2007092557A2 (en) * 2006-02-08 2007-08-16 Entegris, Inc. Stacking rings for wafers
CN101888957A (zh) * 2007-10-12 2010-11-17 必佳塑胶金属制品厂(国际)有限公司 带有交错壁结构的晶圆容器

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JPS61291336A (ja) 1985-06-20 1986-12-22 Matsushita Electric Ind Co Ltd 送出装置
JP2688664B2 (ja) * 1994-09-07 1997-12-10 シノン電気産業株式会社 半導体デバイス用トレー
JP2910684B2 (ja) 1996-07-31 1999-06-23 日本電気株式会社 ウエハー容器
JP3054701U (ja) * 1998-06-05 1998-12-18 株式会社倉元製作所 膜付きガラス基板のスペーサ
US6550619B2 (en) * 2000-05-09 2003-04-22 Entergris, Inc. Shock resistant variable load tolerant wafer shipper
US7040487B2 (en) 2001-07-14 2006-05-09 Entegris, Inc. Protective shipper
US6926150B2 (en) * 2003-02-05 2005-08-09 Texas Instruments Incorporated Protective interleaf for stacked wafer shipping
JP4150963B2 (ja) * 2003-02-07 2008-09-17 株式会社ダイフク 被支持体積層支持装置
JP4329536B2 (ja) 2003-12-26 2009-09-09 アキレス株式会社 半導体ウェハーの収納具
US7225929B2 (en) * 2004-12-30 2007-06-05 Illinois Tool Works Inc. Adjustable height wafer box
FR2901543B1 (fr) * 2006-05-23 2009-02-27 Mezrag Mohamed Seiffeddine Bou Recipient modulaire pour contenir des denrees sensibles a leur mise a l'air.
JP4716928B2 (ja) * 2006-06-07 2011-07-06 信越ポリマー株式会社 ウェーハ収納容器
JP2008044636A (ja) * 2006-08-11 2008-02-28 Sanyu Kikaku:Kk 収納用トレー
JP3130509U (ja) * 2007-01-16 2007-03-29 山汰科技企業有限公司 基板搬送装置
JP5043475B2 (ja) 2007-03-05 2012-10-10 ミライアル株式会社 半導体ウエハ収納容器
JP2009076646A (ja) * 2007-09-20 2009-04-09 Shin Etsu Polymer Co Ltd 基板保持具
JP4825771B2 (ja) * 2007-10-22 2011-11-30 信越ポリマー株式会社 ウェーハ収納容器およびウェーハのハンドリング方法
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JP5712058B2 (ja) 2011-06-03 2015-05-07 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20140076774A1 (en) * 2012-09-18 2014-03-20 Kurt F. Kaashoek Automated Wafer Container with Equipment Interface
SG11201607061WA (en) 2014-02-25 2016-09-29 Entegris Inc Wafer shipper with stacked support rings
JP6427674B2 (ja) 2014-12-08 2018-11-21 インテグリス・インコーポレーテッド 基板格納用の一体型コーナースプリングを備える水平基板コンテナ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6286684B1 (en) * 1999-07-23 2001-09-11 Ray G. Brooks Protective system for integrated circuit (IC) wafers retained within containers designed for storage and shipment
JP2004207260A (ja) * 2002-11-08 2004-07-22 Vantec Co Ltd 半導体ウェハ搬送容器
WO2007092557A2 (en) * 2006-02-08 2007-08-16 Entegris, Inc. Stacking rings for wafers
CN101888957A (zh) * 2007-10-12 2010-11-17 必佳塑胶金属制品厂(国际)有限公司 带有交错壁结构的晶圆容器

Also Published As

Publication number Publication date
CN106463437A (zh) 2017-02-22
EP3111472A1 (en) 2017-01-04
SG11201607061WA (en) 2016-09-29
JP2017508291A (ja) 2017-03-23
TWI733648B (zh) 2021-07-21
TW201539641A (zh) 2015-10-16
KR20160126020A (ko) 2016-11-01
EP3111472B1 (en) 2018-09-26
US20160365265A1 (en) 2016-12-15
WO2015130690A1 (en) 2015-09-03
US10896834B2 (en) 2021-01-19
EP3111472A4 (en) 2017-07-12

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